TWI458039B - Device processor - Google Patents

Device processor Download PDF

Info

Publication number
TWI458039B
TWI458039B TW099145467A TW99145467A TWI458039B TW I458039 B TWI458039 B TW I458039B TW 099145467 A TW099145467 A TW 099145467A TW 99145467 A TW99145467 A TW 99145467A TW I458039 B TWI458039 B TW I458039B
Authority
TW
Taiwan
Prior art keywords
waffle
assembly
wafer
transfer
pack
Prior art date
Application number
TW099145467A
Other languages
English (en)
Chinese (zh)
Other versions
TW201133688A (en
Inventor
Hong-Jun Yoo
Woon-Joung Yoon
Original Assignee
Jt Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jt Corp filed Critical Jt Corp
Publication of TW201133688A publication Critical patent/TW201133688A/zh
Application granted granted Critical
Publication of TWI458039B publication Critical patent/TWI458039B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
TW099145467A 2009-12-24 2010-12-23 Device processor TWI458039B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090130840A KR101052726B1 (ko) 2009-12-24 2009-12-24 소자핸들러

Publications (2)

Publication Number Publication Date
TW201133688A TW201133688A (en) 2011-10-01
TWI458039B true TWI458039B (zh) 2014-10-21

Family

ID=44404448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099145467A TWI458039B (zh) 2009-12-24 2010-12-23 Device processor

Country Status (3)

Country Link
KR (1) KR101052726B1 (ko)
CN (1) CN102142386B (ko)
TW (1) TWI458039B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101291578B1 (ko) * 2011-09-14 2013-08-16 (주)제이티 플레이트픽업장치 및 그를 가지는 엘이디소자핸들러
CN108701633A (zh) * 2016-01-07 2018-10-23 宰体有限公司 移送工具模块以及具有该移送工具模块的元件处理器
KR101886163B1 (ko) * 2016-09-02 2018-08-07 (주)제이티 소자핸들러 및 그에 사용되는 캐리어테이프권취장치
KR20180083557A (ko) * 2017-01-13 2018-07-23 (주)제이티 소자핸들러
KR20240030836A (ko) * 2022-08-31 2024-03-07 (주)제이티 소자핸들러

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030086775A1 (en) * 2001-11-08 2003-05-08 Farhad Farassat Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine
US20080029904A1 (en) * 2006-08-02 2008-02-07 Soon Tatt Ow Yong Double-Sided Waffle Pack

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000088918A (ja) 1998-09-17 2000-03-31 Hitachi Ltd Ｉｃハンドラ
KR100395366B1 (ko) * 2000-12-27 2003-08-21 미래산업 주식회사 반도체 소자 테스트용 핸들러
KR100370846B1 (ko) * 2001-02-28 2003-02-05 앰코 테크놀로지 코리아 주식회사 반도체칩 수납용 와플팩
KR100428030B1 (ko) * 2001-09-12 2004-04-30 미래산업 주식회사 반도체 소자 테스트용 핸들러
US7956447B2 (en) * 2004-03-05 2011-06-07 Ziptronix, Inc. Wafer scale die handling
KR100899087B1 (ko) * 2007-08-09 2009-05-26 고병완 반도체 웨이퍼의 와플팩 트레이
KR20090020354A (ko) * 2007-08-23 2009-02-26 세크론 주식회사 테스트 핸들러

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030086775A1 (en) * 2001-11-08 2003-05-08 Farhad Farassat Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine
US20080029904A1 (en) * 2006-08-02 2008-02-07 Soon Tatt Ow Yong Double-Sided Waffle Pack

Also Published As

Publication number Publication date
KR101052726B1 (ko) 2011-08-01
CN102142386A (zh) 2011-08-03
TW201133688A (en) 2011-10-01
CN102142386B (zh) 2013-03-27
KR20110074011A (ko) 2011-06-30

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees