JP5739782B2 - Dicing die bonding film packing structure and packing method - Google Patents

Description

  The present invention relates to a packaging structure of a dicing die bonding film used when manufacturing a semiconductor device and a packaging method thereof.

  Conventionally, two functions of a dicing tape for fixing a semiconductor wafer when the semiconductor wafer is cut and separated into individual chips and a die bonding film for bonding the cut semiconductor chip to a lead frame, a package substrate, etc. A dicing die-bonding film that has both is developed. Such a dicing die bonding film is usually precut.

  9A and 9B are diagrams showing a film 100 as an example of a dicing die bonding film. FIG. 9A is a front view, and FIG. 9B is a cross-sectional view taken along the line DD in FIG. 9A. The film 100 includes a release film 103, an adhesive layer 105, an adhesive film 107 including a circular label portion 107a and a peripheral portion 107b.

  The adhesive layer 105 is processed into a circle corresponding to the shape of the wafer, and is disposed on the release film 103. The adhesive film 107 is obtained by removing the peripheral area of the circular portion corresponding to the shape of the ring frame for dicing. The circular label portion 107 a of the adhesive film 107 covers the adhesive layer 105, and the outer peripheral portion is in contact with the release film 103.

  An adhesive film is comprised from the base material and the adhesive layer on a base material. In order to fix the semiconductor wafer, the pressure-sensitive adhesive layer usually has a resin having a glass transition temperature of room temperature or lower, preferably 0 ° C. or lower. The adhesive layer usually has a thermosetting resin from the viewpoint of adhesiveness and reliability. For this reason, these films are transported in a temperature controlled to about 0 to 10 ° C. by a refrigerator or a container. However, such a transportation method is expensive and is not suitable for a small amount of transportation. On the other hand, a method of transporting dry ice in a packaging box has been devised (Patent Documents 1 and 2).

JP 2008-116165 A JP 2004-43020 A

  However, the method described in Patent Document 1 devises the arrangement of pellet-shaped dry ice and plate-shaped dry ice, and the dry ice comes into contact with the roll of the dicing die bonding film via a storage bag or the like. There is a fear.

  Moreover, although the method described in patent document 2 has provided the cooling chamber separately, since dry ice sublimates and becomes small with time, there exists a possibility that dry ice may contact directly from a vent hole. Moreover, even if it does not contact directly, only the roll of the exit part of a vent hole is locally cooled. Thus, when the dicing die bonding film is locally cooled by dry ice, the resin constituting the film is placed below the glass transition temperature, which may reduce the adhesion between the adhesive film and the adhesive layer. is there. Moreover, since the heat shrinkage rate differs between the pressure-sensitive adhesive film and the adhesive layer, there is a possibility that an adverse effect is caused such that a space (void) is generated between the pressure-sensitive adhesive film and the adhesive layer. If there is a space between the adhesive film and the adhesive layer, when the semiconductor wafer is cut and separated into individual chips, the semiconductor wafer will not be sufficiently fixed, and the chip with the adhesive layer will fly or chipping will occur There is a risk of doing.

  The present invention has been made in view of such problems, and an object thereof is to provide a packaging structure of a dicing die bonding film that does not adversely affect the characteristics of the film while being stored at a low temperature. To do.

In order to achieve the above-mentioned object, a first invention is a packaging structure for a dicing die bonding film, and includes a product storage portion and a cold insulation storage portion formed on both sides of the product storage portion. The product storage unit and the cold insulation material storage unit are partitioned by a partition member using a box, and a roll around which a dicing die bonding film is wound is stored in the product storage unit, and the cold storage material storage unit is provided with dry ice. Is stored, the thickness of the side wall of the packaging box is t1 (mm), the thickness of the partition member is t2 (mm), the thickness of the bottom surface of the packaging box is t3 (mm), T1 when the sum of the surface areas is A1 (mm ² ), the surface area on the partition member side of the cold insulation material storage part is A2 (mm ² ), and the surface area on the bottom side of the cold insulation material storage part is A3 (mm ² ). = A / T1, T2 = A2 / t2, and T3 = A3 / t3, (T2 / T1) is 1.1 to 2.0, and (T3 / T1) is 0.3 or less. It is a packing structure of a dicing die bonding film.

  Support members may be attached to both ends of the roll, and the roll and the support member may be fixed with at least two bands so as to intersect at the support member.

  Two or more of the support members and the rolls fixed by the band are arranged and accommodated in a packaging box, and the support members are larger than the outer diameter of the rolls, and the rolls are stored in the product storage unit. In doing so, a gap may be formed between the roll and the partition member.

