TWI485225B - 接著片及半導體裝置的製造方法 - Google Patents

接著片及半導體裝置的製造方法 Download PDF

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Publication number
TWI485225B
TWI485225B TW102108050A TW102108050A TWI485225B TW I485225 B TWI485225 B TW I485225B TW 102108050 A TW102108050 A TW 102108050A TW 102108050 A TW102108050 A TW 102108050A TW I485225 B TWI485225 B TW I485225B
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Taiwan
Prior art keywords
adhesive layer
mass
adhesive
semiconductor device
softening point
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TW102108050A
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English (en)
Chinese (zh)
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TW201346003A (zh
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小玉美虞彌
徳安孝寛
岩倉哲郎
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日立化成股份有限公司
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Publication of TW201346003A publication Critical patent/TW201346003A/zh
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/153—Connection portion
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  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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JP7294410B2 (ja) * 2019-04-25 2023-06-20 株式会社レゾナック ドルメン構造を有する半導体装置及びその製造方法
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WO2022149277A1 (ja) 2021-01-08 2022-07-14 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
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JP2017204656A (ja) 2017-11-16
KR20170105640A (ko) 2017-09-19
JP6414296B2 (ja) 2018-10-31
CN106024654B (zh) 2019-07-02
KR101953052B1 (ko) 2019-02-27
CN104169383B (zh) 2016-11-09
KR20200006197A (ko) 2020-01-17
JPWO2013133275A1 (ja) 2015-07-30
JP2016021585A (ja) 2016-02-04
US9212298B2 (en) 2015-12-15
KR102067945B1 (ko) 2020-01-17
US20150050780A1 (en) 2015-02-19
TW201346003A (zh) 2013-11-16
KR20160139043A (ko) 2016-12-06
WO2013133275A1 (ja) 2013-09-12
KR20190020191A (ko) 2019-02-27
CN106024654A (zh) 2016-10-12
KR20140126736A (ko) 2014-10-31

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