TWI485094B - Packing structure of dicing die bonding film and packing method - Google Patents

Packing structure of dicing die bonding film and packing method Download PDF

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Publication number
TWI485094B
TWI485094B TW101132834A TW101132834A TWI485094B TW I485094 B TWI485094 B TW I485094B TW 101132834 A TW101132834 A TW 101132834A TW 101132834 A TW101132834 A TW 101132834A TW I485094 B TWI485094 B TW I485094B
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film
side plates
side plate
core
roller
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TW101132834A
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Chinese (zh)
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TW201318934A (en
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Masami Aoyama
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Furukawa Electric Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22Details
    • B65D77/24Inserts or accessories added or incorporated during filling of containers
    • B65D77/26Elements or devices for locating or protecting articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D71/00Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material
    • B65D71/50Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material comprising a plurality of articles held together only partially by packaging elements formed otherwise than by folding a blank
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/053Corner, edge or end protectors
    • B65D81/058Protectors contacting five surfaces of the packaged article, e.g. five-sided end protectors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/67Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
    • B65D85/671Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form
    • B65D85/672Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form on cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2581/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D2581/02Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D2581/05Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/051Details of packaging elements for maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/057Edge protectors adapted to protect the circular edge of rolls of material, e.g. coils of sheet metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Of Machine Parts And Wound Products (AREA)
  • Packages (AREA)
  • Buffer Packaging (AREA)

Description

切割用黏晶膜之捆包構造及捆包方法Bundling structure and packing method for cutting die film

本發明係關於製造半導體裝置時使用的切割用黏晶膜之捆包構造及其捆包方法。The present invention relates to a packing structure of a die-bonding film for dicing used in the manufacture of a semiconductor device and a packaging method therefor.

以往,開發有兼具切割膠帶(dicing tape)和晶粒接合薄膜(die bonding film)這兩種功能的切割用黏晶膜(die dicing bonding film),該切割膠帶係於將半導體晶圓切斷分離成各個晶片時用以固定半導體晶圓,該晶粒接合薄膜係用以將被切斷的半導體晶片接合在引線架或封裝基板等。這種切割用黏晶膜通常被施以預切割加工。Conventionally, a die dicing bonding film has been developed which has both functions of a dicing tape and a die bonding film, and the dicing tape is used to cut a semiconductor wafer. The semiconductor wafer is fixed when being separated into individual wafers for bonding the cut semiconductor wafer to a lead frame or a package substrate or the like. Such a die-cut film for cutting is usually subjected to pre-cut processing.

圖8係顯示做為切割用黏晶膜之一例的薄膜100之圖,圖8(a)為前視圖,圖8(b)為圖8(a)的D-D線剖視圖。薄膜100係由脫模薄膜103、接著劑層105、以及由圓形標籤部107a及周邊部107b構成的黏合薄膜107等所構成。Fig. 8 is a view showing a film 100 as an example of a die-cut film for dicing, Fig. 8(a) is a front view, and Fig. 8(b) is a cross-sectional view taken along line D-D of Fig. 8(a). The film 100 is composed of a release film 103, an adhesive layer 105, and an adhesive film 107 composed of a circular label portion 107a and a peripheral portion 107b.

接著劑層105係被加工成對應晶圓的形狀之圓形,配置於脫模薄膜103上。黏合薄膜107係被去除對應切割用連結框之形狀的圓形部分的周邊區域者。黏合薄膜107的圓形標籤部107a覆蓋接著劑層105,外周部與脫模薄膜103接觸。The subsequent layer 105 is processed into a circular shape corresponding to the shape of the wafer, and is disposed on the release film 103. The adhesive film 107 is removed from the peripheral region of the circular portion corresponding to the shape of the dicing joint frame. The circular label portion 107a of the adhesive film 107 covers the adhesive layer 105, and the outer peripheral portion is in contact with the release film 103.

如圖8(b)所示,接著劑層105和圓形標籤部107a積層的部分,比黏合薄膜107的周邊部107b厚。因此,在被捲成做為製品之輥狀時,接著劑層105和圓形標籤部107a的積層部分、及周邊部107b之階差疊合,而有該階差會被轉印至柔軟的接著劑層105表面之虞。若產生這種轉印痕,則會因為接著劑層105和半導體晶圓的接著不良而有晶圓加 工時產生不良狀況之虞。As shown in FIG. 8(b), the portion where the adhesive layer 105 and the circular label portion 107a are laminated is thicker than the peripheral portion 107b of the adhesive film 107. Therefore, when rolled into a roll shape as a product, the step of the adhesive layer 105 and the laminated portion of the circular label portion 107a and the peripheral portion 107b are superimposed, and the step is transferred to the soft one. Next to the surface of the agent layer 105. If such a transfer mark is generated, there is a wafer addition due to the adhesion of the adhesive layer 105 and the semiconductor wafer. There is a problem with working conditions.

另一方面,為了抑制這種轉印痕的產生而有減弱膠帶的捲繞力之方法。但是,這種方法會因為輸送時的振動而有使製品的捲繞產生不齊之虞。On the other hand, in order to suppress the generation of such a transfer mark, there is a method of weakening the winding force of the tape. However, this method causes the winding of the product to be irregular due to the vibration during transportation.

對此,研究出在預切割形狀下工夫的方法,用以防止這種標籤痕(例如專利文獻1)。In response to this, a method of working in a pre-cut shape has been studied to prevent such label marks (for example, Patent Document 1).

《先行技術文獻》Advanced Technology Literature 《專利文獻》Patent Literature

專利文獻1 日本特開2007-2173號公報Patent Document 1 Japanese Patent Laid-Open Publication No. 2007-2173

但是,如專利文獻1在預切割形狀下工夫的方法,除了形狀調整困難之外,一旦薄膜捲繞張力變強即無法防止標籤痕產生。因而,必須調整捲繞張力。又,以往的捆包方法在搬運線圈時,會有因對製品的一部分施加力量、或手滑而讓製品落下等情形而有對製品造成損傷之虞。However, as in the method of the patent document 1 in the pre-cut shape, in addition to the difficulty in shape adjustment, once the film winding tension is increased, the occurrence of label marks cannot be prevented. Therefore, the winding tension must be adjusted. Further, in the conventional packaging method, when the coil is conveyed, there is a possibility that the product is damaged by applying force to a part of the product or slipping the product.

本發明係鑑於這種問題而研發者,其目的在於提供確實地抑制捲繞不齊,處理性亦優異之切割用黏晶膜之捆包構造及其捆包方法。The present invention has been made in view of such a problem, and an object of the present invention is to provide a packaging structure for a dicing die film for dicing which is excellent in suppressing winding defects and excellent in handleability, and a packaging method therefor.