The thickness of the side wall of the packaging box is preferably 20 mm or more, and the volume of the product storage unit is preferably 0.02 to 0.05 m ³ .

  According to the first invention, since the product storage portion and the cold insulation material storage portion are partitioned by the partition member, the dry ice that is the cold insulation material and the product do not come into contact with each other. Therefore, the product is not locally cooled.

  In addition, since T1 to T3 calculated from the thickness and the surface area are used and T2 / T1 is 1.1 or more and T3 / T1 is 0.3 or less, the cooling of the product can be sufficiently ensured. Moreover, since T2 / T1 is 2.0 or less, it can prevent that the local supercooling with respect to a product arises.

  Moreover, if a support member is attached to the both ends of a roll from the outside of a storage bag and a roll and a support member are fixed with two bands, a film will not wind during transportation. Further, since the support member and the roll are fixed with the two bands so as to cross each other, the support member is not displaced.

  Further, if two or more support members and rolls fixed by a band are arranged and accommodated in the packaging box, the packaging efficiency is high, the handling property is excellent, and the stacking in a plurality of stages becomes easy. Also, when the support member is larger than the outer diameter of the roll and the roll is stored in the product storage section, if a gap is formed between the roll and the partition member, the film is not damaged by the partition member, Moreover, it is not cooled locally by the partition member.

In particular, if the thickness of the side wall of the packaging box is 20 mm or more and the volume of the product storage unit is 0.02 to 0.05 m ³ , a packaging structure excellent in cold insulation capacity and loading efficiency can be obtained.

2nd invention is the packing method of a dicing die bonding film, Comprising: The said product storage is carried out using the packaging box which has a product storage part and the cold storage material storage part formed in the both sides of the said product storage part inside. And the cold insulator storage part are partitioned by a partition member, the thickness of the side wall of the packaging box is t1 (mm), the thickness of the partition member is t2 (mm), and the thickness of the bottom surface of the packaging box is t3 ( mm), the sum of the surface area on the side wall side of the cold insulation material storage part is A1 (mm ² ), the surface area on the partition member side of the cold insulation material storage part is A2 (mm ² ), and the surface area on the bottom side of the cold insulation material storage part Is A3 (mm ² ), and T1 = A1 / t1, T2 = A2 / t2, and T3 = A3 / t3, (T2 / T1) is 1.1 to 2.0, and (T3 / T1) is 0.3 or less, and dicing die bonding The film was wound up roll while accommodated in the product accommodating section, a packing method of the dicing die bonding film, characterized in that housing the dry ice on the cold insulating material accommodating portion.

  A support member larger than the roll is attached to both ends of the roll, and the roll and the support member are fixed with at least two bands so as to intersect with the support member, and then stored in the product storage unit. Also good.

  According to the 2nd invention, the packing method of the dicing die bonding film which made heat insulation and accommodation efficiency compatible can be obtained.

  In particular, if a support member larger than the roll is attached to both ends of the roll from the outside of the storage bag, and the roll and the support member are fixed with two bands and then stored in the product storage section, the roll inside the package Does not move, and roll misalignment can also be prevented.

  Also, when the support member is larger than the outer diameter of the roll and the roll is stored in the product storage section, if a gap is formed between the roll and the partition member, the film is not damaged by the partition member, Moreover, it is not cooled locally by the partition member.

  ADVANTAGE OF THE INVENTION According to this invention, the packaging structure of a dicing die-bonding film etc. which do not have a bad influence on the characteristic of a film can be provided at the same time it stores at cold temperature.

FIG. 3 is an exploded perspective view showing the packing structure 1. The top view except the cover part 21 of the packing structure 1. FIG. FIG. 3 is a sectional elevation view of the packing structure 1 and is a sectional view taken along line AA in FIG. 2. (A) is a top view of the packing box 3, (b) is the BB sectional drawing of (a). FIG. 4 is an exploded perspective view showing a state in which a support member 23 is fixed to a roll 13. The perspective view which shows the state which fixed the supporting member 23 and the roll 13 with the band 27. FIG. The top view except the cover part 21 of the packing structure 1a. The perspective view which shows the other state which fixed the support member 23 and the roll 13 with the band 27. FIG. It is a figure which shows the film 100, Comprising: (a) is a front view, (b) is the sectional view on the AA line of (a).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is an exploded perspective view showing the packing structure 1, FIG. 2 is a plan view (excluding the lid) showing the packing structure 1, and FIG. 3 is a sectional elevation view of the packing structure 1, FIG. FIG. The packaging structure 1 mainly includes a packaging box 3, a partition member 9, a dry ice 11, a roll 13, a lid portion 21, and the like.

