TWI478774B - 預塗處理方法及預塗處理裝置 - Google Patents

預塗處理方法及預塗處理裝置 Download PDF

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Publication number
TWI478774B
TWI478774B TW099118171A TW99118171A TWI478774B TW I478774 B TWI478774 B TW I478774B TW 099118171 A TW099118171 A TW 099118171A TW 99118171 A TW99118171 A TW 99118171A TW I478774 B TWI478774 B TW I478774B
Authority
TW
Taiwan
Prior art keywords
roller
coating
film
liquid
slit nozzle
Prior art date
Application number
TW099118171A
Other languages
English (en)
Chinese (zh)
Other versions
TW201105424A (en
Inventor
Yukihiro Wakamoto
Kei Tashiro
Eiichi Ueda
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201105424A publication Critical patent/TW201105424A/zh
Application granted granted Critical
Publication of TWI478774B publication Critical patent/TWI478774B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0204—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to the edges of essentially flat articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
TW099118171A 2009-06-05 2010-06-04 預塗處理方法及預塗處理裝置 TWI478774B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009135634A JP5154510B2 (ja) 2009-06-05 2009-06-05 プライミング処理方法及びプライミング処理装置

Publications (2)

Publication Number Publication Date
TW201105424A TW201105424A (en) 2011-02-16
TWI478774B true TWI478774B (zh) 2015-04-01

Family

ID=43260880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099118171A TWI478774B (zh) 2009-06-05 2010-06-04 預塗處理方法及預塗處理裝置

Country Status (4)

Country Link
JP (1) JP5154510B2 (ja)
KR (1) KR101518522B1 (ja)
CN (1) CN101905209B (ja)
TW (1) TWI478774B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5154510B2 (ja) 2009-06-05 2013-02-27 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
JP5361657B2 (ja) * 2009-10-22 2013-12-04 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
JP5204164B2 (ja) * 2010-08-03 2013-06-05 東京エレクトロン株式会社 塗布装置およびノズルのプライミング処理方法
CN102698609B (zh) * 2012-05-31 2014-06-25 南京工业大学 一种半连续制备复合膜的装置及其复合膜制备工艺
CN104216231B (zh) * 2013-06-05 2019-02-12 中芯国际集成电路制造(上海)有限公司 涂布装置和涂布方法
EP3763508A1 (en) * 2015-09-30 2021-01-13 Suntory Holdings Limited Method for degassing with a hollow fiber membrane a coating liquid to be applied on a preform
AU2018397882B2 (en) 2017-12-25 2021-11-11 Suntory Holdings Limited Preform coating device
CN113600429A (zh) * 2021-08-27 2021-11-05 合肥国轩高科动力能源有限公司 一种复合涂层涂覆模头

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015177A (ja) * 1998-07-02 2000-01-18 Nkk Corp 金属管外面の塗装方法および塗装装置
JP2001310147A (ja) * 2000-05-02 2001-11-06 Tokyo Ohka Kogyo Co Ltd スリットコータの予備吐出装置および予備吐出方法
JP2004121980A (ja) * 2002-10-02 2004-04-22 Toppan Printing Co Ltd 予備吐出装置および方法
TWI259109B (en) * 2004-03-18 2006-08-01 Dainippon Screen Mfg Slit nozzle and substrate processing apparatus
TWI265831B (en) * 2003-11-18 2006-11-11 Dainippon Screen Mfg Substrate processing apparatus, slit nozzle, structure for determining degree of liquid filling in body to be filled, and structure for determining degree of air mixed in body to be filled
JP2007237046A (ja) * 2006-03-07 2007-09-20 Tokyo Electron Ltd プライミング処理方法及びプライミング処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4455102B2 (ja) * 2004-03-10 2010-04-21 大日本スクリーン製造株式会社 基板処理装置
JP4429073B2 (ja) * 2004-05-20 2010-03-10 東京応化工業株式会社 スリットコータの予備吐出装置
CN101032714A (zh) * 2006-03-08 2007-09-12 住友化学株式会社 涂敷膜形成装置用前处理装置及方法、涂敷膜形成装置及方法
JP2008049226A (ja) * 2006-08-22 2008-03-06 Tokyo Ohka Kogyo Co Ltd 予備吐出装置
JP5154510B2 (ja) 2009-06-05 2013-02-27 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015177A (ja) * 1998-07-02 2000-01-18 Nkk Corp 金属管外面の塗装方法および塗装装置
JP2001310147A (ja) * 2000-05-02 2001-11-06 Tokyo Ohka Kogyo Co Ltd スリットコータの予備吐出装置および予備吐出方法
JP2004121980A (ja) * 2002-10-02 2004-04-22 Toppan Printing Co Ltd 予備吐出装置および方法
TWI265831B (en) * 2003-11-18 2006-11-11 Dainippon Screen Mfg Substrate processing apparatus, slit nozzle, structure for determining degree of liquid filling in body to be filled, and structure for determining degree of air mixed in body to be filled
TWI259109B (en) * 2004-03-18 2006-08-01 Dainippon Screen Mfg Slit nozzle and substrate processing apparatus
JP2007237046A (ja) * 2006-03-07 2007-09-20 Tokyo Electron Ltd プライミング処理方法及びプライミング処理装置

Also Published As

Publication number Publication date
KR20100131374A (ko) 2010-12-15
JP5154510B2 (ja) 2013-02-27
CN101905209A (zh) 2010-12-08
TW201105424A (en) 2011-02-16
KR101518522B1 (ko) 2015-05-07
CN101905209B (zh) 2014-03-19
JP2010279907A (ja) 2010-12-16

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