為了達成前述目的之第1發明,係一種切割用黏晶膜之捆包構造,特徵在於其係具備:由中空的芯、及捲附於前述芯且預切割成預定的形狀之長形的切割用黏晶膜所構成的輥;具有對應前述芯的中空部之凸部的側板;及固定前述輥和前述側板的2條至4條的捆帶;且前述凸部被安裝成嵌合於前述芯的兩端,前述至少2條之捆帶係於前述 側板的部位互相交叉,在一對的各個前述側板被載置成朝向上下方向之狀態下,將上側的前述側板朝上方抬起時的前述側板間的距離變化量,為將前述側板抬起前的前述側板間的距離之1%以下。In order to achieve the above-described first aspect of the invention, there is provided a packaging structure for a die-bonding film for dicing, characterized in that it comprises a hollow core and an elongated cut which is wound into the core and pre-cut into a predetermined shape. a roller formed of a die-bonding film; a side plate having a convex portion corresponding to the hollow portion of the core; and two or four straps fixing the roller and the side plate; and the convex portion is mounted to be fitted to the foregoing At both ends of the core, at least two of the aforementioned straps are tied to the foregoing The amount of change in the distance between the side plates when the side plates of the pair of the side plates are placed in a state in which the side plates are placed in the vertical direction and the upper side plates are lifted upward, before the side plates are lifted The distance between the side plates is 1% or less.

經由前述捆帶固定的前述側板及前述輥,亦可並排2個以上且收容於捆包箱內。The side plate and the roller fixed by the strap may be arranged in two or more rows and housed in the packing box.

在前述側板之前述凸部的相反側面設有凹部,亦可在前述凹部至少有2條之前述捆帶交叉。至少2條之前述捆帶亦可在交叉部互相固定。A recess is provided on an opposite side surface of the convex portion of the side plate, and at least two of the bundles may intersect at the recess. At least two of the aforementioned straps may be fixed to each other at the intersection.

根據第1發明,由於藉由一對側板夾入輥,因此薄膜在輸送中等,不會產生捲繞不齊。又,側板及輥係以至少2條的捆帶交叉之方式被固定,因此不會產生側板偏移。又,藉由將處理時的側板間距離之變化量設定為1%以下之方式,於處理時亦能確實地防止薄膜捲繞不齊。According to the first aspect of the invention, since the roller is sandwiched by the pair of side plates, the film is conveyed at a medium level, and winding is not caused. Further, since the side plates and the roller system are fixed so that at least two of the straps are crossed, the side plate offset does not occur. Further, by setting the amount of change in the distance between the side plates during the treatment to 1% or less, the film can be reliably prevented from being wound at the time of processing.

又,以將2個以上的輥並排收納於捆包箱之方式,捆包箱的層疊性亦優異。又,在側板的外面形成凹部,以將捆帶交叉於凹部之方式,較容易抓取該捆帶,且從捆包箱取出輥之作業等的處理性佳。又,以固定捆帶彼此的交叉部之方式能防止捆帶偏移。In addition, the stacking property of the packing box is also excellent in that two or more rolls are accommodated in a packing box in parallel. Further, a concave portion is formed on the outer surface of the side plate so that the band can be easily caught by the manner in which the band is crossed by the concave portion, and the handling work such as taking out the roller from the packing box is excellent. Moreover, the offset of the strap can be prevented by fixing the intersection of the straps.

第2發明係一種切割用黏晶膜之捆包方法,其特徵在於:將預切割成預定的形狀之長形的切割用黏晶膜捲附於中空的芯而形成輥,將具有對應前述芯的中空部之凸部的一對側板安裝至前述輥,以使前述凸部嵌合於前述芯的兩端,以2條至4條的捆帶在前述側板交叉的方式來固定前述輥和前述側板,以使得一對的各個前述側板於朝向上下方向載置之狀態下,將上側的前述側板朝上方抬起時的前述側 板間的距離變化量,為將前述側板抬起前的前述側板間的距離之1%以下。According to a second aspect of the invention, there is provided a method for packaging a die-bonding film for dicing, characterized in that an elongated die-cut film for pre-cutting into a predetermined shape is wound around a hollow core to form a roll, which has a corresponding core a pair of side plates of the convex portion of the hollow portion are attached to the roller so that the convex portion is fitted to both ends of the core, and the roller and the aforementioned roller are fixed in a manner that two to four straps intersect each other The side plate is such that the side plates of the pair are placed in the up-and-down direction, and the side of the upper side plate is lifted upward. The amount of change in the distance between the plates is 1% or less of the distance between the side plates before lifting the side plates.

裝設前述捆帶後,亦可在彼此的交叉部至少固定有2條的前述捆帶。After the straps are attached, at least two of the straps may be fixed to each other at the intersection.

根據第2發明,能確實地防止薄膜捲繞不齊,並且處理性亦優異,能防止轉印痕產生。According to the second aspect of the invention, it is possible to reliably prevent the film from being wound out, and it is also excellent in handleability, and it is possible to prevent the occurrence of transfer marks.

根據本發明,可提供確實地抑制捲繞不齊且處理性亦優異之切割用黏晶膜之捆包構造及其捆包方法。According to the present invention, it is possible to provide a packing structure for a dicing die film for dicing which is excellent in suppressing winding defects and excellent in handleability, and a packing method therefor.

以下,一邊參照圖式,一邊說明本發明之實施形態。圖1係顯示捆包構造1之分解立體圖,圖2係顯示捆包構造1之立體圖。捆包構造1主要由輥5、側板3、收納袋11、捆帶15、捆包箱13等所構成。Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is an exploded perspective view showing the packing structure 1, and FIG. 2 is a perspective view showing the packing structure 1. The packing structure 1 is mainly composed of a roller 5, a side plate 3, a storage bag 11, a strap 15, a packing box 13, and the like.

輥5係薄膜9捲附於中空的芯7而構成。此外,薄膜9係與圖7所示之薄膜100大致同樣者,其係表面形成有凹凸之切割用黏晶膜。The roll 5 is formed by attaching the film 9 to the hollow core 7. Further, the film 9 is substantially the same as the film 100 shown in Fig. 7, and a film for dicing for embossing is formed on the surface.

薄膜9對芯7的捲繞張力,例如10N至20N左右為佳。若薄膜9的捲繞張力超過20N,則產生依照前述凹凸形狀之轉印痕。又,薄膜9的捲繞張力未達10N時,會有產生薄膜9捲繞不齊等之虞。此外,細節於後述,但通常考慮到捲繞不齊而將薄膜的捲繞張力設定於15N左右,但本發明係以採用以往未有的捆包構造之方式,即使以更低的8N左右捲繞,仍不會產生捲繞不齊。The winding tension of the film 9 to the core 7 is preferably, for example, about 10 N to 20 N. When the winding tension of the film 9 exceeds 20 N, a transfer mark in accordance with the above-described uneven shape is generated. Further, when the winding tension of the film 9 is less than 10 N, the film 9 may be unwound or the like. Further, although the details are described later, the winding tension of the film is usually set to about 15 N in consideration of the winding irregularity. However, the present invention is applied to a lower packing capacity of about 8 N by adopting a conventionally unpacked structure. Winding, still does not produce winding defects.

