JP6005108B2 - Packing structure of dicing die bonding film or die bonding film - Google Patents

Description

  The present invention relates to a dicing die bonding film or a die bonding film packing structure used when manufacturing a semiconductor device.

  Conventionally, two functions of a dicing tape for fixing a semiconductor wafer when the semiconductor wafer is cut and separated into individual chips and a die bonding film for bonding the cut semiconductor chip to a lead frame, a package substrate, etc. A dicing die-bonding film that has both is developed. Such a dicing die bonding film is usually precut.

  6A and 6B are diagrams illustrating a film 100 as an example of a dicing die bonding film, in which FIG. 6A is a front view and FIG. 6B is a cross-sectional view taken along the line DD in FIG. The film 100 wound around the core 101 includes a release film 103, an adhesive layer 105, an adhesive film 107 including a circular label portion 107a and a peripheral portion 107b.

  The adhesive layer 105 is processed into a circle corresponding to the shape of the wafer, and is disposed on the release film 103. The adhesive film 107 is obtained by removing the peripheral area of the circular portion corresponding to the shape of the ring frame for dicing. The circular label portion 107 a of the adhesive film 107 covers the adhesive layer 105, and the outer peripheral portion is in contact with the release film 103.

An adhesive film is comprised from the base material and the adhesive layer on a base material. In order to fix the semiconductor wafer, the pressure-sensitive adhesive layer usually has a resin having a glass transition temperature of room temperature or lower, preferably 0 ° C. or lower.
Moreover, an adhesive bond layer has a thermosetting resin normally from a viewpoint of adhesiveness and reliability. For this reason, these films are transported in a temperature controlled to about 0 to 10 ° C. by a refrigerator or a container. However, such a transportation method is expensive and is not suitable for a small amount of transportation. On the other hand, a method of transporting dry ice in a packaging box has been devised (Patent Documents 1 and 2).

JP 2008-116165 A JP 2004-43020 A

  However, the method described in Patent Document 1 devises the arrangement of pellet-shaped dry ice and plate-shaped dry ice, and the dry ice comes into contact with the roll of the dicing die bonding film via a storage bag or the like. There is a fear.

  Moreover, although the method described in patent document 2 has provided the cooling chamber separately, since dry ice sublimates and becomes small with time, there exists a possibility that dry ice may contact directly from a vent hole. Moreover, even if it does not contact directly, only the roll of the exit part of a vent hole is locally cooled. Thus, when the dicing die bonding film is locally cooled by dry ice, the resin constituting the film is placed below the glass transition temperature, which may reduce the adhesion between the adhesive film and the adhesive layer. is there. Moreover, since the heat shrinkage rate differs between the pressure-sensitive adhesive film and the adhesive layer, there is a possibility that an adverse effect is caused such that a space (void) is generated between the pressure-sensitive adhesive film and the adhesive layer.

  For example, when the target product is a die bonding film, the die bonding film and the release film may be separated due to a difference in linear expansion, and air may enter. In the case of a dicing die bonding film in which the above-described die bonding film is integrated with a dicing tape, not only between the adhesive film 107 (dicing tape) and the release film 103 but also the adhesive layer 105 (die bonding film) There is a possibility that air may enter between the release films 103. Furthermore, the adhesive film 107 and the adhesive layer 105 may be peeled off to generate voids, which may reduce reliability. In recent years, in order to improve the breakability of the adhesive layer, the adhesive layer may have an acrylic copolymer or phenoxy resin having a Tg of 10 ° C. or higher, and / or an inorganic filler. There is a problem that voids are likely to occur.

  As described above, when a space is generated between the pressure-sensitive adhesive film 107 and the adhesive layer 105, when the semiconductor wafer is cut and separated into individual chips, the semiconductor wafer is not sufficiently fixed, and the chip with the adhesive layer may fly away. There is a risk of chipping or chipping.

  The present invention has been made in view of such problems, and is intended to provide a dicing die bonding film or a die bonding film packaging structure that does not adversely affect the characteristics of the film while being stored at a low temperature. Objective.

  In order to achieve the above-described object, the present invention provides a roll in which a dicing die bonding film or a die bond film is wound around a hollow core, a first box in which the roll is accommodated, and the first box is accommodated. A second box, a partition plate that divides the interior of the second box from the storage space of the first box and the storage space of dry ice, and a buffer provided around the first box The partition plate is disposed above the first box, the dry ice is accommodated above the partition plate, the outer surface of the first box and the second box In the packing structure of the dicing die bonding film or the die bond film, wherein the cushioning material is provided between the inner side surface of the box and between the upper surface of the first box and the lower surface of the partition plate. is there.

