TWI457062B - Method for manufacturing multilayer printed circuit board - Google Patents

Method for manufacturing multilayer printed circuit board Download PDF

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Publication number
TWI457062B
TWI457062B TW097135183A TW97135183A TWI457062B TW I457062 B TWI457062 B TW I457062B TW 097135183 A TW097135183 A TW 097135183A TW 97135183 A TW97135183 A TW 97135183A TW I457062 B TWI457062 B TW I457062B
Authority
TW
Taiwan
Prior art keywords
insulating layer
circuit board
prepreg
plastic film
carbon dioxide
Prior art date
Application number
TW097135183A
Other languages
Chinese (zh)
Other versions
TW200934344A (en
Inventor
Shigeo Nakamura
Seiichiro Ohashi
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW200934344A publication Critical patent/TW200934344A/en
Application granted granted Critical
Publication of TWI457062B publication Critical patent/TWI457062B/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Claims (8)

一種多層印刷電路板之製造方法，其特徵為包含在電路基板之兩面或單面上使厚度為20~100μm之預浸片熱硬化形成之絕緣層上，自密著在該絕緣層表面上之厚度為20~50μm之塑膠薄膜上照射碳酸氣體雷射，而形成盲孔之步驟。 A method for manufacturing a multilayer printed circuit board, characterized in that it comprises an insulating layer formed by thermally hardening a prepreg having a thickness of 20 to 100 μm on both sides or a single surface of a circuit substrate, and is adhered to the surface of the insulating layer. A step of forming a blind hole by irradiating a carbon dioxide gas on a plastic film having a thickness of 20 to 50 μm. 如申請專利範圍第1項之方法，其中係於塑膠薄膜上形成有預浸片之接著薄片係以該電路基板之兩面或單面與該預浸片面接觸之方式層合於該電路基板上，使預浸片熱硬化形成絕緣層後，自塑膠薄膜上照射碳酸氣體雷射。 The method of claim 1, wherein the pre-dip sheet formed on the plastic film is laminated on the circuit board in such a manner that two or one side of the circuit board is in surface contact with the prepreg sheet. After the prepreg is thermally hardened to form an insulating layer, a carbon dioxide gas laser is irradiated from the plastic film. 如申請專利範圍第1或2項之方法，其中該碳酸氣體雷射之能量為1mJ以上。 The method of claim 1 or 2, wherein the energy of the carbon dioxide gas is 1 mJ or more. 如申請專利範圍第1或2項之方法，其中該碳酸氣體雷射之能量為1~5mJ。 The method of claim 1 or 2, wherein the energy of the carbon dioxide gas is 1 to 5 mJ. 如申請專利範圍第1或2項之方法，其中該塑膠薄膜為聚對苯二甲酸乙二酯薄膜。 The method of claim 1 or 2, wherein the plastic film is a polyethylene terephthalate film. 如申請專利範圍第1或2項之方法，其中該預浸片係將熱硬化性樹脂組成物含浸在玻璃布中而成之預浸片。 The method of claim 1 or 2, wherein the prepreg is a prepreg obtained by impregnating a thermosetting resin composition with a glass cloth. 如申請專利範圍第1或2項之方法，其進而包含自絕緣層剝離塑膠薄膜之剝離步驟。 The method of claim 1 or 2, further comprising the step of stripping the plastic film from the insulating layer. 如申請專利範圍第1或2項之方法，其進而包含粗糙化處理絕緣層之粗糙化步驟、藉由電鍍在經粗糙化之 絕緣層表面上形成導體層之電鍍步驟，及在導體層上形成電路之電路形成步驟。 The method of claim 1 or 2, further comprising a roughening step of roughening the insulating layer, and roughening by electroplating A plating step of forming a conductor layer on the surface of the insulating layer, and a circuit forming step of forming a circuit on the conductor layer.
TW097135183A 2007-09-14 2008-09-12 Method for manufacturing multilayer printed circuit board TWI457062B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007239672 2007-09-14

Publications (2)

Publication Number Publication Date
TW200934344A TW200934344A (en) 2009-08-01
TWI457062B true TWI457062B (en) 2014-10-11

Family

ID=40452077

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097135183A TWI457062B (en) 2007-09-14 2008-09-12 Method for manufacturing multilayer printed circuit board
TW103124517A TWI535355B (en) 2007-09-14 2008-09-12 Manufacturing method of multilayer printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103124517A TWI535355B (en) 2007-09-14 2008-09-12 Manufacturing method of multilayer printed circuit board

Country Status (5)

Country Link
JP (1) JP5532924B2 (en)
KR (1) KR101464142B1 (en)
CN (1) CN101803485B (en)
TW (2) TWI457062B (en)
WO (1) WO2009035071A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5685946B2 (en) * 2010-01-22 2015-03-18 住友ベークライト株式会社 Prepreg lamination method, printed wiring board manufacturing method, and prepreg roll
TWI613124B (en) * 2015-02-05 2018-02-01 Kodama Plastics Co Ltd Excellent transparency and chemical resistance blown laminated container
CN106793535A (en) * 2015-11-20 2017-05-31 富泰华工业（深圳）有限公司 Circuit board method for printing screen
KR20210007978A (en) 2018-05-09 2021-01-20 쇼와덴코머티리얼즈가부시끼가이샤 Resin film for interlayer insulating layer with support, multilayer printed wiring board, and manufacturing method of multilayer printed wiring board
CN109596557A (en) * 2018-11-29 2019-04-09 健鼎（湖北）电子有限公司 The method for determining to remove glue number without dicyandiamide material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200264A (en) * 1997-01-06 1998-07-31 Ibiden Co Ltd Multilayer printed wiring board and manufacture thereof
JP2001156453A (en) * 1999-11-29 2001-06-08 Karentekku:Kk Forming method for embedded via at printed wiring board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3861537B2 (en) * 1998-12-02 2006-12-20 味の素株式会社 Vacuum lamination method of adhesive film
US6224965B1 (en) * 1999-06-25 2001-05-01 Honeywell International Inc. Microfiber dielectrics which facilitate laser via drilling
JP4300687B2 (en) * 1999-10-28 2009-07-22 味の素株式会社 Manufacturing method of multilayer printed wiring board using adhesive film
JP2004349357A (en) * 2003-05-21 2004-12-09 Matsushita Electric Works Ltd Method for manufacturing multilayer printed wiring board
JP4811015B2 (en) * 2005-12-21 2011-11-09 イビデン株式会社 Method for manufacturing printed wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10200264A (en) * 1997-01-06 1998-07-31 Ibiden Co Ltd Multilayer printed wiring board and manufacture thereof
JP2001156453A (en) * 1999-11-29 2001-06-08 Karentekku:Kk Forming method for embedded via at printed wiring board

Also Published As

Publication number Publication date
TW200934344A (en) 2009-08-01
CN101803485A (en) 2010-08-11
KR20100058631A (en) 2010-06-03
KR101464142B1 (en) 2014-11-25
TW201503791A (en) 2015-01-16
JPWO2009035071A1 (en) 2010-12-24
JP5532924B2 (en) 2014-06-25
TWI535355B (en) 2016-05-21
WO2009035071A1 (en) 2009-03-19
CN101803485B (en) 2012-01-25

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