TWI479262B - 低溫硬化性感光性樹脂組合物 - Google Patents
低溫硬化性感光性樹脂組合物 Download PDFInfo
- Publication number
- TWI479262B TWI479262B TW098113148A TW98113148A TWI479262B TW I479262 B TWI479262 B TW I479262B TW 098113148 A TW098113148 A TW 098113148A TW 98113148 A TW98113148 A TW 98113148A TW I479262 B TWI479262 B TW I479262B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- photosensitive resin
- resin composition
- chemical formula
- low
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims description 42
- 239000000126 substance Substances 0.000 claims description 41
- 150000001875 compounds Chemical class 0.000 claims description 31
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 30
- -1 acrylic compound Chemical class 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 27
- 229920006243 acrylic copolymer Polymers 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 20
- 238000013035 low temperature curing Methods 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 239000000178 monomer Substances 0.000 claims description 13
- 238000009835 boiling Methods 0.000 claims description 12
- 238000001704 evaporation Methods 0.000 claims description 12
- 230000008020 evaporation Effects 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 10
- 229910052731 fluorine Inorganic materials 0.000 claims description 10
- 239000011737 fluorine Substances 0.000 claims description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 8
- 150000001336 alkenes Chemical class 0.000 claims description 8
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 8
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000007334 copolymerization reaction Methods 0.000 claims description 3
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 description 15
- 239000000243 solution Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 6
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000003513 alkali Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- CPEXFJVZFNYXGU-UHFFFAOYSA-N 2,4,6-trihydroxybenzophenone Chemical compound OC1=CC(O)=CC(O)=C1C(=O)C1=CC=CC=C1 CPEXFJVZFNYXGU-UHFFFAOYSA-N 0.000 description 2
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- BLBBMBKUUHYSMI-UHFFFAOYSA-N furan-2,3,4,5-tetrol Chemical compound OC=1OC(O)=C(O)C=1O BLBBMBKUUHYSMI-UHFFFAOYSA-N 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 238000007348 radical reaction Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- DIBYQTLCOMYUAP-UHFFFAOYSA-N (2-hydroxy-4-methylphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound OC1=CC(C)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O DIBYQTLCOMYUAP-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- KIJJAQMJSXOBIE-UHFFFAOYSA-N (2-methylcyclohexyl) 2-methylprop-2-enoate Chemical compound CC1CCCCC1OC(=O)C(C)=C KIJJAQMJSXOBIE-UHFFFAOYSA-N 0.000 description 1
