KR20130126935A - Dicing die bonding film packing structure and packing method - Google Patents

Abstract

The roll 5 is formed by winding the film 9 on the hollow core 7. On the other hand, the film 9 is almost the same as the film 100 shown in FIG. 7, and is a dicing die bonding film in which the unevenness | corrugation was formed in the surface. The roll 5 is put in the storage bag 11. In the state where the roll 5 was put in the storage bag 11, the side plate 3 is provided in the both ends. The convex part 19 of the side plate 3 is provided so that it may fit in the hollow part of both ends of the core 7. The side plates 3 and the rolls 5 are fixed by two to four bands 15 with respect to the rolls 5 provided with the pair of side plates 3 at the upper and lower ends. The band 15 is provided over the whole perimeter of the side plate 3 and the roll 5 (storage bag 11) so that at least two may cross | intersect, and the side plate 3 and the roll 5 are fixed.

Description

Packaging structure of dicing die bonding film and packaging method {DICING DIE BONDING FILM PACKING STRUCTURE AND PACKING METHOD}

TECHNICAL FIELD This invention relates to the packaging structure of the dicing die bonding film used when manufacturing a semiconductor device, and its packaging method.

Dicing combines two functions: a dicing tape for fixing a semiconductor wafer and a die bonding film for adhering the cut semiconductor chip to a lead frame or a package substrate when cutting and separating the semiconductor wafer into individual chips. Die bonding films have been developed. Such a dicing die bonding film was normally precut.

FIG. 8 is a diagram illustrating a film 100 as one example of a dicing die bonding film, FIG. 8A is a front view, and FIG. 8B is a cross-sectional view taken along the line D-D of FIG. 8A. The film 100 is comprised by the release film 103, the adhesive bond layer 105, the adhesive film 107 which consists of a circular label part 107a, and the periphery part 107b.

The adhesive layer 105 is processed into a circle corresponding to the shape of the wafer and is disposed on the release film 103. The adhesive film 107 is a peripheral area of the circular portion corresponding to the shape of the ring frame for dicing is removed. The circular label portion 107a of the adhesive film 107 covers the adhesive layer 105, and the outer circumferential portion thereof contacts the release film 103.

As shown in FIG. 8B, the portion where the adhesive layer 105 and the circular label portion 107a are laminated is thicker than the peripheral portion 107b of the adhesive film 107. For this reason, when wound in a roll shape as a product, the step between the laminated portion of the adhesive layer 105 and the circular label portion 107a and the peripheral portion 107b overlaps, and the step is transferred onto the surface of the flexible adhesive layer 105. There is a concern. If such a transfer trace occurs, there is a possibility that a defect may occur during processing of the wafer due to the poor adhesion between the adhesive layer 105 and the semiconductor wafer.

On the other hand, in order to suppress the generation | occurrence | production of such a transfer trace, there exists a method of weakening the winding force of a tape. However, in this method, there exists a possibility that a shift | offset | difference may arise in winding of a product by the vibration etc. at the time of transport.

In order to prevent such a label trace, the method of devising a precut shape is devised (for example, patent document 1).

[Patent Document]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2007-002173

However, in the method of devising the precut shape as in Patent Document 1, it is difficult to adjust the shape, and when the winding tension of the film becomes stronger, the occurrence of label traces cannot be prevented. Therefore, it is necessary to adjust the winding tension. In addition, in the conventional packaging method, when the coil is moved, a force may be applied to a part of the product, or the hand may slip, resulting in damage to the product.

The present invention has been carried out in view of such a problem, and an object thereof is to provide a packaging structure of a dicing die bonding film and a packaging method of the dicing die-bonding film which reliably suppress the deviation of the winding and are excellent in handling.

According to a first aspect of the present invention, there is provided a roll including a hollow core, a long dicing die bonding film wound around the core and precut to a predetermined shape, and a convex corresponding to the hollow portion of the core. And a side plate having a portion, and two to four bands for fixing the roll and the side plate, the convex portions are installed to be fitted at both ends of the core, and the at least two bands cross each other at the side plate portion, In the state where each of the pair of side plates is placed in the vertical direction, the amount of change in distance between the side plates when the upper side plate is lifted upwards is the distance between the side plates before lifting the side plate. It is a packaging structure of a dicing die bonding film, which is 1% or less.

