TWI480371B - 熱傳導潤滑脂 - Google Patents

熱傳導潤滑脂 Download PDF

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TWI480371B
TWI480371B TW095128306A TW95128306A TWI480371B TW I480371 B TWI480371 B TW I480371B TW 095128306 A TW095128306 A TW 095128306A TW 95128306 A TW95128306 A TW 95128306A TW I480371 B TWI480371 B TW I480371B
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thermally conductive
particles
dispersant
conductive grease
conductive particles
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TW095128306A
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TW200710216A (en
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Jeffrey Todd Anderson
Philip Edward Kendall
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3M Innovative Properties Co
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Description

熱傳導潤滑脂
本發明係關於導熱界面材料及其用途。
在電腦工業中，持續不斷地向更高的計算能力與速度行進。微處理器之特徵尺寸正變得愈來愈小，用以提高計算速度。相應地，功率通量增加，且每單位面積之微處理器產生更多的熱量。由於微處理器之熱量輸出增加，導致熱量或"熱管理"變得更具挑戰。
熱管理之一態樣在業界已知為"導熱界面材料"或"TIM"，該種材料位於熱源(如微處理器)與散熱裝置之間以利於熱傳遞。TIM可呈潤滑脂或片狀材料之形式。導熱界面材料亦用於消除微處理器與散熱裝置之間的任何絕緣空氣。
TIM通常用於熱聯繫熱源與均熱器(即，較該熱源大之導熱板)，在此情形下，該等TIM亦稱為TIMI。TIM亦可用在均熱器與散熱裝置(諸如冷卻裝置或鰭片散熱器)之間，在此情形下，該等TIM稱為TIM II。TIM可存在於特定設備中的一個或兩個位置。
在一個實施例中，本發明提供一種熱傳導潤滑脂，其包含0至約49.5重量百分比之載劑油、約0.5至約25重量百分比之至少一種分散劑及至少約50重量百分比之熱傳導粒子。該等熱傳導粒子包含至少三種分佈之熱傳導粒子之混合物，該至少三種分佈之熱傳導粒子各自具有與其他分佈相比相差至少5倍之平均(D5 0 )粒度。
在另一個實施例中，本發明提供一種製備本發明之熱傳導潤滑脂之方法，其包含提供載劑油、分散劑及熱傳導粒子且接著一起混合該載劑油(若存在)、分散劑及熱傳導粒子之步驟。
在一態樣中，載劑油(若存在)與分散劑一起混合，而熱傳導粒子隨後以最精細至最大平均粒度之次序混合入該載劑油與分散劑之混合物中。在另一態樣，熱傳導粒子一起混合，接著混合入載劑油(若存在)與分散劑之混合物中。在另一態樣，在將熱傳導粒子混合入該載劑油(若存在)與分散劑混合物之前，使一部分或全部熱傳導粒子以分散劑預先分散。
