JP4956560B2 - Wafer processing tape roll packaging method - Google Patents

Description

  The present invention relates to a packaging method for a roll body of a wafer processing tape, and more particularly to a packaging method for a roll body of a wafer processing tape having a laminated dicing die bonding film having two functions of a dicing tape and a die bonding film. .

  Recently, a dicing tape for fixing a semiconductor wafer when the semiconductor wafer is cut and separated into individual chips (dicing) and a semiconductor chip that has been cut are bonded to a lead frame, a package substrate, or the like, or stacked. As a package, a dicing die bonding tape having two functions of a die bonding film (also referred to as a die attach film) for laminating and adhering semiconductor chips has been developed.

  As such a dicing / die bonding film, there is a film that has been precut in consideration of workability such as attachment to a wafer and attachment to a ring frame during dicing.

  Examples of the pre-cut dicing / die bonding film are shown in FIGS. 2, FIG. 3 (A), and FIG. 3 (B) are a schematic view, a plan view, and a cross-sectional view of a wafer processing tape 20 provided with a dicing die bonding film 30, respectively. The wafer processing tape 20 includes a release film 21, an adhesive layer 22, and an adhesive film 23. The adhesive layer 22 is processed into a circular shape corresponding to the shape of the wafer, and has a circular label shape. The adhesive film 23 is obtained by removing the peripheral area of the circular portion corresponding to the shape of the ring frame for dicing. As shown in the drawing, the adhesive film 23 includes a circular label portion 23a and a peripheral portion 23b surrounding the outside. Have. The adhesive layer 22 and the circular label portion 23a of the pressure-sensitive adhesive film 23 are laminated with their centers aligned, and the circular label portion 23a of the pressure-sensitive adhesive film 23 covers the adhesive layer 22 and is released from the periphery thereof. It is in contact with the film 21. The dicing / die bonding film 30 is configured by a laminated structure including the adhesive layer 22 and the circular label portion 23 a of the adhesive film 23.

  When dicing the wafer, the release film 21 is peeled from the laminated adhesive layer 22 and the adhesive film 23, and the back surface of the semiconductor wafer W is pasted on the adhesive layer 22, as shown in FIG. The dicing ring frame R is adhesively fixed to the outer peripheral portion of the circular label portion 23 a of the adhesive film 23. In this state, the semiconductor wafer W is diced, and then the adhesive film 23 is subjected to a curing process such as ultraviolet irradiation to pick up a semiconductor chip. At this time, since the adhesive film 23 has a reduced adhesive force due to the curing treatment, the adhesive film 23 is easily peeled off from the adhesive layer 22, and the semiconductor chip is picked up with the adhesive layer 22 attached to the back surface. The adhesive layer 22 attached to the back surface of the semiconductor chip then functions as a die bonding film when the semiconductor chip is bonded to a lead frame, a package substrate, or another semiconductor chip.

  By the way, the wafer processing tape to be shipped is formed as a roll body 40 of the wafer processing tape wound around the winding core (FIG. 5A), and then vacuum packaging using the packaging member is performed as it is. Then, it is refrigerated and stored as a roll body 45 of the wafer processing tape that has been heat-sealed and packaged (FIG. 5B).

  Here, as shown in FIGS. 2 and 3, the wafer processing tape 20 has a dicing die bonding film 30 portion in which an adhesive layer 22 and a circular label portion 23 a of the adhesive film 23 are laminated. It is formed thicker than the peripheral portion 23b. For this reason, when the packaged roll of wafer processing tape is refrigerated, the product is strongly compressed, so the laminated dicing / die bonding film of the adhesive layer 22 and the circular label portion 23a of the adhesive film 23. The level difference between the portion and the peripheral portion 23b of the adhesive film 23 is overlapped, and the level difference is transferred to the surface of the flexible adhesive layer 22, that is, the transfer mark (label mark, wrinkle, or winding) as shown in FIG. Also referred to as a trace).

  Such transfer marks are particularly noticeable when the adhesive layer 22 is formed of a soft resin, has a thickness, or has a large number of windings of the tape 20. When the transfer mark is generated, air is caught between the adhesive layer and the semiconductor wafer and does not come into close contact with each other. As a result, adhesion failure occurs, and there is a possibility that a defect may occur during processing of the wafer.

  In order to suppress the occurrence of the transfer marks, it is conceivable to reduce the film winding pressure. However, in this method, the winding of the product occurs, for example, the film is difficult to set on the tape mounter. There is a risk of hindrance during actual use.

  Further, the dicing die bonding film 30 portion has a two-layer structure in which the adhesive layer 22 and the circular label portion 23a of the adhesive film 23 are laminated, so that the circular label of the adhesive layer 22 and the adhesive film 23 is obtained. A void called a void is generated between the portion 23a. The dicing die bonding film in which voids are generated is handled as a defective product.

