TWI577777B - Wafer processing tape - Google Patents

Description

Wafer processing tape

The present invention relates to a tape for wafer processing, and more particularly to a tape for wafer processing having two functions of a die dicing tape and a die bond film.

Recently, a die cutting/die bonding tape is being developed which combines a die cutting tape for fixing a semiconductor wafer when the semiconductor wafer is cut and separated (die-cut) into individual wafers, and is used for cutting The broken semiconductor wafer is bonded to a lead frame or a package substrate or the like, or two functions of a die bond film (also referred to as a die attach film) for laminating and adhering semiconductor wafers to each other in a stacked package.

As such a die cutting/die bonding tape, pre-cut processing may be performed in consideration of operability such as attachment to a wafer or mounting to a ring frame at the time of die cutting.

An example of a die cutting/die bonding tape after pre-cut processing is shown in FIGS. 4 and 5. 4 is a view showing a state in which a die cutting/die bond tape is wound into a roll shape, and FIG. 5(a) is a die cutting/ A plan view of the die bond tape, and Fig. 5(b) is a cross-sectional view based on line B-B of Fig. 5(a). The die cutting/die bonding tape 50 includes a release film 51, an adhesive layer 52, and an adhesive film 53. The subsequent agent layer 52 is processed into a circular shape corresponding to the shape of the wafer and has a circular label shape. The adhesive film 53 has a peripheral portion of a circular portion corresponding to the shape of the annular frame for die cutting, and as shown, has a circular label portion 53a and a peripheral portion 53b surrounding the outer side thereof. The adhesive layer 52 and the circular label portion 53a of the adhesive film 53 are laminated so as to be aligned with each other, and the circular label portion 53a of the adhesive film 53 covers the adhesive layer 52 and is in contact with the release film 51 around the adhesive layer 51.

When the wafer die is cut, the release film 51 is peeled off from the adhesive layer 52 and the adhesive film 53 in a laminated state, and as shown in FIG. 6, the back surface of the semiconductor wafer W is attached to the adhesive layer 52, and the adhesive film is bonded. The outer peripheral portion of the circular label portion 53a of 53 is bonded and fixed to the ring-shaped frame R for die cutting. In this state, the semiconductor wafer W is diced, and then the adhesion film 53 is subjected to a curing treatment such as ultraviolet irradiation to pick up the semiconductor wafer. At this time, since the adhesive force of the adhesive film 53 is lowered by the curing treatment, it is easy to peel off from the adhesive layer 52, and the semiconductor wafer is picked up while the adhesive layer 52 is adhered to the back surface. The adhesive layer 52 attached to the back surface of the semiconductor wafer functions as a grain bonding film when the semiconductor wafer is subsequently attached to a lead frame, a package substrate, or other semiconductor wafer.

Further, as in the above-described die cutting/die bonding tape 50, the portion where the adhesive layer 52 and the circular label portion 53a of the adhesive film 53 are laminated is thicker than the peripheral portion 53b of the adhesive film 53. Therefore, when the product is wound into a roll shape, the circular layer of the adhesive layer 52 and the adhesive film 53 The difference in height between the laminated portion of the portion 53a and the peripheral portion 53a of the adhesive film 53 overlaps with each other, and the transfer height difference occurs on the surface of the flexible adhesive layer 52, that is, the transfer mark as shown in Fig. 7 (also called Label marks, wrinkles, or winding marks). The occurrence of such a transfer mark is remarkable particularly in the case where the adhesive layer 52 is formed of a soft resin, the case where the thickness is present, and the case where the number of windings of the tape 50 is large. Then, when a transfer mark is generated, there is a possibility that a defect occurs in the processing of the wafer due to a defect in adhesion between the adhesive layer and the semiconductor wafer.