  The roll 13 is configured by winding a film around a hollow core 19. The film is a dicing die bonding film. The roll 13 is stored in the storage bag 15. The dicing die bonding film is composed of a release film, an adhesive layer, an adhesive film, and the like as described above.

  An adhesive film is comprised from the base material and the adhesive layer on a base material. Examples of the base material include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene- Homopolymer or copolymer of α-olefin such as methyl acrylate copolymer, ethylene-acrylic acid copolymer, ionomer, or a mixture thereof, polyurethane, styrene-ethylene-butene copolymer or pentene copolymer , Thermoplastic elastomers such as polyamide-polyol copolymers, and mixtures thereof. In addition, two or more materials selected from these groups may be mixed, or may be a single layer or a multi-layered material, but those having a small shape change due to temperature are preferable. The thickness of the substrate is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm.

  The pressure-sensitive adhesive layer is a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, addition reaction type organopolysiloxane resin, silicon acrylate resin, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer. A polymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, polyisoprene, styrene / butadiene copolymer, various hydrogenated elastomers, etc., and mixtures thereof are appropriately blended and prepared. Is preferred. In order to fix the semiconductor wafer, it is desirable to add a resin having a glass transition temperature of room temperature or lower, more preferably 0 ° C. or lower.

  Various surfactants and surface smoothing agents may be added. There are radiation-curing types and non-radiation-curing types in which the adhesive strength does not change by irradiation, the former is easy to control the adhesive strength, and the latter can be used for devices that do not allow radiation irradiation. It is selected appropriately. When the radiation curable type is selected, it is preferable to prepare it by appropriately blending a radiation polymerizable compound having a photopolymerizable carbon-carbon double bond and a photopolymerization initiator. Although the thickness of an adhesive layer is not specifically limited, Usually, 5-50 micrometers is preferable and 7-20 micrometers is more preferable.

  The adhesive layer is obtained by forming a film of the adhesive in advance, and preferably has a thermosetting resin from the viewpoint of adhesiveness and reliability. For example, known polyimide resins, polyamide resins, polyetherimide resins, polyamideimide resins, polyester resins, polyesterimide resins, phenoxy resins, polysulfone resins, polyethersulfone resins, polyphenylene sulfide resins, polyether ketones used for adhesives Resin, chlorinated polypropylene resin, acrylic resin, polyurethane resin, epoxy resin, polyacrylamide resin, melamine resin, etc., and mixtures thereof can be used. To improve the breakability of the adhesive layer, acrylic copolymer It is preferable that Tg of an acrylic copolymer is 10 degreeC or more including a polymer and an epoxy resin. Furthermore, it is preferable to contain 5-50% of an inorganic filler. Moreover, in order to reinforce the adhesive force with respect to a chip | tip or a lead frame, it is desirable to add a silane coupling agent or a titanium coupling agent to the said material and its mixture as an additive. Although the thickness of an adhesive bond layer is not specifically limited, Usually, about 5-100 micrometers is preferable.

  A pair of partition members 9 are provided inside the packing box 3 and the internal space is partitioned into three. The space on both sides of the packaging box 3 becomes the cold insulation material storage portion 5, and the central space becomes the product storage portion 7.

  As shown in FIG. 2, the cold insulation material storage unit 5 stores dry ice 11 that is a cold insulation material. The dry ice 11 is, for example, a plate shape. The size of the dry ice 11 is appropriately set according to the size of the cold insulation material storage unit 5 and the transportation time. Moreover, it is preferable that the total surface area of the dry ice 11 is 0.5 to 8 times the total surface area inside the cold insulating material storage unit 5. If it is less than 0.5 times, the amount of dry ice is insufficient, and the temperature of the entire product storage unit 7 cannot be sufficiently controlled. If it is 8 times or more, the sublimation speed of dry ice is too fast, and the cooling effect may be lost during transportation.

  Further, for example, two rolls 13 are stored in the product storage unit 7 side by side. That is, the product storage unit 7 does not store the cold insulating material (dry ice 11). Moreover, as shown in FIG. 3, the cover part 21 is provided in the upper part of the packaging box 3, and a packaging box is closed. The lid portion 21 may be made of the same material as the packaging box 3.