  In order to suppress the occurrence of the label mark as described above, a film thickness equal to or greater than the total film thickness of the adhesive layer and the pressure-sensitive adhesive film is formed on the outside of the adhesive layer and the pressure-sensitive adhesive film on the release substrate. An adhesive sheet provided with a supporting layer is disclosed (Patent Document 1). The adhesive sheet of Patent Document 1 includes a support layer, so that the winding pressure applied to the adhesive sheet is dispersed or collected in the support layer, and the adhesive layer, the laminated portion of the adhesive film, and the adhesive film only portion Is suppressed from being transferred to another adhesive layer.

JP 2007-2173 A

  However, in the adhesive sheet of Patent Document 1, since the support layer is formed on a part other than the adhesive layer and the pressure-sensitive adhesive film required when manufacturing a semiconductor device on the release substrate, the support layer The width of the support layer is limited with respect to the outer diameter of the adhesive layer and the pressure-sensitive adhesive film, and the effect of suppressing the label traces is not sufficient.

  Therefore, an object of the present invention is to vacuum-packaging and heat-sealing a roll body of a wafer processing tape having a dicing die-bonding film having an adhesive layer and an adhesive film on a release film using a packaging member. Later, when the wafer processing tape roll body is stored in a refrigerator, the wafer processing tape roll body having a dicing die bonding film capable of sufficiently suppressing the generation of transfer marks on the adhesive layer. It is to provide a packaging method.

In order to achieve the above-described object, the method for packaging a roll body of a wafer processing tape according to the present invention includes two plate-like members having an area larger than the circular side surface of the roll body, and the two side surfaces of the roll body. And attaching to the side surface so as to cover. Specifically,
A release film, an adhesive layer having a predetermined planar shape provided on the surface of the release film, and covering the adhesive layer and contacting the release film around the adhesive layer Packaging of a hollow cylindrical roll body of a tape for wafer processing, including a label portion having a predetermined planar shape provided in such a manner and an adhesive film having a peripheral portion provided so as to surround the outside of the label portion A method,
Attaching two plate members having a larger area than the circular side surface of the roll body to the side surface so as to cover the two side surfaces of the roll body;
A step of vacuum packaging the roll body to which the plate-like member is attached with a packaging material;
Look including a step of heat-sealing a portion of the packaging material,
The plate-like member has a columnar protrusion that can be attached to a hollow portion of the roll body.
It is characterized by that.

  Since two plate-like members having an area larger than the circular side surface of the roll body are attached to the side surface so as to cover the two side surfaces of the roll body, the roll body of the wafer processing tape is used when vacuum packaging is performed in a subsequent process. The pressure acting on the curved surface of the roll body, that is, the wafer processing tape surface direction can be relaxed compared to the case where no plate-like member is attached to the surface. As a result, since the roll body of the wafer processing tape itself can be vacuum-packed at a desired pressure, the pressure applied to the adhesive layer having a flexible step shape can be alleviated, thereby suppressing the generation of voids and transfer marks. Can do. In addition, regarding the two plate-like members having a larger area than the circular side surface of the roll body, it is preferable that the periphery of the plate-like member is at a distance of 1.5 mm or more from the circular side surface of the roll body.

  According to the above-described invention, since the plate-like member has the columnar protrusion that can be attached to the hollow portion of the roll body, it is possible to prevent displacement of the plate-like member from the attachment position in the vacuum packaging process. A desired pressure can be applied without applying an excessive pressure to the curved surface of the roll body. Furthermore, the process of the vacuum packaging process becomes easy. In consideration of the workability of the attaching operation, the clearance between the protrusion and the inner surface forming the hollow portion is preferably less than 2 mm.

  In addition, it is preferable that the shape of a plate-shaped member is a disk shape or square shape from a viewpoint of the space to store and stability. In particular, a rectangular plate-like member is desirable from the viewpoint of preventing cargo collapse during storage.

  According to the present invention, the two plate-shaped members having an area larger than the circular-shaped side surface of the roll body are attached to the side surface so as to cover the two side surfaces of the roll body. Compared with the case where it is not attached, the pressure acting on the curved surface of the roll body can be relaxed. As a result, the pressure that the step shape is pressed against the flexible adhesive layer can be alleviated, so that generation of voids and transfer marks can be suppressed.