輥5被放入收納袋11。此外,使用光(紫外線)硬化性組成物等做為構成薄膜9的黏著劑或接著劑時,可使用該 等不透光物做為收納袋11。The roller 5 is placed in the storage bag 11. Further, when a light (ultraviolet) curable composition or the like is used as an adhesive or an adhesive constituting the film 9, the film can be used. The opaque material is used as the storage bag 11.

將輥5放入收納袋11,於脫氣、熱密封之狀態下,其兩端部設有側板3。圖3係顯示側板3之圖,圖3(a)為俯視圖,圖3(b)為圖3(a)的A-A線剖視圖。The roller 5 is placed in the storage bag 11, and the side plates 3 are provided at both end portions in a state of being deaerated and heat-sealed. 3 is a view showing the side plate 3, FIG. 3(a) is a plan view, and FIG. 3(b) is a cross-sectional view taken along line A-A of FIG. 3(a).

側板3係從中央以放射狀形成為肋之大致矩形形狀的構件。側板3的上面之大致中央設有凹部17。又,側板3的下面側之大致中央設有凸部19。凸部19係朝側板下方突出之大致圓柱狀的部位。於側板3的外緣部,在與凸部19的形成方向同方向形成肋。肋之間可以是連續的板狀,也可是如圖3所示隔著貫通的孔。又,側板3的大致矩形形狀之四隅角可以具有角度,也可以如圖3(a)所示描畫弧形。為了使從上下方向施加的力量緩和且不易分散,較佳為隔著孔或/及描畫弧形。此外,側板3的形狀不限於圖示之例,可適當設定側板3的外形、凹部17、凸部19的形狀或大小、或肋形狀等。又,側板3可使用模具等以一次成形製造,亦可分成大致矩形形狀的板和凸部19等零件,予以分別製造後再組合成形。若按各零件製造則可分解並收納製品,因而容易處理。The side plate 3 is a member having a substantially rectangular shape that is radially formed as a rib from the center. A recess 17 is provided substantially at the center of the upper surface of the side plate 3. Further, a convex portion 19 is provided substantially at the center of the lower surface side of the side plate 3. The convex portion 19 is a substantially cylindrical portion that protrudes toward the lower side of the side plate. A rib is formed in the outer edge portion of the side plate 3 in the same direction as the direction in which the convex portion 19 is formed. The ribs may have a continuous plate shape, or may be a through hole penetrating as shown in FIG. Further, the four corners of the substantially rectangular shape of the side plate 3 may have an angle, or may be curved as shown in Fig. 3(a). In order to relax the force applied from the up and down direction and to be difficult to disperse, it is preferable to form a curved shape via a hole or/and a hole. Further, the shape of the side plate 3 is not limited to the illustrated example, and the outer shape of the side plate 3, the shape and size of the concave portion 17, the convex portion 19, the rib shape, and the like can be appropriately set. Further, the side plate 3 can be formed by one molding using a mold or the like, or can be divided into a substantially rectangular plate and a member such as the convex portion 19, and then separately manufactured and then combined. If it is manufactured according to each part, it can be disassembled and stored, so it is easy to handle.

又,薄膜9係用於製造半導體裝置,故而通常係於潔淨室內處理。因此,構成捆包構造1的芯7、側板3、收納袋11、捆帶15等,係以可在潔淨室內處理的樹脂等構成。亦即,紙、厚紙板、纖維等素材不適用。樹脂方面,特別是使用自然分解性的樹脂時能達到減少環境負擔而更佳。Further, since the film 9 is used for manufacturing a semiconductor device, it is usually handled in a clean room. Therefore, the core 7, the side plate 3, the storage bag 11, the strap 15 and the like constituting the packing structure 1 are made of a resin or the like which can be handled in a clean room. That is, materials such as paper, cardboard, and fiber are not suitable. In terms of the resin, it is preferable to reduce the environmental burden particularly when a naturally decomposable resin is used.

其中,變形量相對於來自側板3的側方之1500N的壓縮力,為2%以下較佳。圖4係顯示側板3的壓縮強度實驗方法之概略圖。如圖4所示,在側板3的側方(與凹部17、 凸部19的形成方向垂直之方向)配置夾具21,對於夾具21以1500N的力量賦予壓縮力(圖中箭頭C方向),測定此時的壓縮變形量。若其變形量對原來的寛度超過2%,則輸送時或後述以捆帶固定時,側板3變形且有隨其在薄膜9產生捲繞不齊等之虞。Among them, the amount of deformation is preferably 2% or less with respect to a compressive force of 1500 N from the side of the side plate 3. Fig. 4 is a schematic view showing an experimental method of compressive strength of the side plate 3. As shown in FIG. 4, on the side of the side panel 3 (with the recess 17, The jig 21 is placed in the direction in which the convex portion 19 is formed in the direction perpendicular to the direction in which the convex portion 19 is formed, and the compressive force (direction of the arrow C in the figure) is applied to the jig 21 with a force of 1500 N, and the amount of compressive deformation at this time is measured. When the amount of deformation is more than 2% with respect to the original twist, the side plate 3 is deformed at the time of conveyance or when it is fixed by a strap, and there is a possibility that the film 9 is not wound around the film 9 or the like.

如圖1、圖2所示,側板3的凸部19嵌合安裝於芯7的兩端部之中空部。其中,於將側板3安裝於輥5的狀態下,輥5(薄膜9)被側板3夾入。因此,薄膜9於輥狀態下,其兩側部被側板3固定。As shown in FIGS. 1 and 2, the convex portion 19 of the side plate 3 is fitted and fitted to the hollow portion of both end portions of the core 7. Here, in a state where the side plate 3 is attached to the roller 5, the roller 5 (film 9) is sandwiched by the side plate 3. Therefore, the film 9 is fixed to the side plate 3 at both side portions in the roll state.

其中,將側板3推入芯7時,為了不讓側板3損傷薄膜的側端部,芯7的寛度和薄膜9的寛度大致相同或略小為佳。又,使側板3與芯7嵌合時,為了藉由側板3確實地保持薄膜9的兩側端部,於必要時亦可在側板3和薄膜9側端部的間隙配置緩衝用的彈性構件等。又,若將側板3的尺寸設定成比輥5的外徑稍大,且讓輥5收納於側板3外緣部的肋之內部,則能防止捆包箱內面和輥5之接觸。Here, when the side plate 3 is pushed into the core 7, in order to prevent the side plate 3 from damaging the side end portion of the film, the twist of the core 7 and the twist of the film 9 are preferably substantially the same or slightly smaller. Further, when the side plate 3 is fitted to the core 7, in order to reliably hold both end portions of the film 9 by the side plate 3, a cushioning elastic member may be disposed in the gap between the side plate 3 and the film 9 side end portion as necessary. Wait. Further, when the size of the side plate 3 is set to be slightly larger than the outer diameter of the roller 5, and the roller 5 is housed inside the rib of the outer edge portion of the side plate 3, the contact between the inner surface of the packing box and the roller 5 can be prevented.

