TWI468632B - Temperature and humidity controller and method for controlling temperature and humidity - Google Patents

Temperature and humidity controller and method for controlling temperature and humidity Download PDF

Info

Publication number
TWI468632B
TWI468632B TW98111989A TW98111989A TWI468632B TW I468632 B TWI468632 B TW I468632B TW 98111989 A TW98111989 A TW 98111989A TW 98111989 A TW98111989 A TW 98111989A TW I468632 B TWI468632 B TW I468632B
Authority
TW
Taiwan
Prior art keywords
temperature
heat medium
heating
cooling
humidity
Prior art date
Application number
TW98111989A
Other languages
Chinese (zh)
Other versions
TW200949175A (en
Inventor
Ohta Hiromoto
Terashima Masatoshi
Kobayashi Shoichi
Original Assignee
Orion Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orion Machinery Co Ltd filed Critical Orion Machinery Co Ltd
Publication of TW200949175A publication Critical patent/TW200949175A/en
Application granted granted Critical
Publication of TWI468632B publication Critical patent/TWI468632B/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/14Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/0008Control or safety arrangements for air-humidification
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F6/00Air-humidification, e.g. cooling by humidification
    • F24F6/12Air-humidification, e.g. cooling by humidification by forming water dispersions in the air
    • F24F6/14Air-humidification, e.g. cooling by humidification by forming water dispersions in the air using nozzles

Description

溫度與濕度控制裝置以及溫度與濕度控制方法Temperature and humidity control device and temperature and humidity control method

本發明係關於溫度與濕度控制裝置以及溫度與濕度控制方法者。The present invention relates to temperature and humidity control devices and temperature and humidity control methods.

通常在半導體裝置之製造工程等的精密加工領域中,該等設備幾乎全部設制在溫度與濕度經過控制的乾淨房室內。Generally, in the field of precision processing such as manufacturing of semiconductor devices, these devices are almost entirely installed in a clean room where temperature and humidity are controlled.

但近年來在精密加工领域中,漸漸出現有要求比先前更高加工精度的精密加工業。However, in recent years, in the field of precision machining, there has been a demand for precision processing industries that require higher processing accuracy than before.

在要求如此高度精密加工程度的工程中,通常須要有較乾淨室的溫度變化更小之溫度變化的環境。因此,要求有高度精密加工程度的工程,係設於有精密溫度管理的空間內。In projects that require such a high degree of precision machining, it is often necessary to have a temperature change environment in which the temperature of the clean room is smaller. Therefore, projects requiring a high degree of precision machining are required to be placed in a space with precise temperature management.

做為有這樣使用於空間單位溫度控制的溫度控制裝置,例如記載於特開昭51-97048號公報中者,有如第13圖所示的溫度控制裝置。As a temperature control device which is used for the space unit temperature control, as described in Japanese Laid-Open Patent Publication No. 51-97048, the temperature control device shown in Fig. 13 is used.

第13圖所示之溫度控制裝置中,設有壓縮機100,三向閥102,冷凝器104,膨脹閥106,冷卻器108及加熱器110,並設有具有冷卻器108的冷卻流路與具有加熱器110的加熱流路。In the temperature control device shown in Fig. 13, a compressor 100, a three-way valve 102, a condenser 104, an expansion valve 106, a cooler 108, and a heater 110 are provided, and a cooling flow path having a cooler 108 is provided. There is a heating flow path of the heater 110.

藉該冷卻器108與加熱器110,來調整從風扇112吹出的做為溫度控制對象的空氣流溫度。The cooler 108 and the heater 110 are used to adjust the temperature of the air flow which is blown from the fan 112 as a temperature control target.

第13圖所示之溫度控制裝置中,以壓縮機100壓縮的高溫熱媒,經三向閥102分配於冷卻流路與加熱流路。分配於冷卻流路側的高溫熱媒,被冷凝器104所冷卻。此被冷卻的熱媒,被膨脹閥106經斷熱膨脹而冷卻後供應予冷卻器108。在冷卻器108一面冷卻風扇112所吹出之做為溫度控制對象之空氣流,一面吸熱,而將升溫的熱媒供應予壓縮機100。In the temperature control device shown in Fig. 13, the high-temperature heat medium compressed by the compressor 100 is distributed to the cooling flow path and the heating flow path via the three-way valve 102. The high-temperature heat medium distributed on the cooling flow path side is cooled by the condenser 104. The cooled heat medium is cooled by the expansion valve 106 by being thermally expanded, and then supplied to the cooler 108. While the cooler 108 cools the air flow which is blown by the fan 112 as the temperature control target, it absorbs heat and supplies the heated heat medium to the compressor 100.

另一方面,分配於加熱流路側的高溫熱媒供應予加熱器110,加熱於冷凝器108所冷卻的做為溫度控制對象之空氣流,調整成所希望的溫度。如此在加熱器110中,加熱於做為溫度控制對象的空氣流,將同時放熱而降溫的熱煤,通過膨脹閥106及冷卻器108供應予壓縮機100。On the other hand, the high-temperature heat medium distributed on the heating flow path side is supplied to the heater 110, and is heated to the air flow which is cooled by the condenser 108 as a temperature control target, and is adjusted to a desired temperature. In the heater 110 as described above, the hot air which is heated as the object of temperature control is heated, and the hot coal which is simultaneously released by the heat release is supplied to the compressor 100 through the expansion valve 106 and the cooler 108.

傳統的溫度調整裝置,其固有的缺陷為可調整空氣等氣體流的溫度範圍狹窄,而且無法實施濕度控制。本發明可解決這些課題。The conventional temperature adjustment device has an inherent defect that the temperature range of the gas flow such as the adjustable air is narrow, and the humidity control cannot be performed. The present invention can solve these problems.

第13圖所示之溫度控制裝置中,壓縮機100所壓縮的全部高溫熱媒通過膨脹閥106,經斷熱膨脹而冷卻後供應予冷卻器108,因此冷卻從風扇112所吹出做為溫度控制對象的空氣流之冷卻能量為一定。In the temperature control device shown in Fig. 13, all of the high-temperature heat medium compressed by the compressor 100 passes through the expansion valve 106, is cooled by the thermal expansion, and is supplied to the cooler 108, so that the cooling is blown out from the fan 112 as temperature control. The cooling energy of the air flow of the object is constant.

另一方面,藉調整三向閥102分配於加熱流路側之高溫熱媒流量,可調整由冷卻器108所冷卻做為溫度控制對象空氣流在加熱器110中的加熱量。On the other hand, by adjusting the flow rate of the high-temperature heat medium distributed to the heating flow path side of the three-way valve 102, the amount of heating by the cooler 108 as the temperature control target air flow in the heater 110 can be adjusted.

由是,可調整通過冷卻器108及加熱器110之做為溫度控制對象空氣流之溫度,空間單元內的溫度管理得以於狹小的溫度範圍內進行。Therefore, the temperature of the air flow through the cooler 108 and the heater 110 as the temperature control object can be adjusted, and the temperature management in the space unit can be performed in a narrow temperature range.

然而在第13圖所示溫度控制裝置,由於被壓縮機100所壓縮的高溫熱媒全部通過膨脹閥106經斷熱膨脹而冷卻後供應予冷卻器108,因此對從風扇112所吹出做為溫度控制對象之空氣流的溫度調整,係專由在壓縮機100內壓縮的供應予加熱器110之高溫熱媒的再加熱來進行。However, in the temperature control device shown in Fig. 13, since all of the high-temperature heat medium compressed by the compressor 100 is cooled by the expansion and expansion of the expansion valve 106, and then supplied to the cooler 108, the temperature is blown from the fan 112. The temperature adjustment of the air flow of the controlled object is performed exclusively by reheating of the high temperature heat medium supplied to the heater 110 compressed in the compressor 100.

如此,第13圖所示溫度控制裝置所採用溫度控制方式中,其加熱所使用之熱媒亦流入冷卻流路,可加熱的熱量只有壓縮機動力所產生的熱量,對冷卻器108及加熱器110負荷變動的對應,發生困難。Thus, in the temperature control method of the temperature control device shown in Fig. 13, the heat medium used for heating also flows into the cooling flow path, and the heat that can be heated is only the heat generated by the compressor power, and the cooler 108 and the heater Difficulties arise in the correspondence of 110 load changes.

因此,於大幅提高通過冷卻器108及加熱器110之做為溫度控制對象空氣流設定溫度的場合,有時發生溫度調整對象之空氣流溫度未能到達設定溫度,或很長時間才能到達之情事。Therefore, when the temperature of the air temperature control target airflow is set to be greatly increased by the cooler 108 and the heater 110, the air flow temperature of the temperature adjustment target may not reach the set temperature, or may arrive for a long time. .

更有甚者,在第13圖所示溫度控制裝置中,未設有調整通過冷卻器108及加熱器110之做為溫度控制對象空氣流之濕度的濕度控制機能,致無法實施空氣流之濕度控制。What is more, in the temperature control device shown in Fig. 13, the humidity control function for adjusting the humidity of the air flow through the cooler 108 and the heater 110 as the temperature control target is not provided, so that the humidity of the air flow cannot be implemented. control.

於是,本發明的目的在提供一種溫度與濕度控制裝置,以及溫度與濕度控制方法,以解決空氣流等氣體流的可控制溫度範圍狹小,同時不能實施濕度控制,而且形成浪費能量的先前溫度控制裝置的課題,俾能夠同時進行廣範圍而節省能量的溫度與濕度控制者。Accordingly, it is an object of the present invention to provide a temperature and humidity control device, and a temperature and humidity control method for solving a narrow temperature range in which a controllable temperature range of a gas flow such as an air flow is small, and at the same time, humidity control cannot be performed, and a previous temperature control for wasting energy is formed. The subject of the device is a temperature and humidity controller that can simultaneously carry out a wide range of energy saving.

本發明人等發現為了解決上述課題,其有效手段為應設置冷卻流路及加熱流路,及設置通過冷卻流路之冷卻機構及加熱流路之加熱機構之溫度與濕度控制對象的空氣,可對其冷卻量及加熱量做變更的分配機構,更設置熱泵機構,從低溫部移動熱至高溫部,藉以提高加熱流路的加熱能力。更在氣體流路內,設置濕度控制機構。The present inventors have found that in order to solve the above problems, an effective means is to provide a cooling flow path and a heating flow path, and to provide air for controlling the temperature and humidity of the heating means passing through the cooling means and the heating path of the cooling flow path. The distribution mechanism for changing the amount of cooling and the amount of heating is further provided with a heat pump mechanism to move the heat from the low temperature portion to the high temperature portion, thereby improving the heating ability of the heating flow path. Further, a humidity control mechanism is provided in the gas flow path.

亦即,做為解決上述課題之手段者,為提供一種溫度與濕度控制裝置,其具備有以壓縮機壓縮加熱之高溫第一熱媒的一部供應予加熱機構的加熱流路;該高溫第一熱媒之殘餘部以冷凝機構冷卻後藉第一膨脹機構以斷熱方式膨脹,並進一步冷卻後供應予冷卻機構的冷卻流路;及,該高溫第一熱媒經分配而通過各該加熱流路與冷卻流路之第一熱媒被再供應予壓縮機的循環回路,將通過該加熱機構及冷卻機構之做為溫度與濕度控制對象的氣體調整成所定溫度及濕度之溫度與濕度調整裝置中設有:將該壓縮機所吐出高溫第一熱媒之一部份分配予該加熱流路側,同時將該高溫第一熱媒之殘餘部份分配於冷卻流路側,並設有可變更分配予該加熱流路與冷卻流路之高溫第一熱媒分配比率的分配機構;為了提高該加熱流路之加熱能力,藉所述加熱機構放熱,經冷卻後以第二膨脹機構作斷熱膨脹而進一步冷卻的第一熱媒,從外部熱源的第二熱媒吸熱的具有吸熱機能的熱泵機構,控制該分配機構,以調整該加熱流路與冷卻流路所配得之高溫第一熱媒之分配比率;將通過該加熱機構與冷卻機構之溫度與濕度調整對象之氣體控制於所定溫度的溫度控制部;及將通過該加熱機構及冷卻機構之氣體控制於所定濕度的濕度控制機構。That is, as a means for solving the above problems, a temperature and humidity control device is provided which is provided with a heating flow path for supplying a heating medium heated by a compressor to a high temperature first heat medium; a residual portion of a heat medium is cooled by a condensing mechanism, expanded by a first expansion mechanism in a heat-dissipating manner, and further cooled and supplied to a cooling flow path of the cooling mechanism; and the high-temperature first heat medium is distributed and passed through each of the heating The first heat medium of the flow path and the cooling flow path is re-supplied to the circulation circuit of the compressor, and the temperature and humidity adjusted by the heating mechanism and the cooling mechanism as the temperature and humidity control target are adjusted to a predetermined temperature and humidity. The device is provided with: distributing a portion of the high temperature first heat medium discharged from the compressor to the heating flow path side, and distributing the remaining portion of the high temperature first heat medium to the cooling flow path side, and is provided with a changeable a distribution mechanism assigned to the high temperature first heat medium distribution ratio of the heating flow path and the cooling flow path; in order to increase the heating capacity of the heating flow path, the heating mechanism releases heat and is cooled a first heat medium that is further cooled by the second expansion mechanism for thermal expansion, and a heat pump mechanism having a heat absorption function that absorbs heat from the second heat medium of the external heat source controls the distribution mechanism to adjust the heating flow path and the cooling flow path. a distribution ratio of the high temperature first heat medium; a temperature control unit that controls the temperature and humidity adjustment target of the heating mechanism to a predetermined temperature; and controls the gas passing through the heating mechanism and the cooling mechanism Humidity control mechanism for the specified humidity.