The side plate and the roll fixed by the band may be accommodated in a packaging box at least two side by side.

A recess may be provided on the side opposite to the convex portion of the side plate, and at least two of the bands may intersect at the recess. At least two said bands may be fixed to each other at the intersection.

According to the first aspect of the invention, since the roll is sandwiched by a pair of side plates, the film does not slip off during transportation or the like. Moreover, since the side plate and the roll are fixed so that at least two bands cross | intersect, a side plate does not shift. Moreover, the shift | offset | difference of the winding of a film can also be prevented reliably also at the time of handling by making the change amount of the side plate distance at the time of handling into 1% or less.

Moreover, by storing two or more rolls side by side in a packaging box, the packaging box is also excellent in loadability. Moreover, by forming a recessed part in the outer surface of a side plate and making a band cross | intersect at a recessed part, it is easy to hold | maintain the said band and handling property in the operation | work which takes out a roll from a packaging box, etc. is favorable. In addition, the band shift can be prevented by fixing the intersections of the bands.

According to a second aspect of the present invention, a long dicing die-bonding film precut into a predetermined shape is wound around a hollow core to form a roll, and the convex portion has a pair of side plates having a convex portion corresponding to the hollow portion of the core. Amount of change in distance between the side plates when the upper side plates are lifted up while being mounted on the roll so as to be fitted to both ends of the core, and the pair of side plates are placed so as to face in the vertical direction. Packaging the dicing die bonding film, characterized in that the roll and the side plate is fixed with two to four bands intersecting the side plate so that the distance between the side plates before lifting the side plate is 1% or less. It is a way.

After providing the band, at least two of the bands may be fixed at intersections with each other.

According to the second invention, it is possible to reliably prevent the deviation of the winding of the film, and at the same time, the handling property is excellent and the generation of the transfer trace can be prevented.

ADVANTAGE OF THE INVENTION According to this invention, the packaging structure of the dicing die bonding film reliably suppressing the shift | offset | difference of a winding, and also excellent in handleability, and the packaging method thereof can be provided.

1 is an exploded perspective view showing the packaging structure 1.
2 is a perspective view showing the packaging structure 1.
3A is a plan view of the side plate 3.
3B is a cross-sectional view taken along line AA of FIG. 3A.
4 is a schematic view showing a method of testing the compressive strength of the side plate 3.
5 is an exploded perspective view showing the packaging structure 1.
6 is a view showing a state in which the packaging structure 1 is lifted up.
FIG. 7: is a figure which shows the accommodating form of the roll 5. As shown in FIG.
8A is a front view illustrating the film 100.
FIG. 8B is a cross-sectional view taken along the line DD of FIG. 8A.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is an exploded perspective view showing the packaging structure 1, and FIG. 2 is a perspective view showing the packaging structure 1. The packaging structure 1 mainly includes a roll 5, a side plate 3, a storage bag 11, a band 15, a packaging box 13, and the like.

The roll 5 is formed by winding the film 9 on the hollow core 7. On the other hand, the film 9 is almost the same as the film 100 shown in FIG. 7, and is a dicing die bonding film in which unevenness | corrugation is formed in the surface.

It is preferable that the winding tension of the film 9 with respect to the core 7 is about 10N-20N, for example. When the winding tension of the film 9 exceeds 20N, the transfer trace which concerns on the above-mentioned uneven | corrugated shape generate | occur | produces. Moreover, when the winding tension of the film 9 is less than 10N, the winding shift of the film 9 etc. may arise. Although details will be described later, the winding tension of the film is usually set to about 15N in consideration of the winding shift. However, in the present invention, the winding shift does not occur even when the winding is lowered to about 8N by employing a packaging structure that is not conventionally employed.