  A plurality of the first boxes may be accommodated in the second box.

  According to the present invention, since the product storage unit and the cold insulation material storage unit are partitioned by the partition plate, the dry ice that is the cold insulation material and the product do not come into contact with each other. Furthermore, since the product is stored in a box different from the box in which the dry ice is stored, the product is kept cool evenly and the product is not locally cooled.

  In addition, when handling the product after removing the cooling agent such as dry ice, it is possible to carry the whole box and the like, so that workability is good.

  Moreover, transport efficiency improves by accommodating a some 1st box in a 2nd box.

  ADVANTAGE OF THE INVENTION According to this invention, the packaging structure of the dicing die-bonding film or die-bonding film which does not have a bad influence on the characteristic of a film can be provided at the same time it stores at cold temperature.

FIG. 3 is an exploded perspective view showing the packing structure 1. The figure which shows the packing structure 1 which shows the state which accommodated the inner box 3 grade | etc., In the outer box 5. FIG. It is a figure which shows the side plate 13, (a) is a top view, (b) is the BB sectional drawing of (a). FIG. 3 is a sectional view taken along line AA in FIG. 2. The disassembled perspective view which shows the packing structure 1a. It is a figure which shows the film 100, Comprising: (a) is a front view, (b) is the DD sectional view taken on the line of (a).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing the packing structure 1, and FIG. 2 is a view showing the packing structure 1 in a state where the inner box 3 and the like are accommodated in the outer box 5. The packing structure 1 mainly includes an inner box 3, an outer box 5, a partition plate 9, a dry ice 11, a roll 7, and the like.

  The roll 7 is configured by winding a film around a hollow core. The film is a dicing die bonding film or a die bond film. The roll 7 is stored in the storage bag 16. In addition, illustration of the storage bag 16 is abbreviate | omitted suitably. The roll 7 is, for example, a dicing die bonding film. As described above, the roll 7 is constituted by a release film, an adhesive layer, an adhesive film, and the like.

  An adhesive film is comprised from the base material and the adhesive layer on a base material. The base material is polyethylene, polypropylene, vinyl chloride, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer , Homopolymers or copolymers of α-olefins such as ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, ionomer or mixtures thereof, polyurethane, styrene-ethylene-butene copolymer or pentene Listed are thermoplastic elastomers such as copolymers, polyamide-polyol copolymers, and mixtures thereof. Further, two or more materials selected from these groups may be mixed, or a single layer or a multilayer may be used. It is preferable to select the one having high processability in accordance with the semiconductor processing step to be applied, such as the dicing property of the semiconductor wafer and the pickup property of the chip. For example, ionomer, vinyl chloride, and polyethylene are selected. Furthermore, the thing with a small shape change by temperature is more preferable. The thickness of the substrate is not particularly limited, but is preferably 50 to 300 μm, more preferably 70 to 150 μm from the viewpoint of dicing properties and chip pickup properties.

  The pressure-sensitive adhesive layer is a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, addition reaction type organopolysiloxane resin, silicon acrylate resin, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer. A polymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, polyisoprene, styrene / butadiene copolymer, various hydrogenated elastomers, etc., and mixtures thereof are appropriately blended and prepared. Is preferred. In order to fix the semiconductor wafer at normal temperature, it is desirable to add a resin having a glass transition temperature of normal temperature or lower, more preferably 0 ° C. or lower.

  Various surfactants and surface smoothing agents may be added. There are radiation-curing types and non-radiation-curing types in which the adhesive strength does not change by irradiation, the former is easy to control the adhesive strength, and the latter can be used for devices that do not allow radiation irradiation. It is selected appropriately. When the radiation curable type is selected, it is preferable to prepare it by appropriately blending a radiation polymerizable compound having a photopolymerizable carbon-carbon double bond and a photopolymerization initiator. Although the thickness of an adhesive layer is not specifically limited, Usually, 3-50 micrometers is preferable and 5-20 micrometers is more preferable.

  The adhesive layer is obtained by forming a film of the adhesive in advance, and preferably has a thermosetting resin, more preferably a thermosetting resin and a thermoplastic resin, from the viewpoint of adhesiveness and reliability.

