TWI471957B - 製造具有層疊至一互連層堆疊之一液晶聚合物焊料光罩之一電子裝置之方法及其相關裝置 - Google Patents

製造具有層疊至一互連層堆疊之一液晶聚合物焊料光罩之一電子裝置之方法及其相關裝置 Download PDF

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Publication number
TWI471957B
TWI471957B TW100147177A TW100147177A TWI471957B TW I471957 B TWI471957 B TW I471957B TW 100147177 A TW100147177 A TW 100147177A TW 100147177 A TW100147177 A TW 100147177A TW I471957 B TWI471957 B TW I471957B
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Taiwan
Prior art keywords
solder
interconnect layer
lcp
layer stack
solder mask
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TW100147177A
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English (en)
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TW201232683A (en
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Louis Joseph Rendek Jr
Michael Weatherspoon
Casey Philip Rodriguez
David Nicol
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Harris Corp
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Publication of TW201232683A publication Critical patent/TW201232683A/zh
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Description

製造具有層疊至一互連層堆疊之一液晶聚合物焊料光罩之一電子裝置之方法及其相關裝置
本發明係關於電子裝置製造之領域，且更特定而言，係關於具有硬質矽基板及液晶聚合物焊料光罩之電子裝置，及其相關方法。
隨著半導體及積體電路技術進步，已存在朝著具有眾多輸入及輸出(I/O)接腳之高功能性積體電路組件發展的趨勢。因此，隨著積體電路變得更小，積體電路日益具有比先前更緊密地配置在一起之更小I/O襯墊。
為了匹配此等積體電路，存在對用以匹配具有緊密配置之焊料襯墊的此等積體電路之佔據面積之印刷線路板(PWB)的需求。然而，目前IC上之襯墊之間的間隔之小型化正以比印刷電路板上之焊料襯墊之小型化大的速率發生。因此，對於一些現代裝置而言，存在互連技術差距。
為了使該等裝置起作用，PWB可能需要用以附接至積體電路之襯墊之額外佈線層或利用扇出封裝。此情形導致積體電路之封裝大小比積體電路自身大，此情形可限制系統小型化。因而，需要將積體電路連接至印刷電路板之額外方法。
鑒於前述背景，因此，本發明之一目標為提供一種製造具有一薄液晶聚合物(LCP)焊料光罩之一電子裝置的方法。
藉由一種製造一電子裝置之方法來提供根據本發明之此目標、特徵及優點及其他目標、特徵及優點，該方法包括在一硬質晶圓基板上形成一互連層堆疊，該互連層堆疊包含複數個經圖案化之電導體層，該複數個經圖案化之電導體層在鄰近之經圖案化之電導體層之間藉由一介電層而分離，及在一最上的經圖案化之電導體層處的一焊料襯墊。該方法亦包括形成一LCP焊料光罩，該LCP焊料光罩中具有一可與該焊料襯墊對準之孔隙。
該方法進一步包括使該LCP焊料光罩與該互連層堆疊對準且將該LCP焊料光罩與該互連層堆疊層疊在一起，及將焊料定位於該孔隙中。另外，該方法包括使用該焊料將至少一電路組件附接至該焊料襯墊。應瞭解，該LCP焊料光罩並不限於用作一僅用於焊料之光罩，且可用於將該至少一電路組件附接至該焊料襯墊之其他方法中。舉例而言，在一些實施例中，可使用其他技術(諸如，藉由一導電環氧樹脂之使用或金屬間結合之形成)將該至少一電路組件附接至該焊料襯墊。
此方法呈現出眾多優點，包括(但不限於)：形成比先前技術之電子裝置薄之一電子裝置；及有效地將一電子組件附接至具有比先前技術之焊料襯墊之間距細微的一間距之一焊料襯墊陣列的能力。附接該電路組件可藉由加熱該焊料來實現，且可藉由將該電子裝置浸漬於一焊料浴中而將該焊料定位於藉由該LCP焊料光罩界定之該等孔隙中。或者或另外，可藉由將焊料膏沈積於該等孔隙中而將該焊料定位於該等孔隙中。
將該LCP焊料光罩與該互連層堆疊層疊在一起可藉由將熱及壓力施加至該LCP焊料光罩及該互連層堆疊(較佳在一高壓釜中)來執行。
形成該LCP焊料光罩可藉由衝壓或雷射研磨該等孔隙來實現。
形成該複數個經圖案化之導體層可藉由習知薄膜沈積方法來實現。
該至少一電路組件可包含至少一積體電路。另外，該LCP焊料光罩可具有一小於0.0015吋之厚度。另外，半導體層可包含一積體電路晶粒。
一裝置態樣係有關一種裝置，該裝置包含一半導體層，且該裝置包括該半導體層上之一互連層堆疊。該層堆疊係由以下各者製成：複數個經圖案化之電導體層、鄰近之經圖案化之電導體層之間的一介電層，及在一最上的經圖案化之電導體層上之一焊料襯墊。在該複數個經圖案化之電導體層之該最上的層上存在一LCP焊料光罩，且該LCP焊料光罩具有一與該等焊料襯墊對準之孔隙。另外，在該互連層堆疊與該LCP焊料光罩之間亦存在一熔融接縫。焊料安置於該等孔隙中，且一電路組件經由該焊料而電耦接至該焊料襯墊。
