TWI471953B - Liquid material filling method and device - Google Patents
Liquid material filling method and device Download PDFInfo
- Publication number
- TWI471953B TWI471953B TW96145098A TW96145098A TWI471953B TW I471953 B TWI471953 B TW I471953B TW 96145098 A TW96145098 A TW 96145098A TW 96145098 A TW96145098 A TW 96145098A TW I471953 B TWI471953 B TW I471953B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid material
- filling
- workpiece
- substrate
- discharge
- Prior art date
Links
- 239000011344 liquid material Substances 0.000 title claims description 132
- 238000000034 method Methods 0.000 title claims description 68
- 239000000463 material Substances 0.000 claims description 122
- 239000000758 substrate Substances 0.000 claims description 88
- 238000003384 imaging method Methods 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 5
- 230000002950 deficient Effects 0.000 claims description 4
- 230000000153 supplemental effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 97
- 235000012431 wafers Nutrition 0.000 description 93
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000012360 testing method Methods 0.000 description 9
- 238000012544 monitoring process Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000013589 supplement Substances 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006321011A JP5089966B2 (ja) | 2006-11-29 | 2006-11-29 | 液体材料の充填方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200834758A TW200834758A (en) | 2008-08-16 |
| TWI471953B true TWI471953B (zh) | 2015-02-01 |
Family
ID=39467770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96145098A TWI471953B (zh) | 2006-11-29 | 2007-11-28 | Liquid material filling method and device |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5089966B2 (ko) |
| KR (1) | KR101457459B1 (ko) |
| CN (1) | CN101563764B (ko) |
| HK (1) | HK1132375A1 (ko) |
| TW (1) | TWI471953B (ko) |
| WO (1) | WO2008065979A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI665021B (zh) * | 2017-05-25 | 2019-07-11 | 日商武藏工業股份有限公司 | Liquid material coating device and liquid material coating method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140093638A1 (en) * | 2012-09-28 | 2014-04-03 | Jonathan Joel Bloom | Method of dispensing material based on angular locate feature |
| JP6355440B2 (ja) * | 2014-06-09 | 2018-07-11 | 富士通周辺機株式会社 | アンダーフィル材の塗布装置 |
| JP7054017B2 (ja) * | 2020-03-09 | 2022-04-13 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置の検査方法 |
| JP7003184B2 (ja) * | 2020-06-22 | 2022-01-20 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び、樹脂成形品の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121482A (ja) * | 1997-10-14 | 1999-04-30 | Matsushita Electric Ind Co Ltd | アンダーフィルボンドの塗布方法 |
| JP2005217435A (ja) * | 2005-03-18 | 2005-08-11 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
| JP2006286744A (ja) * | 2005-03-31 | 2006-10-19 | Taiyo Yuden Co Ltd | 半導体実装基板、半導体実装用基板、その外観検査方法及び外観検査装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204553A (ja) * | 1998-01-08 | 1999-07-30 | Matsushita Electric Ind Co Ltd | 封止装置、及びその定量塗布方法 |
| CN1531042A (zh) * | 2003-01-28 | 2004-09-22 | 诺德森公司 | 用于有效毛细填充的方法 |
| JP2005116805A (ja) * | 2003-10-08 | 2005-04-28 | Seiko Epson Corp | Ｔｃｐ型半導体装置、その製造方法及び製造装置 |
| JP2007194403A (ja) * | 2006-01-19 | 2007-08-02 | Sony Corp | 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法 |
-
2006
- 2006-11-29 JP JP2006321011A patent/JP5089966B2/ja active Active
-
2007
- 2007-11-26 CN CN2007800435463A patent/CN101563764B/zh active Active
- 2007-11-26 WO PCT/JP2007/072721 patent/WO2008065979A1/ja active Search and Examination
- 2007-11-26 KR KR1020097011528A patent/KR101457459B1/ko active IP Right Grant
- 2007-11-28 TW TW96145098A patent/TWI471953B/zh active
-
2009
- 2009-12-30 HK HK09112282.3A patent/HK1132375A1/xx unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121482A (ja) * | 1997-10-14 | 1999-04-30 | Matsushita Electric Ind Co Ltd | アンダーフィルボンドの塗布方法 |
| JP2005217435A (ja) * | 2005-03-18 | 2005-08-11 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
| JP2006286744A (ja) * | 2005-03-31 | 2006-10-19 | Taiyo Yuden Co Ltd | 半導体実装基板、半導体実装用基板、その外観検査方法及び外観検査装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI665021B (zh) * | 2017-05-25 | 2019-07-11 | 日商武藏工業股份有限公司 | Liquid material coating device and liquid material coating method |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1132375A1 (en) | 2010-02-19 |
| JP5089966B2 (ja) | 2012-12-05 |
| TW200834758A (en) | 2008-08-16 |
| KR20090088390A (ko) | 2009-08-19 |
| JP2008132440A (ja) | 2008-06-12 |
| CN101563764B (zh) | 2012-05-30 |
| KR101457459B1 (ko) | 2014-11-03 |
| WO2008065979A1 (fr) | 2008-06-05 |
| CN101563764A (zh) | 2009-10-21 |
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