  Examples of the thermosetting resin include an epoxy resin, a thermosetting acrylic resin, a silicone resin, a phenol resin, a thermosetting polyimide resin, a polyurethane resin, a melamine resin, and a urea resin, and has heat resistance, workability, and reliability. An epoxy resin is preferable in terms of properties. When using an epoxy resin as the thermosetting resin, it is preferable to use an epoxy resin curing agent together.

  Examples of the thermoplastic resin include polyimide resin, polyamide resin, polyetherimide resin, polyamideimide resin, polyester resin, polyesterimide resin, phenoxy resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, polyetherketone resin, An acrylic resin, an acrylic copolymer, etc. are mentioned.

  In order to improve the breakability of the adhesive layer, it is preferable to include an acrylic copolymer and an epoxy resin, or a phenoxy resin and an epoxy resin having a Tg of 10 ° C. or higher. Furthermore, an inorganic filler may be included and it is preferable to contain 5 to 90%. Examples of the inorganic filler include silica filler, and the silica filler is preferably contained in an amount of 5 to 70%, more preferably 5 to 55%. Moreover, in order to reinforce the adhesive force with respect to a chip | tip or a lead frame, it is desirable to add a silane coupling agent or a titanium coupling agent to the said material and its mixture as an additive. The thickness of the adhesive layer is not particularly limited, but is usually preferably about 5 to 100 μm, and more preferably 10 to 60 μm.

  In a state where the roll 7 is put into the storage bag 16 and deaerated and heat-sealed, side plates 13 are provided at both ends. 3 is a view showing the side plate 13, FIG. 3 (a) is a plan view, and FIG. 3 (b) is a cross-sectional view taken along the line BB of FIG. 3 (a).

  The side plate 13 is a substantially rectangular member having ribs formed radially from the center. A concave portion 17 is provided in the approximate center of the upper surface of the side plate 13. In addition, a convex portion 19 is provided at the approximate center on the lower surface side of the side plate 13. The convex part 19 is a substantially cylindrical part which protrudes below the side plate. Ribs are formed on the outer edge of the side plate 13 in the same direction as the direction in which the projections 19 are formed. The shape of the side plate 13 is not limited to the illustrated example, and the outer shape of the side plate 13, the shapes and sizes of the concave portion 17 and the convex portion 19, the rib shape, and the like can be set as appropriate.

  The convex portions 19 of the side plates 13 are fitted and attached to the hollow portions at both ends of the core of the roll 7. Here, in a state where the side plate 13 is attached to the roll 7, the roll 7 is sandwiched between the side plates 13. For this reason, both sides of the roll 7 are fixed by the side plates 13.

  As shown in FIG. 1, the side plate 13 and the roll 7 are fixed by two bands 15 with respect to the roll 7 having a pair of side plates 13 attached to the upper and lower ends. The band 15 is provided over the entire periphery of the side plate 13 and the roll 7 (storage bag 16) so that at least two of the bands 15 intersect, and the side plate 13 and the roll 7 are fixed.

  The two bands 15 intersect at the approximate center of the side plate 13. That is, the intersection of the two bands 15 is the position of the recess 17 (FIG. 3). Therefore, the vicinity of the intersection of the two bands 15 does not contact the side plate 13, and a gap is formed between the side plate 13 (concave portion 17). Therefore, when lifting the roll 7, it is possible to insert a hand (finger) into the gap formed by the concave portion 17, hold the intersecting portion of the band 15, and lift it. Therefore, the roll 7 can be easily lifted from the packing box or from a state in which the plurality of rolls 7 are arranged. The number of bands 15 is not limited to two.

  The roll 7 is accommodated in the inner box 3 which is a first box. In the illustrated example, two rolls 7 are accommodated in the inner box 3. The number of rolls 7 accommodated in the inner box 3 is not limited to the illustrated example.

  A partition plate 9 is provided inside the outer box 5 that is the second box, and the space inside the outer box 5 is partitioned vertically. The size of the partition plate 9 substantially matches the inner size of the outer box 5. The space above the partition plate 9 is a cold insulation material storage portion, and the space below the partition plate 9 is an inner box storage portion in which the inner box 3 is stored. The inner box 3 and the outer box 5 are, for example, cardboard boxes. Moreover, the partition plate 9 is made of, for example, polystyrene foam.