在另一實施例中，本發明提供一種微電子封裝，其包含一基板、至少一個與該基板連接之微電子熱源，及在該至少一個微電子熱源上之本申請案所揭示之熱傳導潤滑脂。
在一態樣，本發明提供上述微電子封裝，其進一步包含一均熱器及處於微電子熱源與均熱器之間的本申請案所揭示之熱傳導潤滑脂。
在另一態樣，本發明提供一種微電子封裝，其包含一基板、至少一個與該基板連接之微電子熱源、一均熱器及一與該均熱器連接之散熱裝置，其中本申請案所揭示之熱傳導潤滑脂位於均熱器與散熱裝置之間。
在另一態樣，本發明提供一種微電子封裝，其包含一基板、至少一個與該基板連接之微電子熱源、一均熱器、位於微電子熱源與均熱器之間之熱傳導潤滑脂及一散熱裝置，其中熱傳導潤滑脂位於均熱器與散熱裝置之間。
如文中所用："潤滑脂"係指一種在1/s之剪切速率及20℃下具有大於1×104 cps(10 Pa.s)且在1/sec之剪切速率及125℃下具有小於108 cps之黏度的材料。
"熱傳導潤滑脂"係指如下文所述之整體熱傳導率(Bulk Thermal Conductivity)測試方法所量測具有大於0.05 W/m－K之體傳導率的潤滑脂。
除非另有說明，否則文中所有數字均假定為由術語"約"修飾。以端點來表述之數字範圍包括在該範圍內所包含之所有數字(例如，1至5包括1、1.5、2、2.75、3、3.80、4及5)。
本發明之熱傳導潤滑脂(TCG)可包含一或多種載劑油。載劑油提供本發明TCG之基底或基質。有用的載劑油可包含合成油或礦物油或其組合，且通常在周圍溫度下可流動。有用載劑油之具體實例包括多元醇酯類、環氧化物類、矽油類及聚烯烴類或其組合。
可購得之載劑油包括HATCOL 1106－二季戊四醇與短鏈脂肪酸之多元醇酯，及HATCOL 3371－三羥甲基丙烷、己二酸、辛酸與癸酸之複合多元醇酯(均可得自NJ之Fords之Hatco Corporation)；及HELOXY 71－脂族環氧酯樹脂，可得自Houston TX之Hexion Specialty Chemicals公司。
載劑油可以0至約49.5重量百分比之量存在於本發明TCG中，且在其他實施例中，存在量為總組合物之0至不大於約20或約12重量百分比。在其他實施例中，載劑油可以組合物之至少2、1或0.5重量百分比之量存在。載劑油亦可以於包括約0.5、1或2至約12、15或20重量百分比之範圍內的量存在於本發明TCG中。
本發明之TCG含有一或多種分散劑。分散劑可與載劑油一起存在，或者可在缺少載劑油時存在。分散劑改良熱傳導粒子(如下述)於載劑油(若存在)中之分散。有用分散劑本質上可為聚合性或離子性。離子性分散劑可為陰離子性或陽離子性。在一些實施例中，分散劑可為非離子性的。可使用分散劑之組合，諸如，離子性分散劑與聚合性分散劑之組合。
有用分散劑之實例包括，但不限於，聚胺類、磺酸酯類、經改質聚己內酯類、有機磷酸酯類、脂肪酸類、脂肪酸鹽類、聚醚類、聚酯類及多元醇類，及無機分散劑，如經表面改質之無機奈米粒子，或其任意組合。
可購得之分散劑包括：商品名為SOLSPERSE 24000及SOLSPERSE 39000超分散劑之商品，可得自OH之Cleveland之Lubrizol Corporation的子公司Noveon,Inc.；商品名為EFKA 4046之商品，即一種經改質之聚胺基甲酸酯分散劑，可得自The Netherlands之Heerenveen的Efka Additives BV；及商品名為RHODAFAC RE－610之商品，即一種有機磷酸酯，可得自NJ之Granbury，Plains Road之Rhone－Poulenc。