又,為了做為解決該課題的手段,本發明提供一種溫度與濕度控制方法,其係利用經壓縮機壓縮加熱之高溫第一熱媒的一部份直接供應的加熱機構,及將該第一熱媒殘餘部份藉冷凝機構冷卻後,以第一膨脹機構經斷熱膨脹更加冷卻後供應的冷卻機構,對依次通過的溫度與濕度控制對象氣體,變更分配予該加熱機構與冷卻機構之該第一熱媒的分配率,以調整該氣體於所定溫度,同時藉設於該溫度與濕度控對象的氣體通過流路的濕度控制機構,調整該氣體於所定濕度,並且將通過該加熱機構的第一熱媒,藉第二膨脹機構經斷熱膨脹而冷卻,通過具有從外部熱源的第二熱媒吸熱之吸熱機構的熱泵機構後,與通過該冷卻機構的第一熱媒,一起返還予該壓縮機。Moreover, in order to solve the problem, the present invention provides a temperature and humidity control method, which is a heating mechanism directly supplied by a part of a high temperature first heat medium compressed and compressed by a compressor, and the first After the residual portion of the heat medium is cooled by the condensing mechanism, the cooling mechanism supplied by the first expansion mechanism after being cooled by the thermal expansion is changed, and the temperature and humidity control target gas sequentially passed through the heating mechanism and the cooling mechanism are changed. a distribution rate of the heat medium to adjust the gas to a predetermined temperature, and the gas controlled by the temperature and humidity control object passes through the humidity control mechanism of the flow path, adjusts the gas to a predetermined humidity, and passes the heating mechanism a heat medium is cooled by thermal expansion and expansion by a second expansion mechanism, and is returned to the compression by a heat pump mechanism having a heat absorption mechanism that absorbs heat from a second heat medium of an external heat source, together with the first heat medium passing through the cooling mechanism. machine.

在本發明人等所提供之解決課題的手段中,可舉出如下之較佳形態。The means for solving the problems provided by the inventors of the present invention include the following preferred embodiments.

做為濕度控制機構者,係供應設定量水分於溫度與濕度控制對象氣體用的水分供應機構,將該水分供應機構供應之水分中液滴,藉加熱機構直接加熱,或對以加熱機構加熱的氣體加熱而使其蒸發,而將該水分供應機構設於加熱機構的該氣體入口側或出口側,實施濕度控制。As a humidity control mechanism, a moisture supply mechanism for supplying a set amount of moisture to a temperature and humidity control target gas, and a droplet of moisture supplied from the moisture supply mechanism, directly heated by a heating mechanism, or heated by a heating mechanism The gas is heated to evaporate, and the moisture supply mechanism is provided on the gas inlet side or the outlet side of the heating mechanism to perform humidity control.

做為此水分供應機構者,具有噴水用的水噴霧噴嘴,供應水於該水噴霧噴嘴之水供應配管中所設置之控制閥,且調整該控制閥,以控制供應於該水喷霧噴嘴之水量的濕度控制部的水分供應機構,藉此容易進行濕度控制。As the water supply mechanism, there is a water spray nozzle for water spray, a control valve provided in the water supply pipe of the water spray nozzle is supplied, and the control valve is adjusted to control supply to the water spray nozzle. The moisture supply mechanism of the humidity control unit of the water amount is easy to perform humidity control.

或者亦可利用藉加熱器而產生水蒸氣的水蒸氣產生機構,做為濕度控制機構。Alternatively, a water vapor generating mechanism that generates water vapor by means of a heater may be used as the humidity control mechanism.

此水蒸氣產生機構,可藉設置濕度控制部,以調整加熱器之加熱量,因而控制水蒸氣之產生量,致可容易的進行濕度控制。This steam generating mechanism can adjust the amount of heating of the heater by setting the humidity control unit, thereby controlling the amount of water vapor generated, so that the humidity can be easily controlled.

將供應於冷卻流路之冷凝機構以冷卻第一熱媒的冷媒,與供應於熱泵機構之吸熱機構的第二熱媒,為同一熱媒,供應予冷凝機構,然後供應予該吸熱機構,藉此有效利用以冷凝機構除去的高溫第一熱媒之熱。The condensing mechanism supplied to the cooling flow path to supply the refrigerant of the first heat medium and the second heat medium supplied to the heat absorbing mechanism of the heat pump mechanism are supplied to the condensing mechanism, and then supplied to the heat absorbing mechanism. This effectively utilizes the heat of the high temperature first heat medium removed by the condensing mechanism.

不經過外部的加熱或冷卻而供應的第二熱媒,利用做為此第二熱媒時,從節能觀點而言,是很有效的。The second heat medium supplied without external heating or cooling is effective as a second heat medium from the viewpoint of energy saving.

又,設控制壓縮機轉速的轉速控制機構,使溫度控制部所控制之高溫第一熱媒分配比率,能成為加熱機構所加於溫度與濕度控制對象之氣體加熱量與冷卻機構所加於溫度與濕度控制對象氣體之冷卻量中,其互相抵消之熱量為較少之分配比率,而透過該轉速控制機構,設立變更壓縮機轉速用的壓縮機控制部,達成加於加熱機構與冷卻機構各自之熱量中互相抵消之熱量較少之目的,在加上熱泵機構之設置,致可更加節省能量。Further, a rotation speed control mechanism for controlling the number of revolutions of the compressor is provided, and the high-temperature first heat medium distribution ratio controlled by the temperature control unit can be added to the temperature of the gas heating amount applied by the heating mechanism to the temperature and humidity control target and the cooling mechanism. In the cooling amount of the humidity control target gas, the amount of heat that cancels each other is a small distribution ratio, and the compressor control unit for changing the compressor rotation speed is set by the rotation speed control means to achieve the addition of the heating mechanism and the cooling mechanism. The purpose of the heat that cancels each other is less, and the heat pump mechanism is added to save energy.

此壓縮機控制部中,其高溫第一熱媒分配比率,於溫度與濕度控制對象氣體在加熱側的場合,高溫第一熱媒中有95~85%分配於加熱機構,而且殘餘高溫第一熱媒中之5~15%分配於冷卻機構,另外,該溫度與濕度控制對象氣體在冷卻側的場合,高溫第一熱媒中有95~85%分配於冷卻機構,而且殘餘高溫第一熱媒中之5~15%分配於加熱機構。假如能夠做以上分式的分配,就可透過轉速控制機構控制壓縮機的轉速,一方面謀求溫度與濕度控制裝置的節能,一方面穩定運轉溫度與濕度控制裝置。此轉速控制機構,最好使用反相器。In the compressor control unit, the high temperature first heat medium distribution ratio is 90 to 85% of the high temperature first heat medium is distributed to the heating unit when the temperature and humidity control target gas is on the heating side, and the residual high temperature is first. 5 to 15% of the heat medium is distributed to the cooling mechanism, and when the temperature and humidity control target gas is on the cooling side, 95 to 85% of the high temperature first heat medium is distributed to the cooling mechanism, and the residual high temperature first heat 5 to 15% of the medium is distributed to the heating mechanism. If the above division can be distributed, the speed of the compressor can be controlled by the speed control mechanism, and on the one hand, the energy consumption of the temperature and humidity control device can be achieved, and on the other hand, the operating temperature and humidity control device can be stabilized. This speed control mechanism preferably uses an inverter.

此外,在通過加熱流路與冷卻流路之第一熱媒合流而再供應壓縮機的第一熱媒流路中,包含從分配機構到該第一熱媒合流為止的該加熱流路之流路及包含冷卻流路之流路,被分別設置為獨立之流路,即可擴大溫度與濕度控制對象氣體的溫度調整範圍。Further, the first heat medium flow path that re-supplies the compressor through the heating flow path and the first heat medium of the cooling flow path includes the flow of the heating flow path from the distribution mechanism to the first heat medium combined flow. The road and the flow path including the cooling flow path are respectively set as independent flow paths, thereby expanding the temperature adjustment range of the temperature and humidity control target gas.

做為對加熱流路與冷卻流路分配高溫第一熱媒的分配機構,可藉利用能實質上連續變更加熱流路與冷卻流路所分配的高溫第一熱媒分配比率。如此得以更加精密調整溫度與濕度控制對象的氣體溫度調整。As a distribution mechanism that distributes the high-temperature first heat medium to the heating flow path and the cooling flow path, the high-temperature first heat medium distribution ratio that is distributed by the heating flow path and the cooling flow path can be substantially continuously changed. This allows for more precise adjustment of the gas temperature adjustment of the temperature and humidity control objects.

做為這樣的分配機構,藉可實質上連續變更分配於加熱流路與冷卻流路之高溫第一熱媒分配比率的分配機構,得以更加精密調整溫度與濕度控制對象的氣體溫度調整。As such a distribution mechanism, the gas temperature adjustment of the temperature and humidity control target can be more precisely adjusted by substantially changing the distribution mechanism of the high-temperature first heat medium distribution ratio of the heating flow path and the cooling flow path.

此「實質上可連續變更的分配機構」,係使用二向閥或比例三向閥做為分配機構。當二向閥或比例三向閥以步級控制做驅動控制時,雖然二向閥或比例三向閥被微細步級驅動,但全體上意味著包含連續驅動的場合。This "distribution mechanism that can be changed continuously" uses a two-way valve or a proportional three-way valve as a distribution mechanism. When the two-way valve or the proportional three-way valve is driven by the step control, although the two-way valve or the proportional three-way valve is driven by the fine step, the whole means that the continuous drive is included.

分配機構欲使分配於加熱流路側與冷卻流路側的各高溫第一熱媒的合計量等於壓縮機所吐出之高溫第一熱媒量。可利用比例分配該高溫第一熱媒的比例三向閥,順利的變更壓縮機所吐出高溫第一熱媒的分配比率。The distribution mechanism intends to make the total amount of the high-temperature first heat mediums distributed on the heating flow path side and the cooling flow path side equal to the high-temperature first heat medium amount discharged from the compressor. The proportional three-way valve of the high-temperature first heat medium can be used to smoothly change the distribution ratio of the high-temperature first heat medium discharged from the compressor.

又,分配機構可用設於分開高溫第一熱媒於加熱流路側與冷卻流路側之各分歧配管上之二向閥,將溫度控制部所用該加熱流路與冷卻流路分配的高溫之第一熱媒分配比率進行調整,以控制通過加熱機構與冷卻機構之溫度與濕度控對象氣體於所定溫度,同時調整各該二向閥之開度,使分配予該加熱流路側與冷卻流路側的高溫第一熱媒的合計量等於壓縮機所吐出高溫第一熱媒量,這樣亦可順利變更壓縮機所吐出高溫第一熱媒的分配比率。Further, the distribution mechanism may be a two-way valve provided on each of the branch pipes on which the high-temperature first heat medium is separated from the heating flow path side and the cooling flow path side, and the first high temperature is distributed between the heating flow path and the cooling flow path used by the temperature control unit. The heat medium distribution ratio is adjusted to control the temperature and humidity control target gas passing through the heating mechanism and the cooling mechanism to a predetermined temperature, and simultaneously adjust the opening degree of each of the two-way valves to distribute the high temperature to the heating flow path side and the cooling flow path side. The total amount of the first heat medium is equal to the high temperature first heat medium amount discharged by the compressor, so that the distribution ratio of the high temperature first heat medium discharged from the compressor can be smoothly changed.

此外,為了將供應予冷卻流路之冷凝機構的冷媒做成液狀媒,設置有控制供應於該冷凝機構之該液狀媒供應量的冷媒控制機構,以保持壓縮機吐出側壓力於一定。即可穩定運轉溫度與濕度控制裝置,防止對冷凝機構供應超過需要的液狀媒。Further, in order to make the refrigerant supplied to the condensing means of the cooling flow path a liquid medium, a refrigerant control mechanism for controlling the supply amount of the liquid medium supplied to the condensing means is provided to keep the pressure on the discharge side of the compressor constant. The temperature and humidity control device can be stably operated to prevent the supply of the liquid medium more than necessary to the condensing mechanism.

[本發明之效果]本發明人所提供的溫度與濕度控制裝置及溫度與濕度控制方法,其對加熱流路之加熱機構及冷卻流路之冷卻機構,供應壓縮機所吐出高溫第一熱媒,而且變更分配於加熱流路與冷卻流路之高溫第一熱媒的分配比率,即可輕易調整通過加熱機構與冷卻機構的溫度與濕度控制對象氣體的加熱量與冷卻量,並調整通過加熱機構及冷卻機構的氣體溫度於所定溫度。[Effects of the Invention] The temperature and humidity control device and the temperature and humidity control method provided by the present inventors supply a heating mechanism for a heating flow path and a cooling mechanism for a cooling flow path, and supply a high temperature first heat medium to a compressor. And changing the distribution ratio of the high temperature first heat medium distributed between the heating flow path and the cooling flow path, the heating amount and the cooling amount of the gas to be controlled by the temperature and humidity of the heating mechanism and the cooling mechanism can be easily adjusted, and the heating is adjusted by heating The gas temperature of the mechanism and the cooling mechanism is at a predetermined temperature.

又由於設有如此可控制通過加熱機構及冷卻機構之氣體於所定濕度之濕度控制機構,因此亦可同時控制通過加熱機構及冷卻機構之氣體濕度於所定濕度。Further, since the humidity control mechanism that controls the gas passing through the heating mechanism and the cooling mechanism to a predetermined humidity is provided, the humidity of the gas passing through the heating mechanism and the cooling mechanism can be simultaneously controlled to a predetermined humidity.