現將在下文中參看隨附圖式來更完全地描述本發明，本發明之較佳實施例展示於該等隨附圖式中。然而，本發明可以許多不同形式來體現且不應被解釋為限於本文中所闡述之實施例。實情為，提供此等實施例以使得本發明將為詳盡的及完整的，且將本發明之範疇完全地傳達給熟習此項技術者。貫穿始終相似數字指代相似元件，且使用單撇記法來指示替代實施例中之類似元件。
最初參看圖1之流程圖50及圖2A至圖2F，現描述製造電子裝置之方法。如圖2A中所展示，在開始(區塊52)之後，在硬質晶圓基板12上形成互連層堆疊14，該互連層堆疊14包括複數個經圖案化之電導體層15，與在鄰近之經圖案化之電導體層之間的介電層19。隨後，在最外的經圖案化之電層上形成至少一焊料襯墊23，其中整個層堆疊配置於硬質晶圓基板12上(在區塊54處)。焊料襯墊23通常由銅形成，且直徑可為0.006"或更小。當然，在一些應用中，焊料襯墊23亦可具有其他直徑。
接下來，如圖2B中所展示，形成LCP焊料光罩16，LCP焊料光罩16中具有可與該至少一焊料襯墊23對準之至少一孔隙17(區塊56)。舉例而言，孔隙17可小至0.001吋至0.002吋或更大。如圖2C中所展示，接著將LCP焊料光罩16與互連層堆疊14層疊在一起(區塊58)。藉由「對準」，意謂：焊料襯墊23包含於孔隙內且可接近以用於施配焊料及附接電子組件。此對準可藉由以下操作來執行：首先使用燈具或導引件來使LCP焊料光罩16與互連層堆疊14粗略對準，且接著在顯微鏡下精細地調整該對準以達到最終對準。此方法有利地允許在0.0005吋至0.001吋之範圍中的位置對準準確度。
出於多種原因，LCP為用以形成焊料光罩之特別有利之材料，該多種原因包括以下事實：LCP具有高拉伸強度，從而提供高耐磨損性及高耐損害性。通常，LCP亦具有高耐化學性、固有之阻燃性及良好之耐氣候性。LCP耐受在高溫下在存在大多數化學物質之情況下的應力破裂性，該等化學物質包括芳族烴或鹵化烴、強酸、鹼、酮及其他侵蝕性工業物質。熟習此項技術者應理解，存在可用於生產根據本發明之電子裝置之多種LCP。
使用LCP來建構焊料光罩16產生比一些先前技術焊料光罩薄之焊料光罩，例如，與0.002+吋厚相對比而為0.001吋厚。此情形允許對降至0.008"間距之球狀柵格陣列之焊料光罩保護，從而有利地允許將襯墊之間具有窄間隔之積體電路附接至基板或印刷電路板，而不增加超出積體電路自身之大小的總封裝之大小。
另外，與一些先前技術焊料光罩相比較而言，LCP焊料光罩16展現出優異的厚度均勻性。另外，LCP焊料光罩16提供比習知焊料光罩更好之電隔離，與習知焊料光罩之每密耳500伏特相對比，LCP焊料光罩16具有約每密耳3500伏特之介電強度。此外，LCP焊料光罩16相抵於互連層堆疊14密封，從而保護互連層堆疊14免受外部污染物影響且保護下伏晶圓基板免受濕氣降解影響，此係由於LCP形成一接近氣密之材料。
如圖2D中所展示，接著將焊料20定位於孔隙17中(區塊60)。如圖2E中所展示，接著將諸如積體電路22之電路組件定位於焊料光罩16之上以使得該電路組件之襯墊接觸焊料20，且使用該焊料將該等襯墊附接至焊料光罩16(區塊62)。區塊64指示該方法之結束。
現參看圖3之流程圖50'且亦參看圖2A至圖2F來描述根據本發明之製造電子裝置的更詳細方法。在開始(區塊52')之後，在硬質晶圓基板12上形成互連層堆疊14(區塊54')。此處，該互連層堆疊14包括以一陣列圖案配置之複數個焊料襯墊23。另外，包括經圖案化之電導體層15的互連層堆疊14係藉由習知薄膜沈積方法而形成。應理解，亦可使用形成互連層堆疊14之其他方法。
接下來，該方法包括在具有小於0.0015吋之厚度之LCP焊料光罩16中衝壓及/或雷射研磨至少一孔隙17，該至少一孔隙17可與該複數個焊料襯墊23中之至少一焊料襯墊23對準(區塊56')。接著使LCP焊料光罩16與互連層堆疊14對準且經由在高壓釜中施加熱及壓力將LCP焊料光罩16與互連層堆疊14層疊在一起(區塊58')。高壓釜有利地提供均衡壓力(亦即，來自所有方向之相等壓力)，且幫助阻止LCP在層疊製程期間變形。雖然將高壓釜用於層疊係較佳的，但亦可使用按壓(有可能在惰性氣氛或真空袋中)來執行層疊。
藉由將裝置浸漬於焊料浴中(例如，在240℃下且歷時5秒之持續時間)或藉由經由刮漿板將焊料膏或導電環氧樹脂定位或沈積於孔隙中，將焊料20定位於孔隙17中(區塊60')。焊料並不會弄濕LCP焊料光罩16。接著藉由加熱焊料20(該焊料20接著熔化且重新凝固)將積體電路22附接至焊料襯墊23(區塊62')。區塊64'指示該方法之結束。
在圖2F中展示完成之電子裝置10。該電子裝置10包含硬質晶圓基板12，與在該硬質晶圓基板上之互連層堆疊14，該互連層堆疊14包括：複數個經圖案化之電導體層15、鄰近之經圖案化之電導體層之間的一介電層19，及在該複數個經圖案化之電導體層之最上的層處的至少一焊料襯墊23。LCP焊料光罩16在互連層堆疊14上，且該焊料光罩具有與該至少一焊料襯墊23對準之至少一孔隙17。在LCP焊料光罩16與互連層堆疊14之間存在一熔融接縫18。此熔融接縫18係在LCP焊料光罩16及互連層堆疊14之熔化及接合期間形成，且在經橫截之裝置的像片中可容易地見到。
焊料24(說明性地為熔化之焊料)在孔隙17中，但應瞭解，可使用導電聚合黏著劑代替焊料。積體電路22經由焊料24而電耦接至焊料襯墊23。
10．．．電子裝置
12．．．硬質晶圓基板
14．．．互連層堆疊
15．．．經圖案化之電導體層
16．．．液晶聚合物(LCP)焊料光罩
17．．．孔隙
18．．．熔融接縫
19．．．介電層
20．．．焊料
22．．．積體電路
23．．．焊料襯墊
24．．．焊料
50．．．流程圖
50'．．．流程圖
圖1為根據本發明之製造電子裝置之方法的流程圖。
圖2A至圖2F為本發明之電子裝置之連續示意性橫截面圖。
圖3為根據本發明之製造電子裝置之更詳細方法的流程圖。
50．．．流程圖