In order to solve such a problem, a tape for wafer processing has been developed which is a second surface of a release film opposite to the first surface on which the adhesive layer and the adhesive film are provided, and on the short side of the release film. Support members are provided at both ends of the direction (for example, refer to Patent Document 1). Since such a wafer processing tape is provided with a support member, when the wafer processing tape is wound into a roll shape, the winding pressure applied to the tape can be dispersed or concentrated on the support member, so that the support can be suppressed. The formation of a transprint of the layer of the agent is then carried out.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 4360653

The adhesive film covers the adhesive layer and is in contact with the release film around it, but depending on the thickness of the adhesive layer, sometimes between the release film and the adhesive film Produces very small gaps and residual air. The tape for wafer processing described in the above-mentioned Patent Document 1 is provided with a support member at both end portions in the short-side direction of the release film. Therefore, in a state in which the wafer processing tape is wound into a roll shape, a hollow structure is formed between the label portion and the release film wound thereon, and the support member needs to be set to have a large width in order to prevent the label mark. There is a problem in that the air (air) cannot move to the outside of the label portion and enters between the adhesive layer and the adhesive film. The air that intrudes between the adhesive layer and the adhesive film is also referred to as a void, and there is a defect in which the semiconductor wafer W is poorly bonded, a subsequent die cutting process of the semiconductor wafer W, or a wafer pick-up procedure. The possibility of a reduction in the yield of the bonding process.

Therefore, an object of the present invention is to provide a wafer processing tape which can reduce the occurrence of label marks and reduce the air (air) wound between the adhesive layer and the adhesive film.

In order to solve the above problems, the tape for wafer processing according to the present invention has a long release film, and an adhesive layer is provided on the first surface of the release film and has a predetermined planar shape. The adhesive film has a label portion and a peripheral portion surrounding the outer side of the label portion, and the label portion is provided to cover the adhesive layer and is in contact with the release film around the adhesive layer, and has a predetermined shape. a planar shape; and a support member provided on the second surface of the release film opposite to the first surface on which the adhesive layer and the adhesive film are provided, and before In one region of the adhesive layer in which the end portion in the short-side direction of the release film is further outward, a plurality of the adhesive layer are provided along the short-side direction of the release film.

Preferably, in the above-mentioned support member provided in the one region, the tape for semiconductor processing has the thickest thickness on the side close to the adhesive layer.

Further, in the above-mentioned tape for semiconductor processing, it is preferable that the width of each of the support members is 10 to 15 mm, and the distance between the support members provided in the one region is 5 mm or more.

According to the present invention, it is possible to reduce the occurrence of label marks and to reduce the winding of air between the adhesive layer and the adhesive film.

10‧‧‧ Wafer processing tape

11‧‧‧ release film

12‧‧‧ adhesive layer

13‧‧‧Adhesive film

13a‧‧‧Circular label

13b‧‧‧ peripherals

14, 14', 14" ‧ ‧ support members

Fig. 1(a) is a plan view of a wafer processing tape according to an embodiment of the present invention, and Fig. 1(b) is a cross-sectional view taken along line A-A of (a).

2 is a cross-sectional view showing a tape for wafer processing according to another embodiment of the present invention.

3 is a cross-sectional view showing a tape for wafer processing according to still another embodiment of the present invention.

4 is a perspective view of a conventional tape for wafer processing.

Fig. 5 (a) is a plan view of a conventional wafer processing tape, and Fig. 5 (b) is a cross-sectional view taken along line B-B of (a).

Fig. 6 is a cross-sectional view showing a state in which a tape for wafer processing is bonded to a ring frame for die cutting.

FIG. 7 is a schematic view for explaining a problem of the conventional wafer processing tape.

Embodiments of the present invention will be described in detail below based on the drawings. 1(a) is a plan view of a wafer processing tape (die cutting/die bonding tape) according to an embodiment of the present invention, and FIG. 1(b) is a cross-sectional view taken along line AA of FIG. 1(a). .

As shown in FIGS. 1(a) and 1(b), the wafer processing tape 10 has a long release film 11, an adhesive layer 12, an adhesive film 13, and a support member 14.

The adhesive layer 12 is provided on the first surface of the release film and has a circular label shape corresponding to the shape of the wafer. The adhesive film 13 has a circular label portion 13a and a peripheral portion 13b surrounding the outer side of the circular label portion 13a. The circular label portion 13a covers the adhesive layer 12 and is in contact with the release film around the adhesive layer 12. Way to set. The peripheral portion 13b includes a form in which the outer side of the circular label portion 13a is completely surrounded, and a form that is not completely surrounded as shown in the drawing. The circular label portion 13a has a shape corresponding to the annular frame for die cutting. Further, the support member 14 is provided on the second surface 11b of the release film 11 opposite to the first surface 11a on which the adhesive 12 and the adhesive film 13 are provided, and is shorter than the release film 11 of the adhesive layer 12. a portion r in the outer side of the edge in the side direction, along the aforementioned stripping A plurality of short sides of the film 11 are provided.

