MY167461A - Dicing die bonding film packaging structure and packing method - Google Patents

Dicing die bonding film packaging structure and packing method

Info

Publication number
MY167461A
MY167461A MYPI2013002645A MYPI2013002645A MY167461A MY 167461 A MY167461 A MY 167461A MY PI2013002645 A MYPI2013002645 A MY PI2013002645A MY PI2013002645 A MYPI2013002645 A MY PI2013002645A MY 167461 A MY167461 A MY 167461A
Authority
MY
Malaysia
Prior art keywords
roll
side plates
die bonding
dicing die
bonding film
Prior art date
Application number
MYPI2013002645A
Inventor
Masami Aoyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY167461A publication Critical patent/MY167461A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22—Details
    • B65D77/24—Inserts or accessories added or incorporated during filling of containers
    • B65D77/26—Elements or devices for locating or protecting articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D71/00—Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material
    • B65D71/50—Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material comprising a plurality of articles held together only partially by packaging elements formed otherwise than by folding a blank
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/053—Corner, edge or end protectors
    • B65D81/058—Protectors contacting five surfaces of the packaged article, e.g. five-sided end protectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/67—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
    • B65D85/671—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form
    • B65D85/672—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form on cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2581/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D2581/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D2581/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/051—Details of packaging elements for maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/057—Edge protectors adapted to protect the circular edge of rolls of material, e.g. coils of sheet metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Of Machine Parts And Wound Products (AREA)
  • Packages (AREA)
  • Buffer Packaging (AREA)

Abstract

A ROLL (5) HAS A STRUCTURE IN WHICH A FILM (9) IS WOUND AROUND A HOLLOW CORE (7). THE FILM (9) IS SUBSTANTIALLY THE SAME AS A FILM (100) ILLUSTRATED IN 8 AND IS A DICING DIE BONDING FILM HAVING A SURFACE WHERE DEPRESSIONS AND PROTRUSIONS ARE FORMED. THE ROLL (5) IS PLACED IN A STORAGE BAG (11). SIDE PLATES (3) ARE PROVIDED TO BOTH END PORTIONS OF THE ROLL (5) BEING PLACED IN THE STORAGE BAG (11). PROTRUDED PORTIONS (19) OF THE SIDE PLATES (3) ARE ATTACHED BY BEING INSERTED INTO BOTH END PORTIONS OF A FOLLOW PORTION OF THE CORE (7). WITH A PAIR OF THE SIDE PLATES (3) BEING ATTACHED TO TOP AND BOTTOM ENDS OF THE ROLL (5), THE SIDE PLATES (3) AND THE ROLL (5) ARE SECURED WITH TWO TO FOUR BANDS (15). THE BANDS (15) ARE PROVIDED ALL AROUND THE OUTER PORTIONS OF THE SIDE PLATES (3) AND THE ROLL (5) (STORAGE BAG 11) SUCH THAT AT LEAST TWO BANDS (15) CROSS, WHEREBY THE SIDE PLATES (3) AND THE ROLL (5) ARE SECURED. THE MOST ILLUSTRATIVE DRAWING IS 1.
MYPI2013002645A 2011-09-09 2012-09-05 Dicing die bonding film packaging structure and packing method MY167461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011196753 2011-09-09

Publications (1)

Publication Number Publication Date
MY167461A true MY167461A (en) 2018-08-28

Family

ID=47832192

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002645A MY167461A (en) 2011-09-09 2012-09-05 Dicing die bonding film packaging structure and packing method

Country Status (7)

Country Link
US (1) US20140034532A1 (en)
JP (1) JP5778244B2 (en)
KR (1) KR20130126935A (en)
CN (1) CN103476682B (en)
MY (1) MY167461A (en)
TW (1) TWI485094B (en)
WO (1) WO2013035749A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5739782B2 (en) * 2011-10-11 2015-06-24 古河電気工業株式会社 Dicing die bonding film packing structure and packing method
TW201408552A (en) * 2012-08-27 2014-03-01 Hon Hai Prec Ind Co Ltd Packing device
US20170038508A1 (en) * 2014-04-17 2017-02-09 Konica Minolta, Inc. Light reflective film roll and light reflective film roll package
JP6005108B2 (en) * 2014-08-01 2016-10-12 古河電気工業株式会社 Packing structure of dicing die bonding film or die bonding film
CN109592478A (en) * 2017-09-30 2019-04-09 中航光电科技股份有限公司 A kind of band packaging cable and its cable package component

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS572568B2 (en) * 1974-04-16 1982-01-18
US4033454A (en) * 1976-07-06 1977-07-05 Greif Bros. Corporation Method and structure for retaining shipping drums on pallets
US4287991A (en) * 1979-04-02 1981-09-08 Donnelly Bernard P Modularized unit load and disposable pallet therefor
JPS5846765U (en) * 1981-09-24 1983-03-29 大森機械工業株式会社 Bundle of stacked paper leaf-like articles
US4730732A (en) * 1982-09-30 1988-03-15 Continental Fibre Drum, Inc. Pallet and top frame for scrolled drum palletized package
US4821880A (en) * 1987-07-27 1989-04-18 Essex Group, Inc. Palletized structure containing spools
JP2604907Y2 (en) * 1993-12-01 2000-06-12 村▲ずみ▼株式会社 Protector for roll products
EP1434088B1 (en) * 2002-12-27 2006-08-30 Fuji Photo Film Co., Ltd. Roll support member and recording material package employing same
US20040251156A1 (en) * 2003-06-12 2004-12-16 Bell Norman H. Roll end support
ES2348137T3 (en) * 2003-10-14 2010-11-30 Kyowa Limited NON-METALLIC MOORING SEAL.
JP2007161286A (en) * 2005-12-12 2007-06-28 Asahi Kasei Electronics Co Ltd Packing material for photo-sensitive film roll
JP5322609B2 (en) * 2008-12-01 2013-10-23 日東電工株式会社 Film roll for semiconductor device manufacturing
JP4956560B2 (en) * 2009-01-14 2012-06-20 古河電気工業株式会社 Wafer processing tape roll packaging method
JP5349111B2 (en) * 2009-03-30 2013-11-20 村角株式会社 Roll product protector
JP5683078B2 (en) * 2009-04-10 2015-03-11 村角株式会社 Roll product protector

Also Published As

Publication number Publication date
TW201318934A (en) 2013-05-16
CN103476682B (en) 2015-05-13
JP5778244B2 (en) 2015-09-16
CN103476682A (en) 2013-12-25
US20140034532A1 (en) 2014-02-06
JPWO2013035749A1 (en) 2015-03-23
KR20130126935A (en) 2013-11-21
WO2013035749A1 (en) 2013-03-14
TWI485094B (en) 2015-05-21

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