TWI474430B - 用以處理基板之裝置、系統及方法 - Google Patents

用以處理基板之裝置、系統及方法 Download PDF

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Publication number
TWI474430B
TWI474430B TW101127222A TW101127222A TWI474430B TW I474430 B TWI474430 B TW I474430B TW 101127222 A TW101127222 A TW 101127222A TW 101127222 A TW101127222 A TW 101127222A TW I474430 B TWI474430 B TW I474430B
Authority
TW
Taiwan
Prior art keywords
substrate
processing
chamber
module
disposed
Prior art date
Application number
TW101127222A
Other languages
English (en)
Chinese (zh)
Other versions
TW201310572A (zh
Inventor
Hyung Joon Kim
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW201310572A publication Critical patent/TW201310572A/zh
Application granted granted Critical
Publication of TWI474430B publication Critical patent/TWI474430B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW101127222A 2011-07-29 2012-07-27 用以處理基板之裝置、系統及方法 TWI474430B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20110076208 2011-07-29
KR1020110128270A KR101400157B1 (ko) 2011-07-29 2011-12-02 기판처리장치, 기판처리설비 및 기판처리방법

Publications (2)

Publication Number Publication Date
TW201310572A TW201310572A (zh) 2013-03-01
TWI474430B true TWI474430B (zh) 2015-02-21

Family

ID=47894582

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101127222A TWI474430B (zh) 2011-07-29 2012-07-27 用以處理基板之裝置、系統及方法

Country Status (3)

Country Link
KR (2) KR101400157B1 (ko)
CN (1) CN103035467B (ko)
TW (1) TWI474430B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102034706B1 (ko) * 2013-03-28 2019-10-21 주식회사 원익아이피에스 기판처리시스템 및 기판처리방법
JP6246606B2 (ja) 2014-01-31 2017-12-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102150452B1 (ko) 2014-03-31 2020-09-01 주식회사 선익시스템 클러스터형 증착장치
KR102121058B1 (ko) * 2015-06-19 2020-06-26 (주) 엔피홀딩스 버퍼챔버를 이용한 건식 및 습식처리 시스템 및 이를 이용한 기판처리 방법
KR102546347B1 (ko) * 2016-01-08 2023-06-21 주성엔지니어링(주) 기판처리장치
CN105529239B (zh) * 2016-03-07 2018-06-29 京东方科技集团股份有限公司 一种干法刻蚀装置及方法
CN108666231B (zh) * 2017-03-28 2022-04-26 雷仲礼 基板处理系统、基板传送装置和传送方法
KR20200000638A (ko) * 2018-06-25 2020-01-03 주성엔지니어링(주) 기판 처리 장치 및 기판 처리 방법
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5981399A (en) * 1995-02-15 1999-11-09 Hitachi, Ltd. Method and apparatus for fabricating semiconductor devices
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US20050006230A1 (en) * 2001-08-31 2005-01-13 Masaki Narushima Semiconductor processing system
TW200837509A (en) * 2007-02-12 2008-09-16 Psk Inc Detecting method of position of substrate, treating method of substrate and treating apparatus of substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1902031A (zh) * 2003-11-10 2007-01-24 布卢希弗特科技公司 用于处理基于真空的半导体处理系统中的工件的方法和系统
KR100758298B1 (ko) * 2006-03-03 2007-09-12 삼성전자주식회사 기판 처리 장치 및 방법
KR101015228B1 (ko) * 2008-09-09 2011-02-18 세메스 주식회사 반도체소자 제조를 위한 멀티챔버 시스템 및 그 시스템에서의 기판 처리 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5981399A (en) * 1995-02-15 1999-11-09 Hitachi, Ltd. Method and apparatus for fabricating semiconductor devices
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US20050006230A1 (en) * 2001-08-31 2005-01-13 Masaki Narushima Semiconductor processing system
TW200837509A (en) * 2007-02-12 2008-09-16 Psk Inc Detecting method of position of substrate, treating method of substrate and treating apparatus of substrate

Also Published As

Publication number Publication date
CN103035467B (zh) 2016-01-20
TW201310572A (zh) 2013-03-01
KR20140016421A (ko) 2014-02-07
KR20130014304A (ko) 2013-02-07
KR101400157B1 (ko) 2014-05-30
CN103035467A (zh) 2013-04-10

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