Claims (10)

  1. 一種製造一電子裝置之方法，其包含：在一硬質晶圓基板上形成一互連層堆疊，該互連層堆疊包含複數個經圖案化之電導體層與在鄰近之經圖案化之電導體層之間的介電層，及在一最上的經圖案化之電導體層上的至少一焊料襯墊；形成不與該互連層堆疊接觸之一LCP焊料光罩，該LCP焊料光罩中具有可與該至少一焊料襯墊對準之至少一孔隙；使該LCP焊料光罩中之該至少一孔隙與該互連層堆疊對準；將該LCP焊料光罩與該互連層堆疊層疊在一起；將焊料定位於該至少一孔隙中；及使用該焊料將至少一電路組件附接至該至少一焊料襯墊。
  2. 如請求項1之方法，其中附接該至少一電路組件包含加熱該焊料。
  3. 如請求項1之方法，其中該焊料係藉由將該電子裝置浸漬於一焊料浴中而定位於該至少一孔隙中。
  4. 如請求項1之方法，其中該焊料係藉由將焊料膏沈積於該至少一孔隙中而定位於該至少一孔隙中。
  5. 如請求項1之方法，其中該焊料係藉由將一導電環氧樹脂沈積於該至少一孔隙中而定位於該至少一孔隙中。
  6. 如請求項1之方法，其中將該LCP焊料光罩與該互連層堆 疊層疊在一起包含將熱及壓力施加至該LCP焊料光罩及該互連層堆疊。
  7. 如請求項1之方法，其中形成該LCP焊料光罩包含衝壓或雷射研磨該LCP焊料光罩以形成該至少一孔隙。
  8. 如請求項1之方法，其中形成該互連層堆疊包含藉由薄膜沈積形成該複數個經圖案化之電導體層。
  9. 如請求項1之方法，其中該至少一電路組件包含至少一積體電路。
  10. 如請求項1之方法，其中該LCP焊料光罩具有一小於0.0015英吋之厚度。
TW100147177A 2011-01-14 2011-12-19 製造具有層疊至一互連層堆疊之一液晶聚合物焊料光罩之一電子裝置之方法及其相關裝置 TWI471957B (zh)

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