又,本發明人等所提供溫度與濕度控制裝置及溫度與濕度控制方法具有熱泵機構。此熱泵機構屬於可從低溫部份向高溫部份移動熱的機構,因此壓縮機所壓縮加熱的高溫第一熱媒(高溫部份)中,將經加熱流路的加熱機構放熱冷卻後以第二膨脹手段斷熱膨脹而更加冷卻的第一熱媒,藉構成熱泵機構的吸熱機構,從外部熱源的第二熱媒(低溫部份)吸熱升溫汽化而歸返壓縮機。因而可大幅增加單位電力的加熱能力,節約能量。Further, the temperature and humidity control device and the temperature and humidity control method provided by the inventors of the present invention have a heat pump mechanism. The heat pump mechanism belongs to a mechanism that can move heat from a low temperature portion to a high temperature portion. Therefore, in the high temperature first heat medium (high temperature portion) compressed and heated by the compressor, the heating mechanism of the heating flow path is cooled and cooled. The first heat medium which is thermally expanded and cooled more by the expansion means is heated by the second heat medium (low temperature portion) of the external heat source to be returned to the compressor by the heat absorbing mechanism constituting the heat pump mechanism. Therefore, the heating capacity of the unit power can be greatly increased, and energy can be saved.

由是此溫度與濕度控制裝置及溫度與濕度控制方法中,壓縮機所吐出之高溫第一熱媒(高溫部份),可加入壓縮機之壓縮動能,熱泵機構從外部熱源的第二熱媒(低溫部份)吸熱的能量,提高受有高溫第一熱媒供應的加熱機構之加熱能力。In the temperature and humidity control device and the temperature and humidity control method, the high temperature first heat medium (high temperature part) discharged from the compressor can be added to the compression kinetic energy of the compressor, and the heat pump mechanism is the second heat medium from the external heat source. The (low temperature part) heat absorption energy increases the heating capacity of the heating mechanism supplied by the high temperature first heat medium.

這樣的溫度與濕度控制裝置及溫度與濕度控制方法中,通過加熱機構及冷卻機構之溫度與濕度控制對象氣體的微小負荷變動,可藉微小調整分配於加熱流路與冷卻流路之高溫第一熱媒分配比率,而可迅速對應,同時負荷變動引起的氣體濕度變化亦可藉濕度控制機構迅速對應,而可對溫度與濕度控制對象氣體,謀求溫度與濕度的調整。In such a temperature and humidity control device and a temperature and humidity control method, the temperature and humidity of the heating target and the cooling mechanism control the minute load fluctuation of the target gas, and the temperature of the heating flow path and the cooling flow path can be slightly adjusted by the slight adjustment. The heat medium distribution ratio can be quickly responded, and the gas humidity change caused by the load fluctuation can be quickly responded to by the humidity control mechanism, and the temperature and humidity control target gas can be adjusted for temperature and humidity.

又,本發明人等提供之溫度與濕度控制裝置及溫度與濕度控制方法中,在大幅提高通過加熱機構與冷卻機構之溫度與濕度控制對象氣體之設定溫度的場合,可藉大幅提高加熱流路對冷卻流路之高壓第一熱媒分配比率,擴大溫度與濕度控制對象氣體的溫度調整幅度。Further, in the temperature and humidity control device and the temperature and humidity control method provided by the inventors of the present invention, when the set temperature of the temperature and humidity control target gas passing through the heating mechanism and the cooling mechanism is greatly increased, the heating flow path can be greatly increased. The high-pressure first heat medium distribution ratio of the cooling flow path is expanded to increase the temperature adjustment range of the temperature and humidity control target gas.

此時溫度與濕度控制對象氣體的濕度,亦可藉濕度控制機構保持於所定濕度。At this time, the humidity of the temperature and humidity control target gas may be maintained at a predetermined humidity by the humidity control mechanism.

如此,本發明人等提供之溫度與濕度控制裝置及溫度與濕度控制方法,可將第13圖所示先前的溫度調整裝置及利用此裝置之溫度調整方法未能達成的目的,即調整溫度與濕度控制對象氣體的溫度與濕度於所定值,予以達成,且可節約能量。Thus, the temperature and humidity control device and the temperature and humidity control method provided by the present inventors can adjust the temperature and the purpose of the previous temperature adjustment device shown in FIG. 13 and the temperature adjustment method using the device. The temperature and humidity of the humidity control target gas are achieved at a predetermined value, and energy can be saved.

第1圖為說明本發明之溫度與濕度控制裝置一例之概略圖。第1圖所示之溫度與濕度控制裝置中具有設置於經調整溫度與濕度之乾淨室內的空間單元10內之加熱流路及冷卻流路,以調整風扇12所吸收之溫度與濕度控制對象氣體的溫度及濕度,及做為濕度控制機構之水分供應機構。Fig. 1 is a schematic view showing an example of a temperature and humidity control device according to the present invention. The temperature and humidity control device shown in Fig. 1 has a heating flow path and a cooling flow path provided in the space unit 10 in the clean room where the temperature and humidity are adjusted to adjust the temperature and humidity control target gas absorbed by the fan 12. Temperature and humidity, and as a moisture supply mechanism for the humidity control mechanism.

設有如此的構成加熱流路加熱機構的加熱器14與構成冷卻流路冷卻機構的冷卻器16,乾淨室內的空氣通過冷卻器16除濕後,經所配設之冷卻器16與加熱器14,通過加熱器14。The heater 14 constituting the heating channel heating mechanism and the cooler 16 constituting the cooling channel cooling mechanism are provided, and the air in the clean room is dehumidified by the cooler 16 and then passed through the cooler 16 and the heater 14 disposed. Pass the heater 14.

在冷卻器16與加熱器14之間,配設有構成水份供應裝置之噴霧噴嘴群15,噴霧既定量之水卻器16除濕後之空氣。構成此噴霧噴嘴群15之噴霧噴嘴15a,15a‧‧,經由幫浦19及水供應配管21中所設控制閥23,供應貯存於水槽17之純水。而且為了噴霧所供應之純水壓縮空氣,也經配管25供應予噴霧噴嘴15a,15a‧‧。Between the cooler 16 and the heater 14, a spray nozzle group 15 constituting a moisture supply device is disposed to spray the air after the dehumidification of the water meter 16 by a predetermined amount. The spray nozzles 15a, 15a, ‧ constituting the spray nozzle group 15 supply the pure water stored in the water tank 17 via the control valve 23 provided in the pump 19 and the water supply pipe 21. Further, in order to spray the supplied pure water compressed air, it is supplied to the spray nozzles 15a, 15a‧ through the piping 25.

水槽17中貯存有經由配管33供應之一般水供應於純水器35所得之純水。水槽17之純水貯存量,係以設於純水供應配管37中之控制閥39保持一定值。Pure water obtained by supplying the normal water supplied through the pipe 33 to the water purifier 35 is stored in the water tank 17. The pure water storage amount of the water tank 17 is maintained at a constant value by the control valve 39 provided in the pure water supply pipe 37.

做為此噴霧噴嘴15a者,可使用習知之噴霧噴嘴,例如同時噴射空氣與水而將水成為霧狀的雙流體噴嘴。或不用噴霧噴嘴群15,而代之以一個雙流體噴嘴。As the spray nozzle 15a, a conventional spray nozzle can be used, for example, a two-fluid nozzle that simultaneously sprays air and water to make water a mist. Instead of spraying the nozzle group 15, a two-fluid nozzle is used instead.

第1圖所示溫度與濕度控制裝置中,壓縮機18所吐出之第一熱媒分配予含加熱器14的加熱流路與含冷卻器16的冷卻流路,通過加熱流路及冷卻流路之第一熱媒,經所設循環回路再供應予壓縮機18。In the temperature and humidity control device shown in Fig. 1, the first heat medium discharged from the compressor 18 is distributed to the heating flow path including the heater 14 and the cooling flow path including the cooler 16, and passes through the heating flow path and the cooling flow path. The first heat medium is supplied to the compressor 18 via a circulating circuit.

此第一熱媒,可使用例如丙烷、異丁烷、環戊烷等碳化氫,亦可使用氟化物類、氨、二氧化碳等。供應此類第一熱媒,因其汽化、液化,將乾淨室內空氣加熱或冷卻,調整於既定溫度。As the first heat medium, for example, hydrocarbon such as propane, isobutane or cyclopentane can be used, and fluorides, ammonia, carbon dioxide or the like can also be used. The first heat medium is supplied, and because of its vaporization and liquefaction, the clean indoor air is heated or cooled and adjusted to a predetermined temperature.

如此的第一熱媒,藉壓縮機18壓縮加熱而成高溫(例如70℃)之氣體狀而吐出。將此壓縮機18吐出之高溫第一熱媒,以分配機構的比例三向閥20分配予設有加熱器14的加熱流路側及設有冷卻器16的冷卻流路側。Such a first heat medium is compressed by a compressor 18 and heated to a high temperature (for example, 70 ° C) gas to be discharged. The high-temperature first heat medium discharged from the compressor 18 is distributed to the heating flow path side where the heater 14 is provided and the cooling flow path side where the cooler 16 is provided by the proportional three-way valve 20 of the distribution mechanism.

在此比例三向閥20,分配於加熱流路側的高溫第一熱媒,與分配於冷卻流路側的高溫第一熱媒之合計量,應分配成等於由壓縮機18吐出之高溫第一熱媒量。In the proportional three-way valve 20, the high-temperature first heat medium distributed on the heating flow path side and the high-temperature first heat medium distributed on the cooling flow path side should be distributed equal to the high-temperature first heat discharged from the compressor 18. Media.

此比例三向閥20係受溫度控制部22之控制。在此溫度控制部22中,比較空間單元之空氣吹出口設置的溫度感知器24所測定之測定溫度與設定溫度,為了使兩溫度一致,實質上連續變更分配於加熱流路側與冷卻流路側高溫第一熱媒的分配比率,因而調整吸入於空間單元10內之空氣於設定溫度。This proportional three-way valve 20 is controlled by the temperature control unit 22. In the temperature control unit 22, the measured temperature and the set temperature measured by the temperature sensor 24 provided in the air blowing port of the comparison unit are substantially continuously changed to the high temperature of the heating channel side and the cooling channel side in order to match the two temperatures. The distribution ratio of the first heat medium thus adjusts the air drawn into the space unit 10 at a set temperature.

此「實質上連續變更」意指以步級控驅動比例三向閥20時,雖然比例三向閥20係受微細的步級控制,但仍含整體上被連續驅動的意思。This "substantially continuously changing" means that when the proportional three-way valve 20 is driven in steps, although the proportional three-way valve 20 is controlled by the fine step, it still has the meaning of being continuously driven as a whole.

這樣設定於溫度控制部22的設定溫度,可任意加以設定。而且第1圖所示之溫度感知器24,係設於風扇12的吐出側,但亦可設於風扇12的吸入側,亦可兩者均設置。The set temperature set in the temperature control unit 22 is set as desired. Further, the temperature sensor 24 shown in Fig. 1 is provided on the discharge side of the fan 12, but may be provided on the suction side of the fan 12, or both.

又,從噴嘴群15噴霧的純水量係被濕度控制部27所控制。此濕度控制部27用以比較設於空間單元10的空氣吹出口的濕度感測器29所測定之測定濕度與經設定之設定濕度,調整控制閥23,使吸入於空間單元10內之空氣於設定濕度,而令測定濕度與設定濕度成一致。Moreover, the amount of pure water sprayed from the nozzle group 15 is controlled by the humidity control unit 27. The humidity control unit 27 compares the measured humidity measured by the humidity sensor 29 provided in the air outlet of the space unit 10 with the set humidity, and adjusts the control valve 23 to allow the air sucked into the space unit 10 to Set the humidity so that the measured humidity is consistent with the set humidity.

設定於濕度控制部27的設定濕度,也可任意設定。而且,第1圖所示之濕度感測器29,係設於風扇12的吐出側,但亦可設於風扇12的吸入側,或設於風扇12的吐出側與吸入側。The set humidity set in the humidity control unit 27 can also be arbitrarily set. Further, the humidity sensor 29 shown in FIG. 1 is provided on the discharge side of the fan 12, but may be provided on the suction side of the fan 12 or on the discharge side and the suction side of the fan 12.

被比例三向閥20分配於加熱流路側的高溫第一熱媒,係直接供應加熱器14,加熱於吸入空間單元10內而被冷卻器16冷卻的空氣流及從噴霧噴嘴群15噴出的水份,調整成設定溫度。此時,高溫第一熱媒放熱冷卻而成含有冷凝液的第一熱媒。The high-temperature first heat medium distributed to the heating flow path side by the proportional three-way valve 20 is directly supplied to the heater 14, and is heated in the suction space unit 10 to be cooled by the cooler 16 and discharged from the spray nozzle group 15. The portion is adjusted to the set temperature. At this time, the high temperature first heat medium is exothermicly cooled to form a first heat medium containing the condensate.

另一方面,分配於冷卻流路側的高溫第一熱媒,被冷凝機構的冷凝器26冷卻,然後藉第一膨脹機構的膨脹閥28斷熱膨脹而更加冷卻(例如冷卻成10℃)。經冷卻的第一熱媒供應予冷卻器16而汽化,以冷卻吸入於空間單元10內的空氣流。On the other hand, the high-temperature first heat medium distributed on the cooling flow path side is cooled by the condenser 26 of the condensing mechanism, and then cooled by the expansion valve 28 of the first expansion mechanism to be further cooled (for example, cooled to 10 ° C). The cooled first heat medium is supplied to the cooler 16 to be vaporized to cool the air flow sucked into the space unit 10.

對此,冷凝器26,有經由冷卻分配予加熱器14側高溫第一熱媒用配管30,不經外部加熱或冷卻而供應的做為第二熱媒的冷卻水。此冷卻水在冷凝器26內藉約70℃的第一熱媒加熱至30℃左右而從配管31吐出。此從配管31吐出的冷卻水,係當作加熱源供應於熱泵機構的吸熱機構之吸熱器32。On the other hand, the condenser 26 is a cooling water which is supplied as a second heat medium, which is supplied to the high-temperature first heat medium pipe 30 on the heater 14 side by cooling, and is supplied without external heating or cooling. This cooling water is heated in the condenser 26 by a first heat medium at about 70 ° C to about 30 ° C to be discharged from the pipe 31. The cooling water discharged from the pipe 31 is used as a heat source to supply the heat sink 32 of the heat absorption mechanism of the heat pump mechanism.