- SSLASPHAKUVIRG-UHFFFAOYSA-N (2-methylcyclohexyl) prop-2-enoate Chemical compound CC1CCCCC1OC(=O)C=C SSLASPHAKUVIRG-UHFFFAOYSA-N 0.000 description 1
- ARYIITVULFDIQB-UHFFFAOYSA-N (2-methyloxiran-2-yl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1(C)CO1 ARYIITVULFDIQB-UHFFFAOYSA-N 0.000 description 1
- HWZREQONUGCFIT-UHFFFAOYSA-N (3-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound OC1=CC=CC(C(=O)C=2C(=C(O)C(O)=CC=2)O)=C1 HWZREQONUGCFIT-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical group C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- FVHMFMMVURPZFE-UHFFFAOYSA-N (4-hydroxy-3-methoxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=C(O)C(OC)=CC(C(=O)C=2C(=C(O)C(O)=CC=2)O)=C1 FVHMFMMVURPZFE-UHFFFAOYSA-N 0.000 description 1
- ZRDYULMDEGRWRC-UHFFFAOYSA-N (4-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O ZRDYULMDEGRWRC-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- IAGVANYWTGRDOU-UHFFFAOYSA-N 1,4-dioxonaphthalene-2-sulfonic acid Chemical compound C1=CC=C2C(=O)C(S(=O)(=O)O)=CC(=O)C2=C1 IAGVANYWTGRDOU-UHFFFAOYSA-N 0.000 description 1
- QYSXYAURTRCDJU-UHFFFAOYSA-N 1-(1-hydroxypropoxy)propan-1-ol Chemical compound CCC(O)OC(O)CC QYSXYAURTRCDJU-UHFFFAOYSA-N 0.000 description 1
- NCWSYEUMCNBLPU-UHFFFAOYSA-N 1-(oxiran-2-yl)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(CC)C1CO1 NCWSYEUMCNBLPU-UHFFFAOYSA-N 0.000 description 1
- PHPRWKJDGHSJMI-UHFFFAOYSA-N 1-adamantyl prop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C=C)C3 PHPRWKJDGHSJMI-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- PTBAHIRKWPUZAM-UHFFFAOYSA-N 2-(oxiran-2-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1CO1 PTBAHIRKWPUZAM-UHFFFAOYSA-N 0.000 description 1
- CBKJLMZJKHOGEQ-UHFFFAOYSA-N 2-(oxiran-2-yl)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCC1CO1 CBKJLMZJKHOGEQ-UHFFFAOYSA-N 0.000 description 1
- LARNQUAWIRVQPK-UHFFFAOYSA-N 2-methyloxiran-2-amine Chemical compound NC1(CO1)C LARNQUAWIRVQPK-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- VXVUDUCBEZFQGY-UHFFFAOYSA-N 4,4-dimethylpentanenitrile Chemical compound CC(C)(C)CCC#N VXVUDUCBEZFQGY-UHFFFAOYSA-N 0.000 description 1
- NBLFJUWXERDUEN-UHFFFAOYSA-N 4-[(2,3,4-trihydroxyphenyl)methyl]benzene-1,2,3-triol Chemical compound OC1=C(O)C(O)=CC=C1CC1=CC=C(O)C(O)=C1O NBLFJUWXERDUEN-UHFFFAOYSA-N 0.000 description 1
- FNFYXIMJKWENNK-UHFFFAOYSA-N 4-[(2,4-dihydroxyphenyl)methyl]benzene-1,3-diol Chemical compound OC1=CC(O)=CC=C1CC1=CC=C(O)C=C1O FNFYXIMJKWENNK-UHFFFAOYSA-N 0.000 description 1
- YNICUQBUXHBYCH-UHFFFAOYSA-N 4-[(4-hydroxy-2,5-dimethylphenyl)-(2-hydroxyphenyl)methyl]-2,5-dimethylphenol Chemical compound C1=C(O)C(C)=CC(C(C=2C(=CC=CC=2)O)C=2C(=CC(O)=C(C)C=2)C)=C1C YNICUQBUXHBYCH-UHFFFAOYSA-N 0.000 description 1