The roll 5 is put in the storage bag 11. And when using a light (ultraviolet) curable composition etc. as an adhesive and an adhesive which comprise the film 9, what does not transmit these lights etc. can be used as the storage bag 11.

In a state where the roll 5 is put in the storage bag 11 and degassed and heat-sealed, the side plates 3 are provided at both ends thereof. 3A is a plan view of the side plate 3, and FIG. 3B is a cross-sectional view taken along the line A-A of FIG. 3A.

The side plate 3 is a substantially rectangular member having ribs formed radially at the center. The recessed part 17 is provided in the substantially center of the upper surface of the side plate 3. Moreover, the convex part 19 is provided in the substantially center of the lower surface side of the side plate 3. The convex part 19 is a site of an almost cylindrical shape which protrudes below the side plate. Ribs are formed in the edge portion of the side plate 3 in the same direction as the formation direction of the convex portion 19. A continuous plate shape may be sufficient between ribs, and the penetrated hole may be perforated as shown in FIG. In addition, four corners of the substantially rectangular shape of the side plate 3 may have an angle, and you may draw an arc as shown to FIG. 3A. In order to relieve the force exerted in the up-down direction and make it difficult to break, it is preferable that a hole is drilled and / or an arc is drawn. The shape of the side plate 3 is not limited only to the example shown, The external shape of the side plate 3, the shape and size of the recessed part 17 and the convex part 19, a rib shape, etc. can be set suitably. In addition, the side plate 3 may be manufactured by batch molding using a metal mold | die etc., may be divided into components, such as a substantially rectangular plate and the convex part 19, and may be separately manufactured, and may be combined and formed. Each part is easy to handle because it can be disassembled and stored.

In addition, since the film 9 is used for manufacturing a semiconductor device, it is usually handled in a clean room. For this reason, the core 7, the side plate 3, the storage bag 11, the band 15, etc. which comprise the packaging structure 1 are comprised by resin etc. which can be handled in a clean room. In other words, materials such as paper, cardboard, fibers, and the like are inappropriate. When biodegradable resin is used especially as resin, since it can aim at reducing environmental load, it is more preferable.

Here, it is preferable that the deformation amount with respect to the compression force of 1500 N from the side of the side plate 3 is 2% or less. 4 is a schematic view showing a method of testing the compressive strength of the side plate 3. As shown in FIG. 4, the jig 21 is arrange | positioned in the side of the side plate 3 (direction perpendicular | vertical to the formation direction of the recessed part 17 and the convex part 19), and is 1500N with respect to the jig 21. The compressive force was applied by the force (direction of arrow C in the drawing), and the amount of compression deformation at this time was measured. When the amount of deformation exceeds 2% with respect to the original width, the large side plate 3 to be fixed at the time of transport or to a band to be described later is deformed, and there is a fear that winding deviation may occur in the film 9.

As shown to FIG. 1 and FIG. 2, the convex part 19 of the side plate 3 is provided in the hollow part of the both ends of the core 7. As shown in FIG. Here, the roll 5 (film 9) is fitted by the side plate 3 in a state where the side plate 3 is attached to the roll 5. For this reason, the film 9 is in roll state, and the both sides are fixed by the side plate 3.

Here, the width of the core 7 is almost equal to or slightly smaller than the width of the film 9 so that the side end of the film is not damaged by the side plate 3 when the side plate 3 is pushed into the core 7. desirable. In addition, in order to reliably support both side ends of the film 9 by the side plate 3 when the side plate 3 is inserted in the core 7, the side plate 3 and the film 9 side end parts as needed. You may arrange | position a shock absorbing elastic member etc. between them. In addition, if the size of the side plate 3 is made larger than the outer diameter of the roll 5 so that the roll 5 is accommodated in the rib inside the edge portion of the side plate 3, the inner surface of the packaging box contacts the roll 5. Can be prevented.

As shown in FIG. 2, the side plate 3 and the roll 5 are fixed by two bands 15 with respect to the roll 5 provided with the pair of side plates 3 at the upper and lower ends. The band 15 is provided over the whole perimeter of the side plate 3 and the roll 5 (storage bag 11) so that at least two may cross | intersect, and the side plate 3 and the roll 5 are fixed.