此吸熱器32係受第一熱媒的供應,其係以加熱器14放熱後,藉第二膨脹機構的膨脹閥34做斷熱膨脹更加冷卻成10℃左右者。因此在吸熱器32,根據以冷凝器26吸熱而升溫為30℃左右的冷卻水與因汽化而冷卻成10℃左右的第一熱媒間溫度差,第一熱媒可從冷卻水吸熱。The heat absorber 32 is supplied by the first heat medium, and after the heater 14 releases heat, it is cooled by the expansion valve 34 of the second expansion mechanism to be further cooled to about 10 °C. Therefore, in the heat absorber 32, the first heat medium can absorb heat from the cooling water based on the temperature difference between the cooling water heated to about 30 ° C by the heat of the condenser 26 and the first heat medium cooled to about 10 ° C by vaporization.

在吸熱器32中從冷卻水吸熱升溫汽化的第一熱媒,經由積存器36供應予壓縮機18。對此積存器36,亦供應有供應予冷卻器16而吸入於空間單元10內的空氣流吸熱而汽化的第一熱媒。The first heat medium heated and vaporized from the cooling water in the heat absorber 32 is supplied to the compressor 18 via the accumulator 36. The accumulator 36 is also supplied with a first heat medium that is supplied to the cooler 16 and that absorbs heat and vaporizes the air stream sucked into the space unit 10.

此積存器36,係屬於貯存液體成份而只將氣體成份再供應壓縮機18之形式,因此可確實只將第一熱媒之氣體成份供應予壓縮機18。The accumulator 36 is in the form of a storage liquid component and only supplies the gas component to the compressor 18, so that it is possible to supply only the gas component of the first heat medium to the compressor 18.

積存器36可利用蓄壓器用形式者。The accumulator 36 can take the form of an accumulator.

又,將吸熱器32所排出之冷卻水供應予純水器35,而從噴霧噴嘴群15之噴霧噴嘴15a噴出亦可。吸熱器32所排出冷卻水溫度高於配管33所供應冷卻水之溫度時,由於噴霧噴嘴15a所噴水之蒸發潛熱較小,故可減輕空氣流之溫度低下。Further, the cooling water discharged from the heat absorber 32 is supplied to the water purifier 35, and may be ejected from the spray nozzle 15a of the spray nozzle group 15. When the temperature of the cooling water discharged from the heat absorber 32 is higher than the temperature of the cooling water supplied from the pipe 33, since the latent heat of vaporization of the water sprayed by the spray nozzle 15a is small, the temperature of the air flow can be reduced.

此外,不設積存器36,將以吸熱器32從空氣流吸熱而升溫汽化的熱媒,與供應予冷卻器16而從吸入空間單元10內的氣體吸熱蒸發的熱媒合流再供應 予壓縮機18亦可。Further, the accumulator 36 is not provided, and the heat medium which is heated by the heat sink 32 and which is heated and vaporized by the heat sink 32 is re-supplied with the heat medium which is supplied to the cooler 16 and absorbs heat from the gas in the suction space unit 10 to evaporate. It is also possible to apply to the compressor 18.

但是,雖然將在加熱器14中放熱的第一熱媒,以膨脹閥34斷熱膨脹而冷卻,但如此一來第一熱媒與外部間並無熱的交換。因此經斷熱冷卻的第一熱媒,可從外部經由冷凝器26而供應於吸熱器32之做為第二熱媒的冷卻水吸熱。However, although the first heat medium which radiates heat in the heater 14 is cooled by the expansion and expansion of the expansion valve 34, there is no heat exchange between the first heat medium and the outside. Therefore, the first heat medium cooled by the heat is absorbed from the outside by the condenser 26 and the heat of the heat sink 32 as the second heat medium absorbs heat.

由是,對壓縮機18所吐出之高溫第一熱媒,壓縮機18之壓縮動能可加入熱泵機構之吸熱器32從外部供應之冷卻水吸熱的能量。此藉吸熱器32的吸熱,可只賴循環第一熱媒的壓縮機18之驅動能來進行。Therefore, for the high temperature first heat medium discharged from the compressor 18, the compression kinetic energy of the compressor 18 can be added to the heat absorbed by the externally supplied cooling water by the heat absorber 32 of the heat pump mechanism. The heat absorption by the heat absorber 32 can be performed only by the driving energy of the compressor 18 that circulates the first heat medium.

再者,第1圖所示之溫度與濕度控制裝置中,有外部供應之冷卻水經由冷凝器26供應予吸熱器32。因此,冷凝器26所除去之從高溫熱媒來的一部份能量,亦可加入於壓縮機18所吐出之高溫第一熱媒,因而提高加熱流路之加熱能力。因此,熱泵機構之吸熱器32所吸熱之能量,加上冷凝器26所除去來自高溫第一熱媒的一部份能量,可加入於壓縮機18所吐出之高溫第一熱媒,提高加熱流路的加熱能力結果,可加寬空氣流溫度調整範圍,而且大幅度節約能量。Further, in the temperature and humidity control device shown in Fig. 1, externally supplied cooling water is supplied to the heat absorber 32 via the condenser 26. Therefore, a part of the energy from the high-temperature heat medium removed by the condenser 26 can also be added to the high-temperature first heat medium discharged from the compressor 18, thereby improving the heating ability of the heating flow path. Therefore, the energy absorbed by the heat absorber 32 of the heat pump mechanism, together with a part of the energy from the high temperature first heat medium removed by the condenser 26, can be added to the high temperature first heat medium discharged from the compressor 18 to improve the heating flow. As a result of the heating capacity of the road, the air flow temperature adjustment range can be widened, and energy is greatly saved.

而且此加熱器14,不只其對空氣流之加熱能力,亦可大幅增加噴霧噴嘴15a之噴水加熱能力,加濕能力亦可大幅增加,因此可加寬空氣流濕度調整範圍。Moreover, the heater 14 not only has the ability to heat the air flow, but also greatly increases the water spray heating capability of the spray nozzle 15a, and the humidification capability can be greatly increased, so that the air flow humidity adjustment range can be widened.

如此,從設於經提高加熱能力之加熱器14之空氣供應側的噴霧噴嘴群15噴出之所定量純水,對空氣流溫度的低下,亦可透過熱泵機構的吸熱,發揮升高空氣流溫度於設定溫度的加熱能力。In this way, the quantitative pure water ejected from the spray nozzle group 15 provided on the air supply side of the heater 14 having improved heating capability can also increase the temperature of the air flow, and can also increase the temperature of the air flow by the heat absorption of the heat pump mechanism. Set the heating capacity of the temperature.

在此,不設熱泵機構,而設噴霧噴嘴群15試做濕度控制之場合,恐怕會發生不能調整空氣流於所定溫度,握須經長久時間才能調整空氣流於所定溫度之事態。Here, when the heat pump mechanism is not provided and the spray nozzle group 15 is set to perform humidity control, there is a fear that the air flow cannot be adjusted to a predetermined temperature, and the air must be adjusted to a predetermined temperature for a long time.

亦即,對以噴霧噴嘴群15所噴之水引起之空氣流溫度低下,不如在供應有壓縮機18所吐出高溫第一熱媒之一部份的加熱器14增加加熱量,更為必要。That is, it is more necessary to increase the heating amount of the heater 14 which is caused by the water sprayed by the spray nozzle group 15 and to supply the heater 14 which is a part of the high temperature first heat medium discharged from the compressor 18.

然而供應於加熱器14的第一熱媒,只是壓縮機18所加的熱量。However, the first heat medium supplied to the heater 14 is only the heat applied by the compressor 18.

由是,溫度控制所用的噴霧噴嘴群15所供應之水量急增時,不能立即供應充分熱量予加熱器14,使空氣流升高至設定溫度。Therefore, when the amount of water supplied from the spray nozzle group 15 for temperature control is sharply increased, sufficient heat cannot be immediately supplied to the heater 14 to raise the air flow to the set temperature.

如此,在第1圖所示之溫度與濕度控制裝置中,依熱泵機構之設置,可提高其加熱流路之加熱能力,可以大幅增加每所定電力之加熱能力及加濕能力,並節約能量。As described above, in the temperature and humidity control device shown in Fig. 1, the heating capacity of the heating flow path can be improved by the arrangement of the heat pump mechanism, and the heating capacity and the humidifying ability of each predetermined electric power can be greatly increased, and energy can be saved.

又,在第1圖所示之溫度與濕度控制裝置中,藉比例三向閥20分配於加熱流路側之高溫第一熱媒與分配於冷卻流路側之高溫第一熱媒的分配比率,可依照空間單元10的溫度,做實質上的連續變更。Further, in the temperature and humidity control device shown in Fig. 1, the ratio of the high-temperature first heat medium distributed on the heating flow path side to the high-temperature first heat medium distributed on the cooling flow path side by the proportional three-way valve 20 is A substantially continuous change is made in accordance with the temperature of the space unit 10.

因此,在第1圖所示之溫度與濕度控制裝置中,加熱流路及冷卻流路經常有高溫第一熱媒的供應,通過加熱流路之加熱器14與冷卻流路之冷卻器16的溫度與濕度控制對象空氣流之微小負載變動,藉比例三向閥20立即做分配於加熱流路與冷卻流路之高溫第一熱媒的分配比率之微小調整,因而可迅速提高對應性。Therefore, in the temperature and humidity control device shown in Fig. 1, the heating flow path and the cooling flow path often have a supply of the high temperature first heat medium, and the heater 14 of the heating flow path and the cooler 16 of the cooling flow path The slight load fluctuation of the air flow of the temperature and humidity control target is immediately adjusted by the proportional three-way valve 20 to the minute ratio of the distribution ratio of the high-temperature first heat medium distributed between the heating flow path and the cooling flow path, so that the correspondence can be quickly improved.

又,如第1圖所示之溫度與濕度控制裝置,從設於加熱器14空氣入口側的噴霧噴嘴噴出純水,可維持空氣中濕度於設定值。而且循環於乾淨室內的循環空氣雖被風扇12等加熱,但可藉噴霧噴嘴群15噴出之純水除熱,可減小冷卻器16的負荷。Further, as shown in Fig. 1, the temperature and humidity control device discharges pure water from a spray nozzle provided on the air inlet side of the heater 14, thereby maintaining the humidity in the air at a set value. Further, although the circulating air circulating in the clean room is heated by the fan 12 or the like, the pure water discharged from the spray nozzle group 15 can be used to remove heat, and the load of the cooler 16 can be reduced.

結果,通過加熱流路之冷卻器16,噴霧噴嘴群15及加熱器14之溫度與濕度控制對象空氣流之溫度與濕度,可對設定值做高精度控制,可減少第1圖所示空間單元10的溫度與濕度變化而有利於設置須要精密加工的工程。As a result, the temperature and humidity of the air flow of the spray nozzle group 15 and the heater 14 can be controlled by the temperature of the cooler 16 of the heating nozzle, and the temperature and humidity of the spray nozzle group 15 can be controlled with high precision, and the space unit shown in Fig. 1 can be reduced. The temperature and humidity changes of 10 are beneficial to the setting of the engineering that requires precision machining.

如上述情形,在第1圖所示之溫度與濕度控制裝置中,提高了加熱流路的加熱能力,而且包含加熱流路與冷卻機構之流路中,獨立設置有從比例三向閥20通過冷卻器16及吸熱器32之第一熱媒在積存器合流之加熱流路與冷卻流路。因此溫度不同之第一熱媒不致於混合,可以擴大溫度與濕度調整對象的溫度調節幅度。As described above, in the temperature and humidity control device shown in Fig. 1, the heating ability of the heating flow path is improved, and the flow path including the heating flow path and the cooling mechanism is independently provided with the passage from the proportional three-way valve 20. The first heat medium of the cooler 16 and the heat sink 32 is combined with the heating flow path and the cooling flow path of the accumulator. Therefore, the first heat medium having a different temperature is not mixed, and the temperature adjustment range of the temperature and humidity adjustment target can be expanded.

又,在大幅提高通過加熱器14與冷卻器16的溫度與濕度控制對象空氣流設定溫度的場合,可藉比例三向閥20大幅提高高溫第一熱媒分配於加熱流路對分配於冷卻流路之比率,迅速調整溫度與濕度調整對象空氣流於設定溫度。Further, when the temperature setting of the temperature and humidity control target air flow by the heater 14 and the cooler 16 is greatly increased, the proportional three-way valve 20 can be greatly increased in temperature. The first heat medium is distributed to the heating flow path pair and distributed to the cooling flow. The ratio of the road, quickly adjust the temperature and humidity to adjust the target air flow to the set temperature.

這樣調整空氣流溫度之際,濕度控制部27調整噴霧噴嘴群15之純水噴霧量,以調整空氣流濕度於設定濕度。When the air flow temperature is adjusted in this way, the humidity control unit 27 adjusts the pure water spray amount of the spray nozzle group 15 to adjust the air flow humidity to the set humidity.

而且,在第1圖所示之溫度與濕度控制裝置中,加熱流路加熱能力被提高,因而不須使用加熱水蒸氣發生裝置等其他水分供應機構或加熱機構,可大幅節約能量。Further, in the temperature and humidity control device shown in Fig. 1, the heating flow path heating ability is improved, so that it is not necessary to use another water supply means or heating means such as a heated water vapor generating device, and energy can be greatly saved.