  Above the partition plate 9, the dry ice 11 which is a cold insulating material is accommodated. The dry ice 11 is, for example, a plate shape. The size of the dry ice 11 is appropriately set according to the size of the outer box 5 and the transportation time.

  4 is a cross-sectional view taken along line AA in FIG. As shown in FIG. 4, a gap is formed between the inner box 3 and the outer box 5 except for the bottom surface portion. A buffer material 21 is provided in the gap. Further, a buffer material 21 is also provided between the upper surface of the inner box 3 and the partition plate 9. That is, the inner box 3 is entirely covered with the cushioning material 21 except for the lower part of the bottom surface.

  Here, it is desirable that gaps of 3 ± 1 cm are formed between the four outer surfaces of the inner box 3 and the corresponding inner surfaces of the outer box 5. If the gap is too large, the cooling effect may be reduced, and the packaging structure will be enlarged. If the gap is too small, the effect of cooling uniformly from the entire periphery of the inner box 3 is reduced.

  Further, it is desirable that a gap of 6 ± 1 cm is formed between the upper surface of the inner box 3 and the lower surface of the partition plate 9. If the gap is too large, the cooling effect may be reduced, and the packaging structure will be enlarged. If the gap is too small, local overcooling of the roll 7 cannot be suppressed.

  The thickness of the partition plate 9 is desirably 20 ± 5 mm. If the partition plate 9 is too thin, local overcooling of the roll 7 cannot be suppressed. If the partition plate 9 is too thick, the cooling effect may be reduced, and the packaging structure is enlarged.

  As described above, according to the present embodiment, for example, even a dicing die bonding film having a thermosetting adhesive film layer can be packed in a state where it is reliably kept cold. Further, since the cold insulation material storage portion and the inner box storage portion are separated by the partition plate 9, the dry ice 11 does not contact the roll 7. In particular, since the roll 7 is accommodated in the inner box 3, the inner box 3 causes the cold air from the dry ice 11 to uniformly diffuse to the outer peripheral portion of the inner box 3, and a part of the roll 7 is locally cooled. There is nothing to do.

  Moreover, since the roll 7 is accommodated in the inner box 3, the dry ice 11 and the like are removed after transportation, and when the roll 7 is transported to a place of use, the inner box 3 can be transported, so that handling is easy. Further, it can be avoided that the shock absorbing material is directly applied to the roll 7 due to an impact or pressure from the outside and the roll 7 is damaged or pressed.

  In addition, you may accommodate the several inner box 3 with respect to the one outer box 5 like the packing structure 1a shown in FIG. In this way, by accommodating a plurality of inner boxes 3, the housing efficiency is improved, and one inner box 3 does not become too heavy, and the handling property is improved.

  EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these. As a packaging object, a dicing die bonding film was prepared and used.

<Production of adhesive film>
In 400 g of toluene as a solvent, 128 g of n-butyl acrylate, 307 g of 2-ethylhexyl acrylate, 67 g of methyl methacrylate, 1.5 g of methacrylic acid, and a mixed solution of benzoyl peroxide as a polymerization initiator are appropriately adjusted in a dropping amount, and reacted. The temperature and the reaction time were adjusted to obtain a solution of the compound (1) having a functional group.

  Next, 2.5 g of 2-hydroxyethyl methacrylate synthesized separately from methacrylic acid and ethylene glycol as a compound (2) having a radiation curable carbon-carbon double bond and a functional group was added to this polymer solution, and hydroquinone as a polymerization inhibitor. Was added by appropriately adjusting the dropping amount, and the reaction temperature and reaction time were adjusted to obtain a solution of the compound (2) having a radiation curable carbon-carbon double bond.

  Subsequently, 1 part by mass of Nippon Polyurethane Co., Ltd .: Coronate L as a polyisocyanate is added to 100 parts by mass of the compound (2) in the compound (2) solution. 0.5 parts by mass and 150 parts by mass of ethyl acetate as a solvent were added to the compound (2) solution and mixed to prepare a radiation curable pressure-sensitive adhesive composition.

  Subsequently, using the prepared pressure-sensitive adhesive layer composition as an ionomer, a base film having a thickness of 100 μm processed by film extrusion at about 200 ° C. using a product name “HIMILAN 1554” manufactured by Mitsui DuPont Polychemical Co., Ltd. Then, the coating was applied so that the dry film thickness was 20 μm, and dried at 110 ° C. for 3 minutes to prepare an adhesive film.