- NYIWTDSCYULDTJ-UHFFFAOYSA-N 4-[2-(2,3,4-trihydroxyphenyl)propan-2-yl]benzene-1,2,3-triol Chemical compound C=1C=C(O)C(O)=C(O)C=1C(C)(C)C1=CC=C(O)C(O)=C1O NYIWTDSCYULDTJ-UHFFFAOYSA-N 0.000 description 1
- WXYSZTISEJBRHW-UHFFFAOYSA-N 4-[2-[4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(C(C)(C=2C=CC(O)=CC=2)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WXYSZTISEJBRHW-UHFFFAOYSA-N 0.000 description 1
- CJBUQOXMWGPKGP-UHFFFAOYSA-N 4-[3,3-bis(4-hydroxy-2,5-dimethylphenyl)-1-phenylpropyl]-2,5-dimethylphenol Chemical compound C1=C(O)C(C)=CC(C(CC(C=2C(=CC(O)=C(C)C=2)C)C=2C(=CC(O)=C(C)C=2)C)C=2C=CC=CC=2)=C1C CJBUQOXMWGPKGP-UHFFFAOYSA-N 0.000 description 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 description 1
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 1
- AAVOCJDNQXQONR-UHFFFAOYSA-N 5,8-dioxonaphthalene-1-sulfonic acid Chemical compound O=C1C=CC(=O)C2=C1C=CC=C2S(=O)(=O)O AAVOCJDNQXQONR-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 1
- DPTGFYXXFXSRIR-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl prop-2-enoate Chemical compound C1C(COC(=O)C=C)CCC2OC21 DPTGFYXXFXSRIR-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- UYMYEYZXJXYFSG-UHFFFAOYSA-N C(=C)C=1C=C(COCCCOCCCOCC2=CC(=CC=C2)C=C)C=CC1 Chemical compound C(=C)C=1C=C(COCCCOCCCOCC2=CC(=CC=C2)C=C)C=CC1 UYMYEYZXJXYFSG-UHFFFAOYSA-N 0.000 description 1
- OMCNZPZIRSRDMR-UHFFFAOYSA-N C(C)OC(CCCCCCCCC)(OCC)OCC.C=C Chemical compound C(C)OC(CCCCCCCCC)(OCC)OCC.C=C OMCNZPZIRSRDMR-UHFFFAOYSA-N 0.000 description 1
- GUNXNCWFVIHWKJ-UHFFFAOYSA-N C1(C=CC(C=2C(=CC=CC12)S(=O)(=O)O)=O)=O.N1N=CC=CC=C1 Chemical compound C1(C=CC(C=2C(=CC=CC12)S(=O)(=O)O)=O)=O.N1N=CC=CC=C1 GUNXNCWFVIHWKJ-UHFFFAOYSA-N 0.000 description 1
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 1
- VSCVYVRTQIRCTN-UHFFFAOYSA-N COC(CCCCCCCCC)(OC)OC.C=C Chemical compound COC(CCCCCCCCC)(OC)OC.C=C VSCVYVRTQIRCTN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- DCTLJGWMHPGCOS-UHFFFAOYSA-N Osajin Chemical compound C1=2C=CC(C)(C)OC=2C(CC=C(C)C)=C(O)C(C2=O)=C1OC=C2C1=CC=C(O)C=C1 DCTLJGWMHPGCOS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- VBWIZSYFQSOUFQ-UHFFFAOYSA-N cyclohexanecarbonitrile Chemical compound N#CC1CCCCC1 VBWIZSYFQSOUFQ-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- AQNSVANSEBPSMK-UHFFFAOYSA-N dicyclopentenyl methacrylate Chemical compound C12CC=CC2C2CC(OC(=O)C(=C)C)C1C2.C12C=CCC2C2CC(OC(=O)C(=C)C)C1C2 AQNSVANSEBPSMK-UHFFFAOYSA-N 0.000 description 1
- JLEDZKABTFDMAQ-UHFFFAOYSA-N dicyclopentylmethyl 2-methylprop-2-enoate Chemical compound C1CCCC1C(OC(=O)C(=C)C)C1CCCC1 JLEDZKABTFDMAQ-UHFFFAOYSA-N 0.000 description 1