分散劑係以至少0.5且不大於50重量百分比之量存在於本發明TCG中，而在其他實施例中，存在量不大於總組合物之25、10或5重量百分比。在另一實施例中，分散及可以至少1重量百分比之量存在。分散劑亦可以於約1至約5重量百分比範圍內之量存在於本發明TCG中。
本發明之TCG含有熱傳導粒子。有用熱傳導粒子包括，但不限於，由以下物質製成或包含以下物質之彼等：鑽石、多晶鑽石、碳化矽、氧化鋁、氮化硼(六方晶或立方晶)、碳化硼、二氧化矽、石墨、非晶形碳、氮化鋁、鋁、氧化鋅、鎳、鎢、銀，及其任一者之組合。該等粒子各自為不同類型。
用於本發明TCG中之熱傳導粒子為至少三種分佈之熱傳導粒子之混合物。該至少三種分佈之熱傳導粒子各自具有與高於及/或低於其之分佈之平均粒度相比相差至少5倍之平均粒度，而在其他實施例中，相差至少7.5倍或至少10倍或10倍以上。舉例而言，熱傳導粒子混合物可由以下物質組成：平均粒度(D5 0 )為0.3微米之最小粒子分佈；平均粒度(D5 0 )為3.0微米之中間分佈；平均粒度(D5 0 )為30微米之最大分佈。另一實例可具有平均粒度(D5 0 )值為0.03微米、0.3微米及3微米之平均直徑粒子分佈。
用於本發明TCG中之熱傳導粒子為至少三種分佈之熱傳導粒子之混合物，其產生至少一個三峰分佈。在此三峰分佈中，各峰間之最小值(峰基線與分佈峰間谷最低點之間的距離)可不大於相鄰峰間之內插值(高度)之75、50、20、10或5百分比。在一些實施例中，三尺寸分佈基本上無重疊。"基本上無重疊"意謂谷最低點不大於相鄰峰間內插值之5%。在其他實施例中，該等三分佈僅具有一最小重疊。"最小重疊"意謂谷最低點不大於相鄰峰間內插值之20%。
對於三峰TCG而言，最小平均直徑之平均粒度通常可介於約0.02至約5.0微米範圍內。中間平均直徑之平均粒度通常可介於約0.10至約50.0微米範圍內。最大平均直徑之平均粒度通常可介於約0.5至約500微米範圍內。
在一些實施例中，希望提供一種具有最大可能體積分數之熱傳導粒子的TCG，該TCG與所得TCG之所要物理性質相一致，例如該TCG適應於其所接觸之表面，及該TCG可充分流動以易於塗覆。
鑒於此，可根據以下通用原則來選擇傳導粒子分佈。最小直徑粒子之分佈的直徑應小於或幾乎橋接待熱聯繫之兩個基板間的預期間隙。當然，最大粒子可橋接基板間之最小間隙。當最大直徑分佈之粒子彼此接觸時，粒子間將保留間隙或空隙體積。中間直徑分佈之平均直徑可進行有利選擇以恰好在較大粒子間之間隙或空隙內。中間直徑分佈之插入將在最大直徑分佈粒子與中間直徑分佈粒子之間產生一群較小間隙或空隙，其尺寸可用於選擇最小分佈之平均直徑。以類似方式，所要平均粒子尺寸可加以選擇以用於第四、第五或更高級別粒子群體(若須要)。
各分佈之熱傳導粒子在該至少三種分佈之每一者或任一者中可包含相同或不同的熱傳導粒子。另外，各分佈之熱傳導粒子可含有不同類型熱傳導粒子之混合物。
殘留空隙可視為以輕微過量填充載劑、分散劑及其他組份以提供可流動性。關於選擇合適粒子分佈之其他指導可見於"Recursive Packing of Dense Particle Mixtures",Journal of Materials Science Letters,21,(2002),第1249－1251頁。由前述論述可見，連續粒度分佈之平均直徑較佳為十分不同的且充分分開，以確保該等粒子會處在由先前填充粒子所留下之縫隙內，而不顯著干擾先前填充粒子之填充。
熱傳導粒子可以至少50重量百分比之量存在於本發明TCG中。在其他實施例中，熱傳導粒子可以至少70、75、80、85、86、87、88、89、90、91、92、93、94、95、96、97或98重量百分比之量存在。在其他實施例中，熱傳導粒子可以至少99、98、97、96、95、94、93、92、91、90、89、88、87、86或85重量百分比之量存在於本發明TCG中。
