TWI479697B - 發光二極體封裝及其製造方法 - Google Patents
發光二極體封裝及其製造方法 Download PDFInfo
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- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
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- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
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Description
本發明係關於LED封裝領域,其等可用於機動車燈中以藉由該LED封裝之至少一發光二極體(LED)提供光。本發明進一步係關於一種方法,藉由該方法可製造此種LED封裝。
從US 6,023,104 A中已知一種LED封裝,其係藉由在一包括一參考標記之共通印刷電路板上配置數個每者包括一對準標記之LED陣列予以接收,其中此配置係藉由經由一光學比較相對於相同的參考標記調整該等對準標記予以實施。
此種LED封裝之一缺點係在更苛求的配置中,當提供諸如光學元件或罩蓋之額外部分時,該LED封裝之光學性能可受影響。尤其係該LED封裝的亮度及光通量係受影響。
本發明之一目的係提供一種LED封裝,其提供改良的光學性能,尤其係改良的亮度及改良的光通量,以及一種製造此種LED封裝之方法。
此目的係藉由一用於一燈中的LED封裝予以實現,其包括至少一LED、一用於引導藉由該LED發射之光的光學元件、一用於至少部分地覆蓋可連接至該LED之電子組件之罩蓋及至少一光學可檢測參考標記,其中該光學元件包括至少一第一光學可檢測標記且該罩蓋包括至少一第二光學可檢測標記,藉此該光學元件及該罩蓋係藉由該第一標記及該第二標記相對於相同的參考標記予以配置與對準。由於該光學元件及該罩蓋之該等標記,因此不需要相對於該光學元件配置與對準該罩蓋,舉例而言,其係相對於該LED予以配置與對準,但需要皆相對於諸如該LED配置與對準該光學元件及該罩蓋。由於用於該光學元件及該罩蓋兩者之相同的參考,因此彼此不增加製造容限使得一校正配置之精確度被提高。特定言之,製造容限可彼此補償。雖然提供該LED封裝之數個不同的部分,其等通常係由於製造容限導致散射光而可影響離開該LED封裝之光的亮度及/或光通量,但防止散射光之一顯著上升。特定言之,可藉由該相同的光學系統實施該光學元件及該罩蓋之定位。因此,可提供一較高的製造精確度及一改良的光學性能而無需額外的製造裝置。用於已存在的製造機械之經調適的控制軟體係足以製造根據本發明之該LED封裝。該LED封裝之品質係以低成本改良。此外,該光學元件及該罩蓋為兩件,因此可選擇不同的材料。例如該光學元件之材料可關於高熱阻及良好的光學屬性予以選擇,其中不需要選擇相同材料用於該罩蓋,因為該罩蓋可經配置隔開該LED及/或該光學元件而不影響該LED封裝之光學性能。
特定言之,可藉由提供具有用於相對於相同的參考標記配置與對準此部分的標記的該LED封裝之額外部分予以提高精確度效果。較佳為提供一基板,其上配置有該LED,其中該基板包括該參考標記或該基板包括至少一用於相對於相同的參考標記配置與對準該基板之第三光學可檢測標記。由於該LED可被固定至該基板,因此當該基板包括該參考標記以便相對於該LED精確地定位該光學元件及該罩蓋時,其為足夠。特定言之,可提供一用於將熱量引導離開該LED之散熱器,該LED係熱連接至該散熱器,其中該散熱器包括該參考標記或該散熱器包括至少一用於相對於該相同參考標記配置與對準該散熱器之第四光學可檢測標記。較佳為該LED或一包括該LED之發光場元件包括至少一用於相對於該相同的參考標記配置與對準該LED或該發光場元件之第五光學可檢測標記。該發光元件可包括數個以規則圖案配置之LED,其中該等LED可被提供於一包括該參考標記之共通基板上。
在一較佳實施例中,該罩蓋與該LED及/或該光學元件之間提供有一熱阻障,尤其係一縫隙。由於高熱絕緣,因此不需要關於高熱阻選擇該罩蓋之材料,因此舉例而言,該罩蓋可藉由射出成形而由一熱塑性材料製成。特定言之,該罩蓋包括一比該光學元件之熱阻低的熱阻。
較佳為該罩蓋包括至少一,特定言之係三個對準元件,特定言之為對準突出物,用於相對於一燈之外殼對準該罩蓋。該對準突出物可毗鄰該外殼,因此藉由該等對準突出物可實施相對於該外殼的該LED封裝之校正對準。因此,提供一垂直於該等參考標記之平面的對準。可實現在三個正交方向之對準。