- XSQNOFMFKVYSNL-UHFFFAOYSA-N ethene;toluene Chemical group C=C.CC1=CC=CC=C1 XSQNOFMFKVYSNL-UHFFFAOYSA-N 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- CNEKKZXYBHKSDC-UHFFFAOYSA-N ethyl acetate;propane-1,2-diol Chemical compound CC(O)CO.CCOC(C)=O CNEKKZXYBHKSDC-UHFFFAOYSA-N 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- NWAHZAIDMVNENC-UHFFFAOYSA-N octahydro-1h-4,7-methanoinden-5-yl methacrylate Chemical compound C12CCCC2C2CC(OC(=O)C(=C)C)C1C2 NWAHZAIDMVNENC-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- CYHJQZZQPLFFBX-UHFFFAOYSA-N pyridazine-3-sulfonic acid Chemical group OS(=O)(=O)C1=CC=CN=N1 CYHJQZZQPLFFBX-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 231100000628 reference dose Toxicity 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nonlinear Science (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Electroluminescent Light Sources (AREA)
Description
本發明係有關於一種低溫硬化性感光性樹脂組成物,更詳而言之,係有關於一種低溫硬化性感光性樹脂組成物,其不僅感度、耐熱性、耐化學性等之性能優異,且可使膜(film)即使在150℃以下之低溫工程中亦具有優異疏水性,藉此,特別是可適用於在製造OLED、OTFT元件的以噴墨(ink-jet)方式形成的觸排(bank)以及供剝離(Lift off)使用。
於習知的液晶顯示器(LCD)製造製程中,係藉由光蝕刻製程形成彩色光阻、電極、配線、半導體(semiconductor)材料。
近來,因應顯示器的低價格化,現已有進行利用壓印(imprinting)之圖案形成、利用噴墨(ink-jet)方式形成之彩色光阻、可溶性有機半導體(soluble organic semiconductor)形成、利用剝離(Lift-off)之可溶性傳導性高分子(soluble conducting polymer)之電極以及配線形成等多種研究。
因此,藉由噴墨形成的觸排及剝離材料之界面特性係非常重要。換言之,因彩色墨水、可溶性有機半導體及可溶性傳導性高分子大體上具有親水性,故為了改良其等在基材(substrate)上的潤濕性(wetting)而非在觸排上的潤濕性,觸排界面上的疏水化係十分重要。然而,習知在利用感光性樹脂組成物形成觸排時,會有因觸排界面與彩色墨水、可溶性有機半導體及可溶性傳導性高分子之微小的極性差,使得於觸排上產生濕潤性而非於基材上產生濕潤性而發生不良情況之問題點存在。
並且,於OLED、OTFT製造製程中所使用的基材、光產生物質對熱很脆弱,而難以如既存的LCD般適用於高溫工程。由於此理由,將適用於既存的LCD製程的感光性樹脂組成物供OLED、OTFT製造使用時,不但會殘留過量殘存溶劑、交聯密度會不佳、作為膜的基本物性會產生問題,還會對基材、光產生物質產生不良影響。因此,現實情況仍進一步需要用來提高即使於一般的OLED、OTFT製造製程溫度150℃以下的製程條件下亦可適用噴墨方式的觸排及剝離材料的疏水化度之研究。
為解決如此的先前技術之問題,本發明之目的係提供一種不僅感度、耐熱性、耐化學性等之性能優異,於150℃以下之低溫製程中膜(film)仍具有優異疏水性的低溫硬化性感光性樹脂組成物、使用前述低溫硬化性感光性樹脂組成物的顯示元件之圖案形成方法。
又,本發明之目的係提供一種不僅感度、耐熱性、耐化學性等之性能優異,且特別是可於製造OLED、OTFT元件時提高適用於噴墨方式的觸排及剝離材料之疏水化度之低溫硬化性感光性樹脂組成物、使用前述低溫硬化性感光性樹脂組成物的顯示元件之圖案形成方法。
為達成前述目的,本發明係一種低溫硬化性感光性樹脂組成物,其特徵在於包含以下組份:a)使i)不飽和羧酸、不飽和羧酸酐或其等之混合物;ii)含有環氧基的不飽和化合物;及iii)烯烴系不飽和化合物共聚合之丙烯酸系共聚物;b)1.2-二疊氮化醌(1,2-quinonediazide)化合物;c)以上述化學式1至5中之一者所表示的氟系化合物;及d)沸點為90至150℃,且蒸發速度在令n-BA(乙酸正丁酯)為1時,係0.3至1.0的溶劑:[化學式1]CF3
(CF2
)n
COOH
於前述化學式1中,n係6至10之整數。
[化學式2]CF3
(CF2
)n
CH2
OH
於前述化學式2中,n係6至10之整數。
[化學式3]CF3
C(CF3
)2
CF2
CF(CF3
)CF2
COOH
[化學式4](CF3
)2
CF(CF2
)3
CF(CF3
)CF2
COOH
C11
HF17
O2
。
較佳地,本發明係包含:
a)使i)不飽和羧酸、不飽和羧酸酐或其等之混合物5至40重量%;
ii)含有環氧基的不飽和化合物10至70重量%;及
iii)烯烴系不飽和化合物10至70重量%共聚合後,去除未反應單體而得到的丙烯酸系共聚物100重量份;
b)1.2-二疊氮化醌化合物5至50重量份;
c)以下列化學式1至5中之一者所表示的氟系化合物3至20重量份;及
d)沸點為90至150℃,且蒸發速度在令n-BA為1時,係0.3至1.0之溶劑,以使前述感光性樹脂組成物內的固態部分含量成為10~50重量%。
再者,本發明係提供一種顯示元件之圖案形成方法,係使用前述低溫硬化性感光性樹脂組成物。
依據本發明的低溫硬化性感光性樹脂組成物不僅感度、耐熱性、耐化學性等之性能優異,且可使膜(film)即使在150℃以下之低溫工程中亦具有優異疏水性,藉此,特別是可適用於在製造OLED、OTFT元件的以噴墨方式形成的觸排以及供剝離使用。
以下將詳細說明本發明。
本發明之低溫硬化性感光性樹脂組成物係將以下作為特徵:包含a)使i)不飽和羧酸、不飽和羧酸酐或其等之混合物;ii)含有環氧基的不飽和化合物;及iii)烯烴系不飽和化合物共聚合之丙烯酸系共聚物;b)1.2-二疊氮化醌化合物;c)以下列化學式1至5中之一者所表示的氟系化合物;及d)沸點為90至150℃,且蒸發速度在令n-BA為1時,係0.3至1.0的溶劑。