  Here, as shown in FIG. 3, the thickness of the side wall (side surface facing the cold insulation material storage unit 5) of the packaging box 3 is defined as t1 (mm). The thickness of the partition member 9 is t2 (mm). Moreover, let t3 (mm) be the bottom face of the packing box (the bottom face facing the cold insulation storage part 5). In addition, t1 is taken as the average thickness of the side wall part of 3 directions of each cold insulating material accommodating part 5. FIG.

4A and 4B are diagrams illustrating the packaging box 3, in which FIG. 4A is a plan view (with a lid omitted), and FIG. 4B is a cross-sectional view taken along line BB in FIG. 4A. As described above, the packaging box 3 is divided into the cold insulation material storage unit 5 and the product storage unit 7. Here, the sum of the surface areas of the side surface side of the cold insulation material storage portion 5 (three-direction surfaces excluding the partition member 9 side as shown in FIG. 4A) is defined as A1 (mm ² ). Further, the surface area of the cold insulator storage portion 5 on the partition member 9 side is A2 (mm ² ). Further, the surface area of the bottom surface side of the cold insulation material storage unit 5 is A3 (mm ² ).

  The surface area / thickness defined as above is defined as follows in each part. It is assumed that T1 = A1 / t1 on the side surface side of the cold insulation material storage unit 5, T2 = A2 / t2 on the partition member 9 side of the cold insulation material storage unit 5, and T3 = A3 / t3 on the bottom side of the cold insulation material storage unit 5. When defined in this way, a range of T2 / T1 = 1.1 to 2.0 is desirable. Moreover, the range of T3 / T1 = 0.05-0.3 is desirable.

  If T2 / T1 is 1.1 or more and T3 / T1 is 0.3 or less, the product inside the product storage section 7 can be reliably cooled without being discharged to the outside. On the other hand, when T2 / T1 exceeds 2.0, the amount of heat transferred through the partition member increases, and a temperature gradient is generated in the product storage unit 7 and only the portion of the roll 13 facing the partition member 9 is excessive. May cause a space between the pressure-sensitive adhesive film and the adhesive layer. On the other hand, if T3 / T1 is less than 0.05, the bottom surface of the packaging box 3 becomes excessively thick and adversely affects weight reduction.

  The packaging box 3 and the partition member 9 can be formed of the same material, for example. Here, the thermal conductivity can be controlled by changing the material constituting the packing box 3 and the partition member 9. The material constituting the partition member 9 and the packing box 3 is preferably an organic resin from the viewpoint of heat insulation, and polypropylene, expanded polystyrene, expanded polypropylene, or the like can be used, but it is preferable to use expanded polystyrene. The expanded polystyrene can change the thermal conductivity by controlling the expansion ratio, but the expansion ratio is preferably 30 to 200 times, more preferably 30 to 120 times. When the expansion ratio is 200 times or more, the thermal conductivity becomes too high, and when the expansion ratio is less than 30 times, the thermal conductivity of the resin before foaming is too close, so the cooling ability is lower than when it is 30 times. is there. In addition, it is preferable that the thermal conductivity of the partition member 9 is 0.1 W / mK or less. When the thermal conductivity is 0.1 W / mK or less, local cooling can be prevented.

  Here, the reason why the surface area / thickness of each part is defined to define the relationship between the parts is as follows. Ease of heat transfer in each part can be examined by heat resistance (heat transfer amount (W) = temperature difference (° C.) / Heat resistance (° C./W)). Here, considering thermal conductivity (W / (m · ° C.)), it can be considered that thermal resistance = thickness / (thermal conductivity / heat transfer area). That is, for the same thermal conductivity, if the area is large, the amount of heat transfer is large, and if the thickness is large, the amount of heat transfer is small. Therefore, in the present invention, for example, when the packaging box 3 and the partition member 9 are made of the same resin material, the ease of movement of heat is improved by the reciprocal of the thermal resistance (heat transfer area / thickness). The relationship between each part is defined in consideration of this.

Note that the thickness of the side wall of the packaging box is desirably 20 mm or more, and the volume of the product storage unit 7 is desirably 0.02 to 0.05 m ³ in consideration of the cold-retaining performance and handling properties of the product.

  The bending strength of the side wall and the bottom surface of the packing box 3 is preferably 0.1 MPa or more. A side wall of 0.5 MPa or more is desirable because the packaging boxes can be sufficiently stacked. There is no problem with the bending strength being large, but considering the size and weight, it is reasonable to set the upper limit to about 3 MPa.