本發明之TCG及TCG組合物亦可視情況包括添加劑，如抗負載劑(antiloading agent)、抗氧化劑、調平劑及溶劑(用以降低塗覆黏度)，例如甲基乙基酮(MEK)、甲基異丁基酮，及酯，如乙酸丁酯。
本發明之TCG通常藉由一起摻合分散劑及載劑油接著以最精細至最大平均粒度之次序將熱傳導粒子相繼摻入該分散劑/載劑油混合物中來製備。亦可將熱傳導粒子與另一熱傳導粒子預先混合，接著添加至液體組份中。將熱量加至該混合物以便降低總黏度且幫助達成均勻分散之混合物。在一些實施例中，可希望在將熱傳導粒子混合入分散劑/載劑混合物之間，以分散劑預處理或預分散一部分或全部之熱傳導粒子。
本發明之TCG可用於微電子封裝中且可用於協助熱源(如微電子晶粒或晶片)將熱量耗散至散熱裝置。微電子封裝可包含至少一個熱源(例如安裝在基板上之晶粒或在基板上之堆疊晶粒)、在該熱源上之本發明熱傳導潤滑脂，且可包括與晶粒熱及實體接觸之其他散熱裝置，例如均熱器。均熱器亦可為任何隨後散熱裝置之熱源。本發明之熱傳導潤滑脂可用於提供該晶粒與散熱裝置之間的熱接觸。另外，本發明之TCG亦可用於散熱裝置與冷卻裝置之間的熱及實體接觸中。在另一實施例中，本發明之TCG可用在產熱裝置與冷卻裝置之間，即在中間不使用均熱器。本發明之TCG可用於TIMI及TIM II應用中。
實例 整體熱傳導率
整體熱傳導率一般根據ASTM D－5470－01使用可得自MN之Blaine之Custom Automation公司的熱傳遞測試儀(Heat Transfer Tester)在TCG樣品上量測。該熱傳遞測試儀係根據Proposal Number 3M－102204－01建成且包括以下特徵：一視覺系統，能夠量測銅公尺棒之間的平衡度及間隙，其用於高達0.010英吋(0.254 mm)之間隙；銅公尺棒，在每個公尺棒上具有5個電阻溫度偵測(RTD)感應器；一冷卻器，用於冷卻具有－20℃至100℃之操作範圍之冷夾緊塊(用來固持冷公尺棒)且可將冷卻劑溫度保持在＋/－0.02℃；一251bF荷重計，其安裝在X－Y微米調節定位臺上；一冷夾緊塊(用來固持冷公尺棒)，其安裝在該荷重計上；一熱加緊塊(用來固持熱公尺棒)，其使用電阻加熱且溫度係由控制器及熱電偶來控制，且能夠增加該熱加緊塊上之重量來自5 N至50 N調節公尺棒上之接觸力；及用於量測與記錄溫度、公尺棒間隙及試算表時間間隔處之接觸力的構件。
如所提供之操作程序所概述來校準用於量測公尺棒間隙之視覺系統。向冷卻器饋入水與乙二醇之50/50摻合物。在室溫下將銅公尺棒之間的間隙設定為約550微米。加熱器設定為120℃且冷卻器設定為－5℃，且使該單元平衡。平衡後公尺棒間隙為約400微米。使用各自公尺棒螺旋扣將熱及冷公尺棒之表面平坦化，直至三個各自相機之每一個相機的公尺棒間隙讀數處在＋/－3 μm範圍內。
將過量之各TCG測試樣品置於熱公尺棒表面上，且滑過整個面。接著封閉頭部，並夾持在適當位置，使得過量TCG樣品滲出公尺棒間隙。用紙巾或細布移除此過量部分，並清潔公尺棒之插腳以便於藉由三個視覺相機精確量測間隙。當連續記錄數據時允許儀器平衡約10分鐘。公尺棒間隙降低約100 μm，過量TCG樣品滲出間隙且被清潔掉。當連續記錄數據時允許儀器再次平衡約10分鐘。重複該降低公尺棒間隙約100 μm增量、清潔及記錄數據之工序，直至取得最後讀數，通常在小於100 μm之公尺棒間隙時。打開公尺棒返回至約400 μm間隙，清潔，且重複該程序以用於下一個樣品。
每7－8秒用儀器記錄數據，數據含有時間/日期戳記、樣品名稱、公尺棒間隙中TCG上施加之力、各公尺棒間隙讀數，及各10 RTD感應器溫度讀數。將檔案下載至試算表中以供分析之用。分析中，將在給定間隙處記錄之最後10個數據點進行平均，且將該等平均值用於計算。