本發明所使用之前述a)之丙烯酸系共聚物,係於溶劑及聚合起始劑的存在下,使作為單體的i)不飽和羧酸、不飽和羧酸酐或其混合物;ii)包含有環氧基的不飽和化合物;及iii)烯烴不飽和化合物進行自由基反應合成後,藉由沉澱及過濾,真空乾燥(vacuum drying)步驟來去除單體而獲得。
本發明所使用之前述a)i)不飽和羧酸、不飽和羧酸酐或其等之混合物係可單獨或混合2種以上使用丙烯酸、甲基丙烯酸等之不飽和單羧酸;順丁烯二酸、反丁烯二酸、焦檸檬酸、中康酸(metaconic acid)、伊康酸等之不飽和二羧酸;或是該等不飽和二羧酸之酸酐等,特別是使用丙烯酸、甲基丙烯酸或順丁烯二酸酐於共聚合反應性與對顯像液之鹼水溶液的溶解性尤佳。
前述不飽和羧酸、不飽和羧酸酐或其等之混合物係相對於全體總單體量以含有5~40重量%為宜,又以含有10~30重量%為佳。於此含量在小於5重量%時會有難溶於鹼水溶液的問題點;而在大於40重量%時則會有對鹼水溶液之溶解度過大的問題點。
本發明中所使用的前述a)ii)之含有環氧基的不飽和化合物係可使用丙烯酸環氧丙酯、甲基丙烯酸環氧丙酯、α-乙基丙烯酸環氧丙酯、α-正丙基丙烯酸環氧丙酯、α-正丁基丙烯酸環氧丙酯、丙烯酸-β-甲基環氧丙酯、甲基丙烯酸-β-甲基環氧丙酯、丙烯酸-β-乙基環氧丙酯、甲基丙烯酸-β-乙基環氧丙酯、丙烯酸-3,4-環氧丁酯、甲基丙烯酸-3,4-環氧丁酯、丙烯酸-6,7-環氧庚酯、甲基丙烯酸-6,7-環氧庚酯、α-乙基丙烯酸-6,7-環氧庚酯、丙烯酸-3,4-環氧環己基甲酯、甲基丙烯酸-3,4-環氧環己基甲酯、4-乙烯基環己烷氧化物、臨乙烯基苯甲基環氧丙基醚、間乙烯基苯甲基環氧丙基醚或是對乙烯基苯甲基環氧丙基醚,且係可單獨使用或混合2種以上使用前述化合物。
特別是,前述含有環氧基的不飽和化合物較佳係使用甲基丙烯酸環氧丙酯、甲基丙烯酸-β-甲基環氧丙酯、甲基丙烯酸-6,7-環氧庚酯、臨乙烯基苯甲基環氧丙基醚、間乙烯基苯甲基環氧丙基醚或是對乙烯基苯甲基環氧丙基醚,因其等可使共聚合反應性及所得到的圖案之耐熱性提升。
前述含有環氧基的不飽和化合物係相對於全體總單體量以含有10~70重量%為宜,又以含有20~60重量%為佳。於此含量小於10重量%時會有降低所得之圖案的耐熱性的問題點;而在大於70重量%時則會有降低共聚物之保存穩定性的問題點。
本發明中所使用的前述a)iii)之烯烴系不飽和化合物,係可使用甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸正丁酯、甲基丙烯酸第二丁酯、甲基丙烯酸第三丁酯、丙烯酸甲酯、丙烯酸異丙酯、甲基丙烯酸環己酯、甲基丙烯酸2-甲基環己酯、丙烯酸二環戊烯酯、丙烯酸二環戊酯(dicyclopentanyl acrylate)、甲基丙烯酸二環戊烯酯、甲基丙烯酸二環戊酯(dicyclopentanyl methacrylate)、丙烯酸1-金剛烷酯、甲基丙烯酸1-金剛烷酯、甲基丙烯酸二環戊氧基乙酯(dicyclopentanyloxyethyl methacrylate)、甲基丙烯酸異酯(isobornyl methacrylate)、丙烯酸環己酯、丙烯酸2-甲基環己酯、丙烯酸二環戊氧基乙酯(dicyclopentanyloxyethyl acrylate)、丙烯酸異酯(isobornyl acrylate)、甲基丙烯酸苯酯、丙烯酸苯酯、丙烯酸苯甲酯、甲基丙烯酸2-羥基乙酯、苯乙烯、σ-甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、乙烯甲苯、對甲氧苯乙烯、1,3-丁二烯、異戊二烯或2,3-二甲基1,3-丁二烯等,且係可單獨使用或混合2種以上使用前述化合物。
特別是,前述烯烴系不飽和化合物使用苯乙烯、甲基丙烯酸二環戊基甲酯或p-甲氧苯乙烯,對共聚合反應性與對顯像液之鹼水溶液的溶解性方面而言尤佳。
前述烯烴系不飽和化合物相對於全體總單體量以含有10~70重量%為宜,又以含有20~50重量%為佳。此含量在小於10重量%時會有降低丙烯酸系共聚物保存安全性的問題點;而在大於70重量%時則會有丙烯酸系共聚物難溶於顯像液之鹼水溶液之問題點。
為了溶液聚合前述單體而使用的溶劑係可使用甲醇、四羥基呋喃、甲苯或二烷。
為了溶液聚合前述單體而使用的聚合起始劑係可使用自由基聚合起始劑。具體而言,可使用2,2-偶氮雙異丁腈、2,2-偶氮雙(2,4-二甲基戊腈)、2,2-偶氮雙(4-甲氧-2,4-二甲基戊腈)、1,1-偶氮雙(環己烷-1-甲腈)或二甲基2,2’-偶氮雙異丁酸酯等。
於溶劑與聚合起始劑的存在下使如前述之單體進行自由基反應,且進行沉澱及過濾、真空乾燥步驟,藉此去除未反應單體而得之前述a)之丙烯酸系共聚物,係以聚苯乙烯換算重量平均分子量(Mw)為5,000~30,000為宜,又以5,000~20,000為佳。在前述聚苯乙烯換算重量平均分子量小於5,000時,會有耐熱性、殘膜率等降低之問題點;而在大於30,000時則會有感度降低或圖案顯像不佳的問題點。
於本發明中所使用的前述b)之1.2-二疊氮化醌化合物係可使用1,2-二疊氮化醌4-磺酸酯、1,2-二疊氮化醌5-磺酸酯或是1,2-二疊氮化醌6-磺酸酯等。
如前述之二疊氮化醌化合物係可在弱鹼的存在下使二疊氮化萘醌磺酸鹵化物與酚化合物反應而製造。
前述酚化合物係可使用2,3,4-三羥基二苯甲酮、2,4,6-三羥基二苯甲酮、2,2'-四羥基二苯甲酮、4,4'-四羥基二苯甲酮、2,3,4,3'-四羥基二苯甲酮、2,3,4,4'-四羥基二苯甲酮、2,3,4,2'-四羥基-4'-甲基二苯甲酮、2,3,4,4'-四羥基-3'-甲氧二苯甲酮、2,3,4,2'-五羥基二苯甲酮、2,3,4,6'-五羥基二苯甲酮、2,4,6,3'-六羥基二苯甲酮、2,4,6,4'-六羥基二苯甲酮、2,4,6,5'-六羥基二苯甲酮、3,4,5,3'-六羥基二苯甲酮、3,4,5,4'-六羥基二苯甲酮、3,4,5,5'-六羥基二苯甲酮、雙(2,4-二羥基苯基)甲烷、雙(p-羥基苯基)甲烷、三(p-羥基苯基)甲烷、1,1,1-三(p-羥基苯基)乙烷、雙(2,3,4-三羥基苯基)甲烷、2,2-雙(2,3,4-三羥基苯基)丙烷、1,1,3-三(2,5-二甲基-4-羥基苯基)-3-苯基丙烷、4,4'-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚、或是雙(2,5-二甲基-4-羥基苯基)-2-羥基苯基甲烷等,且係可單獨使用或混合2種以上使用前述化合物。
以如前述之酚化合物與二疊氮化萘醌磺酸鹵化物合成二疊氮化醌化合物時,酯化度係以50~90%為宜。在前述酯化度小於50%時殘膜率會變差;而在大於90%時保存穩定性則會降低。