  As described above, according to the present embodiment, for example, even a dicing die bonding film having a thermosetting adhesive film layer can be packed in a state where it is reliably kept cold. Moreover, weight reduction of a packaging box etc. can be made compatible, ensuring required heat insulation. In addition, since the cold insulation material storage unit 5 and the product storage unit 7 are separated by the partition member 9, the dry ice 11 does not come into contact with the roll 13 via the storage bag 15. For this reason, a part of roll 13 is not locally cooled.

  Next, a second embodiment will be described. FIG. 5 is an exploded perspective view showing a state in which the support member 23 is fixed to the roll 13, and FIG. 6 is a perspective view showing a state in which the support member 23 and the roll 13 are fixed by the band 27. In addition, in the following description, about the structure which show | plays the function similar to the packaging structure 1, the code | symbol same as FIGS. 1-4 is attached | subjected and the overlapping description is abbreviate | omitted.

  In the second embodiment, resin support members 23 are provided at both ends of the roll 13. The support member 23 is a substantially rectangular member. A convex portion 25 is provided substantially at the center of one surface of the support member 23. The convex portion 25 is a substantially columnar portion protruding on one surface of the support member 23. Ribs are formed on the outer edge of the support member 23 in the same direction as the direction in which the protrusions 25 are formed. In addition, a recess 26 is provided in the approximate center of the other surface of the support member 23. The shape of the support member 23 is not limited to the illustrated example, and the outer shape of the support member 23, the shape and size of the convex portion 25, the rib shape, and the like can be set as appropriate.

  The support member 23 is fixed to the roll 13 from above the storage bag 15. At this time, the convex portions 25 of the support member 23 are fitted and attached to the hollow portions at both ends of the core 19. Here, with the support member 23 attached to the roll 13, the roll 13 is sandwiched between the support members 23. For this reason, both sides of the roll 13 are fixed by the support members 23.

  Here, when the support member 23 is pushed into the core 19, the width of the core 19 is preferably substantially the same as or slightly larger than the width of the film so that the side end portions of the film are not damaged by the support member 23. Further, when the support member 23 is fitted to the core 19, the support member 23 is buffered in the gap between the support member 23 and the roll 13 side end as necessary in order to securely hold the both end portions of the roll 13 with the support member 23. An elastic member or the like may be disposed.

  The size of the support member 23 is desirably slightly larger than the outer diameter of the roll 13. If the roll 13 is accommodated in the rib of the outer edge portion of the support member 23, the contact between the inner surface of the product storage portion and the roll 13 can be prevented.

  As shown in FIG. 6, the support member 23 and the roll 13 are fixed by two resin bands 27 to the roll 13 having a pair of support members 23 attached to the upper and lower ends. The band 27 is provided over the entire periphery of the support member 23 and the roll 13 (storage bag 15) so as to be orthogonal to each other, and the support member 23 and the roll 13 are fixed.

  The two bands 27 intersect at the approximate center of the support member 23. That is, the intersection of the two bands 27 is the position of the support member 23. Note that the intersection of the two bands 27 may be fixed to each other. For example, the bands 27 may be fixed using fusion, adhesion, or other binding members. By doing in this way, the position of an intersection part does not shift and handling becomes easier.

  FIG. 7 is a plan view showing the packing structure 1a (excluding the lid portion 21). In the packing structure 1 a, the roll 13 with the support member 23 fixed is stored in the product storage unit 7. The width of the product storage unit 7 is substantially the same as the width of the support member 23, and the length of the product storage unit 7 is about twice that of the support member 23. That is, two rolls 13 to which the support member 23 is fixed are stored in the product storage unit 7 in parallel.

  The size of the support member 23 is slightly larger than the outer diameter of the roll 13. For this reason, even if the support member 23 contacts the inner surface of the product storage unit 7 (the inner surface of the packing box 3 or the partition member 9), the surface of the roll 13 does not contact the inner surface of the product storage unit 7. That is, a gap is formed between the outer surface of the roll 13 and the inner surface of the product storage unit 7. For this reason, the surface of the roll 13 is not damaged by contact with the inner surface of the product storage unit 7.

  Further, the surface of the partition member 9 on the side of the cold insulation material storage unit 5 is in contact with the dry ice 11. Therefore, although the partition member 9 itself is cooled, in this embodiment, since the size of the support member 23 is slightly larger than the outer diameter of the roll 13, the space between the surface of the roll 13 and the inner surface of the partition member 9. A gap is also formed. Therefore, it has a packing structure in which only a part of the roll 13 is not locally cooled. For this reason, there is no influence on the characteristic accompanying local cooling.