如圖2所示,相對於上下端安裝有一對側板3的輥5而言,側板3及輥5係受2條捆帶15固定。捆帶15係以至少2條交叉的方式遍及全周圍裝設在側板3及輥5(收納袋11)的外部,而將側板3及輥5固定。As shown in FIG. 2, the side plate 3 and the roller 5 are fixed by the two straps 15 with respect to the roller 5 in which the pair of side plates 3 are attached to the upper and lower ends. The strap 15 is attached to the outside of the side panel 3 and the roller 5 (the storage bag 11) over the entire circumference in at least two intersecting manners, and the side panel 3 and the roller 5 are fixed.

捆帶為2條時,2條捆帶15係於側板3的大致中央交叉。亦即,2條捆帶15的交叉部為凹部17(圖3)的位置。因而,不讓2條捆帶15的交叉部附近與側板3接觸,而在側板3(凹部17)之間形成間隙。因而,於將輥5抬起時,能將手(指)插入利用凹部17形成的間隙,抓住捆帶15的交叉部而抬起。因而,從捆包箱取出時,能於複數個輥5並排 之狀態下容易地抬起輥5。When there are two straps, the two straps 15 are arranged at substantially the center of the side panel 3. That is, the intersection of the two straps 15 is the position of the recess 17 (Fig. 3). Therefore, the vicinity of the intersection of the two straps 15 is prevented from coming into contact with the side plate 3, and a gap is formed between the side plates 3 (the recesses 17). Therefore, when the roller 5 is lifted up, the hand (finger) can be inserted into the gap formed by the recessed portion 17, and the intersection of the strap 15 can be grasped and lifted. Therefore, when taken out from the packing box, it can be arranged side by side in a plurality of rolls 5 The roller 5 is easily lifted in the state.

又,如圖5所示之捆包構造1a,亦可進一步增加為4條捆帶。於此情形下,4條捆帶係以各2條形成井型狀。因而,在中央部的交叉變得困難而使得容易地抬起輥5一事變得稍微困難,但以將手指等插入斜向的交叉部分予以抬起的方式,即能以良好的平衡取出輥5。又,捆帶為4條時,亦可綁成1條和3條互相交叉。任一者皆可設置1處以上的交叉部,藉此能容易地抬起輥5。Further, the packing structure 1a shown in Fig. 5 can be further increased into four straps. In this case, the four straps are formed in a well pattern by two strips. Therefore, it becomes difficult to easily cross the roller 5 at the center portion, but it is difficult to lift the roller 5 easily, but the roller 5 can be lifted up by inserting a finger or the like into an oblique portion, that is, the roller 5 can be taken out with a good balance. . Further, when there are four straps, one or three straps may be tied to each other. Either one or more intersections can be provided, whereby the roller 5 can be easily lifted.

此外,2條捆帶15的交叉部亦可互相固定。例如,亦可將捆帶15彼此熔接或黏接,或利用其他捆綁構件予以固定。又,亦可在側板3的外緣部設置嵌合捆帶的淺溝,固定捆帶捆綁的位置,藉此誘導交叉部來到凹部17(圖3)的位置。藉由這種方式,使交叉部的位置不會偏移,更為容易處理。Further, the intersections of the two straps 15 can be fixed to each other. For example, the straps 15 can also be welded or bonded to each other or secured by other binding members. Further, a shallow groove in which the strap is fitted may be provided at the outer edge portion of the side plate 3 to fix the position where the strap is bundled, thereby inducing the position where the intersection portion comes to the recess portion 17 (Fig. 3). In this way, the position of the intersection is not shifted and is easier to handle.

又,捆帶15以可帶進潔淨室內的樹脂製為佳。特別是使用自然分解性的樹脂時能達到減少環境負擔而更佳。又,如前述,為了避免抓住捆帶15抬起輥5時捆帶斷掉,拉伸斷裂強度或5%模數為200N以上較佳。Further, the strap 15 is preferably made of a resin that can be carried into the clean room. In particular, it is better to reduce the environmental burden when using a naturally decomposable resin. Further, as described above, in order to avoid the breakage of the strap when the strap 15 is lifted by the strap 15, the tensile breaking strength or the 5% modulus is preferably 200 N or more.

圖6(a)係顯示捆包構造1(捆包箱除外)之前視圖。將輥5配置成一對側板3位於上下方向。於該狀態下,藉由捆帶15使兩側板3對輥5確實地固定。此時的側板3間的距離為H1。Fig. 6(a) is a front view showing the packing structure 1 (excluding the packing box). The roller 5 is disposed such that the pair of side plates 3 are positioned in the up and down direction. In this state, the side plates 3 are reliably fixed to the rolls 5 by the straps 15. The distance between the side plates 3 at this time is H1.

接著,如圖6(b)所示,從該狀態抬起上方的側板3(圖中箭頭B方向)。將輥5完全地抬起時的側板3間的距離為H2。亦即,(H2-H1)係利用捆包構造本身的重量,藉由捆帶15的伸展及側板3的餘份而產生的距離變化量。Next, as shown in FIG. 6(b), the upper side plate 3 (in the direction of the arrow B in the drawing) is lifted from this state. The distance between the side plates 3 when the roller 5 is completely lifted is H2. That is, (H2-H1) is a distance change amount by the extension of the strap 15 and the remainder of the side panel 3 by the weight of the bale structure itself.

本發明係考慮到捆包構造的重量、捆帶15的強度、側板3的餘份等,而將該側板間距離的變化量(H2-H1)設定為H1的1%以下為佳。亦即,設定捆包構造的重量後,相對於其,以成為上述關係的方式設定捆帶15的強度及側板3的餘裕。又,由於切割用黏晶膜於輸送、保管等時,放置於5℃以下的環境中,於處理時放置於常溫中,因而,受溫度變化的影響較小者為佳。具體而言,捆帶15於0℃至30℃中,長邊方向的伸縮率為±1%以內為佳。In the present invention, it is preferable to set the amount of change in the distance between the side plates (H2-H1) to 1% or less of H1 in consideration of the weight of the packing structure, the strength of the band 15, the remainder of the side plates 3, and the like. In other words, after the weight of the packing structure is set, the strength of the band 15 and the margin of the side plate 3 are set so as to have the above relationship. Further, since the dicing die film is placed in an environment of 5 ° C or lower during transportation, storage, or the like, and is placed at room temperature during the treatment, it is preferably less affected by the temperature change. Specifically, in the case of the band 15 at 0 ° C to 30 ° C, the expansion ratio in the longitudinal direction is preferably within ±1%.

如圖1、圖2所示,將如此地形成的輥5等插入捆包箱13。此外,捆包箱13係於運搬、保管時受保護者,於潔淨室內被處理前,內部的輥5等被取出。因此,捆包箱13亦可以厚紙板製。As shown in FIGS. 1 and 2, the roller 5 and the like thus formed are inserted into the packing box 13. Further, the packing box 13 is protected during transportation and storage, and the internal roller 5 or the like is taken out before being processed in the clean room. Therefore, the packing box 13 can also be made of cardboard.