此外,在第1圖所示之溫度與濕度控制裝置中,係溫度控制部22與濕度控制部27獨立執行溫度與濕度的調整,即使變更設定溫度與設定濕度,空氣流的溫度與濕度,也會在比較短時間內達於設定溫度與設定濕度。Further, in the temperature and humidity control device shown in Fig. 1, the temperature control unit 22 and the humidity control unit 27 independently perform temperature and humidity adjustment, and even if the set temperature and the set humidity, the temperature and humidity of the air flow are changed, It will reach the set temperature and set humidity in a relatively short time.

以上所說明的第1圖所示溫度與濕度控制裝置中,供應冷卻水於冷凝器26之配管30內設有做為冷媒控制機構的控制閥40。此控制閥40控制壓縮機的吐出壓為一定。如第2圖所示,此控制閥40具有棒狀部的閥體40b,用以啟閉設於冷卻水流路內之閥部40a的開口部。此棒狀部之先端面所檔接的彈簧40c使閥體40b付能於將閥部40a的開口部關閉之方向。又,棒狀部之另一端面擋接於供應壓縮機18所吐出第一熱媒壓力之伸縮袋40d,將閥體40b向開放閥部40a之開口部開放方向付能,以令棒狀部抗衡彈簧40c之付能力。In the temperature and humidity control device shown in Fig. 1 described above, the control valve 40 serving as a refrigerant control means is provided in the pipe 30 of the condenser 26 to supply the cooling water. This control valve 40 controls the discharge pressure of the compressor to be constant. As shown in Fig. 2, the control valve 40 has a rod-shaped valve body 40b for opening and closing the opening of the valve portion 40a provided in the cooling water flow path. The spring 40c that is in contact with the front end surface of the rod portion biases the valve body 40b in a direction in which the opening of the valve portion 40a is closed. Further, the other end surface of the rod portion is in contact with the telescopic bag 40d that supplies the pressure of the first heat medium to be supplied from the compressor 18, and the valve body 40b is energized in the opening direction of the opening of the valve portion 40a to make the rod portion The ability to counter the spring 40c.

爰此,壓縮機18之吐出壓變成彈簧40c之付能力以上時,藉伸縮袋40d使閥體40b向閥部40a之開口部開放方向移動,增加供應冷凝器26之冷卻水量,提高冷凝器26之冷卻能力。這樣一來,冷凝器26之冷卻能力提高而壓縮機18之吐出壓降低。When the discharge pressure of the compressor 18 becomes equal to or higher than the capacity of the spring 40c, the valve body 40b is moved in the opening direction of the opening of the valve portion 40a by the bellows 40d, and the amount of cooling water supplied to the condenser 26 is increased to increase the condenser 26. Cooling capacity. As a result, the cooling capacity of the condenser 26 is increased and the discharge pressure of the compressor 18 is lowered.

另一方面,壓縮機18之吐出壓變成彈簧40c之付能力以下時,閥體40d向關閉閥部40a之開口部方向移動,減少供應冷凝器26之冷卻水量而其冷卻能力低下。因此,壓縮機18的吐出壓增高。On the other hand, when the discharge pressure of the compressor 18 is equal to or lower than the capacity of the spring 40c, the valve body 40d moves in the direction of the opening of the closing valve portion 40a, and the amount of cooling water supplied to the condenser 26 is reduced to lower the cooling capacity. Therefore, the discharge pressure of the compressor 18 is increased.

如此,藉保持壓縮機18之吐出壓於一定,可穩定運轉溫度與濕度控制裝置。又可調整防止冷凝器26之供應冷卻水量超過需要量而排水於系統外。In this way, by keeping the discharge pressure of the compressor 18 constant, the temperature and humidity control device can be stably operated. Further, it is possible to adjust to prevent the supply of cooling water of the condenser 26 from exceeding the required amount and draining outside the system.

如第1圖所示,此控制閥40,其短路配管設有閥41。此閥41在控制閥40故障或供應於加熱器14之高壓第一熱媒供應量增加,壓縮機吐出壓降低,因供應水不足而吸熱器32不能發揮實質上之功能等場合,為強制將水供應冷凝器26及吸熱器32而設。As shown in Fig. 1, the control valve 40 is provided with a valve 41 in the short-circuit piping. The valve 41 is in a state where the control valve 40 is malfunctioning or the supply of the high-pressure first heat medium supplied to the heater 14 is increased, the discharge pressure of the compressor is lowered, and the heat sink 32 cannot perform a substantial function due to insufficient supply of water, etc. The condenser 26 and the heat absorber 32 are provided.

在第1圖所示之溫度與濕度控制裝置中。在冷卻器16與加熱器14間配設有噴霧純水用之噴霧噴嘴群15,遞可如第3A圖所示般,配設噴霧噴嘴群15於加熱器14之空氣出口側。如此配設,從噴霧噴嘴群15噴出之水滴,可經加熱器14直接加熱而蒸發。In the temperature and humidity control device shown in Fig. 1. A spray nozzle group 15 for spraying pure water is disposed between the cooler 16 and the heater 14, and the spray nozzle group 15 is disposed on the air outlet side of the heater 14 as shown in Fig. 3A. In this manner, the water droplets ejected from the spray nozzle group 15 can be directly heated by the heater 14 to be evaporated.

又,如第3B圖所示,將冷卻器16與加熱器14配設,空氣供應於加熱器14後,再供應於冷卻器16,而在冷卻器16與加熱器14間配設噴霧噴嘴群15。此時噴霧噴嘴群15噴出之水滴,亦可被加熱器及空氣流加熱而蒸發。Further, as shown in FIG. 3B, the cooler 16 and the heater 14 are disposed, air is supplied to the heater 14, and then supplied to the cooler 16, and a spray nozzle group is disposed between the cooler 16 and the heater 14. 15. At this time, the water droplets sprayed from the spray nozzle group 15 can be heated by the heater and the air stream to evaporate.

而且,如第3B圖所示加熱器14與冷卻器16之配設,亦可如第3C圖所示,配設噴霧噴嘴群15於加熱器14之空氣入口側。此場合下噴霧噴嘴群15所噴水滴,可被加熱器14直接加熱蒸發。Further, as shown in Fig. 3B, the heater 14 and the cooler 16 may be disposed as shown in Fig. 3C, and the spray nozzle group 15 may be disposed on the air inlet side of the heater 14. In this case, water droplets sprayed from the spray nozzle group 15 can be directly heated and evaporated by the heater 14.

但是,例如屬於第3A圖所示之加熱器14與冷卻器16之配設,而如第3D圖所示,將噴霧噴嘴群15配設於冷卻器16之空氣入口側,則噴霧噴嘴群15噴出之水滴,被冷凝於冷卻器16內無法蒸發而從空氣流中除去,欲將空氣流調整於設定濕度就有困難。However, for example, the heater 14 and the cooler 16 shown in FIG. 3A are disposed, and as shown in FIG. 3D, the spray nozzle group 15 is disposed on the air inlet side of the cooler 16, and the spray nozzle group 15 is provided. The ejected water droplets are condensed in the cooler 16 and cannot be evaporated and removed from the air stream. It is difficult to adjust the air flow to the set humidity.

此外,如第3B圖及第3C圖,將噴霧噴嘴群設於加熱器14或冷卻器16上流側時,在噴霧噴嘴群15下流側之加熱器14或冷卻器16,發揮除去噴霧噴嘴群15所噴水滴之功能,可保持通過下流側加熱器14或冷卻器14之空氣流所含水滴大小於一定。Further, as shown in FIGS. 3B and 3C, when the spray nozzle group is provided on the upstream side of the heater 14 or the cooler 16, the heater 14 or the cooler 16 on the downstream side of the spray nozzle group 15 functions to remove the spray nozzle group 15 The function of the water droplets to be sprayed keeps the size of the water droplets contained in the air flow passing through the downstream side heater 14 or the cooler 14 constant.

在第1圖所示之溫度與濕度控制裝置所用分配機構之比例三向閥20,可代之以第4圖所示之做為二具二向閥之二向閥38a、38b。每一二向閥38a、38b都受溫度控制部22的控制。此溫度控制部22調整二向閥38a、38b之開度,實質上連續調整壓縮機18所壓縮加熱的氣體狀高溫第一熱媒分配於加熱流路與冷卻流路之分配比率,因而將通過加熱器14與冷卻器16之空氣流控制於設定溫度。此時各分配於加熱器14側及冷卻器16側之高溫第一熱媒之合計量,令其等於壓縮機18所吐出高溫第一熱媒量,可調整二向閥38a、38b之開度,進行連續的比例分配。The proportional three-way valve 20 of the distribution mechanism used in the temperature and humidity control device shown in Fig. 1 can be replaced by the two-way valve 38a, 38b as two two-way valves as shown in Fig. 4. Each of the two-way valves 38a, 38b is controlled by the temperature control portion 22. The temperature control unit 22 adjusts the opening degrees of the two-way valves 38a and 38b, and substantially continuously adjusts the distribution ratio of the gas-like high-temperature first heat medium compressed and heated by the compressor 18 to the heating flow path and the cooling flow path, and thus passes through The air flow of the heater 14 and the cooler 16 is controlled at a set temperature. At this time, the total amount of the high-temperature first heat medium distributed to the heater 14 side and the cooler 16 side is equal to the high-temperature first heat medium discharged from the compressor 18, and the opening degree of the two-way valves 38a, 38b can be adjusted. , for continuous proportional distribution.

如第5圖所示,各二向閥38a、38b,其開度與流量之關係並非直線狀。因此,溫度控制部22就第5圖所示各二向閥38a、38b保持其流量特性數據。從溫度控制部22,依據二向閥38a、38b各流量特性,對各該二向閥38a、38b發出開度信號。As shown in Fig. 5, the relationship between the opening degree and the flow rate of each of the two-way valves 38a and 38b is not linear. Therefore, the temperature control unit 22 holds the flow rate characteristic data for each of the two-way valves 38a and 38b shown in Fig. 5. The temperature control unit 22 issues an opening degree signal to each of the two-way valves 38a and 38b in accordance with the flow rate characteristics of the two-way valves 38a and 38b.

此處所提「分配於加熱流路與冷卻流路之分配比率做實質上之連續調整」或「分配比率做實質上連續調整」,意指以步級控制方式驅動二向閥38a、38b,於調整加熱流路與冷卻流路分配比率之際,仔細觀察二向閥38a、38b的開度似乎被以步級方式驅動調整,但全體而言亦有連續驅動調整之情形。The "allocation of the distribution ratio between the heating flow path and the cooling flow path is substantially continuously adjusted" or "the distribution ratio is substantially continuously adjusted" as used herein, meaning that the two-way valves 38a, 38b are driven in a stepwise manner. When adjusting the ratio of the heating flow path to the cooling flow path, it is apparent that the opening degrees of the two-way valves 38a, 38b seem to be driven in a stepwise manner, but there is also a case of continuous drive adjustment.

在第1圖所示之溫度與濕度控制裝置中,藉加熱器14與冷卻器16執行的溫度與濕度調整對象空氣流的溫度與濕度調整,例如對象空氣流在加熱側時,於空氣溫度在穩定運轉狀態下,如第6A圖所示,冷卻器16所冷卻空氣流以加熱器14加熱。如第6A圖所示之運轉狀態下,有時加熱器14加熱之能量,比加熱空氣流所需能量A為大。如第6B圖所示,此時如能儘量減少加熱器14與冷卻器16重複的能量,即可節省能量。In the temperature and humidity control device shown in Fig. 1, the temperature and humidity of the target air flow are adjusted by the temperature and humidity performed by the heater 14 and the cooler 16, for example, when the target air flow is on the heating side, and the air temperature is at In the steady operation state, as shown in Fig. 6A, the air flow cooled by the cooler 16 is heated by the heater 14. In the operating state shown in Fig. 6A, the energy heated by the heater 14 may be larger than the energy A required for the heated air flow. As shown in Fig. 6B, energy can be saved if the energy of the heater 14 and the cooler 16 are repeated as much as possible.

另一方面,溫度與濕度控制對象空氣流在冷卻側之場合,於空氣流溫度在穩定運轉狀態下,如第7A圖所示,加熱器14所加熱的空氣在冷卻器16冷卻。於第7A圖所示運轉狀態下,有時冷卻器16冷卻的能量,比冷卻空氣流所需能量B為大。如第7B圖所示,此時如能儘量減少冷卻器16與加熱器14重複的能量,即可節省能量。On the other hand, when the temperature and humidity control target air flow is on the cooling side, the air heated by the heater 14 is cooled by the cooler 16 as shown in Fig. 7A when the air flow temperature is in a stable operation state. In the operating state shown in Fig. 7A, the energy cooled by the cooler 16 may be larger than the energy B required for the cooling air flow. As shown in Fig. 7B, energy can be saved by minimizing the energy of the cooler 16 and the heater 14 at this time.

但是,為了意圖互相抵消之熱量為零而ON-OFF控制高溫第一熱媒對加熱器14與冷卻器16之供應,即溫度與濕度控制裝置之運轉變成不安定,要將空氣流穩定於所定溫度須耗時間。爰此,為了維持溫度與濕度控制裝置於可穩定運轉程度,必須維持加入於加熱器14之加熱量與加入於冷卻器16之冷卻量中互相抵消之熱量為最小限度。However, in order to zero the heat intended to cancel each other, ON-OFF controls the supply of the high temperature first heat medium to the heater 14 and the cooler 16, that is, the operation of the temperature and humidity control device becomes unstable, and the air flow is stabilized at the predetermined The temperature takes time. Accordingly, in order to maintain the temperature and humidity control device in a stable operation state, it is necessary to minimize the amount of heat that is added to the heater 14 and the amount of cooling added to the cooler 16 to cancel each other.

又,此互相抵消的必要最小限熱量,隨溫度與濕度控制裝置而多少有所差異,最好以實驗方式求得。Moreover, the minimum amount of heat required to cancel each other differs somewhat depending on the temperature and humidity control means, and is preferably determined experimentally.

