TWI470377B - 曝光設備及裝置製造方法 - Google Patents

曝光設備及裝置製造方法 Download PDF

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Publication number
TWI470377B
TWI470377B TW101133761A TW101133761A TWI470377B TW I470377 B TWI470377 B TW I470377B TW 101133761 A TW101133761 A TW 101133761A TW 101133761 A TW101133761 A TW 101133761A TW I470377 B TWI470377 B TW I470377B
Authority
TW
Taiwan
Prior art keywords
light shielding
substrate
shielding plate
light
optical system
Prior art date
Application number
TW101133761A
Other languages
English (en)
Chinese (zh)
Other versions
TW201314383A (zh
Inventor
平野真一
牧野了太
Original Assignee
佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW201314383A publication Critical patent/TW201314383A/zh
Application granted granted Critical
Publication of TWI470377B publication Critical patent/TWI470377B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70066—Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
    • H10P76/2041—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW101133761A 2011-09-26 2012-09-14 曝光設備及裝置製造方法 TWI470377B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011209100A JP5868094B2 (ja) 2011-09-26 2011-09-26 露光装置及びデバイス製造方法

Publications (2)

Publication Number Publication Date
TW201314383A TW201314383A (zh) 2013-04-01
TWI470377B true TWI470377B (zh) 2015-01-21

Family

ID=47910962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101133761A TWI470377B (zh) 2011-09-26 2012-09-14 曝光設備及裝置製造方法

Country Status (4)

Country Link
US (1) US8625073B2 (enExample)
JP (1) JP5868094B2 (enExample)
KR (1) KR101530760B1 (enExample)
TW (1) TWI470377B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5127875B2 (ja) * 2010-04-28 2013-01-23 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
JP6288985B2 (ja) * 2013-08-13 2018-03-07 キヤノン株式会社 リソグラフィ装置、および物品の製造方法
DE102014202755A1 (de) * 2014-02-14 2015-08-20 Carl Zeiss Smt Gmbh Verfahren zur Verlagerung mindestens eines optischen Bauelements
JP6970548B2 (ja) * 2016-09-09 2021-11-24 キヤノン株式会社 照明光学系、露光装置、及び物品製造方法
JP7162430B2 (ja) * 2018-02-27 2022-10-28 株式会社オーク製作所 投影露光装置
JP7145620B2 (ja) * 2018-02-27 2022-10-03 株式会社オーク製作所 投影露光装置
JP7179420B2 (ja) * 2019-01-29 2022-11-29 株式会社オーク製作所 投影露光装置及び投影露光装置に使用する遮光板
CN110360934A (zh) * 2019-07-15 2019-10-22 北海市龙浩光电科技有限公司 一种测量弧面玻璃盖板的方法
CN113433799B (zh) * 2020-03-23 2023-01-20 长鑫存储技术有限公司 晶圆边缘曝光方法、晶圆边缘曝光装置及掩膜板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW558750B (en) * 2001-10-09 2003-10-21 Ultratech Stepper Inc Method and apparatus for mechanically masking a workpiece
JP2005045160A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd 露光方法
US6967710B2 (en) * 1990-11-15 2005-11-22 Nikon Corporation Projection exposure apparatus and method
TW200841383A (en) * 2006-12-07 2008-10-16 Canon Kk Exposure apparatus, exposure and developing system, and method of manufacturing a device
TW200842485A (en) * 2006-12-01 2008-11-01 Canon Kk Shutter blade apparatus, shutter unit, image pickup apparatus, exposure apparatus, and method of manufacturing device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3056206B1 (ja) * 1999-03-18 2000-06-26 広島日本電気株式会社 ダミーパターン形成方法及び半導体製造方法
JP2002372735A (ja) * 2001-06-14 2002-12-26 Canon Inc 光学絞り装置、露光装置、露光方法、デバイス製造方法及びデバイス
JP2003158067A (ja) * 2001-11-22 2003-05-30 Hitachi Ltd 半導体装置の製造方法および露光装置
JP4481698B2 (ja) 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
JP2006040915A (ja) * 2004-07-22 2006-02-09 Seiko Epson Corp 半導体装置の製造方法、及びその製造装置、並びに電気光学装置の製造方法
US7936447B2 (en) * 2006-05-08 2011-05-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7777863B2 (en) * 2007-05-30 2010-08-17 Asml Netherlands B.V. Lithographic apparatus with mask to prevent exposure of peripheral exposure region of substrate
JP2009239018A (ja) * 2008-03-27 2009-10-15 Orc Mfg Co Ltd 投影露光装置
JP5127875B2 (ja) * 2010-04-28 2013-01-23 キヤノン株式会社 リソグラフィ装置及び物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6967710B2 (en) * 1990-11-15 2005-11-22 Nikon Corporation Projection exposure apparatus and method
TW558750B (en) * 2001-10-09 2003-10-21 Ultratech Stepper Inc Method and apparatus for mechanically masking a workpiece
JP2005045160A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd 露光方法
TW200842485A (en) * 2006-12-01 2008-11-01 Canon Kk Shutter blade apparatus, shutter unit, image pickup apparatus, exposure apparatus, and method of manufacturing device
TW200841383A (en) * 2006-12-07 2008-10-16 Canon Kk Exposure apparatus, exposure and developing system, and method of manufacturing a device

Also Published As

Publication number Publication date
JP2013069986A (ja) 2013-04-18
US20130077068A1 (en) 2013-03-28
KR101530760B1 (ko) 2015-06-22
TW201314383A (zh) 2013-04-01
US8625073B2 (en) 2014-01-07
KR20130033320A (ko) 2013-04-03
JP5868094B2 (ja) 2016-02-24

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