Hereinafter, each component of the wafer processing tape 10 of the present embodiment will be described in detail.

(release film)

As the release film 11 used in the wafer processing tape 10 of the present invention, polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE), and copolymer (EVA, EEA) can be used. , EBA), or a film in which a part of these materials are replaced to further improve adhesion and mechanical strength. Further, it may be a laminate of these films.

The thickness of the release film is not particularly limited and may be appropriately set, but is preferably 25 to 50 μm.

(adhesive layer)

As described above, the adhesive layer 12 of the present invention has a circular label shape formed on the first surface 11a of the release film 11 and corresponding to the shape of the wafer.

After attaching the die-cut semiconductor wafer or the like, the adhesive layer 12 adheres to the back surface of the wafer when the wafer is picked up, and is used as an adhesive when the wafer is fixed to the substrate or the lead frame. As the adhesive layer 12, an adhesive containing at least one selected from the group consisting of an epoxy resin, an acrylic resin, and a phenol resin can be preferably used. In addition to this, a polyimide-based resin or an anthrone-based resin can also be used. The thickness can be appropriately set, but it is preferably about 5 to 100 μm.

(adhesive film)

As described above, the adhesive film 13 of the present invention has a circular label portion 13a corresponding to the shape of the annular frame for die cutting and a peripheral portion 13b surrounding the outer side. Such an adhesive film can be formed by removing the peripheral region of the circular label portion 13a from the film adhesive by pre-cut processing.

The adhesive film 13 is not particularly limited as long as it has a sufficient adhesive force to prevent the wafer from being peeled off when the wafer die is cut, and exhibits a low adhesion which can be easily peeled off from the adhesive layer when the wafer is picked up after the die cutting. You can do it. For example, an adhesive film in which a binder layer is provided on a substrate film can be suitably used.

The base film of the adhesive film 13 is not particularly limited as long as it is a conventionally known base film. However, when a radiation curable material is used as a binder layer to be described later, it is preferable to use a substrate film having radiation transparency. .

For example, examples of the material thereof include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, and ethylene-acrylic acid B. Homopolymer or copolymer of an α-olefin such as an ester copolymer, an ethylene-methyl acrylate copolymer, an ethylene-acrylic acid copolymer, an ionomer, or a mixture thereof, a polyurethane, a styrene-ethylene-butylene or a pentene system Thermoplastic elastomers such as copolymers, polyamine-polyol copolymers, and mixtures thereof. Further, the base film may be a base film obtained by mixing two or more kinds of materials selected from the group consisting of them, or may be a base film obtained by laminating them in a single layer or a plurality of layers.

The thickness of the base film is not particularly limited and may be appropriately set, but is preferably 50~200μm.

The resin to be used in the adhesive layer of the adhesive film 13 is not particularly limited, and a known chlorinated polypropylene resin, an acrylic resin, a polyester resin, a urethane resin, an epoxy resin or the like used in the adhesive can be used.

An adhesive such as an acrylic adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent, or the like is preferably blended in the resin of the adhesive layer 13 to prepare a binder. The thickness of the adhesive layer 13 is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

The radiation polymerizable compound can be blended in the binder layer and can be easily peeled off from the adhesive layer by radiation curing. As the radiation polymerizable compound, for example, a low-component compound having at least two or more photopolymerizable carbon-carbon double bonds in the molecule which can be three-dimensionally networked by light irradiation can be used.

Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butanediol diacrylate, 1 can be used. , 6-hexanediol diacrylate, polyethylene glycol diacrylate or oligoester acrylate.

Further, in addition to the acrylate-based compound as described above, a urethane acrylate-based oligomer may be used. A polyol compound such as a polyester type or a polyether type can be obtained with a polyvalent isocyanate compound (for example, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-xylylene diisocyanate, 1 , 4-xylylene diisocyanate, two a terminal isocyanate urethane prepolymer obtained by reacting phenylmethane 4,4-diisocyanate or the like with an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl acrylate, methacrylic acid - 2-hydroxyethyl ester, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.) to obtain a urethane acrylate An oligomer.