前述1,2-二疊氮化醌化合物相對於前述a)之丙烯酸系共聚物100重量份係以含有5~50重量份為宜,又以含有10~40重量份為佳。其含量小於5重量份時曝光部與非曝光部之溶解度差會變小而難以形成圖案;大於50重量份時則會在當短時間照射光時,會大量殘留未反應1,2-二疊氮化醌化合物,且使得對顯像液之鹼水溶液之溶解度變得過低,而會有難以顯像的問題點。
於本發明中所使用的前述c)之以前述化學式1至5中一者所表示的氟系化合物,係發揮提升從感光性樹脂組成物所得到的觸排及剝離材料的疏水性之作用。
以前述化學式1至5中所表示的氟系化合物係當然可單獨使用或混合2種以上使用,且其含量相對於前述a)之丙烯酸系聚物100重量份係以含有3~20重量份為宜,又以含有3~15重量份為佳。在該含量小於3重量份時會有圖案之疏水性不佳的問題;大於20重量份時則感度會降低且對顯像液鹼水溶液之溶解度會變得過低而產生殘膜(scum)。
於本發明中所使用的前述d)之溶劑,係發揮形成觸排及剝離材料之平坦性及不產生塗布污漬地形成均勻的圖案輪廓(pattern profile)之作用,且係沸點為90至150℃,且蒸發速度在令n-BA(乙酸正丁酯)為1時,係0.3至1.0的低沸點高揮發性之溶劑。前述蒸發速度係指在以'ASTM D3539-87(1996)Standard Test Methods for Evaporation Rates of Volatile Liquids by Shell Thin-Film Evaporometer測量時,係相對於令n-BA為1來測量的溶劑蒸發量而表示的值之意。
較佳地,前述溶劑之沸點以110至150℃為宜。於前述範圍內時,即使於低溫硬化條件硬化度亦佳,且耐化學性及耐熱性皆優異而可提升有機薄膜電晶體的信頼度。
具體的前述溶劑,係可單獨使用或混合2種以上使用丙二醇甲基醚、丙二醇乙基醚、丙二醇丙基醚或丙二醇丁基醚等之丙二醇單烷基醚類;丙二醇甲基醚乙酸酯、丙二醇乙基醚乙酸酯或丙二醇丙基醚乙酸酯等之丙二醇烷基醚乙酸酯類;乙二醇甲基醚乙酸酯、乙酸正丁酯。較佳地,以使用丙二醇甲基醚、乙二醇甲基醚乙酸酯、丙二醇乙基醚乙酸酯等為佳。
前述溶劑較佳係被包含以使用於全體有機薄膜電晶體的感光性樹脂組成物之固態部分含量(a)+c))成為10至50重量%,且以成為15至40重量%更佳。前述全體組成物之固態部分含量小於10重量%時,會有塗布物的厚度會變薄,而降低塗布物平板性之虞,而在大於50重量%時,則會有塗布物的厚度會變厚,且於塗布時過度勉強塗布裝備之情形。
由如前述成分所組成的本發明之低溫硬化性感光性樹脂組成物可因應需要追加包含有e)環氧樹脂、f)接著劑、g)丙烯酸化合物或是h)界面活性劑等。
前述e)之環氧樹脂係可發揮使由本發明之低溫硬化性感光性樹脂組成物所得到的圖案的耐熱性、感度等提升之作用。
前述環氧樹脂係可使用將雙酚A型環氧樹脂、酚酚醛清漆(phenol novolac)型環氧樹脂、甲酚酚醛清漆型環氧樹脂、環狀脂肪族環氧樹脂、環氧丙基酯型環氧樹脂、環氧丙基胺型環氧樹脂、雜環式環氧樹脂或是與a)之丙烯酸系共聚物相異的環氧丙基甲基丙烯酸酯(共)聚合之樹脂等,特別是以使用雙酚A型環氧樹脂、甲酚酚醛清漆型環氧樹脂或是環氧丙基酯型環氧樹脂為佳。
前述環氧樹脂相對於前述a)之丙烯酸共聚物100重量份係以含有0.1~30重量份為宜。此含量在前述範圍內時,會具有可獲得對丙烯酸共聚物之互溶性與充分的塗布性能之優點。
再者,前述f)之接著劑係發揮使與基板之間的接著性提升之作用,且相對於前述a)之丙烯酸系共聚物100重量份係以含有0.1~20重量份為宜。
前述接著劑係可使用前述接著劑係可使用如具有羧基、甲基丙烯基、異氰酸基或是環氧基等之反應性取代基之矽烷耦合劑等。具體而言,可使用γ-甲基丙烯醯氧丙基三甲氧矽烷、乙烯三乙醯氧矽烷、乙烯三甲氧矽烷、γ-異氰酸基丙基三乙氧矽烷(isocyanatepropyltriethoxysilane)、γ-環氧丙氧丙基三甲氧矽烷或是β-(3,4-環氧環己基)乙基三甲氧矽烷等。
再者,前述g)之丙烯酸化合物係可發揮使由本發明之低溫硬化性感光性樹脂組成物所得到的圖案的透射率、耐熱性、感度等提升之作用。
較佳地,前述丙烯酸化合物係以下列化學式6所表示之化合物為宜。
於前述化學式6中,R係氫原子、碳數1~5之烷基、碳數1~5之烷氧基或是碳數1~5之烷醯基,且1<a<6、a+b=6。
前述丙烯酸化合物相對於前述a)之丙烯酸系共聚物100重量份係以含有0.1~30重量份為宜,又以含0.1~15重量%更佳。此含量在前述範圍內時,對於圖案的透射性、耐熱性、感度等之提升方面更佳。
又,前述h)之界面活性劑係可發揮使感光性組成物之塗布性、顯像力等提升之作用。
前述界面活性劑係可使用聚氧基乙烯辛基苯基醚、聚氧基乙烯壬基苯基醚、F 171、F 172、F 173(商品名:大日本墨水化學工業股份有限公司)、F C 430、F C 431(商品名:住友3M股份有限公司)或是K P341(商品名:信越化學工業股份有限公司)等。
前述界面活性劑相對於前述a)之丙烯酸系聚合物100重量份以0.0001~2重量份被包含為宜,該含量為前述範圍內時於感光性樹脂組成物之塗布性、顯像性之提升方面更佳。
由如前述般成分所組成的本發明之低溫硬化性感光性樹脂組成物之固態部分濃度係以10~50重量%為宜,且具有前述範圍固態部分的組成物係以0.1~0.2μm之Millipore過濾器等過濾後再使用為佳。
又,本發明亦提供包含使用前述低溫硬化性感光性樹脂組成物之顯示元件的圖案形成方法。
本發明之顯示元件的圖案形成方法,其特徵在於在將感光性樹脂組成物形成為觸排及剝離材料再形成OLED、OTFT元件圖案的方法中,使用前述低溫硬化性感光性樹脂組成物,而不贅述的是除了前述低溫硬化性感光性樹脂組成物之使用以外的步驟係可適當地選擇眾所皆知的圖案形成方法而適用。
本發明之顯示元件的圖案形成方法,係使用前述低溫硬化性感光性樹脂組成物,而不僅感度、耐熱性、耐化學性等之性能優異,且可使膜即使在150℃以下之低溫工程中亦具有優異疏水性,藉此,特別適於在製造OLED、OTFT元件的圖案形成方法。
以下,雖然為了供理解本發明而揭示較佳實施例,但下述實施例係僅於例示本發明,且本發明之範圍當不受下列實施例所限制。
於具備冷凝管與攪拌器的燒瓶中加入2,2’-偶氮雙(2,4-二甲基戊腈)6重量份、四羥基呋喃900重量份、甲基丙烯酸25重量份、甲基丙烯酸環氧丙酯25重量份、苯乙烯25重量份及甲基丙烯酸甲酯25重量份,進行氮氣置換後,緩慢地攪拌。使前述反應溶液升溫至60℃,且一邊維持此溫度20小時一邊製造包含丙烯酸系共聚物之聚合物溶液。