又,圖中,例示將2個輥5收納在捆包箱13,但本發明不限於此。但是,考慮到輸送時的捆包箱之層疊性、處理性,對於一個捆包箱13,收納2捲或4捲的輥5為佳。1捲的輥5會使捆包箱13的底面積變小而變得不穩定,因此困難層疊複數層。又,若6捲以上,則捆包箱13的大小會變大且變重,而變得困難處理。因此,將2捲或4捲的輥5收納於捆包箱13為佳。Moreover, in the figure, the two rolls 5 are exemplified in the packing box 13, but the present invention is not limited thereto. However, in consideration of the lamination property and handleability of the packing box at the time of conveyance, it is preferable to accommodate the roll 5 of 2 rolls or 4 rolls for one packing case 13. The roll 5 of one roll makes the bottom area of the packing case 13 small and becomes unstable, so it is difficult to laminate a plurality of layers. Moreover, when it is six or more rolls, the size of the packing case 13 becomes large and becomes heavy, and it becomes difficult to process. Therefore, it is preferable to store the roll 5 of 2 rolls or 4 rolls in the packing case 13.

如以上說明,根據本發明,由於輥5被側板3夾入,因此捲繞張力比通常弱,而能防止產生捲繞不齊。又,由於側板3的凸部19被嵌合於芯7,因此側板3於運搬時等不會有偏移。又,由於側板3的強度充分,因此亦能防止變形等造成的位置偏移。As described above, according to the present invention, since the roller 5 is sandwiched by the side plate 3, the winding tension is weaker than usual, and the occurrence of winding irregularity can be prevented. Further, since the convex portion 19 of the side plate 3 is fitted to the core 7, the side plate 3 does not shift during transportation or the like. Moreover, since the strength of the side plate 3 is sufficient, positional displacement due to deformation or the like can be prevented.

又,側板3形成有凹部,捆帶15係於凹部17的位置交叉,因此能容易地抓住捆帶15的交叉部以抬起輥5。又, 交叉部為互相固定、或捆帶被固定於捆綁的位置,則交叉部的位置不會偏移。Further, since the side plate 3 is formed with a concave portion and the band 15 is intersected at the position of the concave portion 17, the intersection portion of the band 15 can be easily grasped to lift the roller 5. also, When the intersections are fixed to each other or the straps are fixed to the bundled position, the positions of the intersections are not offset.

又,將側板3朝上下方向配置,以抬起上部的側板3時之側板間的距離變化量為原來的側板間的距離之1%以下之方式,能防止處理時產生捲繞不齊。Moreover, the side plate 3 is arranged in the vertical direction, and the amount of change in the distance between the side plates when the upper side plate 3 is lifted is 1% or less of the distance between the original side plates, and it is possible to prevent the winding from being uneven during the processing.

以上,一邊參照附圖,一邊說明本發明之實施形態,但本發明之技術範圍不受前述實施形態左右。只要是熟習此技藝人士,即能在申請專利範圍所記載之技術思想範疇內想到各種變更例或修正例是當然的,亦明瞭該等當然亦屬於本發明之技術範圍。The embodiments of the present invention have been described above with reference to the drawings, but the technical scope of the present invention is not limited to the above embodiments. It is a matter of course that various modifications and changes can be made without departing from the spirit and scope of the invention.

《實施例》"Embodiment"

對各種捆包形態進行其評價。評價對象之薄膜係作成如圖8所示之切割用黏晶膜來使用。以下,說明各構成之製造方法。The evaluation of various bale forms was carried out. The film to be evaluated was used as a dicing film for dicing as shown in Fig. 8 . Hereinafter, a manufacturing method of each configuration will be described.

<黏合薄膜之製作><Production of adhesive film>

在溶劑之甲苯400g中,將丙烯酸正丁酯128g,丙烯酸2-乙基己酯307g、(甲基)丙烯酸甲酯67g、甲基丙烯酸1.5g、做為聚合起始劑之過氧化苯混合液,適當調整滴下量,調整反應溫度及反應時間,得到具有官能基之化合物(1)的溶液。In 400 g of toluene of a solvent, 128 g of n-butyl acrylate, 307 g of 2-ethylhexyl acrylate, 67 g of methyl (meth)acrylate, and 1.5 g of methacrylic acid were used as a polymerization initiator. The amount of the dropwise addition was appropriately adjusted, and the reaction temperature and the reaction time were adjusted to obtain a solution of the compound (1) having a functional group.

接著於該聚合物溶液,做為具有放射線硬化性碳-碳雙鍵及官能基之化合物(2),另外由甲基丙烯酸和乙二醇合成的(甲基)丙烯酸2-羥乙酯2.5g,將做為聚合抑制劑之氫醌調整適當滴下量並加入,調整反應溫度及反應時間,得到具有放射線硬化性碳-碳雙鍵之化合物(A)的溶液。接著,對化合物(A)溶液中的化合物(A)100質量份,加入做為聚異氰酸 酯(B)的1質量份之日本Polyurethane公司製之CORONET L,將做為光聚合起始劑之0.5質量份日本Ciba-geigy公司製之IRGACURE184、做為溶劑之150質量份之乙酸乙酯,加入化合物(A)溶液並混合,調製放射線硬化性的黏著劑組成物。Next, the polymer solution was used as a compound (2) having a radiation-curable carbon-carbon double bond and a functional group, and 2-hydroxyethyl (meth)acrylate 2.5 g synthesized from methacrylic acid and ethylene glycol. The hydroquinone which is a polymerization inhibitor is adjusted and appropriately added, and the reaction temperature and the reaction time are adjusted to obtain a solution of the compound (A) having a radiation-curable carbon-carbon double bond. Next, 100 parts by mass of the compound (A) in the solution of the compound (A) is added as a polyisocyanate. One part by mass of the ester (B), CORONET L, manufactured by Polyurethane Co., Ltd., is used as a photopolymerization initiator, 0.5 parts by mass of IRGACURE 184 manufactured by Ciba-geigy Co., Ltd., and 150 parts by mass of ethyl acetate as a solvent. The compound (A) solution is added and mixed to prepare a radiation curable adhesive composition.

接著,在厚度100μm之乙烯-乙酸乙烯酯共聚物基材薄膜,將經調製之黏著劑層組成物塗布成乾燥膜厚為20μm,以110℃乾燥3分鐘,製作成黏合薄膜1A。Next, the prepared adhesive layer composition was applied to a film having a thickness of 100 μm to a dry film thickness of 20 μm, and dried at 110 ° C for 3 minutes to prepare an adhesive film 1A.

<脫模薄膜><release film>

脫模薄膜2A係使用厚度25μm之經脫模處理之聚對苯二甲酸乙二酯薄膜。The release film 2A was a release-treated polyethylene terephthalate film having a thickness of 25 μm.