The binder layer may be a mixture of two or more selected from the above resins.

When a photopolymerization initiator is used, for example, benzoin isopropyl ether, benzoin isobutyl ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecyl thioxanthone, or the like may be used. Dimethyl thioxanthone, diethyl thioxanthone, benzyldimethylketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethyl phenylpropane, and the like. The amount of the photopolymerization initiator to be added is preferably 0.01 to 5 parts by mass based on 100 parts by mass of the acrylic copolymer.

(support member)

The second surface 11b of the release film 11 opposite to the first surface 11a on which the adhesive 12 and the adhesive film 13 are provided is furthermore than the end portion of the adhesive layer 12 in the short side direction of the release film 11. In one region r on the outer side, a plurality of support members 14 are provided in the short side direction of the release film 11. By providing the support member 14 in this manner, when the wafer processing tape 10 is wound into a roll shape, the winding pressure applied to the tape can be dispersed or concentrated on the support member 14, and thus the adhesive can be suppressed. Formation of a transprint of layer 12.

In addition, by providing a plurality of support members 14 in the short side direction of the release film 11 in a region r outside the end portion of the adhesive layer 12 in the short-side direction of the release film 11, it is possible to reduce The width of one support member 14 to be disposed in one region r (the length in the short side direction of the release film 11). When the width of the support member such as the wafer processing tape described in the prior art document 1 is large, the upper surface of the adhesive film is pressed by the support member in a state of being wound into a roll shape, and therefore, according to the adhesive layer 12 The air remaining in the gap between the release film 11 and the circular label portion 13a cannot move to the outside of the circular label portion 13a, but in the case where the width of the support member 14 is small, the adhesive film The region where the upper surface of the upper surface 13 is pressed by the support member 14 becomes smaller in the short-side direction of the release film 11, and therefore the air remaining in the gap between the release film 11 and the circular label portion 13a against the pressing force thereof is opposed. (air) can move to the outside of the circular label portion 13a.

Further, an area outside the end portion of the adhesive layer 12 in the short-side direction of the release film 11 is as shown in FIG. 1, and there are two places on the right side end portion of the release film 11 and the left end portion of the paper surface. Since a plurality of support members 14 are provided in the short side direction of the release film 11 in one region r, one case is not included in the right end portion of the release surface of the release film 11 and the left end portion of the paper surface.

In addition, in FIG. 1, two support members 14 are provided in the right end portion of the release surface of the release film 11 and the left end portion of the paper surface, but there are no particular limitations as long as they are two or more. Further, a plurality of branches may be provided at one end of the right side of the paper surface of the release film 11 and the left end of the paper surface. Bearing member 14.

When the support member is formed on the first surface 11a in which the adhesive 12 and the adhesive film 13 are provided, the width of the support layer is limited. On the other hand, in the configuration of the present embodiment, the width of the support member 14 can be more widely ensured. It is possible to suppress the generation of transfer marks more effectively. Further, by providing the support member 14 on the second surface 11b of the release film 11, the effect of increasing the tolerance of the positional deviation of the support member 14 can be obtained.

The support members 14 preferably each have a width of 10 to 15 mm, and the interval between the support members 14 provided in one region r is 5 mm or more. By setting the width of each of the support members 14 to 10 to 15 mm, the air becomes more easily discharged to the outside of the label portion 13a against the pressing force based on the support member 14. In addition, by setting the interval between the support members 14 provided in one region r to 5 mm or more, a gap into which the air moving outward can enter can be formed, so that the air is more easily discharged to the outside of the label portion 13a.

The thickness of the support member 14 is the thickness corresponding to the difference in height between the adhesive layer 12 on the release film 11 and the laminated portion of the circular label portion 13a of the adhesive film 13 and the peripheral portion 13b of the adhesive film 13, that is, The agent layer 12 may be the same or above. Fig. 2 is a cross-sectional view showing an example of a support member 14' thicker than the adhesive layer 12.

When the support member has such a thickness, when the tape 10 is wound, the adhesive film 13 comes into contact with the second surface 11b of the release film 11 overlapping the surface thereof, or forms a space therebetween without contact, and thus does not pass through the adhesive. The film 13 strongly presses the second side of the release film 11 toward the soft adhesive layer 12. 11b. Thereby, the generation of transfer marks can be more effectively suppressed.