如此,在第8圖所示溫度與濕度控制裝置中,為了使冷卻器16與加熱器14之重複能量減少,則須使加入於加熱器14之加熱量與加入於冷卻器16之冷卻量中互相抵消之熱量儘量減少,而經壓縮機18之回轉數控制用之回轉數控制部的反向器42,以壓縮機控制部44(以下稱COMP控制部44)控制。Thus, in the temperature and humidity control apparatus shown in Fig. 8, in order to reduce the repetitive energy of the cooler 16 and the heater 14, the amount of heating added to the heater 14 and the amount of cooling added to the cooler 16 must be made. The heat that cancels each other is reduced as much as possible, and the inverter 42 of the number-of-turns control unit for controlling the number of revolutions of the compressor 18 is controlled by the compressor control unit 44 (hereinafter referred to as the COMP control unit 44).

構成第8圖所示溫度與濕度控制裝置的構成部材中,與第1圖所示之溫度與濕度控制裝置構成部材相同者,賦予與第1圖之符號同一標號,而省略詳細說明。The constituent members of the temperature and humidity control device shown in Fig. 8 are denoted by the same reference numerals as those of the first embodiment, and the detailed description thereof will be omitted.

如此之COMP控制部44,與控制比例三向閥20之溫度控制部22共同合作,儘量減少加入於加熱器14之加熱量與加入於冷卻器16之冷卻量中互相抵消之熱量,控制空氣流之溫度與濕度。The COMP control unit 44 cooperates with the temperature control unit 22 that controls the proportional three-way valve 20 to minimize the amount of heat that is added to the heater 14 and the amount of cooling added to the cooler 16 to control the air flow. Temperature and humidity.

茲以第9圖之流程圖來說明溫度控制部22所做之比例三向閥20之控制及COMP控制部44所做之壓縮機18回轉數之控制。The control of the proportional three-way valve 20 by the temperature control unit 22 and the control of the number of revolutions of the compressor 18 by the COMP control unit 44 will be described with reference to the flowchart of Fig. 9.

試運轉第8圖所示溫度控制裝置結果,對空氣流在冷卻側運轉時,加入於加熱器14的加熱量,即藉比例三向閥20分配於加熱器14側之高溫第一熱媒分配率為5~15%(比例三向閥20分配於冷卻器16側的高溫第一熱媒分配率為95~85%)的穩定運轉上較佳。As a result of the temperature control device shown in Fig. 8, the amount of heating added to the heater 14 when the air flow is operated on the cooling side, that is, the high temperature first heat medium distribution distributed to the heater 14 side by the proportional three-way valve 20 The rate is preferably 5 to 15% (the ratio of the high-temperature first heat medium distribution ratio of the proportional three-way valve 20 to the cooler 16 side is 95 to 85%).

另一方面,對空氣流在加熱側運轉時,加入於加熱器14側的加熱量,即藉比例三向閥20分配於加熱器14側之高溫第一熱媒分配率為95~85%(比例三向閥20分配於冷卻器16側的高溫第一熱媒分配率為5~15%)時,穩定運轉上較佳。On the other hand, when the air flow is operated on the heating side, the heating amount added to the heater 14 side, that is, the high-temperature first heat medium distribution ratio which is distributed to the heater 14 side by the proportional three-way valve 20 is 95 to 85% ( When the proportional three-way valve 20 is distributed to the side of the cooler 16 at a high temperature first heat medium distribution ratio of 5 to 15%, it is preferable to operate stably.

爰此,在第9圖所示流程圖的控制中,加入於加熱器14側的加熱量,具體而言為藉比例三向閥20分配於加熱器14側的高溫第一熱媒分配率,於對空氣流在冷卻側運轉時,控制壓縮機18的回轉數,使其成為5~15%。對空氣流在加熱側運轉時,控制壓縮機18的回轉數,使其成為95~85%。Here, in the control of the flowchart shown in FIG. 9, the amount of heating added to the heater 14 side, specifically, the high-temperature first heat medium distribution ratio assigned to the heater 14 side by the proportional three-way valve 20, When the air flow is operated on the cooling side, the number of revolutions of the compressor 18 is controlled to be 5 to 15%. When the air flow is operated on the heating side, the number of revolutions of the compressor 18 is controlled to be 95 to 85%.

在第9圖所示流程圖中,在S10起動壓縮機18後,利用設於空間單元10內的溫度感知器24依據所測定之溫度信號,在S12中連續變更比例三向閥20分配於加熱器14側與冷卻器16側高溫第一熱媒之分配比率,調整吸入於空間單元10之空氣流於設定溫度。In the flowchart shown in FIG. 9, after the compressor 18 is started in S10, the temperature sensor 24 provided in the space unit 10 continuously changes the proportional three-way valve 20 to be heated in S12 based on the measured temperature signal. The ratio of the high temperature first heat medium to the side of the cooler 14 and the side of the cooler 16 adjusts the air flow sucked into the space unit 10 to a set temperature.

在S14中判斷如此之空氣流是否穩定於該所定溫度,空氣流溫度如未穩定,則反返於S12,連續變更比例三向閥20分配於加熱器14側與冷卻器16側之高溫熱媒之分配比率。S12與S14係在溫度控制部22執行。In S14, it is determined whether the air flow is stable at the predetermined temperature, and if the air flow temperature is not stabilized, the flow returns to S12, and the proportional three-way valve 20 is continuously changed to the high temperature heat of the heater 14 side and the cooler 16 side. The distribution ratio of the media. S12 and S14 are executed by the temperature control unit 22.

另一方面,空間單元10內的空氣流到達於設定溫度而穩定時,在S16~S22判斷分配於加熱器14側之高溫第一熱媒分配比率是否在設定範圍內。S16~S22係在COMP控制部44中執行。On the other hand, when the air flow in the space unit 10 reaches the set temperature and is stabilized, it is determined in S16 to S22 whether or not the high temperature first heat medium distribution ratio assigned to the heater 14 side is within the set range. S16 to S22 are executed by the COMP control unit 44.

此外,第9圖所示高溫第一熱媒平均分配率,因分配於加熱器14側的高溫第一熱媒分配比率有所參差,係在一定時間內取得的第一熱媒分配率之平均值,以下稱之為第一熱媒平均分配率。In addition, the average distribution ratio of the high-temperature first heat medium shown in FIG. 9 is uneven due to the distribution ratio of the high-temperature first heat medium distributed to the heater 14 side, and is the average of the first heat-distribution rate obtained in a certain period of time. The value, hereinafter referred to as the first heat medium average distribution rate.

首先,在S16與S18中,假定空氣流在冷卻側,判斷加熱器14側第一熱媒平均分配率是否在5~15%內。First, in S16 and S18, it is assumed that the air flow is on the cooling side, and it is judged whether or not the average distribution ratio of the first heat medium on the heater 14 side is within 5 to 15%.

於是,如果加熱器14側第一熱媒平均分配率為5~15%時,對空氣流是在冷卻側,而且係在溫度與濕度控制裝置的穩定運轉範圍內,可通過S16從S18返回S16。Therefore, if the average heat distribution rate of the first heat medium on the heater 14 side is 5 to 15%, the air flow is on the cooling side, and is within the stable operation range of the temperature and humidity control device, and can be returned from S18 to S16 through S16. .

另一方面,加熱器14側的第一熱媒平均分配率為未滿5%時,該分配率過低,溫度與濕度控制裝置之運轉易陷於不安定。為此,應增加加熱器14側第一熱媒之平均分配率,從S16移行於S24,增加壓縮機18之回轉數。在S24中,從COMP控制部44向反相器42發送設定於反相器42之要以最小變化量增加壓縮機18回轉數的增加信號,如此,則可穩定運轉溫度與濕度控制裝置。On the other hand, when the average distribution ratio of the first heat medium on the heater 14 side is less than 5%, the distribution ratio is too low, and the operation of the temperature and humidity control device is liable to be unstable. To this end, the average distribution ratio of the first heat medium on the heater 14 side should be increased, and the flow rate from S16 to S24 is increased to increase the number of revolutions of the compressor 18. In S24, the COMP control unit 44 transmits an increase signal set to the inverter 42 to increase the number of revolutions of the compressor 18 by the minimum amount of change from the COMP control unit 44. Thus, the operating temperature and humidity control device can be stabilized.

此外,變化壓縮機18回轉數的最小變化量,依溫度與濕度調整裝置而異,宜以實驗方式求得,但壓縮機18的回轉數在2000~5000rpm時,最小變化量宜在3~10%之範圍內。In addition, the minimum amount of change in the number of revolutions of the compressor 18 varies depending on the temperature and humidity adjustment device, and is preferably determined experimentally. However, when the number of revolutions of the compressor 18 is 2000 to 5000 rpm, the minimum variation is preferably 3 to 10. Within the range of %.

又,加熱器14側的第一熱媒體平均分配率超過15%時,通過S16及S18,判斷空氣流不在冷卻側,而移行於S20及S22。在S20及S22中,如假定空氣流在加熱側,判斷加熱器14側的第一熱媒平均分配率是否在95~85%以內。When the first heat medium average distribution ratio on the heater 14 side exceeds 15%, it is determined in S16 and S18 that the air flow is not on the cooling side, and the flow proceeds to S20 and S22. In S20 and S22, if it is assumed that the air flow is on the heating side, it is judged whether or not the average distribution ratio of the first heat medium on the heater 14 side is within 95 to 85%.

於此,如果加熱器14側的第一熱媒平均分配率在85~95%以內時,由於空氣流在加熱側,而且在溫度與濕度控制裝置運轉之安定範圍內,故通過S20,從S22返回S16。Here, if the average distribution rate of the first heat medium on the heater 14 side is within 85 to 95%, since the air flow is on the heating side and within the stability range in which the temperature and humidity control device operates, the S20 is passed from S22. Go back to S16.

另一方面,加熱器14側第一熱媒的平均分配率超過95%時,加熱器14側的第一熱媒平均分配率過高,溫度與濕度控制裝置之運轉易陷於不安定。因此,應減少加熱器14側的第一熱媒平均分配率而從S2O移行於S24,增加壓縮機18的回轉數。在S24中,從COMP控制部44向反相器42,發出以最小變化量增加設定於反相器42中壓縮機18回轉數的增加信號。On the other hand, when the average distribution ratio of the first heat medium on the heater 14 side exceeds 95%, the average distribution ratio of the first heat medium on the heater 14 side is too high, and the operation of the temperature and humidity control device is liable to be unstable. Therefore, the average distribution ratio of the first heat medium on the heater 14 side should be reduced and the flow rate from S2O to S24 should be increased to increase the number of revolutions of the compressor 18. In S24, the COMP control unit 44 sends an increase signal to the inverter 42 that increases the number of revolutions of the compressor 18 set in the inverter 42 with a minimum amount of change.

又,加熱器14側第一熱媒的平均分配率如為未滿85%時,在S22中,判斷空氣流為不在加熱側,也不在冷卻側之狀態,亦即加入於加熱器14之加熱量與加入於冷卻器16之冷卻量中,互相抵消之熱量過多之狀態。為此,移行於S26,降低壓縮機18之回轉數。在S26中,從COMP控制部44向反相器42發出設定於反向器42之以最小變化量降低壓縮機18回轉數的降低信號,如此,是為了將空氣流移行於加熱側或冷卻側。Further, when the average distribution ratio of the first heat medium on the heater 14 side is less than 85%, in S22, it is determined that the air flow is not on the heating side, nor is it on the cooling side, that is, the heating added to the heater 14. The amount and the amount of cooling added to the cooler 16 are excessively offset by the amount of heat. To this end, the process proceeds to S26 to reduce the number of revolutions of the compressor 18. In S26, the COMP control unit 44 sends a lowering signal to the inverter 42 that is set to the inverter 42 to reduce the number of revolutions of the compressor 18 with a minimum amount of change, so that the air flow is moved to the heating side or the cooling side. .

其次,通過S24或S26而移行於S28,判斷壓縮機18是否在運轉中,如果壓縮機18在運轉中,則返回S14。在S14中,在S24或S26中判斷壓縮機18回轉數以最小變壓量增加或減低的狀態,空間單元10內的空氣流是否達於設定溫度而穩定。如果是如此,則依S16~S26,再度判斷加熱器14側的第一熱媒平均分配率,是否在設定範圍內。Next, the process proceeds to S28 via S24 or S26, and it is judged whether or not the compressor 18 is in operation. If the compressor 18 is in operation, the process returns to S14. In S14, it is judged in S24 or S26 that the number of revolutions of the compressor 18 is increased or decreased with a minimum amount of pressure change, and whether the air flow in the space unit 10 reaches the set temperature is stabilized. If so, according to S16 to S26, it is determined again whether or not the average distribution ratio of the first heat medium on the heater 14 side is within the set range.

另一方面,在S14中如判斷空間單元10內之空氣流溫度並非安定,即返回S12,連續變更比例三向閥20分配於加熱器14側與冷卻器16側的第一熱媒分配比率。等到空間單元10內之空氣流到達於設定溫度並安定後,移行於S16~S26。On the other hand, if it is determined in S14 that the air flow temperature in the space unit 10 is not stabilized, that is, the process returns to S12, and the first heat medium distribution ratio of the proportional three-way valve 20 to the heater 14 side and the cooler 16 side is continuously changed. After the air flow in the space unit 10 reaches the set temperature and is stabilized, the flow proceeds to S16 to S26.

此外,在S28中,壓縮機18不在運轉狀態時,溫度控制部22及COMP控制部44所進行的控制就停止。Further, in S28, when the compressor 18 is not in the operating state, the control by the temperature control unit 22 and the COMP control unit 44 is stopped.

