TWI489691B - 包括至少一第一傳輸線的第一基體與包括至少一第二傳輸線的第二基體之相連接系統 - Google Patents

包括至少一第一傳輸線的第一基體與包括至少一第二傳輸線的第二基體之相連接系統 Download PDF

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TWI489691B
TWI489691B TW098103760A TW98103760A TWI489691B TW I489691 B TWI489691 B TW I489691B TW 098103760 A TW098103760 A TW 098103760A TW 98103760 A TW98103760 A TW 98103760A TW I489691 B TWI489691 B TW I489691B
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substrate
transmission line
recess
phase
hole
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TW200937740A (en
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Julian Thevenard
Hine Tong Dominique Lo
Ali Louzir
Corinne Nicolas
Christian Person
Jean-Philippe Coupez
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Thomson Licensing
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

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  • Condensed Matter Physics & Semiconductors (AREA)
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Description

包括至少一第一傳輸線的第一基體與包括至少一第二傳輸線的第二基體之相連接系統
本發明係關於包括至少一第一傳輸線的第一基體與包括至少一第二傳輸線的第二基體之相連接系統，第一基體相對於第二基體之定向係隨意性。
本發明尤指以特別方式關於相連接系統，其中傳輸線是印刷線，相連接系統亦包含濾波功能。
亟需減小現時系統之尺寸，同時使用最低廉的製造方法。故本發明擬議一種包括至少一第一傳輸線的第一基體和包括至少一第二傳輸線的第二基體之新相連接系統，以簡單的機械式接觸實施，一旦進行組裝時，不需任何焊接或任何其他相連接手段。
本發明亦關係到有濾波功能的二傳輸線間過渡位準之積合，旨在除去發射或接收之寄生頻率，不減弱所用頻率帶寬之效能，也不影響過渡之物理維度。故本發明不但把第一基體的能量傳送到第二基體，而且能節省尺寸，以及系統之總體成本。
本發明顯然應用在包括印刷天線的基體與實施其他電子功能的第二基體之相連接架構，例如本申請人在法國專利申請案第06 55246號所述。
因此，本發明係關於包括至少一第一傳輸線的第一基體與包括至少一第二傳輸線的第二基體之相連接系統，第一基體相對於第二基體之定向係隨意性，其特徵為，第一基體包括在該第一傳輸線一極端之至少一金屬化洞孔，而第二傳輸線包括延長該第二傳輸線之凸出元件，該凸出元件係插入於金屬化洞孔內。第一基體上實施之洞孔宜在該基體兩面，圍繞非金屬化凹部，而去金屬化區位在第二基體背面。金屬化洞孔和跨越凹部的傳輸線部份相關第一基體間之凹部，連 同跨越第二基體上的凹部之傳輸線部份，形成濾波元件。此濾波元件有準橢圓形低通式回應傳輸零點，使共振元件數值為金屬化洞孔和基底平面間的第一基體上所製成凹部維度之函數，第一感應元件數值為此凹部上方的傳輸線長度之函數，而第二感應元件數值為第二基體上所製成凹部上方的傳輸線長度之函數。
按照本發明另一特徵，第一基體之傳輸線以一個線元件延伸超越金屬化洞孔。線元件在過渡位準供應電抗，能夠控制濾波器之共振頻率。
按照較佳具體例，第二基體之凸出元件部份在接收第二饋電線面之相反面非金屬化。第一和第二饋電線以微條線、共平面線或三板線為佳，而第一和第二基體是單層或多層基體。按照較佳具體例，第一和第二基體位於彼此形成90°角。
本發明其他特徵和優點，閱讀參照附圖所示不同具體例之說明即可明白。
茲先參照第1-6圖說明本發明相連接系統之第一具體例。在第1和2圖中，顯示第一基體1係由多層基體1a,1b,1c形成。凡精於此道之士可知，本發明亦可應用於單層基體。基體頂面包括金屬層2。
按照本發明，饋電線3尤指微條線，藉蝕刻該基體，實施於該基體1頂面。此傳輸線進入金屬化洞孔4內。此洞孔4周圍是凹部5，由金屬層2去金屬化而成。