  In addition, the heat insulation effect of the upper and lower surfaces of the roll 13 can be enhanced by configuring the material of the support member 23 with a heat-insulating resin member. For this reason, heat from the outside of the packaging box 3 can be prevented from being transmitted to the roll 13 even if the thickness of the bottom surface (t3) and the thickness of the lid are made thinner than the thickness (t1) of the side surface. It is possible to reduce the size of the packaging box.

  As described above, when two bands are used, the two bands 27 intersect at the approximate center of the support member 23. That is, the intersection of the two bands 27 is the position of the recess 26. Therefore, the vicinity of the intersection of the two bands 27 does not contact the support member 23, and a gap is formed between the support member 23 (recess 26). Therefore, when lifting the roll 13, it is possible to insert a hand (finger) into the gap formed by the recess 26, hold the intersecting portion of the band 27 and lift it. Therefore, the roll 13 can be easily lifted from the packing box or from a state in which the plurality of rolls 13 are arranged.

  On the other hand, as shown in FIG. 8, the number of bands may be further increased to four. In this case, each of the four bands is formed in a well shape. Therefore, although it is difficult to cross the center portion and it is difficult to lift the roll 13 easily, it is possible to take out the roll 13 in a well-balanced manner by inserting a finger or the like into the crossing portion facing diagonally. In the case of four bands, one and three bands may be hung so as to cross each other. In any case, the roll 13 can be easily lifted by providing one or more intersections.

  According to the second embodiment, an effect similar to that of the first embodiment can be obtained. Further, since the roll 13 is sandwiched by the support member 23 and fixed by the band 27, it is possible to prevent the film from being unwound. Moreover, since the roll 13 is stored in the product storage unit 7 together with the support member 23, the edge of the roll 13 and the like are not damaged.

  Further, if the support member 23 is larger than the roll 13, a gap can be formed between the roll 13 and the partition member 9 and the like. For this reason, local cooling of the roll 13 can be prevented by contact with the partition member 9.

  EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these.

(Preparation of adhesive layer)
(Adhesive layer 1)
15 parts by weight of cresol novolac type epoxy resin (epoxy equivalent 197, molecular weight 1200, softening point 70 ° C.) as an epoxy resin, 70 parts by weight of acrylic resin (mass average molecular weight: 800,000, glass transition temperature 7 ° C.), phenol novolac as a curing agent Adhesive composition 1 obtained by stirring 15 parts by weight of a resin (hydroxyl equivalent 104, softening point 80 ° C.) and 1 part of Curesol 2PZ (manufactured by Shikoku Kasei Co., Ltd., trade name: 2-phenylimidazole) as an accelerator in an organic solvent. Got. This adhesive composition is applied to a PET film forming a release film, and heated and dried at 120 ° C. for 10 minutes to form a 20 μm-thick B-stage coating film after drying. PET film / adhesive A layer 1 / PET film laminate was obtained.
In addition, the PET film (Teijin: Hupyrex S-314 (trade name), thickness 25 μm) subjected to silicone release treatment was used as the PET film.

(Adhesive layer 2)
5 parts by weight of a cresol novolac type epoxy resin (epoxy equivalent 197, molecular weight 1200, softening point 70 ° C.) as an epoxy resin, 0.5 parts by mass of 3-glycidoxypropyltrimethoxysilane as an silane coupling agent, an average particle size of 1. From 50 parts by mass of 0 μm silica filler, 2,2′-bis [4- (4-aminophenoxy) phenyl] propane, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and pyromellitic anhydride 40 parts by weight of a synthesized polyimide resin having a weight average molecular weight of 50,000, 5 parts by weight of a phenol novolak resin (hydroxyl equivalent: 104, softening point: 80 ° C.) as a curing agent, and 1 part of Curezol 2PZ as an accelerator are bonded together in an organic solvent. After obtaining the agent composition 2, the adhesive layer 2 was obtained in the same manner as the adhesive layer 1.

<Manufacture of adhesive film>
(Adhesive layer composition 1)
A pressure-sensitive adhesive layer composition 1 was obtained by adding 3 parts by weight of polyisocyanate as a curing agent to 100 parts of an acrylic copolymer having a glass transition temperature of −13 ° C. and mixing them.
(Adhesive layer composition 2)
An acrylic copolymer having a glass transition temperature of −34 ° C. is mixed with 3 parts by mass of a polyisocyanate as a curing agent and 1 part by mass of 1-hydroxy-cyclohexyl-phenyl-ketone as a photopolymerization initiator. 2.