The support member 14 provided in one region r can set the thickness of the side close to the adhesive layer 12 to be the thickest. Thereby, in the state of being wound into a roll shape, the pressing force by the support member 14 on the outer side of the label portion 13a is low, and therefore the air is easily discharged to the outside of the label portion 13a.

The support member 14 may be provided intermittently or continuously along the longitudinal direction of the release film 11, but it is preferably provided continuously along the longitudinal direction of the base film 11 from the viewpoint of more effectively suppressing the generation of transfer marks.

Moreover, it is preferable that the support member 14 has a material having a certain coefficient of friction with respect to the adhesive film 13 from the viewpoint of preventing the winding offset of the wafer processing tape 10 . Thereby, it is possible to prevent the winding deviation of the wafer processing tape 10, and it is possible to obtain an effect that the winding can be performed at a high speed and the number of windings can be increased.

Further, the static friction coefficient between the support member 14 and the base film of the adhesive film 13 is preferably 0.2 to 2.0, and more preferably 0.6 to 1.6. When the wafer processing tape is wound into a roll shape, the peripheral portion 13a of the adhesive film 13 provided on the first surface 11a side of the release film 11 and the support provided on the second surface 11b side of the release film 11 are provided. When the member 14 is in contact with each other, the coefficient of static friction between the support member 14 and the base film of the adhesive film 13 is as small as less than 0.2, and the winding deviation is likely to occur at the time of manufacture and use, and the workability is deteriorated. On the other hand, when it is more than 2.0, the resistance between the base film of the adhesive film 13 and the support member 14 is too large, and the operability of the manufacturing process is deteriorated, or the bending progress is performed at the time of high-speed winding. Therefore, by setting the static friction coefficient between the two to the above range, the wafer processing tape 10 can be prevented. The winding is offset to obtain an effect of enabling high-speed winding and increasing the number of windings.

In the present invention, the static friction coefficient between the support member 14 and the base film of the adhesive film 13 can be obtained by the following measurement method in accordance with JIS K7125.

The base film of the adhesive film 13 respectively cut into 25 mm (width) × 100 mm (length) was superposed on the two film samples of the support member 14, and the film on the lower side was fixed. Then, a weight of 200 g was placed on the laminated film as a load W, and the upper film was stretched at a speed of 200 mm/min, and the force Fd (g) at the time of slipping was measured, and the static friction coefficient was obtained by the following formula ( Dd).

Dd=Fd/W

As the support member 14, for example, an adhesive tape to which a resin film substrate is coated with an adhesive can be suitably used. The wafer processing tape 10 of the present embodiment can be formed by attaching such an adhesive tape to a predetermined position of both end portions of the second surface 11b of the release film 11.

The base material resin which is an adhesive tape is not particularly limited as long as it satisfies the range of the above linear expansion coefficient and can withstand the winding pressure, but is preferably from polyethylene terephthalate in terms of heat resistance, smoothness, and ease of availability. Selected among glycol esters (PET), polypropylene, and high density polyethylene.

The composition and physical properties of the adhesive for the adhesive tape are not particularly limited as long as they are not removed from the release film 11 in the winding process and the storage procedure of the tape 10. Peel off.

Further, as the support member 14, a colored support member can be used. By using such a colored support member, when the wafer processing tape is wound into a roll shape, the type of the tape can be clearly recognized. For example, by changing the color of the coloring support member 14 depending on the type and thickness of the tape for wafer processing, the type and thickness of the tape can be easily recognized, and occurrence of human error can be suppressed and prevented.

[Examples]

Next, embodiments of the invention will be described, but the invention is not limited to the embodiments.

(1) Production of adhesive film

(adhesive film 1A)

The amount of dripping was appropriately adjusted to 400 g of the solvent toluene, and 128 g of n-butyl acrylate, 307 g of 2-ethylhexyl acrylate, 67 g of methyl methacrylate, 1.5 g of methacrylic acid, and benzoic acid peroxide as a polymerization initiator were added dropwise. The reaction mixture and the reaction time were adjusted to obtain a solution of the compound (1) having a functional group.