該罩蓋可包括至少一,特定言之係錐形連接開口,用於尤其是藉由雷射焊接經由該連接開口連接該罩蓋。藉由該等連接開口,能將該罩蓋固定至一諸如基板或該散熱器之結構而不相對於該結構移動該罩蓋。因此,一固定係可能的而不影響該對準。
本發明進一步係關於一燈,特定言之係用於機動車之前燈或尾燈,其包括一可如先前描述所設計的LED封裝,及一外殼,該LED封裝係經由該罩蓋連接至該外殼。由於該LED之所需對準係在該LED封裝之製造期間予以實施,因此該LED封裝至該燈中的裝配可為便利。例如足以在該LED封裝之該罩蓋與該燈之該外殼之間提供一快速連接以提供該LED封裝之一精確的對準。
較佳為該外殼包括至少一參考特點,用於將至少一諸如透鏡或準直儀之第二光學元件安裝相鄰於該光學元件。該第二光學元件可為一透鏡系統之部分,使得視需要聚焦由該LED封裝發射之光。由於該LED封裝係連接至該外殼,因此該LED封裝相對於該外殼之精確定位為可能使得該(等)第二光學元件可十分精確地相對於該LED封裝之該光學元件被配置。較佳為該第二光學元件係經配置為接近該光學元件使得大體上所有發射光係藉由該第二光學元件予以集中。
本發明進一步係關於一種製造一如先前描述之LED封裝之方法,其中一參考標記係提供於該LED封裝上,特定言之係在該基板或該散熱器上,該光學元件係藉由一光學系統經由該第一光學可檢測標記相對於該參考標記經配置與對準;且該罩蓋係藉由該光學系統經由該第二光學可檢測標記相對於該相同的參考標記經配置與對準。
圖1中繪示之該LED封裝10包括一散熱器12,其可為一銅片或類似物。一基板14係熱且機械連接至該散熱器12。配置成一線之四個LED 16係固定至該基板14。該等LED 16係藉由一光學元件18予以圍繞,其可為一包括一用於集中並引導藉由該等LED 16發射之光的反射性塗層的準直儀。
該光學元件18係經對準為十分接近該等LED 16。較佳地係該光學元件18包括一具有高鏡面或擴散反射率及高溫電阻之材料。反射係數可為,較佳為且最佳為。此材料可包括在150℃以上的良好長期穩定。一諸如由TiO2
或Al2
O3
微粒填充之LCP的高溫塑膠材料可用作具有一高擴散反射率的材料。
此外,一印刷電路板(PCB)20係提供以控制該等LED 16。該PCB 20係經由連接機構22連接至該等LED 16,其等係連接至配置於該基板14上的未繪示的線。連接器24係連接至該PCB 20用於提供一電源。較佳地係在該等連接器24與該基板14之間建立一直接電連接。最佳地係此電連接係藉由該等連接器24至該基板14之一導電層的一雷射焊接接合予以實施。
一罩蓋26覆蓋該等連接器24、該PCB 20、該連接機構20及大多數基板14以及該散熱器12。該罩蓋包括突出物28,該LED封裝10可經由該等突出物被固定至一燈之外殼。由於該等突出物28,該LED封裝可相對於該外殼、一透鏡系統或類似物被精確定位。舉例而言,該等突出物28可藉由此種外殼之凹陷而彈簧載入式地予以接收,因此提供該LED封裝之一明確及精確的對準。
該光學元件18包括二個第一標記30,其等係藉由一用於提供相對於二個參考標記32之校正配置與對準的光學系統予以檢測,在所繪示的該實施例中,該等參考標記係提供於該基板14上。該罩蓋26包括二個第二光學可檢測標記34,該罩蓋26係藉由其等相對於該基板14之該等相同的參考標記32予以配置與對準。在一替代實施例中,該等標記32可為用於相對於配置於別處,舉例而言配置於該散熱器12上的參考標記配置與對準該基板14以及固定至該基板14之該等LED 16之第三光學可檢測標記32,其中該光學元件18及該罩蓋26係被定位至該相同的參考標記。該散熱器12可包括二個第四光學標記36,使得該基板14及該散熱器12可經由該相同的參考標記32被校正定位至彼此。
該罩蓋26進一步包括三個對準突出物38,其等突出至同一水平(圖2),因此該LED封裝10可被定位在一機動車燈之一外殼或一諸如一反射器的外光學系統或一投影儀系統上的校正高度。為此目的,該LED封裝10可為彈簧載入式,例如經由該散熱器12,使得所有三個對準突出物38係成一裝配狀態接觸該外殼。此外,該罩蓋26包括三個錐形連接開口40,因此該罩蓋26可經由雷射焊接或類似物而連接至該散熱器12。該罩蓋26與該光學元件18之間提供有一縫隙42。該縫隙42提供一熱阻障,使得藉由該等LED 16發射並傳導至該光學元件18之熱量大體上不被傳導至該罩蓋26。
雖然在圖式及前述描述中已詳細繪示與描述本發明,但此繪示與描述係被視為說明性或例證性而非限制性;本發明並不限於所揭示的該等實施例。