<接合薄膜之製作><Production of bonding film>

在由做為環氧樹脂之甲酚酚醛型環氧樹脂(環氧當量197、分子量1200、軟化點70℃)50質量份、做為矽烷耦合劑之γ-巰丙基三甲基矽烷1.5質量份、γ-脲丙基三乙基矽烷3質量份、由平均粒徑16nm之二氧化矽填料30質量份構成的組成物,加入環己酮並攪拌混合,進一步使用珠磨機混練90分鐘。In the epoxy resin cresol novolac type epoxy resin (epoxy equivalent 197, molecular weight 1200, softening point 70 ° C) 50 parts by mass, as a decane coupling agent γ-mercaptopropyl trimethyl decane 1.5 mass A component comprising 3 parts by mass of γ-ureidopropyltriethyl decane and 30 parts by mass of a cerium oxide filler having an average particle diameter of 16 nm was added to cyclohexanone, stirred and mixed, and further kneaded using a bead mill for 90 minutes.

於其中加入丙烯酸樹脂(質量平均分子量:80萬,玻璃轉移溫度-17℃)100質量份、做為6官能丙烯酸酯單體之聚二季戊四醇六丙烯酸酯5質量份、做為硬化劑之六亞甲基二異氰酸酯之加合物體0.5質量份、curezol 2PZ(日本四國化成(股)製商品名,2-苯基咪唑)2.5質量份,攪拌混合且真空脫氣而得到接著劑。將上述接著劑塗布於脫模薄膜2A上,以110℃加熱乾燥1分鐘,形成膜厚為20μm之B層(stage)狀態(熱硬化性樹脂的硬化中間狀態)的塗膜,在脫模薄膜 2A上形成接著劑層3A並冷藏保管。100 parts by mass of an acrylic resin (mass average molecular weight: 800,000, glass transition temperature - 17 ° C), 5 parts by mass of polydipentaerythritol hexaacrylate as a 6-functional acrylate monomer, and 6-membered as a hardener 0.5 parts by mass of an adduct of methyl diisocyanate and 2.5 parts by mass of curezol 2PZ (trade name of Nippon Kasei Co., Ltd., 2-phenylimidazole) were stirred and mixed, and deaerated under vacuum to obtain an adhesive. The above-mentioned adhesive agent was applied onto the release film 2A, and dried by heating at 110 ° C for 1 minute to form a coating film having a film thickness of 20 μm in a B-stage state (hardened intermediate state of the thermosetting resin), and a release film. The adhesive layer 3A is formed on 2A and stored in a refrigerator.

<預切割之加工><Pre-cutting processing>

使形成有經冷藏保管的接著劑層3A之脫模薄膜2A回到常溫,對接著劑層,調整成朝脫模薄膜的切入深度為10μm以下,進行直徑220 mm的圓形預切割加工。然後,去除接著劑層不要的部分,使脫模薄膜2A於室溫中層疊,以使黏合薄膜1A之黏著劑層與接著劑層相接。然後,對黏合薄膜1A,調整成朝脫模薄膜的切入深度為10μm以下,進行與接著劑層為同心圓狀之直徑290 mm的圓形預切割之加工,以製作成晶圓加工用膠帶4A。The release film 2A on which the adhesive layer 3A having been stored in the refrigerator is formed is returned to normal temperature, and the adhesive layer is adjusted so that the depth of cut into the release film is 10 μm or less, and a circular pre-cut process of 220 mm in diameter is performed. Then, the unnecessary portion of the adhesive layer is removed, and the release film 2A is laminated at room temperature so that the adhesive layer of the adhesive film 1A is in contact with the adhesive layer. Then, the adhesive film 1A is adjusted so that the cut-in depth to the release film is 10 μm or less, and a circular pre-cut process having a diameter of 290 mm concentric with the adhesive layer is performed to prepare a wafer processing tape 4A. .

將根據以上所製作的薄膜以各種方法捆包。The film produced according to the above was bundled in various ways.

(實施例1)(Example 1)

將經預切割加工的晶圓加工用膠帶4A,於開始捲繞和結束捲繞處設置大約1.2m的無標籤部分,以10N捲取300片。將其收納在聚乙烯製袋中,脫氣後予以熱密封並將圖3的形狀之聚丙烯製的側板安裝於兩端部。進一步,將2條PP捆帶捆綁成十字並熔接而接合。側板間的距離變化量(圖5之H2-H1)為側板間的距離(H1)之0.3%。製作2捲相同者,如圖7(a)所示,將2捲收納於厚紙板箱之捆包箱13,而得到實施例1的晶圓加工用膠帶捆包體。The pre-cut processed wafer processing tape 4A was provided with an unlabeled portion of about 1.2 m at the start winding and the end winding, and 300 sheets were taken at 10N. This was housed in a polyethylene bag, degassed, and then heat-sealed, and the side plates made of polypropylene in the shape of Fig. 3 were attached to both end portions. Further, the two PP straps are bundled into a cross and welded to join. The amount of change in the distance between the side plates (H2-H1 in Fig. 5) is 0.3% of the distance (H1) between the side plates. Two rolls of the same volume were produced, and as shown in Fig. 7 (a), two rolls were stored in a packing box 13 of a cardboard box, and the tape processing package for wafer processing of Example 1 was obtained.

(實施例2)(Example 2)

如圖7(b)所示,除了將4捲收納於捆包箱13a以外,與實施例1同樣,而得到實施例2之晶圓加工用膠帶捆包體。As shown in Fig. 7 (b), the wafer processing tape package of Example 2 was obtained in the same manner as in Example 1 except that the four rolls were housed in the packing box 13a.

(實施例3)(Example 3)

除了將PP捆帶捆綁成側板間的距離變化量為1%以外,與實施例1同樣,而得到實施例3之晶圓加工用膠帶 捆包體。The wafer processing tape of Example 3 was obtained in the same manner as in Example 1 except that the PP strap was bundled so that the distance between the side plates was changed by 1%. Bundle body.

(實施例4)(Example 4)

除了將4條捆帶捆綁成井型狀以外,與實施例1同樣,而得到實施例4之晶圓加工用膠帶捆包體。The wafer processing tape package of Example 4 was obtained in the same manner as in Example 1 except that the four straps were bundled into a well pattern.

(實施例5)(Example 5)

除了不熔接2條PP捆帶,而在側板的四邊之外緣部設置溝用以捆綁捆帶以外,與實施例1同樣,而得到實施例5之晶圓加工用膠帶捆包體。The wafer processing tape package of Example 5 was obtained in the same manner as in Example 1 except that the two PP straps were not welded, and the grooves were provided on the outer edges of the four sides of the side panels.

(比較例1)(Comparative Example 1)

除了捲繞張力為40N以外,與實施例1同樣,而得到比較例1之晶圓加工用膠帶捆包體。The wafer processing tape package of Comparative Example 1 was obtained in the same manner as in Example 1 except that the winding tension was 40 N.