<Release film>
As the release film, a 25 μm-thick polyethylene terephthalate film subjected to release treatment was used.

<Preparation of adhesive film>
15.0 parts by weight of phenol novolac resin (Sumitomo Bakelite, PR55617), 45.0 parts by weight of liquid bisphenol A type epoxy resin (Dainippon Ink and Chemicals, EPICLON-840S), and bisphenol A type phenoxy resin (Mitsubishi Chemical) Manufactured, 1256, glass transition temperature: 98 ° C., 24.4 parts by weight, 0.1 part by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as a curing accelerator, and as a silane coupling agent 0.5 parts by weight of β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-403) is dissolved in methyl ethyl ketone, and further silica filler (manufactured by Admatechs, SO-C2, average particle size). Prepare a varnish with a solid content of 30% by dispersing 15 parts by weight. It was.

  The obtained varnish was applied to a release film of polyethylene terephthalate having a release treatment of 25 μm in thickness, dried at 100 ° C. for 5 minutes, and then in a B stage state with a film thickness of 20 μm (curing intermediate of thermosetting resin State) was formed, an adhesive film was formed on the release film, and stored refrigerated.

<Precut processing>
The mold release film on which the adhesive film that had been refrigerated is formed is returned to room temperature, and the adhesive film is adjusted so that the depth of cut into the mold release film is 10 μm or less, and circular precut processing with a diameter of 220 mm is performed. went. Then, the unnecessary part of the adhesive film was removed, and the release film was laminated at room temperature so that the adhesive layer was in contact with the adhesive film. Then, the adhesive film is adjusted so that the depth of cut into the release film is 10 μm or less, and is subjected to circular pre-cut processing with a diameter of 290 mm concentrically with the adhesive film to form a dicing die bonding film to be packaged. Produced.

<Production of inner box 3>
A pre-cut dicing die bonding film was provided with a portion having no label of about 1.2 m at the start and end of winding, and 300 sheets were wound with a tension of 10N. This was stored in a polyethylene bag, degassed, heat sealed, and a polypropylene side plate 13 having the shape shown in FIG. 3 was attached to both ends. Furthermore, the two PP bands were hung in a cross so as to be fused and joined to produce a sealing roll. Two rolls of the same sealing roll were produced, and two rolls were stored in a cardboard inner box as shown in FIGS. The inner box 3 in which the dicing die bonding film was primarily packed as described above was refrigerated and packed by the following methods.

Example 1
One inner box 3 was accommodated in another outer box 5 having a distance of 3 cm from the outer diameter of the inner box 3 in the horizontal direction and a height of 16 cm from the inner box 3 in the height direction. Three partition plates 9 made of polystyrene foam having a thickness of 8 mm are installed above the inner box 3 at a distance of 6 cm from the inner box 3, and the space between the outer box 5, the partition plate 9 and the inner box 3 is a cushioning material. Filled with 21. As the cushioning material, a foam-like cushioning material produced by steam foaming of a mixture of corn starch and binder polypropylene was used. 10 kg of dry ice was placed on the expanded polystyrene, and the outer box 5 was sealed to produce a package of Example 1.

(Example 2)
A package of Example 2 was produced in the same manner as in Example 1 except that the number of inner boxes 3 was set to two and stored in the outer box 5 according to the number.

(Example 3)
A package of Example 3 was produced in the same manner as in Example 1 except that two foamed polystyrene plates were used.

Example 4
A package of Example 4 was produced in the same manner as Example 1 except that the dry ice was 8 kg.

(Example 5)
A package of Example 5 was manufactured in the same manner as Example 1 except that an S-shaped foamed rose-shaped buffer material made of polystyrene resin as a main material was used as the buffer material.

(Comparative Example 1)
The sealing roll is directly stored in the outer box 5, and three foamed polystyrene plates with a thickness of 8 mm are installed above the sealing roll at a distance of 6 cm from the sealing roll, and sealed with the outer box 5 and the foamed polystyrene board. The space of the stop roll was filled with cushioning material. As the cushioning material, a foam-like cushioning material produced by steam foaming of a mixture of corn starch and binder polypropylene was used. 10 kg of dry ice was placed on the expanded polystyrene, and the outer box 5 was sealed to prepare a package of Comparative Example 1.