In the case of having two bands, the two bands 15 intersect at almost the center of the side plate 3. In other words, the intersection of the two bands 15 becomes the position of the recess 17 (FIG. 3). Therefore, the vicinity of the intersection of the two bands 15 does not contact the side plate 3, and a gap is formed between the side plate 3 and the concave portion 17. Therefore, when lifting the roll 5, a hand (finger) can be inserted in the clearance gap formed by the recessed part 17, and it can grasp and raise the intersection part of the band 15. Accordingly, the roll 5 can be easily lifted when taken out of the packaging box or in a state where the plurality of rolls 5 are lined up.

In addition, as in the packaging structure 1a shown in FIG. 5, the band may be further increased to four. In this case, four bands are formed in well well shape two by two. Therefore, it is difficult to lift the roll 5 easily because the intersection at the center becomes difficult, but the roll 5 can be taken out while maintaining a good balance by raising a finger or the like at a diagonal crossing portion. have. In the case of four bands, one and three may be crossed with each other. In any case, the roll 5 can be easily lifted by providing one or more intersections.

The intersections of the two bands 15 may be fixed to each other. For example, the bands 15 may be fixed to each other using fusion, adhesion, or another binding member. In addition, by providing a shallow groove through which the band can be inserted into the edge portion of the side plate 3 and fixing the position at which the band is applied, the cross section may be led to the position of the concave portion 17 (FIG. 3). By doing in this way, handling becomes easier, without shifting the position of an intersection part.

Moreover, as the band 15, it is preferable that it is made of resin which can be brought in in a clean room. In particular, the use of biodegradable resins is more preferable because reduction in environmental load can be achieved. In addition, as mentioned above, it is preferable that tensile breaking strength or 5% modulus is 200 N or more so that when a band 15 is gripped and the roll 5 is lifted up, a band does not break.

6A is a front view showing the packaging structure 1 (excluding the packaging box). The roll 5 is arrange | positioned so that a pair of side plate 3 may be located in an up-down direction. In this state, both side plates 3 are reliably fixed to the roll 5 by the band 15. The distance between the side plates 3 at this time is represented by 'H1'.

Next, as shown in FIG. 6B, the upper side plate 3 is lifted in this state (the arrow B direction in a figure). The distance between the side plates 3 when the roll 5 is fully lifted is indicated by 'H2'. In other words, (H2-H1) is the amount of change in distance caused by the self-weight of the packaging structure and by the elongation of the band 15 and the play of the side plate 3.

In the present invention, in consideration of the weight of the packaging structure, the strength of the band 15, the play of the side plate 3, and the like, the amount of change (H2-H1) of the distance between the side plates is set to be 1% or less of 'H1'. It is preferable to be. In other words, when the weight of the packaging structure is set, the strength of the band 15 and the play of the side plate 3 are set so as to be in the relation described above. In addition, since the dicing die bonding film is placed in an environment of 5 ° C. or lower when carrying out transportation, storage, or the like, and is placed at room temperature when handling, it is preferable that the effect of temperature change is small. Specifically, it is preferable that the band 15 has a stretching ratio in the longitudinal direction of 0 ° C to 30 ° C within ± 1%.

The roll 5 etc. formed in this way are inserted in the packaging box 13, as shown to FIG. 1 and FIG. The packaging box 13 is protected at the time of transportation and storage, and the rolls 5 and the like are taken out before being handled in the clean room. For this reason, the packaging box 13 may be corrugated cardboard.

In addition, although the figure shows the example which accommodates two rolls 5 in the packaging box 13, this invention is not limited to this. However, in consideration of the loadability and handling of the packaging box during transportation, it is preferable to store two or four rolls 5 with respect to one packaging box 13. With one roll 5, since the bottom area of the packaging box 13 becomes small and unstable, it becomes difficult to load in multiple stages. Moreover, since the size of the packaging box 13 becomes large and heavy for six or more rolls, handling becomes difficult. For this reason, it is preferable to accommodate two or four rolls 5 in the packaging box 13.