以上所說明的第9圖所示流程圖中,溫度控制部22係著重於加熱器14側之第一熱媒平均分配率而進行控制,但亦可著重於冷卻器16側之第一熱媒平均分配率而進行控制。In the flowchart shown in Fig. 9 described above, the temperature control unit 22 focuses on the first heat medium average distribution ratio on the heater 14 side, but may focus on the first heat medium on the cooler 16 side. The average distribution rate is controlled.

又,亦可將設定溫度輸入用輸入機構及表示運轉狀態的標示機構,與溫度控制部22及濕度控制部27成為一體或分開設置。Further, the set temperature input input means and the indicator means indicating the operation state may be integrated with or separately from the temperature control unit 22 and the humidity control unit 27.

第1圖~第9圖所示溫度與濕度控制裝置中,冷凝器26及吸熱器32使用水做為冷卻水與加熱源,但亦可如第10圖所示,以風扇50吹室內空氣的方式,做冷凝器26及吸熱器32的冷卻源與加熱源。In the temperature and humidity control device shown in FIGS. 1 to 9, the condenser 26 and the heat absorber 32 use water as a cooling water and a heating source, but as shown in FIG. 10, the indoor air is blown by the fan 50. In the manner, the cooling source and the heating source of the condenser 26 and the heat absorber 32 are used.

構成第10圖所示之溫度與濕度控制裝置之構成部材中,與第1圖所示溫度與濕度控制裝置構成部材同一之部材,賦予與第1圖之符號同一標號,而省略詳細說明。In the components constituting the temperature and humidity control device shown in Fig. 10, the same components as those of the components of the temperature and humidity control device shown in Fig. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

又,第1圖~第9圖所示之溫度與濕度控制裝置中,配設有做為濕度控制機構的噴霧用噴嘴群15,但亦可如第11圖所示,不設噴霧用噴嘴群15,而代之以在空氣流路內配設蒸氣發生器52。蒸氣發生器52,為一種通過加熱器14與冷卻器16,供應水分於空氣流之裝置,藉加熱電熱器56加熱貯存於容器54內純水而產生蒸氣。此加熱器56係由溫度控制部27控制。Further, in the temperature and humidity control device shown in Figs. 1 to 9, the spray nozzle group 15 as the humidity control means is disposed, but as shown in Fig. 11, the spray nozzle group may not be provided. 15, and instead, a steam generator 52 is disposed in the air flow path. The steam generator 52 is a device for supplying moisture to the air flow through the heater 14 and the cooler 16, and the heated electric heater 56 heats the pure water stored in the container 54 to generate steam. This heater 56 is controlled by the temperature control unit 27.

亦即在濕度控制器27,應風扇12所吐出空氣流中之濕度與目標濕度之差異,調整蒸氣發生器52之加熱器56之加熱量,調整風扇12所吐出空氣流中濕度於目標濕度。That is, in the humidity controller 27, the amount of heating of the heater 56 of the steam generator 52 is adjusted by the difference between the humidity in the air flow discharged from the fan 12 and the target humidity, and the humidity in the air flow discharged from the fan 12 is adjusted to the target humidity.

如此,就是使用做為濕度控制手段的蒸氣發生器52,在第11圖所示溫度與濕度控制裝置中,可以節約能量。Thus, the steam generator 52 as a humidity control means is used, and in the temperature and humidity control means shown in Fig. 11, energy can be saved.

亦即利用熱泵機構的設置,藉經提高加熱能力的加熱器14加熱於空氣流,以提高空氣流中之露點,保留多量水分於空氣流中。That is, by using the arrangement of the heat pump mechanism, the heater 14 having improved heating capability is heated to the air flow to increase the dew point in the air flow and retain a large amount of moisture in the air flow.

構成第11圖所示之溫度與濕度控制裝置的構成部材中,與第1圖所示溫度與濕度控制裝置構成部材同一之部材,賦予與第1圖之符號同一標號,而省略詳細說明。In the components constituting the temperature and humidity control device shown in Fig. 11, the same components as those of the components of the temperature and humidity control device shown in Fig. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

再者,如第12圖所示,亦可分別配管於冷凝器26與吸熱器32而供水。例如經由配管33供水予冷凝器26,而經由配管32a供水予吸熱器32,如此通過冷凝器26與吸熱器32之水共同排出於系統外。Further, as shown in Fig. 12, the condenser 26 and the heat absorber 32 may be separately supplied and supplied with water. For example, the water is supplied to the condenser 26 via the pipe 33, and is supplied to the heat absorber 32 via the pipe 32a, and thus discharged through the condenser 26 and the water of the heat absorber 32 to the outside of the system.

構成第12圖所示之溫度與濕度控制裝置的構成部材中,與第1圖所示溫度與濕度控制裝置構成部材同一之部材,賦予與第1圖之符號同一標號,而省略詳細說明。In the components of the temperature and humidity control device shown in Fig. 12, the same components as those of the components of the temperature and humidity control device shown in Fig. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

又,亦可分別以不同配管供水於冷凝器26與純水器35。例如供應通常之水予冷凝器26,而供應純水予純水器35。Further, the condenser 26 and the water purifier 35 may be supplied with water through different pipes. For example, normal water is supplied to the condenser 26, and pure water is supplied to the water purifier 35.

此外,第1圖~第12圖所示之溫度與濕度控制裝置所用濕度控制手段,可用較溫度與濕度控制對象空氣更乾燥之空氣,與水分供給機構併用,或不用水分供給機構而代之以將乾燥空氣吹入空氣流路。In addition, the humidity control means used in the temperature and humidity control device shown in Figs. 1 to 12 can be used in combination with the water supply mechanism or the water supply mechanism instead of the moisture supply means. Dry air is blown into the air flow path.

以上所說明之第1圖~第12圖所示溫度與濕度控制裝置所採用之溫度與濕度調整對象之空氣流的溫度與濕度調整方法,其可同時調整溫度與濕度之範圍寬廣,且有節能的作用與效果。The method for adjusting the temperature and humidity of the air flow to be used for the temperature and humidity adjustment by the temperature and humidity control device shown in Figs. 1 to 12 described above can adjust the temperature and humidity range at the same time, and has energy saving. The role and effect.

這樣的溫度調整方法中,對依序通過直接供應壓縮機18所壓縮加熱之高溫第一熱媒的加熱器14,與將第一熱媒殘餘部以冷凝器26冷卻後,藉膨脹閥28斷熱膨脹更加冷卻而供應之冷卻器16的空氣流,以三向閥20或二向閥38a、38b,變更分配於加熱器14與冷卻器16之分配率而調整空氣流於所定溫度,同時藉設於空氣流之通過流路之濕度控制機構,調整空氣流於所定濕度。In such a temperature adjustment method, the heater 14 of the high-temperature first heat medium which is compressed and heated by the compressor 18 is directly supplied, and the remaining portion of the first heat medium is cooled by the condenser 26, and then the expansion valve 28 is broken. The air flow of the cooler 16 supplied by the thermal expansion is further cooled, and the distribution ratio of the heater 14 and the cooler 16 is changed by the three-way valve 20 or the two-way valves 38a and 38b to adjust the air flow to the predetermined temperature while borrowing The air flow is controlled by a humidity control mechanism of the flow path to adjust the air flow to a predetermined humidity.

再者,將通過加熱器14的第一熱媒,以膨脹閥34斷熱膨脹而冷卻,使其通過具備從外部熱源之水或空氣吸熱的吸熱器32之熱泵機構後,與通過冷卻器16的第一熱媒共同返回壓縮機18。Further, the first heat medium passing through the heater 14 is cooled and expanded by the expansion valve 34 to be cooled by a heat pump mechanism having a heat absorber 32 that absorbs heat from water or air of an external heat source, and then passed through the cooler 16 The first heat medium is returned to the compressor 18 in common.

以上所說明之溫度與濕度控制裝置及溫度與濕度控制方法,係使用於半導體裝置製造工程等精密加工領域之乾淨室內的溫度與濕度控制用,但當然亦可應用於其他工程領域之乾淨室內的溫度與濕度控制。The temperature and humidity control device and the temperature and humidity control method described above are used for temperature and humidity control in a clean room in the field of precision machining such as semiconductor device manufacturing engineering, but can of course be applied to clean rooms in other engineering fields. Temperature and humidity control.

又以上所說明的溫度與濕度控制裝置及溫度與濕度控制方法,還可應用於其他領域,例如塗裝室、太陽能模擬器、印刷基板儲藏室、電子顯微鏡、打錠機、三次元測定器、色層譜、繪圖室、曝光裝置、旋塗裝置、液晶玻璃基板、篩網印刷機、畫像診斷裝置、水泥養護、鑄模、射出成形機、細胞培養、植物栽培、食品保存與熟成、DNA固定化等領域等的溫度與濕度調整用。The temperature and humidity control device and the temperature and humidity control method described above can also be applied to other fields, such as a painting room, a solar simulator, a printed substrate storage room, an electron microscope, a tableting machine, a three-dimensional measuring device, Chromatography, drawing room, exposure apparatus, spin coating apparatus, liquid crystal glass substrate, screen printing machine, image diagnostic apparatus, cement curing, mold, injection molding machine, cell culture, plant cultivation, food preservation and ripening, DNA fixation Temperature and humidity adjustment for fields such as chemistry.

10...空間單元10. . . Space unit

12...風扇12. . . fan

14...加熱器14. . . Heater

15...噴霧噴嘴群15. . . Spray nozzle group

15a...噴霧噴嘴15a. . . Spray nozzle

16...冷卻器16. . . Cooler

17...水槽17. . . sink

18...壓縮機18. . . compressor

19...幫浦19. . . Pump

20...比例三向閥20. . . Proportional three-way valve

21...供應水配管twenty one. . . Supply water piping

22...溫度控制部twenty two. . . Temperature control department

23...控制閥twenty three. . . Control valve

24...溫度感知器twenty four. . . Temperature sensor

25...配管25. . . Piping

26...冷凝器26. . . Condenser

27...濕度控制部27. . . Humidity control department

28...膨脹閥28. . . Expansion valve

29...濕度感知器29. . . Humidity sensor

30...第一熱媒用配管30. . . First heat medium piping

31...配管31. . . Piping

32...吸熱器32. . . Heat sink

32a...配管32a. . . Piping

33...配管33. . . Piping

34...膨脹閥34. . . Expansion valve

35...純水器35. . . Water purifier

36...積存器36. . . Accumulator

37...純水供應配管37. . . Pure water supply piping

39...控制閥39. . . Control valve

40...控制閥40. . . Control valve

40a...閥部40a. . . Valve department

40b...閥體40b. . . Valve body

40c...彈簧40c. . . spring

40d...伸縮袋40d. . . Telescopic bag

38a、38b...二向閥38a, 38b. . . Two-way valve

41...閥41. . . valve

42...反向器42. . . Inverter

44...COMP控制部44. . . COMP Control Department

50...風扇50. . . fan

52...蒸氣發生器52. . . Steam generator

54...容器54. . . container

56...加熱電熱器56. . . Heating electric heater

100...壓縮機100. . . compressor

102...三向閥102. . . Three-way valve

104...冷凝器104. . . Condenser

106...膨脹閥106. . . Expansion valve

108...冷卻器108. . . Cooler

110...加熱器110. . . Heater

112...風扇112. . . fan

第1圖為說明本發明溫度與濕度控制裝置一例之概略圖。Fig. 1 is a schematic view showing an example of a temperature and humidity control device of the present invention.

第2圖為第1圖所示溫度與濕度控制裝置所用控制閥40之內部構造說明圖。Fig. 2 is an explanatory view showing the internal structure of the control valve 40 used in the temperature and humidity control device shown in Fig. 1.

第3A圖~第3D圖為第1圖所示加熱器14、冷卻器16及噴霧噴嘴群15配列之說明圖。3A to 3D are explanatory views showing the arrangement of the heater 14, the cooler 16, and the spray nozzle group 15 shown in Fig. 1.

第4圖為第1圖所示溫度與濕度控制裝置可用之其他分配機構之說明圖。Fig. 4 is an explanatory view of another distribution mechanism usable for the temperature and humidity control device shown in Fig. 1.

第5圖為第4圖所示分配機構所用二向閥流量特性曲線圖。Figure 5 is a graph showing the flow characteristics of the two-way valve used in the distribution mechanism shown in Figure 4.

第6A圖及第6B圖為第1圖所示溫度與濕度控制裝置在冷卻側時節能原理說明圖。Fig. 6A and Fig. 6B are explanatory diagrams of the principle of energy saving when the temperature and humidity control device shown in Fig. 1 is on the cooling side.

第7A圖及第7B圖為第1圖所示溫度與濕度控制裝置在加熱側時節能原理說明圖。Fig. 7A and Fig. 7B are explanatory diagrams of the principle of energy saving when the temperature and humidity control device shown in Fig. 1 is on the heating side.

第8圖為說明本發明之溫度與濕度控制裝置其他實施例之概略圖。Figure 8 is a schematic view showing another embodiment of the temperature and humidity control device of the present invention.

第9圖為第8圖所示溫度與濕度控制裝置依溫度控制部22與COMP控制部44所進行控制步驟的流程圖。Fig. 9 is a flow chart showing the control procedures of the temperature and humidity control device shown in Fig. 8 by the temperature control unit 22 and the COMP control unit 44.

第10圖為本發明之溫度與濕度控制裝置另一實施例概略圖。Figure 10 is a schematic view showing another embodiment of the temperature and humidity control device of the present invention.

第11圖為本發明之溫度與濕度控制裝置另一實施例概略圖。Figure 11 is a schematic view showing another embodiment of the temperature and humidity control device of the present invention.

第12圖為本發明之溫度與濕度控制裝置另一實施例概略圖。Figure 12 is a schematic view showing another embodiment of the temperature and humidity control apparatus of the present invention.