使用已知的銅體傳導率、銅棒尺寸及RTD溫度感應器之位置來計算流過TCG樣品之功率。通常，計算結果表明流下熱公尺棒與流下冷公尺棒之瓦特數(wattage)稍微不同；平均該兩個值以用於擴展至TCG樣品之計算。各公尺棒之表面的溫度亦係外推自溫度與RTD感應器位置之曲線。
接著使用功率、各公尺棒間隙之平均值、穿過公尺棒間隙之溫度降及熱/冷公尺棒之橫截面積來計算溫度梯度、功率通量，以及在彼等條件下TCG樣品之熱阻抗。
在測試TCG樣品時完成對各公尺棒間隙之該等計算，且將所得熱阻抗與平均間隙數據繪圖。使用試算表軟體將一條線擬合為數據，且將體傳導率計算為該等線之斜率的倒數。接著使用y軸截距及斜率計算100 μm公尺棒間隙處之熱阻抗。
黏度
在Rheometrics RDA3黏度計(TA Instruments,Newcastle,DE)上產生關於選定樣品之黏度數據。以拋棄式1英吋(25.4 mm)直徑平行板、以對數掃描模式(log sweep mode)，且以0.5/sec初始剪切速率開始，採用5 points/decade達至1000/sec剪切速率，來運行黏度計。間隙設定為0.5 mm運行一次，接著對一些樣品降低為0.25 mm運行第二次；對於其他樣品，將間隙設定為0.25 mm且僅運行一次。運行溫度控制在125℃或25℃，如下表所指示。在1.25/sec剪切速率下記錄黏度，以mPa.s表示。
研磨程序
粗略地將40 cc之0.5 mm直徑經氧化釔穩定之氧化鋯小球(可得自Tosoh,Hudson,OH or from Toray Ceramics,George Missbach & Co.,Atlanta,GA)放入Hockmeyer HM－1/16 Micro Mill("Hockmeyer mill")(Hockmeyer Equipment Corp.,Harrison,NJ)之籃筐中。將所要之MEK及分散劑(SOLSPERSE)添加至研磨機腔室中，且以空氣混合器攪拌至少4分鐘，以便使分散劑溶解在溶解中。稱重鑽石粒子並添加至該腔室中，且再攪拌內容物一分鐘以打濕鑽石粒子。接著以Hockmeyer之避免飛濺之最大速度研磨所得混合物。將所得漿料傾入聚乙烯容器中，蒸發溶劑直至不能偵測到其氣味。所研磨之組合物之詳細情況如下所示。
離子性分散劑"磺化雙(戊烷二己內酯)"係如下製備：向配備有機械攪拌器及真空之反應器中添加25公克(0.476當量)1,5－戊二醇(得自Aldrich Chemical Co.,Milwaukee,WI)、54.3公克(0.476當量)己內酯(得自Aldrich Chemical Co.)及8.0公克(0.054當量)二甲基－5－鈉磺酸基間苯二甲酸酯(得自DuPont Chemicals,Wilmington,DE)。在115 mm汞柱之真空下攪拌反應器內容物且加熱至170℃。4小時後反應完成且由紅外光譜法分析樣品。終產物為澄清的低黏度液體，理論磺酸酯當量為1342。
非離子性無機分散劑"iC8改質二氧化矽奈米粒子"係如下製備：將61.42公克BS1316異辛基三甲氧基矽烷(Wacker Silicones Corp.,Adrian,MI)、1940公克1－甲氧基－2－丙醇及1000公克NALCO 2326膠狀二氧化矽於1加侖玻璃瓶中組合。震盪混合物以確保混合，接著於80℃置於烘箱中隔夜。接著於150℃在流通烘箱中乾燥混合物以產生白色顆粒固體。
磺化多元醇離子性分散劑"HIMOD"係如下製備：向配備有機械攪拌器、氮氣淨化及蒸餾設備之反應器中饋入二甲基－5－鈉磺酸基間苯二甲酸酯(42.6公克，0.144莫耳，可得自DuPont Chemicals,Wilmington,DE)、分子量為400之聚乙二醇(115.1公克，0.288莫耳，可得自Union Carbide Chemical and Plastics Co.,Inc.(現為The Dow Chemical Company,Midland,MI))及分子量為425之聚丙二醇(122.3公克，0.288莫耳，可得自Aldrich Chemical Co.,Milwaukee,WI)以及二甲苯(75公克)。將反應器緩慢加熱至220℃維持約1小時以移除二甲苯。接著將乙酸鋅(0.2公克)添加至反應器中，並將溫度保持在220℃維持4小時，同時自反應蒸餾出甲醇。將溫度降低至約160℃，且施加0.2托(SI)真空至所得混合物維持30分鐘。在氮氣下將內容物冷卻至120℃以得到澄清的無色多元醇。測定OH當量為310公克/莫耳OH，且發現理論磺化物當量為1882公克聚合物/莫耳磺化物。
離子性分散劑"TCPA HATCOL 3371"如下製備：向配備有機械攪拌器及氮氣淨化之反應器添加45公克(0.0241當量)HATCOL 3371及3.4公克(0.0121當量)四氯鄰苯二甲酸酐。在恆定氮氣淨化下，攪拌反應器內容物且加熱至150℃。4小時後反應完成且由紅外光譜法分析樣品。終產物為棕色的低黏度液體，理論酸當量為18,127。
離子性分散劑"TONE 305 TCPA"如下製備：向配備有機械攪拌器及氮氣淨化之反應器添加10公克(0.1當量)Tone 305(Dow Chemical Company)及1.0公克(0.00355當量)四氯鄰苯二甲酸酐(Aldrich Chemical)。在恆定氮氣淨化下，攪拌反應器內容物且加熱至105℃。4小時後反應完成且由紅外光譜法分析樣品。終產物為澄清的低黏度液體，理論酸當量為3,100。
樣品製備
除在具體實例中所述外，分散劑或分散劑混合物皆稱重至表玻璃中。任何其他表面活性成份(若存在)亦稱重至該表玻璃上。將載劑油(若存在)添加至分散劑中，以金屬刮刀攪拌該混合物直至分散劑完全混合入載劑油中。隨後以最小粒度分佈開始相繼將熱傳導粒子添加至分散劑/載劑油混合物中。在添加下一種分佈之熱傳導粒子之前借助於金屬刮刀使每一種熱傳導粒子分佈分散至分散劑/載劑油混合物中。必要時，在烘箱中(110℃)加熱熱傳導潤滑脂組合物以降低組合物之黏度，從而有利於熱傳導粒子之混合物及/或熱傳導粒子之相繼添加。將所得熱傳導潤滑脂轉移至加蓋的玻璃瓶中且儲存於其中。
在預分散熱傳導粒子之情況下，計算待用於細熱傳導粒子分佈之分散劑的量。接著測定為調配所必需之剩餘分散劑之量，且稱重至表玻璃上。其餘步驟與上述彼等相同。
實例1－64
實例1－64之組合物示於表1中。實例A－N及65－74之組合物示於表2中。表3顯示為選定實例量測體傳導率及熱阻抗所得到之數據。表4顯示選定實例之黏度數據。
(1)實例44含有第四熱傳導粒子：DP2，(4.41公克)，(60微米)。
(2)實例46－48及50－54使用根據上述研磨程序及樣品製備所製備之0.25、0.50或1.0 μm預分散鑽石粒子。
實例A－N及65－74
除下述外，組份均單獨稱重至表玻璃中且如下混合。起初藉由以金屬刮刀攪拌將二氧化矽、抗氧化劑、分散劑及載劑油與精細及中間熱傳導粒子組合直至成份組合為平滑且均勻之摻合物。接著添加最大粒子，且再次以金屬刮刀攪拌/捏合表玻璃內容物直至複合物為平滑且均勻之摻合物。必要時，在烘箱中(110℃)加熱熱傳導潤滑脂組合物以降低組合物之黏度，從而有利於熱傳導粒子之混合及/或熱傳導粒子之後繼添加。將所得熱傳導潤滑脂轉移至加蓋的玻璃瓶中且儲存於其中。
