TWI479958B - Copper foil for printed wiring board and manufacturing method thereof - Google Patents

Copper foil for printed wiring board and manufacturing method thereof Download PDF

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Publication number
TWI479958B
TWI479958B TW099108438A TW99108438A TWI479958B TW I479958 B TWI479958 B TW I479958B TW 099108438 A TW099108438 A TW 099108438A TW 99108438 A TW99108438 A TW 99108438A TW I479958 B TWI479958 B TW I479958B
Authority
TW
Taiwan
Prior art keywords
copper foil
printed wiring
wiring board
layer
copper
Prior art date
Application number
TW099108438A
Other languages
English (en)
Chinese (zh)
Other versions
TW201039702A (en
Inventor
Fumiaki Akase
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201039702A publication Critical patent/TW201039702A/zh
Application granted granted Critical
Publication of TWI479958B publication Critical patent/TWI479958B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/16—Layered products comprising a layer of metal next to a particulate layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW099108438A 2009-03-27 2010-03-23 Copper foil for printed wiring board and manufacturing method thereof TWI479958B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009078272 2009-03-27

Publications (2)

Publication Number Publication Date
TW201039702A TW201039702A (en) 2010-11-01
TWI479958B true TWI479958B (zh) 2015-04-01

Family

ID=42780785

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099108438A TWI479958B (zh) 2009-03-27 2010-03-23 Copper foil for printed wiring board and manufacturing method thereof

Country Status (5)

Country Link
JP (1) JP5406278B2 (ja)
KR (3) KR20130054447A (ja)
CN (1) CN102362559B (ja)
TW (1) TWI479958B (ja)
WO (1) WO2010110092A1 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130189538A1 (en) * 2010-09-24 2013-07-25 Jx Nippon Mining & Metals Corporation Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring board
CN103125149B (zh) 2010-09-27 2016-09-14 吉坤日矿日石金属株式会社 印刷电路板用铜箔、其制造方法、印刷电路板用树脂基板以及印刷电路板
WO2012132577A1 (ja) * 2011-03-30 2012-10-04 Jx日鉱日石金属株式会社 印刷回路用銅箔
CN102277605B (zh) * 2011-08-12 2013-11-13 合肥铜冠国轩铜材有限公司 光面粗化电解铜箔的制造工艺
JP6029590B2 (ja) * 2011-09-30 2016-11-24 Ｊｘ金属株式会社 樹脂との密着性に優れた銅箔及びその製造方法並びに該電解銅箔を用いたプリント配線板又は電池用負極材
JP5204908B1 (ja) 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
WO2014051123A1 (ja) * 2012-09-28 2014-04-03 Jx日鉱日石金属株式会社 キャリア付銅箔及びキャリア付き銅箔を用いた銅張積層板
WO2014157728A1 (ja) * 2013-03-29 2014-10-02 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
JP5470487B1 (ja) * 2013-05-29 2014-04-16 Ｊｘ日鉱日石金属株式会社 銅箔、それを用いた半導体パッケージ用銅張積層体、プリント配線板、プリント回路板、樹脂基材、回路の形成方法、セミアディティブ工法、半導体パッケージ用回路形成基板及び半導体パッケージ
MY182166A (en) * 2013-09-20 2021-01-18 Namics Corp Copper foil, copper foil with carrier foil, and copper-clad laminate
WO2015111756A1 (ja) * 2014-01-27 2015-07-30 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
WO2016158775A1 (ja) * 2015-03-31 2016-10-06 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2017018232A1 (ja) * 2015-07-29 2017-02-02 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP6087028B1 (ja) * 2015-09-30 2017-03-01 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
US10280501B2 (en) 2015-09-30 2019-05-07 Mitsui Mining & Smelting Co., Ltd. Roughened copper foil, copper clad laminate, and printed circuit board
KR102432584B1 (ko) 2016-02-24 2022-08-12 에스케이넥실리스 주식회사 비전도성 고분자막과의 박리강도를 향상시킬 수 있는 동박, 그 제조방법, 및 그것을 포함하는 연성동박적층필름
TWI619851B (zh) * 2017-02-24 2018-04-01 南亞塑膠工業股份有限公司 具近似絨毛狀銅瘤的電解銅箔與線路板組件的製造方法
TWI619852B (zh) * 2017-02-24 2018-04-01 南亞塑膠工業股份有限公司 具近似橄欖球狀銅瘤的電解銅箔與線路板組件的製造方法
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
WO2022153580A1 (ja) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR102495997B1 (ko) * 2021-03-11 2023-02-06 일진머티리얼즈 주식회사 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판
WO2023281759A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
CN114635168B (zh) * 2022-02-21 2024-05-17 江东电子材料有限公司 一种瘤球针状低轮廓铜箔的制备技术

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231152A (ja) * 1993-12-24 1995-08-29 Mitsui Mining & Smelting Co Ltd プリント回路内層用銅箔およびその製造方法
TW200718324A (en) * 2005-08-01 2007-05-01 Furukawa Circuit Foil Laminated circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515216A (en) * 1978-07-20 1980-02-02 Mitsui Anakonda Dohaku Kk Printed circut copper foil and method of manufacturing same
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
US5482784A (en) * 1993-12-24 1996-01-09 Mitsui Mining And Smelting Co., Ltd. Printed circuit inner-layer copper foil and process for producing the same
TW317575B (ja) * 1994-01-21 1997-10-11 Olin Corp
JP2920083B2 (ja) * 1995-02-23 1999-07-19 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
KR100553840B1 (ko) * 2003-05-29 2006-02-24 일진소재산업주식회사 인쇄회로기판용 동박의 제조 방법
JP4532322B2 (ja) * 2005-03-30 2010-08-25 古河電気工業株式会社 ビルトアップ基板内層用銅箔

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231152A (ja) * 1993-12-24 1995-08-29 Mitsui Mining & Smelting Co Ltd プリント回路内層用銅箔およびその製造方法
TW200718324A (en) * 2005-08-01 2007-05-01 Furukawa Circuit Foil Laminated circuit board

Also Published As

Publication number Publication date
KR20130054447A (ko) 2013-05-24
CN102362559A (zh) 2012-02-22
JP5406278B2 (ja) 2014-02-05
KR20170029648A (ko) 2017-03-15
JPWO2010110092A1 (ja) 2012-09-27
KR20110126128A (ko) 2011-11-22
CN102362559B (zh) 2014-12-10
KR102104161B1 (ko) 2020-04-23
TW201039702A (en) 2010-11-01
WO2010110092A1 (ja) 2010-09-30

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