As described above, according to the present invention, since the roll 5 is fitted to the side plate 3, the occurrence of winding shift can be prevented even if the winding tension is weaker than usual. In addition, since the convex part 19 of the side plate 3 is fitted to the core 7, the side plate 3 does not shift | deviate at the time of conveyance. In addition, since the strength of the side plate 3 is sufficient, the position shift due to deformation or the like can be prevented.

Moreover, since the recessed part is formed in the side plate 3 and the band 15 intersects in the position of the recessed part 17, the roll 5 can be lifted easily by grasping the intersection part of the band 15. As shown in FIG. In addition, if the intersections are fixed to each other or the position where the band is held is fixed, the positions of the intersections do not shift.

In addition, by shifting the side plate 3 in the up and down direction and making the amount of change in the side plate distance when the upper side plate 3 lifted up to 1% or less of the original side plate distance, winding shift occurs during handling. Can be prevented.

As mentioned above, although embodiment of this invention was described with reference to attached drawing, the technical scope of this invention does not depend on embodiment mentioned above. Those skilled in the art will appreciate that various modifications or modifications can be made within the scope of the technical idea described in the claims, and they are naturally understood to belong to the technical scope of the present invention.

Example

The evaluation was performed about various packaging forms. As a film of evaluation object, the dicing die bonding film as shown in FIG. 8 was created and used. Hereinafter, the manufacturing method of each structure is demonstrated.

Production of adhesive film

In 400 g of toluene, which is a solvent, n-butyl acrylate 128 g, 2-ethylhexyl acrylate 307 g, methyl methacrylate 67 g, methacrylic acid 1.5 g, and a dropping amount of a mixture of benzoyl peroxide are suitably adjusted as a polymerization initiator to react. Temperature and reaction time were adjusted and the compound (1) which is a solution which has a functional group was obtained.

Next, as the compound (2) having a radiation-curable carbon-carbon double bond and a functional group in this polymer solution, 2.5 g of 2-hydroxyethyl methacrylate synthesized separately from methacrylic acid and ethylene glycol and a hydrogel as a polymerization inhibitor. The quinone was added while adjusting the dropping amount appropriately, and reaction temperature and reaction time were adjusted and the compound (A) which is a solution which has a radiation curable carbon-carbon double bond was obtained. Next, 1 mass part of coronate L (made by Nippon Polyurethane Industry Co., Ltd.) as a polyisocyanate (B) with respect to 100 mass parts of compounds (A) in a compound (A) solution. Furthermore, 0.5 mass part of Irgacure 184 (made by Nihon Ciba-Geigy KK) as a photoinitiator, 150 mass parts of ethyl acetate as a solvent were added to the compound (A) solution, and it mixed, and radiation Curable adhesive composition was prepared.

Subsequently, the prepared pressure-sensitive adhesive layer composition was coated on a 100 μm-thick ethylene-vinyl acetate copolymer base film so as to have a dry film thickness of 20 μm, and dried at 110 ° C. for 3 minutes to prepare an adhesive film 1A.

Release film

As the release film 2A, a release treated polyethylene terephthalate film having a thickness of 25 µm was used.

Production of adhesive film

50 mass parts of cresol novolak-type epoxy resins (epoxy equivalent 197, molecular weight 1200, softening point 70 degreeC) as an epoxy resin, 1.5 mass parts of (gamma)-mercaptopropyl trimethoxysilane as a silane coupling agent, (gamma) -ureidopropyl triethoxy Cyclohexanone was added to the composition which consists of 3 mass parts of silanes, and 30 mass parts of silica fillers with an average particle diameter of 16 nm, and it stirred and mixed, and knead | mixed further for 90 minutes using the bead mill.

