TWI458039B - Device processor - Google Patents
Device processor Download PDFInfo
- Publication number
- TWI458039B TWI458039B TW099145467A TW99145467A TWI458039B TW I458039 B TWI458039 B TW I458039B TW 099145467 A TW099145467 A TW 099145467A TW 99145467 A TW99145467 A TW 99145467A TW I458039 B TWI458039 B TW I458039B
- Authority
- TW
- Taiwan
- Prior art keywords
- waffle
- assembly
- wafer
- transfer
- pack
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090130840A KR101052726B1 (ko) | 2009-12-24 | 2009-12-24 | 소자핸들러 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201133688A TW201133688A (en) | 2011-10-01 |
TWI458039B true TWI458039B (zh) | 2014-10-21 |
Family
ID=44404448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099145467A TWI458039B (zh) | 2009-12-24 | 2010-12-23 | Device processor |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101052726B1 (ko) |
CN (1) | CN102142386B (ko) |
TW (1) | TWI458039B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101291578B1 (ko) * | 2011-09-14 | 2013-08-16 | (주)제이티 | 플레이트픽업장치 및 그를 가지는 엘이디소자핸들러 |
WO2017119786A1 (ko) * | 2016-01-07 | 2017-07-13 | (주)제이티 | 이송툴모듈 및 그를 가지는 소자핸들러 |
KR101886163B1 (ko) * | 2016-09-02 | 2018-08-07 | (주)제이티 | 소자핸들러 및 그에 사용되는 캐리어테이프권취장치 |
KR20180083557A (ko) * | 2017-01-13 | 2018-07-23 | (주)제이티 | 소자핸들러 |
KR20240030836A (ko) * | 2022-08-31 | 2024-03-07 | (주)제이티 | 소자핸들러 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030086775A1 (en) * | 2001-11-08 | 2003-05-08 | Farhad Farassat | Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine |
US20080029904A1 (en) * | 2006-08-02 | 2008-02-07 | Soon Tatt Ow Yong | Double-Sided Waffle Pack |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000088918A (ja) | 1998-09-17 | 2000-03-31 | Hitachi Ltd | Icハンドラ |
KR100395366B1 (ko) * | 2000-12-27 | 2003-08-21 | 미래산업 주식회사 | 반도체 소자 테스트용 핸들러 |
KR100370846B1 (ko) * | 2001-02-28 | 2003-02-05 | 앰코 테크놀로지 코리아 주식회사 | 반도체칩 수납용 와플팩 |
KR100428030B1 (ko) * | 2001-09-12 | 2004-04-30 | 미래산업 주식회사 | 반도체 소자 테스트용 핸들러 |
US7956447B2 (en) * | 2004-03-05 | 2011-06-07 | Ziptronix, Inc. | Wafer scale die handling |
KR100899087B1 (ko) * | 2007-08-09 | 2009-05-26 | 고병완 | 반도체 웨이퍼의 와플팩 트레이 |
KR20090020354A (ko) * | 2007-08-23 | 2009-02-26 | 세크론 주식회사 | 테스트 핸들러 |
-
2009
- 2009-12-24 KR KR1020090130840A patent/KR101052726B1/ko not_active IP Right Cessation
-
2010
- 2010-12-23 CN CN201010608445XA patent/CN102142386B/zh not_active Expired - Fee Related
- 2010-12-23 TW TW099145467A patent/TWI458039B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030086775A1 (en) * | 2001-11-08 | 2003-05-08 | Farhad Farassat | Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine |
US20080029904A1 (en) * | 2006-08-02 | 2008-02-07 | Soon Tatt Ow Yong | Double-Sided Waffle Pack |
Also Published As
Publication number | Publication date |
---|---|
KR20110074011A (ko) | 2011-06-30 |
CN102142386A (zh) | 2011-08-03 |
KR101052726B1 (ko) | 2011-08-01 |
TW201133688A (en) | 2011-10-01 |
CN102142386B (zh) | 2013-03-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |