TWI465539B - 粘著劑組成物及表面保護膜 - Google Patents

粘著劑組成物及表面保護膜 Download PDF

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Publication number
TWI465539B
TWI465539B TW102119765A TW102119765A TWI465539B TW I465539 B TWI465539 B TW I465539B TW 102119765 A TW102119765 A TW 102119765A TW 102119765 A TW102119765 A TW 102119765A TW I465539 B TWI465539 B TW I465539B
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TW
Taiwan
Prior art keywords
meth
acrylate
group
weight
compound
Prior art date
Application number
TW102119765A
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English (en)
Chinese (zh)
Other versions
TW201406899A (zh
Inventor
長倉毅
島口龍介
長谷川良
Original Assignee
藤森工業股份有限公司
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Publication date
Application filed by 藤森工業股份有限公司 filed Critical 藤森工業股份有限公司
Publication of TW201406899A publication Critical patent/TW201406899A/zh
Application granted granted Critical
Publication of TWI465539B publication Critical patent/TWI465539B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW102119765A 2012-06-20 2013-06-04 粘著劑組成物及表面保護膜 TWI465539B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012138575A JP5877129B2 (ja) 2012-06-20 2012-06-20 粘着剤組成物及び表面保護フィルム

Publications (2)

Publication Number Publication Date
TW201406899A TW201406899A (zh) 2014-02-16
TWI465539B true TWI465539B (zh) 2014-12-21

Family

ID=49892942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102119765A TWI465539B (zh) 2012-06-20 2013-06-04 粘著劑組成物及表面保護膜

Country Status (4)

Country Link
JP (1) JP5877129B2 (cg-RX-API-DMAC7.html)
KR (1) KR101443136B1 (cg-RX-API-DMAC7.html)
CN (1) CN103509503B (cg-RX-API-DMAC7.html)
TW (1) TWI465539B (cg-RX-API-DMAC7.html)

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TWI568812B (zh) * 2013-06-19 2017-02-01 Ｌｇ化學股份有限公司 壓敏性黏著劑組成物
JP6243300B2 (ja) * 2014-07-03 2017-12-06 藤森工業株式会社 粘着剤組成物及び表面保護フィルム
WO2016104510A1 (ja) * 2014-12-24 2016-06-30 東洋インキＳｃホールディングス株式会社 接着剤組成物および積層体
JP6804843B2 (ja) * 2015-01-30 2020-12-23 日東電工株式会社 セパレータ付き光学用表面保護フィルム
WO2016121875A1 (ja) * 2015-01-30 2016-08-04 日東電工株式会社 セパレータ付き光学用表面保護フィルム
KR20160109180A (ko) 2015-03-10 2016-09-21 동우 화인켐 주식회사 아크릴계 보호필름, 이를 포함하는 편광판 및 액정표시장치
EP3467068A4 (en) * 2016-06-06 2019-11-27 Showa Denko K.K. LIQUID COMPOSITION AND LIQUID COMPOSITION MANUFACTURING METHOD
JP6580540B2 (ja) * 2016-09-28 2019-09-25 藤森工業株式会社 粘着剤組成物及び粘着フィルム
WO2021060796A1 (ko) * 2019-09-27 2021-04-01 주식회사 엘지화학 점착제 조성물, 이를 이용하여 제조된 편광판 및 디스플레이 장치
JP7238057B2 (ja) * 2020-01-06 2023-03-13 藤森工業株式会社 粘着剤組成物
JP6876855B2 (ja) * 2020-06-16 2021-05-26 藤森工業株式会社 帯電防止表面保護フィルム用剥離フィルム
JP7671595B2 (ja) * 2021-02-22 2025-05-02 日東電工株式会社 粘着剤組成物および粘着テープ
KR102870378B1 (ko) * 2023-02-28 2025-10-13 동우 화인켐 주식회사 점착제 조성물 및 이로부터 형성된 점착 시트
CN117645686B (zh) * 2023-10-18 2024-08-16 皇冠新材料科技股份有限公司 丙烯酸酯聚合物、胶黏剂组合物、保护膜胶粘带及其应用

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TWI350302B (cg-RX-API-DMAC7.html) * 2006-03-27 2011-10-11 Nitto Denko Corp

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JP4776272B2 (ja) * 2004-05-20 2011-09-21 サイデン化学株式会社 粘着剤用重合体組成物、表面保護フィルム用粘着剤組成物および表面保護フィルム
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Also Published As

Publication number Publication date
KR101443136B1 (ko) 2014-09-22
JP2014001332A (ja) 2014-01-09
TW201406899A (zh) 2014-02-16
JP5877129B2 (ja) 2016-03-02
CN103509503A (zh) 2014-01-15
KR20130142919A (ko) 2013-12-30
CN103509503B (zh) 2015-10-14

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