舉例而言,在一其中該散熱器12之該第四個標記36係該參考標記而非該基板14之該標記32之實施例中,可操作本發明。此外,該等LED 16可包括若干第四光學可檢測標記或該等LED可連接至一連接至該基板14之分離發光場之共通子結構,其中該發光場,特定言之係諸如一薄膜層之該子結構可包括用於相對於該相同的參考標記32配置與對準該等LED 16之該等第四標記。此外,該等標記30、32、34、36不僅可經設計為十字交叉式。該等標記30、32、34、36可具有足以藉由用於在兩個不同方向的彼此對準之光學技術比較兩個不同的標記30、32、34、36之任何適當的設計。
熟習此項技術者在實作所請求的本發明之請求項、研究圖式、揭示內容與附屬請求項時,可瞭解與達成所揭示之具體實施例的其他變更。在請求項中,"包括"一詞並不排除其他元件或步驟,且不定冠詞"一"並不排除係複數。互不相同之獨立請求項中描述之特定方法並不表明該等方法之結合不具備優點。請求項之任何參考標記不應解釋成限制範圍。
10...LED封裝
12...散熱器
14...基板
16...LED
18...光學元件
20...印刷電路板(PCB)
22...連接機構
24...連接器
26...罩蓋
28...突出物
30...第一標記
32...參考標記
34...第二光學可檢測標記
36...第四光學標記
38...對準突出物
40...錐形連接開口
42...縫隙
圖1係根據本發明之該LED封裝之一示意性的頂視圖;及
圖2係圖1之該LED封裝之一示意性的截面圖。
10...LED封裝
12...散熱器
14...基板
16...LED
18...光學元件
20...印刷電路板(PCB)
22...連接機構
24...連接器
26...罩蓋
28...突出物
30...第一標記
32...參考標記
34...第二光學可檢測標記
36...第四光學標記
38...對準突出物
40...錐形連接開口
Claims (10)
- 一種用於一燈中的LED封裝,其包括:至少一LED(16);一用於引導藉由該LED(16)發射之光的光學元件(18);一用於至少部分地覆蓋可連接至該LED(16)之電子組件(20、22、24)之罩蓋(26);及至少一光學可檢測參考標記(32;36);其中該光學元件(18)包括至少一第一光學可檢測標記(30)且該罩蓋(26)包括至少一第二光學可檢測標記(34),藉此該光學元件(18)及該罩蓋(26)係藉由該第一光學可檢測標記(30)及該第二光學可檢測標記(34)相對於該相同的參考標記(32;36)予以配置與對準。
- 如請求項1之LED封裝,其中提供一基板(14),其上配置有該LED(16),其中該基板(14)包括該參考標記(32)或該基板(14)包括至少一用於相對於該相同的參考標記(36)配置與對準該基板(14)之第三光學可檢測標記(32)。
- 如請求項1之LED封裝,其中提供一用於將熱量引導離開該LED(16)之散熱器(12),該LED(16)係熱連接至該散熱器(12),其中該散熱器(12)包括該參考標記(36)或該散熱器(12)包括至少一用於相對於該相同參考標記(32)配置與對準該散熱器(12)之第四光學可檢測標記(36)。
- 如請求項1之LED封裝,其中該LED(16)或一包括該LED(16)之發光場元件包括至少一用於相對於該相同的參考 標記(32;36)配置與對準該LED(16)或該發光場元件之第五光學可檢測標記。
- 如請求項1之LED封裝,其中該罩蓋(26)與該LED(16)及/或該光學元件(18)之間提供有一熱阻障,尤其係一縫隙(42)。
- 如請求項1之LED封裝,其中該罩蓋(26)包括一比該光學元件(18)之熱阻低的熱阻。
- 如請求項1之LED封裝,其中該罩蓋(26)包括至少一個對準元件,特定言之為對準突出物(38),用於相對於一燈之一外殼對準該罩蓋(26)。
- 如請求項1之LED封裝,其中該罩蓋(26)包括至少一個,尤其係錐形連接開口(40),用於尤其是藉由雷射焊接經由該連接開口(40)連接該罩蓋(26)。
- 一種燈,尤其用於機動車之前燈或尾燈,其包括一如請求項1之LED封裝(10)及一外殼,該LED封裝(10)係經由該罩蓋(26)連接至該外殼,其中該外殼尤其包括至少一經配置相鄰於該光學元件(18)之透鏡。
- 一種製造一如請求項1之LED封裝(10)之方法,其中該參考標記(32;36)係提供於該LED封裝(10)上,該光學元件(18)係藉由一光學系統經由第一光學可檢測標記(30)相對於該參考標記(32;36)經配置與對準;且該罩蓋(26)係藉由該光學系統經由該第二光學可檢測標記(34)相對於該相同的參考標記(32;36)予以配置與對準。
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