(比較例2)(Comparative Example 2)

如圖7(c)所示,除了將1捲收納於捆包箱13b以外,與實施例1同樣,而得到比較例2之晶圓加工用膠帶捆包體。As shown in Fig. 7 (c), the wafer processing tape package of Comparative Example 2 was obtained in the same manner as in Example 1 except that one roll was stored in the packing box 13b.

(比較例3)(Comparative Example 3)

除了側板為牛皮紙製以外,與實施例1同樣,而得到比較例3之晶圓加工用膠帶捆包體。The wafer processing tape package of Comparative Example 3 was obtained in the same manner as in Example 1 except that the side plate was made of kraft paper.

(比較例4)(Comparative Example 4)

除了將PP捆帶捆綁成側板間的距離變化量為2%以外,與實施例1同樣,而得到比較例4之晶圓加工用膠帶捆包體。The wafer processing tape package of Comparative Example 4 was obtained in the same manner as in Example 1 except that the PP tape was bundled into a distance change of 2% between the side plates.

結果顯示於表1。The results are shown in Table 1.

表中的「捲繞不齊」及「轉印痕」係以下述方式評價。首先,將各捆包體保管於冷藏庫內(5℃)1個月後,放在運送用卡車,於冷藏狀態下在日本平塚至神戸間(約1000km)來回。然後,將各捆包體開捆,使輥回到常溫後將包裝袋開封,只固定芯且於自然負重下將輥放置1分鐘後,觀察有無捲繞不齊,若捲繞不齊為2mm以內則為「○」,捲繞不齊為2mm以上則為「×」。The "wound winding" and "transfer marks" in the table were evaluated in the following manner. First, each package was stored in a refrigerator (5 ° C) for one month, and then placed in a transport truck. In a refrigerated state, it was moved back and forth between Japan and the Shrine (about 1000 km). Then, the bundles are bundled, the package is returned to normal temperature, and the package is opened. Only the core is fixed and the roller is placed under natural load for 1 minute, and then the presence or absence of winding is observed. If the winding is not 2 mm. It is "○" inside, and "X" when the winding is 2 mm or more.

接著,解開輥,以目視觀察有無轉印痕並評價。從各種角度目視觀察皆無法確認轉印痕或孔隙者為「◎」,根據角度而能確認若干轉印痕或孔隙者為「○」,從任何角度目視觀察皆能確認薄膜上有轉印痕或孔隙者為「×」。Next, the roll was unwound, and the presence or absence of a transfer mark was visually observed and evaluated. When it is visually observed from various angles, it is impossible to confirm that the transfer marks or voids are "◎", and it is confirmed that some transfer marks or voids are "○" depending on the angle, and any transfer marks or voids on the film can be confirmed by visual observation from any angle. It is "X".

又,將各捆包體層疊3層,於冷藏庫內(5℃)保管1個月後,放在搬運用台車,以0.01m/sec2 至0.25m/sec2 之加速度,觀察有無貨物塌下。無貨物塌下時為「○」,有貨物塌下時為「×」。In addition, each of the bundles was stacked in three layers and stored in a refrigerator (5 ° C) for one month, and then placed in a transporting trolley to observe the presence or absence of a cargo collapse at an acceleration of 0.01 m/sec 2 to 0.25 m/sec 2 . under. "○" when there is no cargo collapse, and "X" when the cargo collapses.

又,將各捆包體開捆,於取出輥時評價處理性。非常 容易處理、處理性及生產性優異者為「◎」,容易處理、處理性及生產性良好者為「○」,處理困難、處理性及生產性差者為「×」。Moreover, each package body was bundled, and the handleability was evaluated at the time of taking out a roll. very much Those who are easy to handle, have excellent handling and productivity, are "◎", and those who are easy to handle, have good handling and productivity are "○", and those who are difficult to handle, have poor handling and productivity are "X".

使用側板的實施例1至實施例3及比較例1至比較例3中未產生捲繞不齊,但側板間的距離變化量大的比較例4中產生捲繞不齊。得知以側板間的距離變化量小的方式能防止捲繞不齊。In the first to third embodiments and the comparative examples 1 to 3 in which the side plates were used, the winding was not generated, but the comparative example 4 in which the amount of change in the distance between the side plates was large was caused to be misaligned. It is known that the winding amount is prevented in such a manner that the amount of change in the distance between the side plates is small.

關於轉印痕,各實施例、比較例皆完全無法抑制,但於捲繞張力高到40N的比較例1中被評價為「×」。亦即,得知根據捲繞張力會使轉印痕的產生有差異。Regarding the transfer marks, each of the examples and the comparative examples was completely uncontrollable, but was evaluated as "x" in Comparative Example 1 in which the winding tension was as high as 40 N. That is, it is known that there is a difference in the generation of transfer marks depending on the winding tension.

關於層疊性,在將1捲收納於捆包箱的比較例2中產生貨物塌下。得知捆包箱收納有2捲以上者,層疊後的穩定性高。Regarding the lamination property, the product was collapsed in Comparative Example 2 in which one roll was stored in the packing box. When it is found that two or more rolls are accommodated in the packing box, the stability after lamination is high.

關於處理性,在將捆帶強力捆包的實施例1至實施例2、實施例5及比較例1中,製品容易取出。實施例3中,捆帶有若干鬆動,因此製品取出性略差。實施例4中,捆帶的交叉部分無凹陷處,因此取出時不易抓住,處理性略差。比較例2中,製品容易取出,但1捲1捲地收納於捆包箱,因而必須1捲1捲地開捆而使得生產性較差。比較例3中,由於使用牛皮紙製的側板,因而無法直接帶入使用製品的潔淨室,必須在潔淨室外取下側板處理,處理性差。比較例4中,捆帶強度弱,因而難以拿著,處理性差。Regarding the handleability, in Examples 1 to 2, Example 5, and Comparative Example 1 in which the bundles were strongly bundled, the product was easily taken out. In the embodiment 3, the bundle has a certain amount of looseness, so that the product take-out property is slightly inferior. In the fourth embodiment, the intersecting portions of the straps have no depressions, so that they are not easily caught when taken out, and the handleability is slightly inferior. In the second comparative example, the product was easily taken out, but it was stored in the bale case in one roll and one roll. Therefore, it was necessary to open the bundle in one roll and one roll, and the productivity was inferior. In Comparative Example 3, since the side plate made of kraft paper was used, it was not possible to directly carry it into the clean room in which the product was used, and it was necessary to remove the side plate treatment in the clean room, and the handleability was poor. In Comparative Example 4, the strength of the band was weak, so that it was difficult to hold and the handleability was poor.