Next, in the polymer solution, the amount of the dropwise addition is appropriately adjusted, and methacrylic acid-2- which is separately synthesized from methacrylic acid and ethylene glycol, which is a compound (2) having a radiation-curable carbon-carbon double bond and a functional group, is added. 2.5 g of hydroxyethyl ester, hydroquinone as a polymerization inhibitor, and the reaction temperature and reaction time were adjusted to obtain a solution of the compound (A) having a radiation curable carbon-carbon double bond. Next, in the solution of the compound (A), 100 parts by mass of the compound (A) in the solution of the compound (A) in the solution of the compound (A) is added to a Japanese polyurethane company as a polyisocyanate (B): coronate L 1 part by mass. A radiation-curable adhesive composition was prepared by mixing with 0.5 parts by mass of Irgacure-184 and 150 parts by mass of ethyl acetate as a solvent, which were prepared as a photopolymerization initiator.

Next, the prepared adhesive layer composition was applied to the ethylene-vinyl acetate copolymer base film having a thickness of 100 μm so as to have a dry film thickness of 20 μm, and dried at 110 ° C for 3 minutes to prepare an adhesive film 1A.

(2) release film

The release film 2A shown below was used.

Release film 2A: release-treated polyethylene terephthalate film having a thickness of 38 μm

(3) Formation of an adhesive layer

(adhesive layer 3A)

50 parts by mass of a cresol novolac type epoxy resin (epoxy equivalent 197, molecular weight 1200, softening point 70 ° C) as an epoxy resin, γ-mercaptopropyltrimethoxide as a decane coupling agent 1.5 parts by mass of decane, 3 parts by mass of γ-mercaptopropyltriethoxy decane, and 30 parts by mass of a cerium oxide filler having an average particle diameter of 16 nm, cyclohexanone was added and stirred, and further, a bead mill was used. Mix for 90 minutes.

Adding an acrylic resin to it (mass average molecular weight: 800,000, glass 100 parts by mass of a glass transition temperature of -17 ° C), 5 parts by mass of dipentaerythritol hexaacrylate as a 6-functional acrylate monomer, 0.5 parts by mass of an adduct of hexamethylene diisocyanate as a curing agent, and Curezol 2PZ (four 2.5 parts by mass of a product name of 2-Phenylimidazole manufactured by Kokusai Kasei Co., Ltd., stirred and mixed, and deaerated under vacuum to obtain an adhesive.

The above-mentioned adhesive was applied onto the release film 2A, and dried by heating at 110 ° C for 1 minute to form a coating film having a film thickness of 20 μm in a B-stage state (solidified state of the thermosetting resin), and an adhesive layer was formed on the release film 2A. 3A, cold storage.

(adhesive layer 3B)

The above-mentioned adhesive was applied onto the release film 2A, and dried by heating at 110 ° C for 1 minute to form a coating film having a film thickness of 60 μm in a B-stage state (solidified state of the thermosetting resin), and an adhesive layer was formed on the release film 2A. 3B, cold storage.

(adhesive layer 3C)

The above-mentioned adhesive was applied onto the release film 2A, and dried by heating at 110 ° C for 1 minute to form a coating film having a film thickness of 120 μm in a B-stage state (solidified state of the thermosetting resin), and an adhesive layer was formed on the release film 2A. 3C, storage in cold storage.

(4) Production of supporting members

(support member 4A)

100 parts by mass of an acrylic resin (mass average molecular weight: 600,000, glass transition temperature: -20 ° C), and 10 parts by mass of a polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., trade name: coronate L) as a curing agent were mixed. A binder composition is obtained.

The pressure-sensitive adhesive composition was applied to a low-density polyethylene film having a thickness of 40 μm so as to have a dry film thickness of 20 μm, dried at 110 ° C for 3 minutes, and the obtained adhesive tape was cut into a width of 10 mm to prepare a support member 4A. .

(support member 4B)

The support member 4B was produced in the same manner as the support member 4A except that the adhesive tape obtained above was cut to have a width of 15 mm.

(support member 4C)

The support member 4C was produced in the same manner as the support member 4A except that the adhesive tape obtained above was cut to have a width of 25 mm.

(support member 4D)

The adhesive composition was applied to a low-density polyethylene film having a thickness of 40 μm so as to have a dry film thickness of 32 μm, dried at 110 ° C for 3 minutes, and the obtained adhesive tape was cut into a width of 10 mm to prepare a support member 4D.

