TWI471953B - Liquid material filling method and device - Google Patents

Liquid material filling method and device Download PDF

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Publication number
TWI471953B
TWI471953B TW96145098A TW96145098A TWI471953B TW I471953 B TWI471953 B TW I471953B TW 96145098 A TW96145098 A TW 96145098A TW 96145098 A TW96145098 A TW 96145098A TW I471953 B TWI471953 B TW I471953B
Authority
TW
Taiwan
Prior art keywords
liquid material
filling
workpiece
substrate
discharge
Prior art date
Application number
TW96145098A
Other languages
English (en)
Chinese (zh)
Other versions
TW200834758A (en
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of TW200834758A publication Critical patent/TW200834758A/zh
Application granted granted Critical
Publication of TWI471953B publication Critical patent/TWI471953B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01067Holmium [Ho]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
TW96145098A 2006-11-29 2007-11-28 Liquid material filling method and device TWI471953B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006321011A JP5089966B2 (ja) 2006-11-29 2006-11-29 液体材料の充填方法および装置

Publications (2)

Publication Number Publication Date
TW200834758A TW200834758A (en) 2008-08-16
TWI471953B true TWI471953B (zh) 2015-02-01

Family

ID=39467770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96145098A TWI471953B (zh) 2006-11-29 2007-11-28 Liquid material filling method and device

Country Status (6)

Country Link
JP (1) JP5089966B2 (ko)
KR (1) KR101457459B1 (ko)
CN (1) CN101563764B (ko)
HK (1) HK1132375A1 (ko)
TW (1) TWI471953B (ko)
WO (1) WO2008065979A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665021B (zh) * 2017-05-25 2019-07-11 日商武藏工業股份有限公司 Liquid material coating device and liquid material coating method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140093638A1 (en) * 2012-09-28 2014-04-03 Jonathan Joel Bloom Method of dispensing material based on angular locate feature
JP6355440B2 (ja) * 2014-06-09 2018-07-11 富士通周辺機株式会社 アンダーフィル材の塗布装置
JP7054017B2 (ja) * 2020-03-09 2022-04-13 日亜化学工業株式会社 発光装置の製造方法及び発光装置の検査方法
JP7003184B2 (ja) * 2020-06-22 2022-01-20 Towa株式会社 樹脂成形装置、及び、樹脂成形品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121482A (ja) * 1997-10-14 1999-04-30 Matsushita Electric Ind Co Ltd アンダーフィルボンドの塗布方法
JP2005217435A (ja) * 2005-03-18 2005-08-11 Matsushita Electric Ind Co Ltd 部品の実装方法と装置
JP2006286744A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 半導体実装基板、半導体実装用基板、その外観検査方法及び外観検査装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204553A (ja) * 1998-01-08 1999-07-30 Matsushita Electric Ind Co Ltd 封止装置、及びその定量塗布方法
CN1531042A (zh) * 2003-01-28 2004-09-22 诺德森公司 用于有效毛细填充的方法
JP2005116805A (ja) * 2003-10-08 2005-04-28 Seiko Epson Corp Tcp型半導体装置、その製造方法及び製造装置
JP2007194403A (ja) * 2006-01-19 2007-08-02 Sony Corp 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121482A (ja) * 1997-10-14 1999-04-30 Matsushita Electric Ind Co Ltd アンダーフィルボンドの塗布方法
JP2005217435A (ja) * 2005-03-18 2005-08-11 Matsushita Electric Ind Co Ltd 部品の実装方法と装置
JP2006286744A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 半導体実装基板、半導体実装用基板、その外観検査方法及び外観検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665021B (zh) * 2017-05-25 2019-07-11 日商武藏工業股份有限公司 Liquid material coating device and liquid material coating method

Also Published As

Publication number Publication date
HK1132375A1 (en) 2010-02-19
JP5089966B2 (ja) 2012-12-05
TW200834758A (en) 2008-08-16
KR20090088390A (ko) 2009-08-19
JP2008132440A (ja) 2008-06-12
CN101563764B (zh) 2012-05-30
KR101457459B1 (ko) 2014-11-03
WO2008065979A1 (fr) 2008-06-05
CN101563764A (zh) 2009-10-21

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