1、1a‧‧‧捆包構造1, 1a‧‧‧ bale structure

3‧‧‧側板3‧‧‧ side panels

5‧‧‧輥5‧‧‧ Roll

7、101‧‧‧芯7, 101‧‧ core

9、100‧‧‧薄膜9, 100‧‧‧ film

11‧‧‧收納袋11‧‧‧ storage bag

13、13a、13b‧‧‧捆包箱13, 13a, 13b‧‧‧ bundled boxes

15‧‧‧捆帶15‧‧‧Band

17‧‧‧凹部17‧‧‧ recess

19‧‧‧凸部19‧‧‧ convex

21‧‧‧夾具21‧‧‧Clamp

103‧‧‧脫模薄膜103‧‧‧ release film

105‧‧‧接著劑層105‧‧‧ adhesive layer

107‧‧‧黏合薄膜107‧‧‧Adhesive film

107a‧‧‧圓形標籤部107a‧‧‧Circular label

107b‧‧‧周邊部107b‧‧‧ peripherals

H1、H2‧‧‧側板3間的距離Distance between H1, H2‧‧‧ side panels 3

圖1係顯示捆包構造1之分解立體圖。Fig. 1 is an exploded perspective view showing the bale structure 1.

圖2係顯示捆包構造1之立體圖。2 is a perspective view showing the bale structure 1.

圖3(a)及(b)係顯示側板3之圖,圖3(a)為俯視圖,圖 3(b)為圖3(a)的A-A線剖視圖。3(a) and 3(b) are views showing the side plate 3, and Fig. 3(a) is a plan view. 3(b) is a cross-sectional view taken along line A-A of Fig. 3(a).

圖4係顯示側板3的壓縮強度實驗方法之概略圖。Fig. 4 is a schematic view showing an experimental method of compressive strength of the side plate 3.

圖5係顯示捆包構造1之分解立體圖。Fig. 5 is an exploded perspective view showing the packing structure 1.

圖6(a)及(b)係顯示將捆包構造1抬起之狀態圖。6(a) and 6(b) are views showing a state in which the bale structure 1 is lifted up.

圖7(a)至(c)係顯示輥5的收納形態圖。7(a) to 7(c) are diagrams showing the storage form of the roller 5.

圖8(a)及(b)係顯示薄膜100之圖,圖8(a)為前視圖,圖8(b)為圖8(a)的D-D線剖視圖。8(a) and 8(b) are views showing the film 100, Fig. 8(a) is a front view, and Fig. 8(b) is a cross-sectional view taken along line D-D of Fig. 8(a).

1‧‧‧捆包構造1‧‧‧Bundle structure

3‧‧‧側板3‧‧‧ side panels

5‧‧‧輥5‧‧‧ Roll

7‧‧‧芯7‧‧ ‧ core

9‧‧‧薄膜9‧‧‧film

11‧‧‧收納袋11‧‧‧ storage bag

13‧‧‧捆包箱13‧‧‧Bundle box

15‧‧‧捆帶15‧‧‧Band

17‧‧‧凹部17‧‧‧ recess

19‧‧‧凸部19‧‧‧ convex

Claims (6)

一種切割用黏晶膜之捆包構造,係具備:輥,係由中空的芯、及捲附於前述芯且預切割成預定形狀之長形的切割用黏晶膜所構成;一對側板,係具有對應前述芯的中空部之凸部;及2條至4條的捆帶,係固定前述輥和前述側板;前述捆帶係在0℃至30℃中,長邊方向的伸縮率為±1%以內;前述凸部被安裝成嵌合於前述芯的一端;至少2條之前述捆帶係於前述側板的部位互相交叉;在一對的各個前述側板被載置成朝向上下方向之狀態下,將上側的前述側板朝上方抬起時的前述側板間的距離變化量,為將前述側板抬起前的前述側板間的距離之1%以下。 A packing structure for a die-bonding film for dicing, comprising: a roll comprising a hollow core and an elongated die-cut film which is wound around the core and pre-cut into a predetermined shape; a pair of side plates, a projection having a hollow portion corresponding to the core; and two to four straps for fixing the roller and the side plate; wherein the strap is in a range of 0 ° C to 30 ° C, and the expansion ratio in the longitudinal direction is ± 1% or less; the convex portion is attached to one end of the core; at least two of the straps are intersected with each other at a portion of the side plate; and each of the pair of side plates is placed in a vertical direction The amount of change in the distance between the side plates when the upper side plate is lifted upward is 1% or less of the distance between the side plates before the side plates are lifted up. 如申請專利範圍第1項之切割用黏晶膜之捆包構造,其中由前述捆帶固定的前述側板及前述輥係並排2個以上且收容於捆包箱內。 The binding structure of the dicing film for dicing according to the first aspect of the invention, wherein the side plate and the roller system fixed by the tying tape are arranged in two or more rows and housed in a packing box. 如申請專利範圍第1項之切割用黏晶膜之捆包構造,其中前述芯的寬度較前述輥的寬度還小,在前述側板之前述凸部的相反側面的中央設有凹部,在前述凹部至少有2條之前述捆帶交叉。 The packing structure of the die-bonding film for cutting according to the first aspect of the invention, wherein the width of the core is smaller than a width of the roller, and a concave portion is provided in a center of the opposite side surface of the convex portion of the side plate, in the concave portion At least two of the aforementioned straps intersect. 如申請專利範圍第1項之切割用黏晶膜之捆包構造,其中至少2條之前述捆帶係於交叉部互相固定。 In the packing structure of the dicing die for cutting according to the first aspect of the invention, at least two of the slats are fixed to each other at the intersection. 一種切割用黏晶膜之捆包方法,係將預切割成預定形狀之長形的切割用黏晶膜捲附於中空的芯而形成輥;將具有對應前述芯的中空部之凸部的一對側板安裝至前 述輥,以使前述凸部嵌合於前述芯的兩端;在0℃至30℃中,使用長邊方向的伸縮率為±1%以內的捆帶;以2條至4條的前述捆帶在前述側板交叉的方式來固定前述輥和前述側板,以使一對的各個前述側板在朝向上下方向載置之狀態下,將上側的前述側板朝上方抬起時的前述側板間的距離變化量,為將前述側板抬起前的前述側板間的距離之1%以下。 A method for packaging a die-bonding film for cutting, wherein a long-shaped die-cut film for pre-cutting into a predetermined shape is wound around a hollow core to form a roll; and a convex portion having a hollow portion corresponding to the core is formed Install the side panel to the front The roller is such that the convex portion is fitted to both ends of the core; at 0 ° C to 30 ° C, a stretch band having a stretch ratio of ±1% in the longitudinal direction is used; and the bundle of two to four is used. The distance between the side plates when the upper side plate is lifted upward in a state where the pair of the side plates are placed in the vertical direction so that the pair of side plates are placed in the vertical direction The amount is 1% or less of the distance between the side plates before lifting the side plates. 如申請專利範圍第5項之切割用黏晶膜之捆包方法,其係在裝設前述捆帶後,在彼此的交叉部固定至少有2條的前述捆帶。 The method for packaging a dicing film for dicing according to claim 5, wherein after the tying is attached, at least two of the slats are fixed at intersections of the two.
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