第13圖為傳統溫度與濕度控制裝置之概略圖。Figure 13 is a schematic diagram of a conventional temperature and humidity control device.

10...空間單元10. . . Space unit

12...風扇12. . . fan

14...加熱器14. . . Heater

15...噴霧噴嘴群15. . . Spray nozzle group

15a...噴霧噴嘴15a. . . Spray nozzle

16...冷卻器16. . . Cooler

17...水槽17. . . sink

18...壓縮機18. . . compressor

19...幫浦19. . . Pump

20...比例三向閥20. . . Proportional three-way valve

21...供應水配管twenty one. . . Supply water piping

22...溫度控制部twenty two. . . Temperature control department

23...控制閥twenty three. . . Control valve

24...溫度感知器twenty four. . . Temperature sensor

25...配管25. . . Piping

26...冷凝器26. . . Condenser

27...濕度控制部27. . . Humidity control department

28...膨脹閥28. . . Expansion valve

29...濕度感知器29. . . Humidity sensor

30...第一熱媒用配管30. . . First heat medium piping

31...配管31. . . Piping

32...吸熱器32. . . Heat sink

33...配管33. . . Piping

34...膨脹閥34. . . Expansion valve

35...純水器35. . . Water purifier

36...積存器36. . . Accumulator

37...純水供應配管37. . . Pure water supply piping

39...控制閥39. . . Control valve

Claims (3)

一種溫度與濕度控制裝置,其具備有以壓縮機進行了壓縮加熱之高溫第一熱媒的一部供應予加熱機構的加熱流路,該高溫第一熱媒之殘餘部以冷凝機構冷卻後藉第一膨脹機構以斷熱方式膨脹,並進一步冷卻後供應予冷卻機構的冷卻流路;及,該高溫第一熱媒經分配而通過各該加熱流路與冷卻流路之溫度與濕度控制裝置第一熱媒被再供應予壓縮機的循環回路;將通過該加熱機構及冷卻機構之做為溫度與濕度控制對象的氣體調整成所定溫度及濕度之溫度與濕度調整裝置中設有:將該壓縮機所吐出高溫第一熱媒之一部份分配於該加熱流路側,同時將該高溫第一熱媒之殘餘部份分配於冷卻流路側,並設有可變更分配予該加熱流路與冷卻流路之高溫第一熱媒分配比率的分配機構;為提高該加熱流路之加熱能力,藉所述加熱機構放熱,經冷卻後以第二膨脹機構作斷熱膨脹而進一步冷卻的第一熱媒,具有從外部熱源的第二熱媒吸熱之吸熱機能的熱泵機構; 控制該分配機構,以調整該加熱流路與冷卻流路所配得之高溫第一熱媒之分配比率,將通過該加熱機構與冷卻機構之溫度與濕度調整對象之氣體控制於所定溫度的溫度控制部;以及將通過該加熱機構及冷卻機構之氣體控制於所定濕度的濕度控制機構;控制壓縮機轉速的轉速控制機構;以及使溫度控制部所控制之高溫第一熱媒分配比率,能成為加熱機構所加於溫度與濕度控制對象氣體之加熱量與冷卻機構所加於溫度與濕度控制對象氣體之冷卻量中,其互相抵消之熱量為較少之分配比率,而透過該轉速控制機構,設立變更壓縮機轉速用之壓縮機控制部。 A temperature and humidity control device comprising a heating flow path for supplying a preheating mechanism to a high temperature first heat medium compressed and heated by a compressor, wherein a residual portion of the high temperature first heat medium is cooled by a condensing mechanism The first expansion mechanism is expanded in a heat-dissipating manner, and further cooled and supplied to the cooling flow path of the cooling mechanism; and the high-temperature first heat medium is distributed and passes through the temperature and humidity control devices of the heating flow path and the cooling flow path. The first heat medium is re-supplied to the circulation circuit of the compressor; and the temperature and humidity adjustment device that adjusts the temperature and humidity control by the heating mechanism and the cooling mechanism to a predetermined temperature and humidity is provided in the device: One part of the first heat medium discharged from the compressor is distributed on the heating flow path side, and the remaining portion of the high temperature first heat medium is distributed on the side of the cooling flow path, and is provided with a changeable distribution to the heating flow path. a distribution mechanism for the high temperature first heat medium distribution ratio of the cooling flow path; to increase the heating capacity of the heating flow path, the heat is radiated by the heating mechanism, and after cooling, the second expansion mechanism is Adiabatic expansion of the further cooled first heat medium, the heat pump mechanism having a second heat absorbing function of the heat medium absorbs heat from an external heat source; Controlling the distribution mechanism to adjust a distribution ratio of the high temperature first heat medium to which the heating flow path and the cooling flow path are arranged, and controlling a temperature of the temperature and humidity adjustment target by the heating mechanism and the cooling mechanism to a temperature of a predetermined temperature a control unit; a humidity control mechanism that controls the gas passing through the heating mechanism and the cooling mechanism to a predetermined humidity; a rotation speed control mechanism that controls the rotation speed of the compressor; and a high temperature first heat medium distribution ratio controlled by the temperature control unit The amount of heating applied by the heating mechanism to the temperature and humidity control target gas and the cooling amount of the cooling mechanism applied to the temperature and humidity control target gas are offset by a small distribution ratio, and the rotation speed control mechanism is passed through the rotation speed control mechanism. Establish a compressor control unit for changing the compressor speed. 如申請專利範圍第1項之溫度與濕度控制裝置,其中所述壓縮機控制部中,為了使高溫第一熱媒分配比率,於溫度與濕度控制對象氣體在加熱側時,高溫第一熱媒中有95~85%分配於加熱機構,而殘餘高溫第一熱媒中5~15%分配於冷卻機構,另外,該溫度與濕度控制對象氣體在冷卻側時,高溫第一熱媒中有95~85%分配於冷卻機構,而殘餘高溫第一熱媒中5~15%分配於加熱機構,透過轉速控制機構控制壓縮機的轉速。 The temperature and humidity control device according to claim 1, wherein in the compressor control unit, in order to set a high temperature first heat medium distribution ratio, when the temperature and humidity control target gas is on the heating side, the high temperature first heat medium 95~85% of the heat is distributed to the heating mechanism, and 5~15% of the residual high temperature first heat medium is distributed to the cooling mechanism. In addition, when the temperature and humidity control target gas is on the cooling side, there is 95 in the high temperature first heat medium. ~85% is distributed to the cooling mechanism, and 5~15% of the residual high temperature first heat medium is distributed to the heating mechanism, and the rotation speed control mechanism controls the rotation speed of the compressor. 如申請專利範圍第1項或第2項之溫度與濕度控制裝置,其中所述轉速控制機構,為反相器。The temperature and humidity control device according to claim 1 or 2, wherein the rotation speed control mechanism is an inverter.
TW98111989A 2008-04-10 2009-04-10 Temperature and humidity controller and method for controlling temperature and humidity TWI468632B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008102339 2008-04-10

Publications (2)

Publication Number Publication Date
TW200949175A TW200949175A (en) 2009-12-01
TWI468632B true TWI468632B (en) 2015-01-11

Family

ID=41161907

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98111989A TWI468632B (en) 2008-04-10 2009-04-10 Temperature and humidity controller and method for controlling temperature and humidity

Country Status (5)

Country Link
JP (2) JP5343231B2 (en)
KR (1) KR101516772B1 (en)
CN (1) CN101990617B (en)
TW (1) TWI468632B (en)
WO (1) WO2009125776A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5296655B2 (en) * 2009-10-23 2013-09-25 株式会社日立ハイテクノロジーズ Gas temperature and humidity control method and gas supply device
JP5327636B2 (en) * 2009-11-30 2013-10-30 オリオン機械株式会社 Temperature and humidity control device
JP5568728B2 (en) * 2009-12-21 2014-08-13 オリオン機械株式会社 Temperature / humidity adjusting device and temperature / humidity adjusting method
TWI495871B (en) * 2011-11-04 2015-08-11 Grand Mate Co Ltd Humidity detection device and detection method thereof
JP6047726B2 (en) * 2011-12-12 2016-12-21 オリオン機械株式会社 Temperature and humidity control device
WO2013114936A1 (en) * 2012-02-01 2013-08-08 国立大学法人 東京大学 Distillation device and distillation method
EP2762793A1 (en) * 2013-02-01 2014-08-06 Technische Hochshule Mittelhessen Device for regulating air humidity
CN104406321B (en) * 2014-11-28 2016-09-21 烟台大学 A kind of heat supply humidification, cooling one heat pump assembly
CN104864536B (en) * 2015-06-23 2017-05-03 向君 Efficient energy-saving multi-stage heat and humidity treatment air conditioning device and treatment method thereof
CN105407688A (en) * 2015-10-24 2016-03-16 无锡商业职业技术学院 Fully-closed intelligent electric control cabinet cooling system
JP6461073B2 (en) * 2016-12-09 2019-01-30 ダイキン工業株式会社 Humidifier
US11491502B2 (en) * 2017-03-27 2022-11-08 Toshiba, Mitsubishi-Electric Industrial Systems Corporation Two fluid spray equipment
AT521086B1 (en) * 2018-03-28 2020-02-15 Avl List Gmbh Conditioning device for regulating a gaseous or
CN109273742B (en) * 2018-09-27 2020-06-09 德州新动能铁塔发电有限公司 Air supply system of methanol-water reforming hydrogen production fuel cell

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197048A (en) * 1975-02-22 1976-08-26
JPS63259707A (en) * 1987-04-16 1988-10-26 Tabai Esupetsuku Kk Method and device for obtaining constant temperature and constant humidity
JPH09189460A (en) * 1996-01-09 1997-07-22 Mitsubishi Heavy Ind Ltd Refrigerating device
JP2002048380A (en) * 2000-08-01 2002-02-15 Yamatake Corp Air conditioner and method therefor
JP2005282938A (en) * 2004-03-29 2005-10-13 Orion Mach Co Ltd Cooling device
JP2006207856A (en) * 2005-01-25 2006-08-10 Sanki Eng Co Ltd Air conditioner for conditioning outside air

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0728545Y2 (en) * 1986-10-18 1995-06-28 ダイキン工業株式会社 Liquid temperature controller
JP2898866B2 (en) * 1993-11-12 1999-06-02 鹿島建設株式会社 Double coil heat pump package air conditioner
TW234736B (en) * 1993-12-16 1994-11-21 Orion Machinery Co Ltd Construction of dehumidifier for cooled type compressed air
JP3615301B2 (en) * 1996-03-28 2005-02-02 西淀空調機株式会社 Heat pump for hot water supply
JPH10300126A (en) * 1997-04-21 1998-11-13 Orion Mach Co Ltd Apparatus for supplying air of constant temperature and constant humidity
JP2003269805A (en) 2002-03-13 2003-09-25 Mitsubishi Heavy Ind Ltd Marine refrigerating unit
JP2006343052A (en) * 2005-06-10 2006-12-21 Hitachi Ltd Simultaneous cooling and heating multi-air conditioner
JP4954665B2 (en) * 2005-10-19 2012-06-20 三機工業株式会社 Proportional control method and apparatus for two-fluid water spray nozzle.
CN101558270B (en) * 2006-12-27 2011-07-20 奥利安机械股份有限公司 Device for precise temperature control

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197048A (en) * 1975-02-22 1976-08-26
JPS63259707A (en) * 1987-04-16 1988-10-26 Tabai Esupetsuku Kk Method and device for obtaining constant temperature and constant humidity
JPH09189460A (en) * 1996-01-09 1997-07-22 Mitsubishi Heavy Ind Ltd Refrigerating device
JP2002048380A (en) * 2000-08-01 2002-02-15 Yamatake Corp Air conditioner and method therefor
JP2005282938A (en) * 2004-03-29 2005-10-13 Orion Mach Co Ltd Cooling device
JP2006207856A (en) * 2005-01-25 2006-08-10 Sanki Eng Co Ltd Air conditioner for conditioning outside air

Also Published As

Publication number Publication date
CN101990617A (en) 2011-03-23
TW200949175A (en) 2009-12-01
KR20110016861A (en) 2011-02-18
CN101990617B (en) 2013-11-27
WO2009125776A1 (en) 2009-10-15
JPWO2009125776A1 (en) 2011-08-04
JP2013167437A (en) 2013-08-29
JP5343231B2 (en) 2013-11-13
KR101516772B1 (en) 2015-05-04

Similar Documents

Publication Publication Date Title
TWI468632B (en) Temperature and humidity controller and method for controlling temperature and humidity
KR101453924B1 (en) Device for precise temperature control
KR20180123904A (en) Humidity control device using humidity material
JP5205601B2 (en) Temperature and humidity control device
JP5099843B2 (en) Temperature and humidity control device
JP4960292B2 (en) Temperature and humidity control device
JP2010007961A (en) Temperature-humidity controller
JP4865758B2 (en) Temperature and humidity control device
JP5568728B2 (en) Temperature / humidity adjusting device and temperature / humidity adjusting method
JP2011021830A (en) Temperature and humidity control device
JP2009115442A (en) Temperature adjusting device
JP2009300049A (en) Temperature and humidity adjusting device
JP2010007962A (en) Temperature controller
JP2009122357A (en) Device for regulating temperature of plate-like member
JP6047726B2 (en) Temperature and humidity control device
JP2010007955A (en) Temperature controller
JP6047725B2 (en) Temperature and humidity control device
JP2008309465A (en) Temperature control device
JP2009293834A (en) Temperature and humidity regulator
JP2010236700A (en) Temperature and humidity control device
JP2010255879A (en) Temperature adjusting device
JP2009293833A (en) Temperature and humidity regulator
JP2010185616A (en) Temperature/humidity regulating device
JP5526359B2 (en) Temperature control blower
JPH02122162A (en) Refrigerator