在基體1的另一面，即圖示具體例之下面，層6形成基底平面。此層6在洞孔4周圍7去金屬化。此基底平面藉沿傳輸線3在基底凹部5周圍之金屬化洞孔(此圖未示)，連接至頂部基底平面2。金屬化洞孔4周圍之二去金屬化區5和7，將微條線和基底平面上其餘電路之金屬化洞孔絕緣。此外，頂面凹部可防止短路，用來實施濾波過渡，詳後。
如第3和4圖所示，多層或單層之第二基體10在頂面10a有金屬化線11。基體亦包括凸出元件12，上面實施該線11。為防止短路，包括基底平面的基體10另一面10b，在凸出元件12及其頂部之位準去金屬化，其方式一如形成凹部13。凸出元件12形狀得以插入金屬化洞孔4內，如第5和6圖所示。在第5和6圖中，二基體1和2彼此垂直相連接。凡精於此道之士均知，二基體間定向亦可呈90°以外，不悖本發明範圍。詳見第6圖，二凹部13和5可防止短路。
因此，如第5和6圖所示，二饋電線3和11間可分別利用基體1和基體2，實施簡單之機械式相連接。此項組裝不需任何焊接或作業，只要一基體簡單插入另一基體即可。再者，此項相連接之機械性能，可供能夠藉簡單接觸從一基體傳送至另一基體，不用焊接或其他方法。
此外，如下所述，如此實施之過渡幾何形狀，可同時實施濾波功能。此項濾波功能參照第7至10圖詳述如下。
第7圖為第1圖之放大圖，其濾波功能是由金屬化洞孔和凹部5周圍的基體頂部金屬件2間形成之電容元件Cr所構成。電容元件數值因洞孔4和組件2間之距離C而定，詳參見第9圖曲線之說明。基底洞孔因而構成數值Lr之電感環路。再者，凹部5上方之饋電線形成電感元件Ls1，其數值是凹部上方的維度L1之函數，詳見第10圖。凹部13上方之傳輸線亦形成電感元件Ls2，其數值因線的背面所形成基底凹部之長度L2而定。過渡之組裝形成濾波網路，見第8圖之電路圖。濾波器包括二自感Ls1和Ls2，在輸入端口P1和輸出端口P2之間串聯，而共振元件Lr/Cr串聯安裝在自感接合點和接地m間。如此所示濾波器是傳輸零點之位階3的低通濾波器。
詳見第9和10圖，藉修飾C值或修飾L1值，可移動濾波器之截止頻率。因此，第9圖表示不同之截止頻率，其C值分別為0.6mm、1mm、1.6mm、2.6mm，L值恒定，等於 1.9mm，而第10圖表示濾波過渡之截止頻率，L值分別為0.6mm、1.6mm、2.6mm，C為常值，等於1.9mm。凡精於此道之士均知，藉修飾長度L2值，亦即濾波網路之等效電感Ls2值，可改變截止頻率。同理，修飾金屬化洞孔4的維度，亦即等效電感Lr值，可修飾傳輸零點之頻率。
為突顯本發明相連接系統之效能，以無線通訊應用WLAN(Wireless Local Area Network簡稱)之頻帶作業的結構，特別因應IEEE標準802.11 a/b/g/n，其頻率帶在2.4GHz和5.5GHz左右作業，使用ANSOFT的HFSS模擬器加以模擬。
水平基體1是FR4式基體，由四金屬層構成，各隔離0.26mm，並支持長度3.4mm，寬度1.5mm之長方形金屬化洞孔4。水平基體總厚度0.78mm。見第1圖。直立基體如第3和4圖所示，由Pocan型塑膠基體構成，屬於聚對苯二甲酸丁二酯(PBT)族，介質係數3.4，損失正切等於0.01。水平凹部係同樣形狀，長6.3mm，寬3.8mm。凸出元件12為平行六面形，高1.6mm，深1.5mm，寬1.9mm。後面凹部13呈長方形，高L2為2.5mm，寬5.9mm。此項濾波過渡結果如第12圖所示，賦予濾波過渡之曲線S21。在上述情況下，過渡專用損失低於0.1dB帶寬。曲線上所示傳輸位準，在6GHz為-0.9dB左右，因材料的介質損失之故。
如第11圖所示，濾波過渡可加電感或電容式元件。因此，在第11圖中，線元件8把線3延長超越洞孔4。此線元件8蝕刻在基體1之面2，長度可控制濾波器之共振頻率，對長度3mm之元件而言，位在例如6.7GHz，而在此頻率周圍之1.3GHz頻帶內，發生衰減在15dB以上之傳輸訊號。此增加線元件係濾波器之控制參數，並確保過渡之操作，見第12圖。
1‧‧‧第一基體
1a,1b,1c‧‧‧多層基體
2‧‧‧金屬層
3‧‧‧饋電線
4‧‧‧金屬化洞孔
5‧‧‧基底凹部
6‧‧‧基底平面
7‧‧‧洞孔周圍
8‧‧‧線元件
10‧‧‧第二基體
10a‧‧‧基體頂面
10b‧‧‧基體另一面
11‧‧‧金屬化線
12‧‧‧凸出元件
13‧‧‧凹部
X,Y,Z‧‧‧座標
L1‧‧‧凹部上方的維度
C‧‧‧洞孔和組件間距離
L2‧‧‧基底凹部之長度
Ls1,Ls2‧‧‧電感元件
P1‧‧‧輸入端口
P2‧‧‧輸出端口
Lr‧‧‧電感環路
Cr‧‧‧電容元件
m‧‧‧接地
S21‧‧‧曲線
第1圖為本發明第一基體之俯視圖； 第2圖為第1圖基體之仰視圖；第3圖為本發明第二基體之透視前視圖；第4圖為第3圖所示第二基體之透視後視圖；第5和6圖為本發明二基體相連接系統之透視圖；第7圖為與本發明相連接系統關聯的濾波過濾之放大俯視圖；第8圖為第7圖濾波過渡之電路圖；第9圖為濾波過渡按照電容元件距離C之傳輸曲線；第10圖為不同數值距離L(即電感元件)之濾波過渡之不同傳輸曲線；第11圖為修飾濾波過渡之第一基體圖；第12圖為濾波過渡以頻率為函數之曲線S21圖。
1‧‧‧第一基體
3‧‧‧饋電線
10‧‧‧第二基體
11‧‧‧金屬化線
X,Y,Z‧‧‧座標