100 mass parts of acrylic resin (mass average molecular weight: 800,000, glass transition temperature -17 degreeC), 5 mass parts of dipentaerythritol hexaacrylates as a 6 functional acrylate monomer, and 0.5 mass of adducts of hexamethylene diisocyanate as a hardening | curing agent Subsequently, 2.5 parts by mass of cure sol 2PZ (trade name, 2-phenylimidazole manufactured by Shikoku Chemical Co., Ltd.) was added, stirred and mixed, and vacuum degassed to obtain an adhesive. The adhesive was applied onto the release film 2A, heated and dried at 110 ° C. for 1 minute to form a coating film in a B stage state (intermediate curing state of the thermosetting resin) having a film thickness of 20 μm, and the adhesive on the release film 2A. Layer 3A was formed and refrigerated.

Precut processing

The release film 2A in which the adhesive bond layer 3A was refrigerated was returned to room temperature, and it adjusted so that the cutting depth to a release film might be 10 micrometers or less with respect to an adhesive bond layer, and the circular precut process of diameter 220mm was performed. Then, the unnecessary part of the adhesive bond layer was removed, and the release film 2A was laminated at room temperature so that the adhesive film 1A might contact the adhesive bond layer. And 1 A of adhesive films were adjusted so that the depth of cut | disconnection to a release film might be 10 micrometers or less, the circular precut process of diameter 290mm was performed concentrically with the adhesive bond layer, and the tape for wafer processing 4A was produced.

The film produced by the above was packaged by each method.

Example 1

The pre-processed wafer processing tape 4A was provided with an unlabeled portion of about 1.2 m at the beginning of the winding and the end of the winding, and then wound 300 sheets at 10N. This was stored in a bag made of polyethylene, degassed, heat-sealed, and polypropylene side plates of the shape shown in Fig. 3 were provided at both ends. The two PP bands were cross-bonded to form a cross. The amount of change of the side plate distance (H2-H1 of FIG. 5) was made into 0.3% of the side plate distance H1. Two similar rolls were produced, and as shown in FIG. 7A, two were accommodated in the packaging box 13 which is a corrugated cardboard box, and the tape package for wafer processing of Example 1 was obtained.

Example 2

As shown in FIG. 7B, the tape package for wafer processing of Example 2 was obtained like Example 1 except having stored four in the packaging box 13a.

Example 3

A tape package for wafer processing of Example 3 was obtained in the same manner as in Example 1 except that the PP band was applied so that the amount of change in the side plate distance was 1%.

Example 4

A tape package for wafer processing of Example 4 was obtained in the same manner as in Example 1 except that four bands were crossed in a well sperm shape.

Example 5

The tape package for a wafer process of Example 5 was obtained like Example 1 except having provided the groove | channel in the edge part of the four sides of a side plate, and not fused two PP bands.

Comparative Example 1

A tape package for wafer processing of Comparative Example 1 was obtained in the same manner as in Example 1 except that the winding tension was 40N.

Comparative Example 2

As shown in FIG. 7C, the tape package for wafer processing of the comparative example 2 was obtained like Example 1 except having stored one roll in the packaging box 13b.

Comparative Example 3

A tape package for wafer processing of Comparative Example 3 was obtained in the same manner as in Example 1 except that the side plates were made of corrugated cardboard.

Comparative Example 4

A tape package for wafer processing of Comparative Example 4 was obtained in the same manner as in Example 1 except that the PP band was applied so that the amount of change in the side plate distance was 2%.

The results are shown in Table 1.

Table 1

The "winding shift | offset | difference" and the "trace of transcription" in the table were evaluated as follows. First, each package was stored in a refrigerator (5 ° C.) for one month, and then loaded on a transport truck and shuttled from Hiratsuka to Kobe (about 1,000 km) in a refrigerated state. Thereafter, each package is opened, the roll is returned to room temperature, the packaging bag is opened, the core is fixed and the winding shift is observed when the roll is left for 1 minute under natural load, and the winding shift is less than 2 mm. (Circle) 'and winding shift were made into "' when it was 2 mm or more.

Next, the roll was unwound and the presence or absence of traces of transcription was visually observed and evaluated. '◎' means that no trace of transcription or void can be observed even with the naked eye from various angles, and '○' means that some trace of trace or void can be identified depending on the angle. Even if it was able to confirm a trace of transcription or a void on a film, it was set as "'."