為了去除含有丙烯酸系共聚物之聚合物溶液之未反應單體,以相對於不良溶劑(Poor Solvent)正己烷(n-hexane)1,000重量份沉澱前述聚合物溶液100重量份。其後,為了藉由利用篩網(mesh)之過濾(filtering)步驟而去除溶有未反應物的溶劑,而於30℃以下進行真空乾燥,並將含有剩餘未反應單體的溶劑完全去除,以製造重量平均分子量為10,000的丙烯酸系共聚物。此時,重量平均分子量係經使用GPC測量的聚苯乙烯換算平均分子量。
使4,4'-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚1莫耳與1,2-二疊氮化萘醌-5-磺酸[氯化物]2莫耳進行縮合反應,而製造4,4'-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚1,2-二疊氮化萘醌-5-磺酸酯。
混合前述所製造的丙烯酸共聚物100重量份、與於前述所製造的4,4'-[1-[4-[1-[4-羥基苯基]-1-甲基乙基]苯基]亞乙基]雙酚1,2-二疊氮化萘醌-5-磺酸酯30重量份、及以下列化學式1-1所表示的氟系化合物10重量份。其後,以沸點為121℃且蒸發速度在令n-BA為1時,係0.66之丙二醇甲基醚溶解而使前述混合物之固態部分含量成為20重量%後,以0.2μm之Millipore過濾器過濾而製造低溫硬化性感光性樹脂組成物。
CF3
(CF2
)10
COOH
除了於前述實施例1中使用沸點為142℃,且蒸發速度在令n-BA為1時,係0.32之乙二醇甲基醚乙酸酯作為溶劑之外,以與前述實施例1相同的方法實施來製造低溫硬化性感光性樹脂組成物。
使用以下列化學式2-1所表示的氟系化合物代替於前述實施例1中以化學式1-1所表示的氟系化合物,除此之外,以與前述實施例1相同的方法實施來製造低溫硬化性感光性樹脂組成物。
CF3
(CF2
)8
CH2
OH
使用以下列化學式3所表示的氟系化合物代替於前述實施例1中以化學式1-1所表示的氟系化合物,除此之外,以與前述實施例1相同的方法實施來製造低溫硬化性感光性樹脂組成物。
CF3
C(CF3
)2
CF2
CF(CF3
)CF2
COOH
除了於前述實施例1中使用沸點為146℃,且蒸發速度在令n-BA為1時,係0.34之丙二醇單乙基乙酸酯作為溶劑之外,以與前述實施例1相同的方法實施來製造低溫硬化性感光性樹脂組成物。
於前述實施例1中不使用以化學式1-1所表示的氟系化合物,並使用沸點為190℃,且蒸發速度在令n-BA為1時,係0.02之二乙二醇乙基乙基醚作為溶劑,除此之外,以與前述實施例1相同的方法實施來製造低溫硬化性感光性樹脂組成物。
除了於前述實施例1中使用沸點為190℃,且蒸發速度在令n-BA為1時,係0.02之二乙二醇乙基乙基醚作為溶劑之外,以與前述實施例1相同的方法實施來製造低溫硬化性感光性樹脂組成物。
利用以前述實施例1至5及比較例1至2製造的感光性樹脂組成物,以如下述之方法評定物性後,而將其結果示於下列表1中。
A)疏水性-使用旋轉塗布機將以前述實施例1至5及比較例1至2製造的感光性樹脂組成物塗布於玻璃(glass)基板上後,在加熱板上以90℃預烤2分鐘,並分別藉由150℃、220℃之對流烘箱(convection oven)硬化而形成厚度1.0μm之膜。其後,以相對於利用Kruss公司之DNA-100並藉由泡滴法(Sessile Drop Method)以0.5秒間隔對於20秒內40Poing之平均接觸角為基準,在接觸角為90度以上時以○表示,80~90度時以△表示,小於80度時以×表示。
B)感度-於以前述A)所形成之膜上使用預定的圖案遮罩(pattern mask),以435nm之強度為20mW/cm2
的紫外線,將感度為10μm線與間隙(line & space)1:1CD基準劑量
(Dose)之量照射後,以0.38重量%之四甲基銨氫氧化物水溶液於23℃顯像2分鐘後,以超純水洗滌1分鐘而得到圖案膜。
C)解析度-以最小的大小測量於以前述B)之感度測量時所形成之圖案膜。
D)耐熱性-將前述B)之感度測量時所形成的圖案膜藉由對流烘箱(convection oven)於150℃硬化1小時而形成最終圖案膜。此時,硬化前後之10μmCD變化率為0~20%時係以○表示,為20~40%時以△表示,大於40%時以×表示。
E)耐化學性-將於前述D)所得到的圖案膜在NMP中以70℃ 5分鐘浸漬(dipping)後,以超純水漂洗(rinse),並測量NMP處理前後的10μmCD變化率。此時,10μmCD變化率為0~20%時係以○表示,為20~40%時以△表示,大於40%時以×表示。
由前述表1可知,藉由本發明所製造的實施例1至5之低溫硬化性感光性樹脂組成物係感度、解析度、耐熱性及耐化學性皆優異,特別是與比較例1~2比較,因於低溫(150℃)具有顯著提升的疏水性、耐熱性及耐化學性,而可知能適用於LCD,以外亦可適用於在如OLED、OTFT的低溫製程中以噴墨方式形成的觸排及供剝離使用。
Claims (4)
- 一種低溫硬化性感光性樹脂組成物,其特徵在於:在OLED、OTFT之元件觸排形成用感光性樹脂組成物中包含以下組份:a)100重量份之丙烯酸系共聚物,其係使i)5至40重量%之不飽和羧酸、不飽和羧酸酐或其等之混合物;ii)10至70重量%之含有環氧基的不飽和化合物;及iii)10至70重量%之烯烴系不飽和化合物共聚合後,去除未反應單體而得到者;b)5至50重量份之1.2-二疊氮化醌(1,2-quinonediazide)化合物;c)3至20重量份之以下列化學式1至5中之一者所表示的氟系化合物;及d)沸點為110至150℃,且在令n-BA(乙酸正丁酯)為1時,蒸發速度係0.3至1.0的丙二醇甲基醚或乙二醇甲基醚乙酸酯溶劑,以使前述感光性樹脂組成物內的固態部分含量成為10~50重量%,[化學式1]CF3 (CF2 )n COOH於前述化學式1中,n係6至10之整數;[化學式2]CF3 (CF2 )n CH2 OH 於前述化學式2中,n係6至10之整數;[化學式3]CF3 C(CF3 )2 CF2 CF(CF3 )CF2 COOH[化學式4](CF3 )2 CF(CF2 )3 CF(CF3 )CF2 COOH[化學式5]C11 HF17 O2 。
- 如申請專利範圍第1項之低溫硬化性感光性樹脂組成物,其中前述a)之丙烯酸系共聚物換算成聚苯乙烯之重量平均分子量(Mw)係5,000-30,000。