(Adhesive films 1, 2)
The prepared pressure-sensitive adhesive layer composition was applied to a PET film forming a release film so that the dry film thickness was 10 μm, and dried at 120 ° C. for 3 minutes. By transferring the pressure-sensitive adhesive layer composition applied to this PET film onto a 100-μm-thick polypropylene-elastomer (PP: HSBR = 80: 20 elastomer) resin film as a supporting substrate, the pressure-sensitive adhesive films 1, 2 Was made.
In addition, Novatec FG4 (trade name) manufactured by Nippon Polychem Co., Ltd. was used for polypropylene (PP), and Dynalon 1320P (trade name) manufactured by JSR Corporation was used for hydrogenated styrene butadiene (HSBR). Moreover, the PET film (Teijin: Hupyrex S-314 (trade name), thickness 25 μm) subjected to silicone release treatment was used as the PET film.

<Precut processing>
The adhesive layer 1 and the pressure-sensitive adhesive film 1 obtained as described above are peeled off only one side of the PET film of the adhesive layer, and adjusted so that the depth of cut into the release film is 10 μm or less, and the diameter is 220 mm. The circular pre-cut processing was performed. Thereafter, unnecessary portions of the adhesive layer 1 were removed, and the release film was laminated at room temperature so that the adhesive film 1 was in contact with the adhesive layer 1. Then, the dicing die bonding film A is prepared by adjusting the adhesive film 1 so that the depth of cut into the release film is 10 μm or less and performing a circular precut process with a diameter of 290 mm concentrically with the adhesive layer 1. Produced.
Dicing die bonding films B, C, and D are produced using adhesive layer 1 and adhesive film 2, adhesive layer 2 and adhesive film 1, adhesive layer 2 and adhesive film 2 in the same manner as dicing die bonding film A. did.

  The precut-processed dicing die bonding film was provided with approximately 1.2 m of unlabeled portions at the beginning and end of winding, and 300 sheets were wound with 10N. This was stored in a polyethylene bag, and after deaeration, heat-sealed and a side plate made of polypropylene was attached to both ends. Further, the two PP bands were hung in a cross so as to be fused and joined. The results are shown in Table 1.

  T1 to T3 in the table are calculated as described above from the thickness of each part shown in FIG. 3 and the surface area of each part shown in FIG. Each item in the table was measured and evaluated as follows.

(void)
First, each package is stored in the refrigerator (5 ° C.) for 1 month, then removed from the refrigerator, stored in a plate-shaped dry ice of approximately the same volume as the cold insulation storage unit, and placed on a transport truck. We traveled back and forth between Akita (about 1000km) in a refrigerated state. Thereafter, each package was unpacked, the roll was returned to room temperature, the packaging bag was opened, the roll was unwound, and the presence or absence of voids between the adhesive layer and the adhesive film was visually observed. The case where no void was observed at all was rated as “」 ”, and“ 300 ”when there were 5 or less labels with voids, and“ x ”when 5 or more.

(Decrease rate of adhesive strength)
The adhesive force was measured as follows using a label without voids. The adhesive layer of the label was heat bonded to the wafer at 70 ° C. for 1 minute, then fixed to the ring frame, and the semiconductor wafer was diced into 5 mm × 5 mm chips. The chip with the adhesive layer is placed so that the adhesive layer is in contact with the mirror surface of a separately prepared 10 mm × 10 mm silicon chip base, and a load (0.1 MPa) is applied vertically to the substrate. Heated at 150 ° C. for 3 seconds. Then, it heated at 175 degreeC for 4 hours, and the adhesive bond layer was hardened. Thus, a test piece in which the chip was fixed to the base with the cured adhesive layer was obtained. With the base of this test piece fixed to the hot plate, the chip was pushed in a horizontal direction (direction parallel to the base) at a speed of 0.125 mm / sec with a push-pull gauge and a hot plate temperature of 265 ° C. The force was measured. The rate of decrease from the value of the adhesive strength measured immediately before transportation was confirmed. When the rate of decrease was less than 5%, “◯” was assigned, and when the reduction rate was 5% or more, “X” was assigned.