In addition, each package was stacked in three tiers, and stored in a refrigerator (5 ° C.) for one month, and then placed in a transport cart to observe the presence of luggage collapse at an acceleration of 0.01 to 0.25 m / sec ² . If there was no load collapse, it was set as '○'.

Moreover, each package was opened and the handling property at the time of taking out a roll was evaluated. '◎' is very easy to handle and has excellent handling and productivity. '○' is easy to handle and has good handling and productivity. '○' is difficult to handle and is inferior to handling and productivity. It was set as.

Although the winding shift did not generate | occur | produce in Examples 1-3 and the comparative examples 1-3 using the side plate, the winding shift generate | occur | produced in the comparative example 4 with a large amount of change of the side plate distance. It was found that the winding shift can be prevented by reducing the amount of change in the side plate distance.

Regarding the traces of transcription, in each of the examples and the comparative examples, it could not be completely suppressed, but in Comparative Example 1 in which the winding tension was as high as 40N, the evaluation was performed. In other words, it was found that the difference in the generation of the transcriptional trace was caused by the winding tension.

About multi-stage stackability, baggage collapse occurred in the comparative example 2 which accommodated one roll in the packaging box. It was found that the stability of the case where two or more were accommodated in a packaging box was large when it was stacked in multiple stages.

About handling property, the product was easy to take out in Examples 1-2, 5, and Comparative Example 1 which strongly packaged the band. In Example 3, since the band was slightly loosened, the takeout property of the product was somewhat inferior. In Example 4, since there was no concave portion at the intersection of the band, the handling property was somewhat inferior in that it was difficult to grasp for taking out. In Comparative Example 2, the extraction of the product is easy, but since the rolls are stored one by one in the packaging box, it is necessary to open one by one and the productivity is slightly decreased. In the comparative example 3, since the side board made of corrugated cardboard is used, it cannot be brought into a clean room using a product as it is, and it is necessary to unwind and handle a side plate outside a clean room, and handling property is inferior. In the comparative example 4, since the band strength was weak, carrying was difficult and the handling property was inferior.

1: packaging structure 3: side plate
5: roll 7: core
9: film 11: storage bag
13, 13a, 13b: packaging box 15: band
17: recess 19: convex
21: jig 100: film
101: core 103: release film
105: adhesive layer 107: adhesive film
107a: circular label portion 107b: peripheral portion

Claims (6)

A roll comprising a hollow core and an elongated dicing die bonding film wound around the core and precut to a predetermined shape;
A side plate having a convex portion corresponding to the hollow portion of the core; And
It has two to four bands for fixing the roll and the side plate,
The convex portions are installed to be fitted to both ends of the core,
At least two said bands intersect each other at said side plate portion,
In a state where each of the pair of side plates is placed in the vertical direction, the amount of change in distance between the side plates when the upper side plate is lifted upward is 1% or less of the distance between the side plates before lifting the side plate. The packaging structure of the dicing die bonding film characterized by the above-mentioned. The packaging structure of a dicing die bonding film according to claim 1, wherein the side plate and the roll fixed by the band are accommodated in a packaging box at least two side by side. The packaging structure of a dicing die bonding film according to claim 1, wherein a concave portion is provided on a side opposite to the convex portion of the side plate, and at least two of the bands intersect at the concave portion. The packaging structure of a dicing die bonding film according to claim 1, wherein at least two said bands are fixed to each other at an intersection. A long dicing die bonding film precut to a predetermined shape is wound around a hollow core to form a roll,
A pair of side plates having a convex portion corresponding to the hollow portion of the core is provided on the roll such that the convex portions are fitted to both ends of the core,
In the state where each of the pair of side plates is placed in the up and down direction, the amount of change in distance between the side plates when the upper side plate is lifted upward is 1% or less of the distance between the side plates before lifting the side plate. Fixing the roll and the side plate with two to four bands intersecting at the side plate, wherein the dicing die bonding film is packaged. The packaging method for a dicing die bonding film according to claim 5, wherein after the band is provided, at least two of the bands are fixed at intersections of each other.

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