某些樣品之製備與上述相同，其例外為製備約16.5公克抗氧化劑、二氧化矽、分散劑及載劑流體之預摻合物。以金屬刮刀攪拌混合物直至成份組合為平滑且均勻之摻合物。接著在一乾淨表玻璃上於攪拌下組合約0.824公克預摻合物與精細及中間熱傳導粒子，接著添加最大粒子。下文描述某些樣品及預摻合物組合物。
使用預摻合物A製備實例J、K、L及I。使用預摻合物B製備實例65、67及71以及實例M及N。
CE 1＝ShinEtsu G751，樣品1 CE 2＝ShinEtsu G751，樣品2 CE 3＝Dow Corning TC5022 CE 4＝ShinEtsu G751，樣品3
CE＝ShinEtsu G751
在不偏離本發明之範疇及精神下熟悉此項技術者將顯見本發明之可預見修正及變更。本發明不應限定於本申請案中所提及之實施例，該等實施例係用於說明性目的。

Claims (15)

  1. 一種熱傳導潤滑脂，其包含：0至約49.5重量百分比之載劑油；約0.5至約25重量百分比之至少一種分散劑；及至少約49.5重量百分比之熱傳導粒子，其中該等熱傳導粒子包含至少三種分佈之熱傳導粒子之混合物，該至少三種分佈之熱傳導粒子各自具有與其他分佈相比相差至少5倍之平均(D50 )粒度，且其中該熱傳導潤滑脂進一步展現約4.23至約6.80W/m-K之整體熱傳導率。
  2. 如請求項1之熱傳導潤滑脂，其中該等熱傳導粒子包含選自由以下各物組成之群之物質：鑽石、碳化矽、氧化鋁、氮化硼(六方晶或立方晶)、碳化硼、二氧化矽、石墨、非晶形碳、多晶鑽石、氮化鋁、鋁、氧化鋅、鎳、鎢、銀及其組合。
  3. 如請求項1之熱傳導潤滑脂，其中該分散劑包含選自由以下各物組成之群之分散劑：非離子性分散劑、聚合性分散劑、離子性分散劑、無機分散劑及其組合。
  4. 如請求項1之熱傳導潤滑脂，其中載劑油係以約0.5至約20重量百分比之量存在。
  5. 如請求項1之熱傳導潤滑脂，其中該至少三種分佈之熱傳導粒子中之一者的平均粒度係在約0.02至約5微米之範圍內。
  6. 如請求項1之熱傳導潤滑脂，其中該至少一種分散劑包含離子性分散劑及聚合性分散劑。
  7. 如請求項1之熱傳導潤滑脂，其中該等熱傳導粒子包含鑽石與碳化矽粒子之混合物。
  8. 如請求項1之熱傳導潤滑脂，其中具有最大平均(D50 )粒度之粒子分佈包含金屬粒子。
  9. 如請求項8之熱傳導潤滑脂，其中該等熱傳導粒子包含鑽石與金屬粒子之混合物。
  10. 如請求項8之熱傳導潤滑脂，其中具有中間平均(D50 )粒度之粒子分佈包含碳化矽或鑽石粒子。
  11. 如請求項8之熱傳導潤滑脂，其中具有最小平均(D50 )粒度之粒子分佈包含氧化鋅粒子。
  12. 如請求項8之熱傳導潤滑脂，其中具有最大平均(D50 )粒度之粒子分佈包含球狀鋁粒子。
  13. 一種製備熱傳導潤滑脂之方法，其包含以下步驟：提供載劑油、分散劑及如請求項1之熱傳導粒子；一起混合該載劑油及分散劑；及以最精細至最大平均粒度之次序相繼將該等熱傳導粒子混合入該載劑油與分散劑之混合物中。
  14. 一種製備熱傳導潤滑脂之方法，其包含以下步驟：提供如請求項1之載劑油、分散劑及熱傳導粒子；一起混合該等熱傳導粒子；一起混合該載劑油及分散劑；及混合該等經混合之熱傳導粒子與該載劑油與分散劑之混合物。
  15. 一種微電子封裝，其包含： 一基板；至少一個與該基板連接之微電子熱源；及處在該至少一個微電子熱源上之如請求項1之熱傳導潤滑脂。
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US7404853B2 (en) 2008-07-29
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