(Example 1)
A foamed polystyrene having an expansion ratio of 50 times is processed, and the ratio of T1 to T3 (hereinafter simply referred to as “ratio”) as in Example 1 of Table 1 and the volume of the product container (hereinafter simply referred to as “volume”), A packaging box having a thickness was produced. Two rolls of the dicing die bonding film A were accommodated in this packing box as shown in FIG. 7 to obtain a dicing die bonding film package of Example 1.

(Examples 2-8, Comparative Examples 1-4)
Dicing die bonding in Examples 2 to 8 and Comparative Examples 1 to 4 in the same manner as in Example 1 using the expansion ratio, ratio, volume, side wall thickness, and type of dicing die bonding film described in Table 1. A film package was obtained.

  In Examples 1 to 8, no void was generated, and the decrease in adhesive force was small. On the other hand, in Comparative Example 1, T2 / T1 exceeds 2.0, the amount of heat transferred through the partition member increases, and a temperature gradient is generated in the product storage portion. The part was cooled excessively and voids were generated. Moreover, since T2 / T1 was less than 1.1 in Comparative Example 2 and Comparative Example 3, the product was not sufficiently cooled and the adhesive strength was greatly reduced. In Comparative Example 3, since T3 / T1 is less than 0.05, the bottom surface of the packaging box 3 becomes very thick, and the weight cannot be reduced. In Comparative Example 4, since T3 / T1 exceeded 3.0, the product was not sufficiently cooled and the adhesive strength was greatly reduced.

  As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs.

DESCRIPTION OF SYMBOLS 1, 1a ......... Packing structure 3 ......... Packing box 5 ......... Cold insulation storage part 7 ......... Product storage part 9 ......... Partition member 11 ......... Dry ice 13 ......... Roll 15 ......... Storage bag 19 ... Core 21 ... Lid 23 ... Support member 25 ... Convex 27 ... Band

Claims (6)

A dicing die bonding film packaging structure,
Inside, using a packaging box having a product storage part, and a cold insulation storage part formed on both sides of the product storage part,
The product storage section and the cold insulation storage section are partitioned by a partition member,
A roll wound with a dicing die bonding film is stored in the product storage unit,
Dry ice is stored in the cold insulation storage unit,
The thickness of the side wall of the packaging box is t1 (mm), the thickness of the partition member is t2 (mm), the thickness of the bottom surface of the packaging box is t3 (mm), T1 = A1 / t1 where A1 (mm ² ), the surface area on the partition member side of the cold insulation material storage part is A2 (mm ² ), and the surface area on the bottom side of the cold insulation material storage part is A3 (mm ² ). , T2 = A2 / t2, and T3 = A3 / t3,
(T2 / T1) is 1.1-2.0, and (T3 / T1) is 0.3 or less, The packaging structure of the dicing die bonding film characterized by the above-mentioned.   The dicing die bonding according to claim 1, wherein a support member is attached to both ends of the roll, and the roll and the support member are fixed with at least two bands so as to intersect at the support member. Film packing structure. Two or more of the support members and the rolls fixed by the band are arranged and accommodated in a packaging box,
The said support member is larger than the outer diameter of the said roll, and when the said roll is accommodated in the said product accommodating part, a clearance gap is formed between the said roll and the said partition member, It is characterized by the above-mentioned. Packaging structure of the dicing die bonding film described. The packing structure for a dicing die bonding film according to claim 3, wherein the side wall of the packing box has a thickness of 20 mm or more, and the volume of the product storage section is 0.02 to 0.05 m ³ . A dicing die bonding film packaging method,
Inside, using a packaging box having a product storage part, and a cold insulation storage part formed on both sides of the product storage part,
The product storage section and the cold insulation storage section are partitioned by a partition member,
The thickness of the side wall of the packaging box is t1 (mm), the thickness of the partition member is t2 (mm), the thickness of the bottom surface of the packaging box is t3 (mm), T1 = A1 / t1 where A1 (mm ² ), the surface area on the partition member side of the cold insulation material storage part is A2 (mm ² ), and the surface area on the bottom side of the cold insulation material storage part is A3 (mm ² ). , T2 = A2 / t2, and T3 = A3 / t3,
(T2 / T1) is 1.1 to 2.0, (T3 / T1) is 0.3 or less,
A packaging method for a dicing die bonding film, wherein a roll around which a dicing die bonding film is wound is stored in the product storage section, and dry ice is stored in the cold insulation storage section.   A support member larger than the roll is attached to both ends of the roll, and the roll and the support member are fixed with at least two bands so as to intersect with the support member, and then stored in the product storage unit. The packing method of the dicing die bonding film according to claim 5.

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