(A) is a figure explaining the preparatory process of the packaging method of the roll body of the tape for wafer processing which concerns on embodiment of this invention. (B) is a figure explaining the attachment process which is a post process of a preparation process. (C) is a figure explaining the vacuum packaging process which is a post process of an attachment process. It is a schematic diagram of the conventional wafer processing tape. (A) is a top view of the conventional tape for wafer processing, (B) is the same sectional drawing. It is sectional drawing which shows the state by which the tape for wafer processing and the ring frame for dicing were bonded together. It is a figure for demonstrating the packaging method of the roll body of the conventional tape for wafer processing. It is a schematic diagram for demonstrating the malfunction of the conventional tape for wafer processing.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a view for explaining a method of packaging a roll body of a wafer processing tape according to an embodiment of the present invention. FIG. 1A is a diagram for explaining a preparatory process that is a pre-process of an attaching process for attaching two plate-like members to a roll body of a wafer processing tape. FIG. 1B is a view for explaining an attachment process for attaching two plate-like members to a roll body of a wafer processing tape. FIG. 1C is a view for explaining a vacuum packaging step of vacuum packaging a wafer processing tape using a packaging member.

<Preparation process>
In the preparation step, as shown in FIG. 1A, in order to attach the plate member 11 to the roll body 10 of wafer processing tape, the roll body 10 of hollow cylindrical wafer processing tape and two plate members 11a and 11b are prepared at predetermined positions. Here, the wafer processing tape roll 10 is formed by winding a wafer processing tape having a dicing die bonding film around a hollow cylindrical core to form a roll. As shown in FIG. 1A, the roll body 10 has a hollow cylindrical shape, and has two circular side surfaces 12 each having a circular space 13 formed by a winding core (not shown), and a cylindrical surface. And have. Then, square plate-like plate members 11 a and 11 b having an area larger than that of the side surface 12 are prepared at predetermined positions.

  The plate-like members 11a and 11b are provided with columnar protrusions 14 that can be attached to the circular space 13 of the side surface 12. Accordingly, in the subsequent vacuum packaging process, it is possible to prevent displacement from the mounting position of the plate-like member, so that a desired pressure can be applied to the curved surface of the roll body 10 without applying an excessive pressure. it can. Furthermore, the vacuum packaging process can be easily performed. In the preparation step, the plate-like members 11 a and 11 b are prepared at positions where the protrusions 14 can be attached to the circular space 13 of the roll body 10.

  The plate-like member 11 and the winding core are not particularly limited with respect to materials and the like, and usable materials can be selected from the viewpoints of pressure resistance, light weight, refrigerated storage, and the like. In this embodiment, as an example, the plate member is made of polypropylene resin, the dimensions are 200 * 200 mm, the thickness is 20 mm, the diameter of the cylindrical protrusion of the plate member is 73.5 mm, and the winding core Were made of ABS resin and had a length of 300 mm, an outer diameter of 90 mm, and an inner diameter of 75 mm.

  Similar to the wafer processing tape shown in FIGS. 2 and 3, the wafer processing tape according to the present embodiment is a long release film, an adhesive layer, and a side opposite to the side in contact with the adhesive layer. It has an adhesive film on the surface. The adhesive layer is provided on the release film and has a circular label shape corresponding to the shape of the wafer. The pressure-sensitive adhesive film covers the adhesive layer and is provided with a circular label portion provided so as to be in contact with the release film around the adhesive layer, and a peripheral portion provided so as to surround the outer side of the circular label portion. Have The peripheral part includes a form that completely surrounds the outside of the circular label part and a form that does not completely surround the periphery. The circular label portion has a shape corresponding to a ring frame for dicing. And the dicing die-bonding film is comprised from the adhesive bond layer and the circular label part. Hereafter, each component of the tape for wafer processing of this embodiment is demonstrated in detail.

(Release film)
As the release film used for the wafer processing tape, a known film such as a polyethylene terephthalate (PET) type, a polyethylene type, or a release-treated film can be used. The thickness of the release film is not particularly limited and may be appropriately set, but is preferably 25 to 50 μm.

(Adhesive layer)
As described above, the adhesive layer is formed on the release film and has a circular label shape corresponding to the shape of the wafer. The adhesive layer is attached to the back of the chip when the chip is picked up after the semiconductor wafer is bonded and diced, and is used as an adhesive when fixing the chip to the substrate or lead frame It is. As the adhesive layer, an adhesive including at least one selected from an epoxy resin, an acrylic resin, and a phenol resin can be used. In addition, a polyimide resin or a silicone resin can also be used. The thickness may be appropriately set, but is preferably about 5 to 100 μm.

(Adhesive film)
The pressure-sensitive adhesive film has a circular label portion corresponding to the shape of the ring frame for dicing and a peripheral portion provided so as to surround the outside thereof. Such an adhesive film can be formed by removing the peripheral region of the circular label portion from the film-like adhesive by precut processing.

  The pressure-sensitive adhesive film is not particularly limited, and has a low pressure-sensitive adhesive that has sufficient adhesive strength so that the wafer does not peel when dicing the wafer, and can be easily peeled off from the adhesive layer when picking up the chip after dicing. It only needs to show power. For example, what provided the adhesive layer in the base film can be used conveniently.