(Comparative Example 2)
The inner box 3 was stored in another outer box 5 having a distance of 3 cm from the outer diameter of the inner box 3 in the horizontal direction and a height of 16 cm from the inner box 3 in the height direction. 10 kg of dry ice was placed around the inner box 3, and the outer box 5 and the space between the dry ice and the inner box 3 were filled with a buffer material. As the cushioning material, a foam-like cushioning material produced by steam foaming of a mixture of corn starch and binder polypropylene was used. The outer box 5 was sealed to produce a package of Comparative Example 2.

(Comparative Example 3)
A package of Comparative Example 3 was produced in the same manner as Comparative Example 2 except that the dry ice was 1 kg.

<Cooling evaluation>
The packaging boxes of the example and the comparative example were placed on a transportation truck and reciprocated between Hiratsuka and Akita (about 1000 km), and the temperature course of the inner box 3 (Comparative Example 1 is in the sealing roll) between them was measured. Then, each packing box was unpacked and the measurement result was confirmed. According to the following evaluation criteria, it evaluated in two steps of (circle) and x.
○ (good product): The temperature from packing to unpacking is 5 ° C or less.
X (defective product): The temperature reached 5 ° C. or more even once from the packaging to the unpacking.

<Suppression evaluation of overcooling>
The packaging boxes of the example and the comparative example were placed on a transportation truck and reciprocated between Hiratsuka and Akita (about 1000 km). Thereafter, each packing box was unpacked, the roll of the dicing die bonding film was returned to room temperature, the packaging bag was opened, the roll was unwound, and the presence or absence of supercooling was visually observed. Inhibition of overcooling was evaluated by visually observing whether voids or air was present between the dicing die bonding films, and evaluated in three stages, ◎, ○, and ×, according to the following evaluation criteria. Moreover, about the sample of (circle) and x, the ratio of the film by which the void or air was confirmed was shown.
◎ (excellent): Voids and air cannot be confirmed even by visual observation from various angles.
○ (good product): Some air can be confirmed between the adhesive film and the release film.
X (defective product): A void can be confirmed between the adhesive film and the adhesive film.

  The results are shown in Table 1. In Examples 1, 2, 4, and 5, there was no problem in cooling evaluation, and generation of voids and the like was not observed. In Example 3, since the partition by the foamed polystyrene plate was 1.6 cm, the dicing die bonding film was easily cooled compared to the case of 2.4 cm, and some air entered between the adhesive film and the release film. No voids were confirmed, and the product could be prevented from being damaged or peeled off due to overcooling.

  On the other hand, since Comparative Example 1 was refrigerated and packed without putting the sealing roll in the inner box 3, the outside of the dicing die bonding film was overcooled, and voids were formed between 205 of the 300 adhesive films and the adhesive film. confirmed. In Comparative Example 2, since the dry ice was installed around the inner box 3 and refrigerated and packed, the entire dicing die bonding film was in a supercooled state, and voids were confirmed between all the adhesive films and the adhesive films. In Comparative Example 3, the dicing die bonding film was not sufficiently cooled.

  As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

1, 1a ......... Packing structure 3 ......... Inner box 5 ......... Outer box 7 ......... Roll 9 ......... Partition plate 11 ......... Dry ice 13 ......... Side plate 15 ......... Band 16 ... ... Storage bag 17 ... ... Concavity 19 ... ... Convex part 21 ... ... Buffer material 23 ... ... Support member 100 ... ... Film 101 ... ... Core 103 ... ... Release film 105 ... ... Adhesive layer 107 ......... Adhesive film 107a ......... Circular label 107b ......... Peripheral part

Claims (2)

A roll in which a dicing die bonding film or a die bonding film is wound around a hollow core,
A first box containing the roll;
A second box in which the first box is housed;
A partition plate for partitioning the interior of the second box from the storage space of the first box and the storage space of dry ice;
A cushioning material provided around the first box;
Comprising
The partition plate is disposed above the first box, and the dry ice is accommodated above the partition plate,
The cushioning material is provided between the outer surface of the first box and the inner surface of the second box, and between the upper surface of the first box and the lower surface of the partition plate. A dicing die bonding film or a die bonding film packaging structure. The packaging structure of a dicing die bonding film or a die bond film according to claim 1, wherein a plurality of the first boxes are accommodated in the second box.

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