- 如申請專利範圍第1項之低溫硬化性感光性樹脂組成物,其追加包含有添加劑,該添加劑係選自於由e)環氧樹脂、f)接著劑、g)丙烯酸化合物及h)界面活性劑所構成之群組中之1種以上者。
- 一種OLED、OTFT之元件觸排形成方法,係使用如申請專利範圍第1項之低溫硬化性感光性樹脂組成物者。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080037171A KR20090111517A (ko) | 2008-04-22 | 2008-04-22 | 저온 경화성 감광성 수지 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201005442A TW201005442A (en) | 2010-02-01 |
TWI479262B true TWI479262B (zh) | 2015-04-01 |
Family
ID=41283018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098113148A TWI479262B (zh) | 2008-04-22 | 2009-04-21 | 低溫硬化性感光性樹脂組合物 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20090111517A (zh) |
CN (1) | CN101566796A (zh) |
TW (1) | TWI479262B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6455008B2 (ja) * | 2013-08-29 | 2019-01-23 | 日鉄ケミカル&マテリアル株式会社 | ゲート絶縁膜、有機薄膜トランジスタ、及び有機薄膜トランジスタの製造方法 |
KR102329943B1 (ko) * | 2016-03-16 | 2021-11-22 | 동우 화인켐 주식회사 | 네가티브 감광형 수지 조성물 및 이로부터 제조된 광경화 패턴 |
CN109828436B (zh) * | 2019-04-03 | 2022-05-31 | 杭州福斯特电子材料有限公司 | 一种高附着耐蚀刻光敏树脂组合物 |
KR20210111492A (ko) * | 2020-03-03 | 2021-09-13 | 동우 화인켐 주식회사 | 경화성 수지 조성물, 패턴 및 표시장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101059653A (zh) * | 2006-04-18 | 2007-10-24 | 东进世美肯株式会社 | 感光性树脂组合物 |
-
2008
- 2008-04-22 KR KR1020080037171A patent/KR20090111517A/ko not_active Application Discontinuation
-
2009
- 2009-04-21 TW TW098113148A patent/TWI479262B/zh active
- 2009-04-22 CN CNA2009101310964A patent/CN101566796A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101059653A (zh) * | 2006-04-18 | 2007-10-24 | 东进世美肯株式会社 | 感光性树脂组合物 |
Also Published As
Publication number | Publication date |
---|---|
CN101566796A (zh) | 2009-10-28 |
TW201005442A (en) | 2010-02-01 |
KR20090111517A (ko) | 2009-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI403848B (zh) | 感光性樹脂組成物 | |
TWI519897B (zh) | 正型光敏性有機-無機混成絕緣膜組成物 | |
CN1702554B (zh) | 感光性树脂组合物 | |
TWI403841B (zh) | 感光性樹脂組成物 | |
TWI413856B (zh) | 感光性樹脂組成物(一) | |
JP2007286620A (ja) | 感光性樹脂組成物 | |
TWI594079B (zh) | 負型感光性矽氧烷組成物 | |
TWI466349B (zh) | 有機薄膜電晶體用感光性樹脂組成物 | |
TWI479262B (zh) | 低溫硬化性感光性樹脂組合物 | |
TWI361951B (zh) | ||
CN106909028B (zh) | 感光性树脂组成物、保护膜以及液晶显示元件 | |
JP4786360B2 (ja) | 感光性樹脂組成物、lcd基板及びその製造方法 | |
KR101249997B1 (ko) | 유기 절연막용 감광성 수지 조성물 및 이로부터 제조된 유기 절연막 | |
KR100922844B1 (ko) | 절연막 형성용 감광성 수지 조성물 | |
JP5056260B2 (ja) | 感光性シロキサン組成物およびその製造方法、並びにそれから形成された硬化膜および硬化膜を有する素子 | |
KR19990036936A (ko) | 열가소성 수지 경화막의 제조 방법 | |
CN108572516B (zh) | 正型感光性树脂组合物、显示器件及其图案形成方法 | |
CN102566273B (zh) | 正型感光性树脂组成物及其形成图案的方法 | |
CN109073971B (zh) | 光敏树脂组合物和由其制备的固化膜 | |
JP7469024B2 (ja) | ポジティブ型感光性樹脂組成物 | |
TWI453539B (zh) | 感光性樹脂組成物 | |
TWI796541B (zh) | 正型感光性樹脂組合物、使用其組合物的顯示元件的圖案形成方法及包含其組合物的固化物的顯示元件 | |
CN116880125A (zh) | 正性感光性树脂组合物其用途及使用其的金属图形化方法 | |
CN117130224A (zh) | 一种液晶显示元件的有机绝缘膜用正型光刻胶组合物 | |
KR101249992B1 (ko) | 유기 절연막용 감광성 수지 조성물 및 이로부터 제조된유기 절연막 |