TWI466349B - 有機薄膜電晶體用感光性樹脂組成物 - Google Patents

有機薄膜電晶體用感光性樹脂組成物 Download PDF

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Publication number
TWI466349B
TWI466349B TW097123872A TW97123872A TWI466349B TW I466349 B TWI466349 B TW I466349B TW 097123872 A TW097123872 A TW 097123872A TW 97123872 A TW97123872 A TW 97123872A TW I466349 B TWI466349 B TW I466349B
Authority
TW
Taiwan
Prior art keywords
thin film
film transistor
organic thin
photosensitive resin
resin composition
Prior art date
Application number
TW097123872A
Other languages
English (en)
Chinese (zh)
Other versions
TW200908407A (en
Inventor
Byung Uk Kim
Hyoc Min Youn
Ki Hyuk Koo
Tae Hoon Yeo
Joo Pyo Yun
Sang Gak Choi
Su Youn Choi
Ho Jin Lee
Dae Jung Jeong
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200908407A publication Critical patent/TW200908407A/zh
Application granted granted Critical
Publication of TWI466349B publication Critical patent/TWI466349B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Thin Film Transistor (AREA)
TW097123872A 2007-06-29 2008-06-26 有機薄膜電晶體用感光性樹脂組成物 TWI466349B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070065379A KR101399281B1 (ko) 2007-06-29 2007-06-29 유기박막 트랜지스터용 감광성 수지 조성물

Publications (2)

Publication Number Publication Date
TW200908407A TW200908407A (en) 2009-02-16
TWI466349B true TWI466349B (zh) 2014-12-21

Family

ID=40197261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097123872A TWI466349B (zh) 2007-06-29 2008-06-26 有機薄膜電晶體用感光性樹脂組成物

Country Status (3)

Country Link
KR (1) KR101399281B1 (ko)
CN (1) CN101334587B (ko)
TW (1) TWI466349B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451611B (zh) * 2011-05-19 2014-09-01 Au Optronics Corp 有機發光裝置
KR102219109B1 (ko) 2014-01-22 2021-02-24 삼성디스플레이 주식회사 포토레지스트 조성물, 이를 이용한 패턴의 형성 방법 및 박막 트랜지스터 기판의 제조 방법
US10199548B2 (en) * 2015-03-27 2019-02-05 Toray Industries, Inc. Photosensitive resin composition for thin film transistors, cured film, thin film transistor, liquid crystal display device or organic electroluminescent display device, method for producing cured film, method for manufacturing thin film transistor, and method for manufacturing liquid crystal display device or organic electroluminescent display device
KR102134633B1 (ko) 2016-11-25 2020-07-16 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치
GB2568516A (en) * 2017-11-17 2019-05-22 Flexenable Ltd Organic semiconductor devices
TWI841777B (zh) * 2019-08-27 2024-05-11 日商富士軟片股份有限公司 硬化膜的製造方法、積層體的製造方法及電子元件的製造方法
KR20230114702A (ko) 2022-01-25 2023-08-01 주식회사 이엔에프테크놀로지 신규한 중합체 및 이를 포함하는 감광성 수지 조성물
KR20230115617A (ko) 2022-01-27 2023-08-03 주식회사 이엔에프테크놀로지 저온 경화성 감광성 수지 조성물 및 이로부터 제조된 경화막

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW468091B (en) * 1997-09-05 2001-12-11 Kansai Paint Co Ltd Visible light-sensitive compositions and pattern formation process
TW482943B (en) * 1996-04-25 2002-04-11 Fuji Photo Film Co Ltd Positive working photosensitive composition
US6420476B1 (en) * 1998-04-16 2002-07-16 Tdk Corporation Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom
US20040132855A1 (en) * 2002-10-16 2004-07-08 Kohl Paul A. Polymers, methods of use thereof, and methods of decomposition thereof
WO2005109099A1 (ja) * 2004-05-07 2005-11-17 Hitachi Chemical Dupont Microsystems Ltd. ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2031564A1 (en) * 1989-12-18 1991-06-19 Leonard E. Bogan, Jr. Method of preparing high glass transition temperature novolak resin for use in high resolution photoresist compositions
JPH06102662A (ja) * 1991-10-14 1994-04-15 Sannopuko Kk 感光性樹脂組成物
JPH1124271A (ja) * 1997-06-30 1999-01-29 Kurarianto Japan Kk 高耐熱性放射線感応性レジスト組成物
JP2000194130A (ja) * 1998-12-25 2000-07-14 Clariant (Japan) Kk 感光性樹脂組成物
US20050279995A1 (en) * 2004-06-21 2005-12-22 Samsung Electronics Co., Ltd. Composition for preparing organic insulating film and organic insulating film prepared from the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW482943B (en) * 1996-04-25 2002-04-11 Fuji Photo Film Co Ltd Positive working photosensitive composition
TW468091B (en) * 1997-09-05 2001-12-11 Kansai Paint Co Ltd Visible light-sensitive compositions and pattern formation process
US6420476B1 (en) * 1998-04-16 2002-07-16 Tdk Corporation Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom
US20040132855A1 (en) * 2002-10-16 2004-07-08 Kohl Paul A. Polymers, methods of use thereof, and methods of decomposition thereof
EP1551906A2 (en) * 2002-10-16 2005-07-13 Georgia Tech Research Corporation Polymers, methods of use thereof, and methods of decomposition thereof
WO2005109099A1 (ja) * 2004-05-07 2005-11-17 Hitachi Chemical Dupont Microsystems Ltd. ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品

Also Published As

Publication number Publication date
KR101399281B1 (ko) 2014-05-26
CN101334587B (zh) 2014-04-09
KR20090001178A (ko) 2009-01-08
TW200908407A (en) 2009-02-16
CN101334587A (zh) 2008-12-31

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