TWI457062B - 多層印刷電路板之製造方法 - Google Patents

多層印刷電路板之製造方法 Download PDF

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Publication number
TWI457062B
TWI457062B TW097135183A TW97135183A TWI457062B TW I457062 B TWI457062 B TW I457062B TW 097135183 A TW097135183 A TW 097135183A TW 97135183 A TW97135183 A TW 97135183A TW I457062 B TWI457062 B TW I457062B
Authority
TW
Taiwan
Prior art keywords
insulating layer
circuit board
prepreg
plastic film
carbon dioxide
Prior art date
Application number
TW097135183A
Other languages
English (en)
Chinese (zh)
Other versions
TW200934344A (en
Inventor
Shigeo Nakamura
Seiichiro Ohashi
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW200934344A publication Critical patent/TW200934344A/zh
Application granted granted Critical
Publication of TWI457062B publication Critical patent/TWI457062B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Laser Beam Processing (AREA)
TW097135183A 2007-09-14 2008-09-12 多層印刷電路板之製造方法 TWI457062B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007239672 2007-09-14

Publications (2)

Publication Number Publication Date
TW200934344A TW200934344A (en) 2009-08-01
TWI457062B true TWI457062B (zh) 2014-10-11

Family

ID=40452077

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097135183A TWI457062B (zh) 2007-09-14 2008-09-12 多層印刷電路板之製造方法
TW103124517A TWI535355B (zh) 2007-09-14 2008-09-12 Manufacturing method of multilayer printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103124517A TWI535355B (zh) 2007-09-14 2008-09-12 Manufacturing method of multilayer printed circuit board

Country Status (5)

Country Link
JP (1) JP5532924B2 (fr)
KR (1) KR101464142B1 (fr)
CN (1) CN101803485B (fr)
TW (2) TWI457062B (fr)
WO (1) WO2009035071A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5685946B2 (ja) * 2010-01-22 2015-03-18 住友ベークライト株式会社 プリプレグの積層方法、プリント配線板の製造方法およびプリプレグのロール
TWI613124B (zh) * 2015-02-05 2018-02-01 Kodama Plastics Co Ltd 透明性優良耐化學藥品性吹塑積層容器
CN106793535A (zh) * 2015-11-20 2017-05-31 富泰华工业（深圳）有限公司 电路板丝网印刷方法
KR20210007978A (ko) 2018-05-09 2021-01-20 쇼와덴코머티리얼즈가부시끼가이샤 지지체 부착 층간 절연층용 수지 필름, 다층 프린트 배선판 및 다층 프린트 배선판의 제조 방법
CN109596557A (zh) * 2018-11-29 2019-04-09 健鼎（湖北）电子有限公司 决定无双氰胺材料除胶次数的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200264A (ja) * 1997-01-06 1998-07-31 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2001156453A (ja) * 1999-11-29 2001-06-08 Karentekku:Kk プリント配線板における埋め込みヴィアの形成方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3861537B2 (ja) * 1998-12-02 2006-12-20 味の素株式会社 接着フィルムの真空積層法
US6224965B1 (en) * 1999-06-25 2001-05-01 Honeywell International Inc. Microfiber dielectrics which facilitate laser via drilling
JP4300687B2 (ja) * 1999-10-28 2009-07-22 味の素株式会社 接着フィルムを用いた多層プリント配線板の製造法
JP2004349357A (ja) * 2003-05-21 2004-12-09 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP4811015B2 (ja) * 2005-12-21 2011-11-09 イビデン株式会社 プリント配線板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200264A (ja) * 1997-01-06 1998-07-31 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2001156453A (ja) * 1999-11-29 2001-06-08 Karentekku:Kk プリント配線板における埋め込みヴィアの形成方法

Also Published As

Publication number Publication date
CN101803485A (zh) 2010-08-11
KR20100058631A (ko) 2010-06-03
JP5532924B2 (ja) 2014-06-25
WO2009035071A1 (fr) 2009-03-19
TWI535355B (zh) 2016-05-21
CN101803485B (zh) 2012-01-25
KR101464142B1 (ko) 2014-11-25
TW201503791A (zh) 2015-01-16
TW200934344A (en) 2009-08-01
JPWO2009035071A1 (ja) 2010-12-24

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