Claims (9)

  1. 一種包括至少一第一傳輸線的第一基體與包括至少一第二傳輸線的第二基體之相連接系統，第一基體相對於第二基體之定向係幾近垂直，第一基體包括在該第一線極端之至少一金屬化洞孔，此洞孔在第一基體的兩面，以非金屬化凹部包圍，第二基體包括從該至少一第二傳輸線延伸之凸出元件，和基體凹部，該凸出元件係插入金屬化洞孔內，其特徵為，凹部係形成於金屬化洞孔，以及與跨越凹部的至少一第一傳輸線連同位於第二基體的至少一第二傳輸線關聯的第一基體基底平面之間，而其對應基體凹部形成傳輸零點之低通濾波元件者。
  2. 如申請專利範圍第1項之相連接系統，其中濾波元件係二串聯由自感元件和一並聯共振元件構成者。
  3. 如申請專利範圍第2項之相連接系統，其中共振元件值，係以第一基體的金屬化洞孔和基底平面間之凹部維度為函數者。
  4. 如申請專利範圍第2項之相連接系統，其中第一基體之自感值係以凹部上方的第一傳輸線長度為函數者。
  5. 如申請專利範圍第2項之相連接系統，其中第二基體之自感值係以凹部上方的至少一第一傳輸線長度為函數者。
  6. 如申請專利範圍第1項之相連接系統，其中第一基體之至少一第一傳輸線以線元件延伸超越金屬化洞孔者。
  7. 如申請專利範圍第1項之相連接系統，其中第二基體之凸出元件部份，係在接收至少一第二傳輸線面的相反面上非金屬化者。
  8. 如申請專利範圍第1項之相連接系統，其中第一和第二傳輸線係微條線、共平面線、三板線者。
  9. 如申請專利範圍第1項之相連接系統，其中第一和第二基體係單層或多層基體者。
TW098103760A 2008-02-27 2009-02-06 包括至少一第一傳輸線的第一基體與包括至少一第二傳輸線的第二基體之相連接系統 TWI489691B (zh)

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CN101521313B (zh) 2014-07-30
US7804695B2 (en) 2010-09-28
JP5405851B2 (ja) 2014-02-05
CN101521313A (zh) 2009-09-02
TW200937740A (en) 2009-09-01
EP2096904B1 (en) 2018-10-10
KR20090092706A (ko) 2009-09-01
KR101571345B1 (ko) 2015-11-24
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US20090213562A1 (en) 2009-08-27
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