(support member 4E)

Except that the adhesive tape obtained above was cut to a width of 15 mm, A support member 4E is produced in the same manner as the support member 4D.

(support member 4F)

The support member 4F was produced in the same manner as the support member 4D except that the adhesive tape obtained above was cut to have a width of 25 mm.

(support member 4G)

The above-mentioned adhesive composition was applied to a polyethylene terephthalate film having a thickness of 100 μm so as to have a dry film thickness of 30 μm, dried at 110 ° C for 3 minutes, and the obtained adhesive tape was cut into a width of 15 mm to prepare. The support member 4G.

(support member 4H)

The support member 4H was produced in the same manner as the support member 4G except that the adhesive tape obtained above was cut to have a width of 25 mm.

(Example 1)

The release film 2A in which the adhesive layer 3A was formed after the storage was stored was returned to normal temperature, and the adhesive layer was adjusted so that the depth of the release film was 10 μm or less, and a circular pre-cutting process of 220 mm in diameter was performed. . Thereafter, the unnecessary portion of the adhesive layer is removed, and the release film 2A is laminated at room temperature so that the adhesive layer of the adhesive film 1A comes into contact with the adhesive layer. Then, the adhesive film 1A is adjusted so as to have a depth of cut of 10 μm or less to the release film, and is straightened concentrically with the adhesive layer. Circular pre-cutting with a diameter of 290mm. Then, the second surface opposite to the first surface on which the adhesive layer and the adhesive film are provided on the release film 2A, and the region r at both end portions in the short-side direction of the release film 2A are spaced apart from each other by 10 mm. The wafer processing tape of Example 1 having the structure shown in Fig. 1 was produced by the joint supporting member 4A.

(Example 2)

The wafer processing tape of Example 2 was produced in the same manner as in Example 1 except that the support member 4G was used instead of the support member 4A and the interval between the support members was set to 5 mm.

(Example 3)

A wafer processing tape of Example 3 was produced in the same manner as in Example 1 except that the support member 4D was used instead of the support member 4A and the adhesive layer 3B was used instead of the adhesive layer 3A.

(Example 4)

The wafer processing tape of Example 4 was produced in the same manner as in Example 3 except that the support member 4G was used instead of the support member 4D and the interval between the support members was set to 5 mm.

(Example 5)

A wafer processing tape of Example 5 was produced in the same manner as in Example 4 except that the adhesive layer 3C was used instead of the adhesive layer 3B.

(Example 6)

The wafer processing tape of Example 6 was produced in the same manner as in Example 5 except that the support member G was used in the vicinity of the adhesive layer and the support member E was used on the end side.

(Comparative Example 1)

The release film 2A in which the adhesive layer 3A was formed after the storage was stored was returned to normal temperature, and the adhesive layer was adjusted so that the depth of the release film was 10 μm or less, and a circular pre-cutting process of 220 mm in diameter was performed. . Thereafter, the unnecessary portion of the adhesive layer is removed, and the release film 2A is laminated at room temperature so that the adhesive layer of the adhesive film 1A comes into contact with the adhesive layer. Then, the adhesive film 1A is adjusted so as to have a depth of cut to the release film of 10 μm or less, and a circular pre-cut process having a diameter of 290 mm is concentrically formed with the adhesive layer, leaving a circular label portion and a peripheral portion. Removed other unwanted parts. Then, one support member 4C was bonded to the second surface of the release film 2A opposite to the first surface on which the adhesive layer and the adhesive film were provided, and the support member 4C was bonded to both end portions of the release film 2A in the short-side direction. The tape for wafer processing of Comparative Example 1 having the structure shown in FIG. 1 of Patent Document 1 is known.

(Comparative Example 2)

A wafer processing tape of Comparative Example 2 was produced in the same manner as in Comparative Example 1, except that the adhesive layer 3B was used instead of the adhesive layer 3A.

(Comparative Example 3)

A wafer processing tape of Comparative Example 3 was produced in the same manner as in Comparative Example 1, except that the support member 4H was used instead of the support member 4C and the adhesive layer 3B was used instead of the adhesive layer 3A.

(Comparative Example 4)

A wafer processing tape of Comparative Example 4 was produced in the same manner as in Comparative Example 1, except that the support member 4H was used instead of the support member 4C and the adhesive layer 3C was used instead of the adhesive layer 3A.