  As the base film of the adhesive film, any conventionally known film can be used without particular limitation. However, when a radiation curable material is used as the adhesive layer described later, the radiation transparency is reduced. It is preferable to use what has. In addition, the thickness of a base film is not specifically limited, Although you may set suitably, 50-200 micrometers is preferable.

  The resin used for the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin or the like used for the pressure-sensitive adhesive is used. be able to. It is preferable to prepare a pressure-sensitive adhesive by appropriately mixing an acrylic pressure-sensitive adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent and the like with the resin of the pressure-sensitive adhesive layer. The thickness of the pressure-sensitive adhesive layer 13 is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

<Installation process>
In the attaching step, as shown in FIG. 1B, the protrusions 14 of the plate-like members 11a and 11b are attached to the circular space 13 of the roll body 10. At this time, since the plate-like members 11a and 11b have a larger area than the side surface 12, the two side surfaces 12 can be attached so as to be covered by the plate-like members 11a and 11b. Further, since the side surface of the roll body 10 is formed substantially horizontally, the plate-like members 11 a and 11 b can be attached in close contact with the side surface 12 of the roll body 10.

<Vacuum packaging process>
In the vacuum packaging step, as shown in FIG. 1 (C), the roll body 10 is vacuum packaged together with the plate-like members 11a and 11b attached so as to cover the two side surfaces 12 of the roll body 10 using a packaging member. . Since the two plate-like members 11a and 11b having an area larger than the side surface 12 are attached to the side surface so as to cover the two side surfaces of the roll body 10, the plate-like member is not attached to the roll body of the wafer processing tape. In comparison, the pressure acting on the curved surface of the roll body 10, that is, the surface of the wafer processing tape can be relaxed. As a result, since the roll body 10 itself of the wafer processing tape can be vacuum-packed at a desired pressure, the pressure applied to the adhesive layer having a flexible step shape can be relaxed, so that generation of voids and transfer marks are suppressed. be able to.

  From the viewpoint of storage, a black plastic bag (thickness: about 100 μm) made of polyethylene resin was used as the packaging member, and the roll body 10 was vacuum packaged at a vacuum pressure of 0.005 MPa. Specifically, after packaging the roll body 10 using the packaging member, the nozzle of the vacuum device is inserted into the packaging member, the roll body 10 is packaged at a vacuum pressure of 0.005 MPa, and the nozzle is packaged at a predetermined timing. Vacuum packaging was performed by heat-sealing by thermocompression bonding after or while removing from the container.

<Evaluation method>
A 300 mm-wide wafer processing tape was wound up at a constant tension of 15 N to prepare a roll body. And the roll body 10 vacuum-packed by the preparation process of the packaging method which concerns on this embodiment, an attachment process, and a vacuum packaging process was refrigerated and stored in 5 degreeC environment for 90 days. Thereafter, the presence or absence of voids and wrinkles was determined by visual observation. As a result, generation of voids and wrinkles was not confirmed.

  As described above, according to the wafer processing tape packaging method of the present embodiment, the wafer processing tape roll body having the dicing die bonding film is vacuum-packed using the packaging member, heat-sealed, and then packed. Further, when the wafer processing tape roll was stored refrigerated, generation of transfer marks on the adhesive layer was simultaneously and sufficiently suppressed.

10, 40: Roll body for wafer processing tape 11a: 11b: Plate member 12: Side surface 15, 45: Roll body for packaged wafer processing tape 21: Release film 22: Adhesive layer 23: Adhesive film 23a : Circular label portion 23b: Peripheral portion 30: Dicing die bonding film

Claims (3)

A release film, an adhesive layer having a predetermined planar shape provided on the surface of the release film, and covering the adhesive layer and contacting the release film around the adhesive layer Packaging of a hollow cylindrical roll body of a tape for wafer processing, including a label portion having a predetermined planar shape provided in such a manner and an adhesive film having a peripheral portion provided so as to surround the outside of the label portion A method,
Attaching two plate members having a larger area than the circular side surface of the roll body to the side surface so as to cover the two side surfaces of the roll body;
A step of vacuum packaging the roll body to which the plate-like member is attached with a packaging material;
Look including a step of heat-sealing a portion of the packaging material,
The plate-like member has a columnar protrusion that can be attached to a hollow portion of the roll body.
A roll body packaging method characterized by the above. The periphery of the plate-like member is at a distance of 1.5 mm or more from the circular side surface of the roll body,
The roll body packaging method according to claim 1. The protrusion has a clearance between the inner surface forming the hollow part of less than 2 mm,
The roll body packaging method according to claim 1 .

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