(Comparative Example 5)

A wafer processing tape of Comparative Example 5 was produced in the same manner as in Comparative Example 2 except that the support member was not provided.

[Evaluation of the inhibition of label marks]

The wafer processing tapes of the examples and the comparative examples were wound into a roll shape so that the number of the circular-shaped adhesive films was 300 sheets, and a tape roll for wafer processing was produced. The obtained wafer processing tape roll was stored in a refrigerator (5 ° C) for one month. After that, the wafer processing tape roll was returned to room temperature, and the roll was unwound, and the presence or absence of the label mark was visually observed. The wafer processing tape was evaluated in three levels of ○, Δ, and × based on the following evaluation criteria. The inhibition of the transfer marks. The results are shown in Tables 1 and 2.

○ (good product): It is impossible to visually observe the label marks from various angles. trace

△ (allowable product): It is possible to confirm the label trace but not to affect the processing procedure of the semiconductor device.

× (defective product): It can be confirmed that there is a label trace that may affect the processing procedure of the semiconductor device.

[Evaluation of inhibition of air entrapment]

The wafer processing tapes of the examples and the comparative examples were wound into a roll shape so that the number of the circular-shaped adhesive films was 200, and a tape roll for wafer processing was produced. The obtained roll of the wafer processing tape was placed in a packaging bag, stored in a refrigerator (5 ° C) for one month, and then stored in a dry ice atmosphere having a surface of -50 ° C for 3 days. After that, the wafer processing tape roll is returned to normal temperature, the package bag is unsealed, the roll is unwound, and the presence or absence of air is visually observed, and the air is discharged to the outside of the circular label portion, at the adhesive layer and the adhesive film. The evaluation of the absence of air between the circular label portions is ○ (good), and the air is not completely discharged to the outside of the circular label portion, but a part remains, but in the circular label portion of the adhesive layer and the adhesive film. The evaluation of the entrapment of air between the adhesive layer and the circular label portion of the adhesive film was evaluated as × (defective product), and the wafer processing was evaluated. Inhibition of entrapment of air with tape. The results are shown in Tables 1 and 2.

As shown in Table 1, the tape for wafer processing according to Examples 1 to 6 is on the second surface of the release film opposite to the first surface and on the short side of the release film on the release film. a plurality of support members are disposed in a short side of the release film in a region on the outer side of the end portion in the direction, and thus the label The suppression of the traces and the inhibition of the entrapment of air are all good results. In Example 6 in which the thickness of the support member on the side close to the adhesive layer was the thickest, the suppression of the entrapment of air was particularly excellent.

On the other hand, in Comparative Example 1 to 4 in which only one support member was provided in the short-side direction of the release film in one region outside the end portion of the adhesive layer in the short-side direction of the release film. As shown in Table 2, the tape for wafer processing involved was inferior in suppressing the entrapment of air. The tape for wafer processing according to the comparative example 5 in which the support member is not provided is excellent as a result of suppressing the entrapment of air, but the suppression of the label trace is a poor result.

10‧‧‧ Wafer processing tape

11‧‧‧ release film

11a‧‧‧1st

11b‧‧‧2nd

12‧‧‧ adhesive layer

13‧‧‧Adhesive film

13a‧‧‧Circular label

13b‧‧‧ peripherals

14‧‧‧Support members

Claims (3)

A tape for processing a wafer, comprising: a long release film; an adhesive layer provided on a first surface of the release film and having a predetermined planar shape, an adhesive film having a label portion and surrounding a peripheral portion of the outer side of the label portion, the label portion is provided to cover the adhesive layer, and is provided in contact with the release film around the adhesive layer, and has a predetermined planar shape; and the support member is disposed at The second surface of the release film opposite to the first surface on which the adhesive layer and the adhesive film are provided is on the outer side of the end portion of the adhesive layer in the short-side direction of the release film. A plurality of regions are provided in one region along the short side direction of the release film. The tape for wafer processing according to the first aspect of the invention, wherein the thickness of the side of the support member provided in the one region is the thickest. The tape for wafer processing according to claim 1 or 2, wherein each of the support members has a width of 10 to 15 mm, and an interval between the support members provided in the one region is 5 mm or more.