TWI455992B - 無鹵素樹脂組成物及應用其之銅箔基板及印刷電路板 - Google Patents
無鹵素樹脂組成物及應用其之銅箔基板及印刷電路板 Download PDFInfo
- Publication number
- TWI455992B TWI455992B TW102106695A TW102106695A TWI455992B TW I455992 B TWI455992 B TW I455992B TW 102106695 A TW102106695 A TW 102106695A TW 102106695 A TW102106695 A TW 102106695A TW I455992 B TWI455992 B TW I455992B
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- Prior art keywords
- resin
- halogen
- resin composition
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Claims (10)
- 一種無鹵素樹脂組成物，其包含：(A)100重量份的環氧樹脂；(B)2~15重量份的二氨基二苯醚；以及(C)2~20重量份的氨基三嗪酚醛樹脂。
- 如申請專利範圍第1項所述的無鹵素樹脂組成物，其進一步包含雙氰胺。
- 如申請專利範圍第2項所述的無鹵素樹脂組成物，所述雙氰胺的含量為0.01至3重量份。
- 如申請專利範圍第1項所述的無鹵素樹脂組成物，其進一步包含10~100重量份的無鹵阻燃劑。
- 如申請專利範圍第4項所述的無鹵素樹脂組成物，所述無鹵阻燃劑選自下列組中的至少一者：雙酚二苯基磷酸酯、聚磷酸銨、對苯二酚-雙-(二苯基磷酸酯)、雙酚A-雙-(二苯基磷酸酯)、三(2-羧乙基)膦、三(氯異丙基)磷酸酯、磷酸三甲酯、甲基膦酸二甲酯、間苯二酚雙二甲苯基磷酸酯、磷腈、間苯甲基膦、聚磷酸三聚氰胺、三聚氰胺氰尿酸酯及三-羥乙基異氰尿酸酯、9,10-二氫-9-氧雜-10-磷菲-10-氧化物、含DOPO酚樹脂、含DOPO環氧樹脂及含DOPO-HQ環氧樹脂。
- 如申請專利範圍第1至5項中任一項所述的無鹵素樹脂組成物，其進一步包含選自下列組中的至少一者：無機填充物、硬化促進劑、矽烷偶合劑、增韌劑及溶劑。
- 如申請專利範圍第6項所述的無鹵素樹脂組成物，其進一步包含選自下列組中的至少一者或其改質物：酚樹脂、酚醛樹脂、聚苯醚樹脂、氰酸酯樹脂、 異氰酸酯樹脂、馬來醯亞胺、聚酯樹脂、苯乙烯樹脂、丁二烯樹脂、苯氧樹脂、聚醯胺樹脂及聚醯亞胺樹脂。
- 一種半固化膠片，其包含申請專利範圍第1至7項中任一項所述的無鹵素樹脂組成物。
- 一種銅箔基板，其包含申請專利範圍第8項所述的半固化膠片。
- 一種印刷電路板，其包含申請專利範圍第9項所述的銅箔基板。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210572175.0A CN103897338B (zh) | 2012-12-25 | 2012-12-25 | 无卤素树脂组合物及其应用 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201425446A TW201425446A (zh) | 2014-07-01 |
| TWI455992B true TWI455992B (zh) | 2014-10-11 |
Family
ID=50974976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102106695A TWI455992B (zh) | 2012-12-25 | 2013-02-26 | 無鹵素樹脂組成物及應用其之銅箔基板及印刷電路板 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9185801B2 (zh) |
| CN (1) | CN103897338B (zh) |
| TW (1) | TWI455992B (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104312104A (zh) * | 2014-10-31 | 2015-01-28 | 合肥鼎雅家具有限责任公司 | 一种低介电高强度环氧树脂复合材料及其制作方法 |
| KR102048320B1 (ko) * | 2018-05-11 | 2020-01-08 | 삼성전자주식회사 | 인쇄회로기판 및 ic 패키지용 수지 조성물, 및 이를 이용한 제품 |
| CN111057200B (zh) * | 2019-12-02 | 2021-12-24 | 中昊北方涂料工业研究设计院有限公司 | 一种含二氨基二苯醚结构单元的聚氨酯弹性树脂 |
| CN114806089A (zh) * | 2022-04-15 | 2022-07-29 | 中国矿业大学 | 具有优异阻燃性和韧性的环氧树脂复合材料及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201041927A (en) * | 2009-05-19 | 2010-12-01 | Albemarle Corp | DOPO-derived flame retardant and epoxy resin composition |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0763566A4 (en) | 1995-03-10 | 1997-05-28 | Toshiba Chem Corp | HALOGEN-FREE FLAME RETARDANT EPOXY RESIN COMPOSITION |
| US6440567B1 (en) | 2000-03-31 | 2002-08-27 | Isola Laminate Systems Corp. | Halogen free flame retardant adhesive resin coated composite |
| JP4783984B2 (ja) * | 2001-02-15 | 2011-09-28 | 日立化成工業株式会社 | 樹脂組成物およびその用途ならびにそれらの製造方法 |
| KR100561070B1 (ko) | 2003-09-05 | 2006-03-15 | 주식회사 엘지화학 | 고속전송 회로기판용 열경화성 수지 조성물 |
| TWI382055B (zh) | 2006-10-03 | 2013-01-11 | Tech Advance Ind Co Ltd | 熱固性樹脂組合物 |
| CN101415296B (zh) * | 2008-11-24 | 2010-06-09 | 广东汕头超声电子股份有限公司覆铜板厂 | 一种覆铜板结构 |
| CN101585955B (zh) * | 2008-12-31 | 2012-02-22 | 广东生益科技股份有限公司 | 一种树脂组合物及其制作的涂覆树脂铜箔以及使用该涂覆树脂铜箔制作的覆铜板 |
| TWI464191B (zh) * | 2010-04-20 | 2014-12-11 | Taiwan Union Technology Corp | Epoxy resin compositions and prepregs and printed circuit boards made thereof |
| TWI471350B (zh) * | 2010-05-12 | 2015-02-01 | Taiwan Union Technology Corp | 無鹵素的阻燃性環氧樹脂組成物及由其製成的預浸材和印刷電路板 |
| TWI401269B (zh) * | 2010-06-14 | 2013-07-11 | Taiwan Union Technology Corp | 環氧樹脂組成物及其製成的預浸材和印刷電路板 |
| CN101906239A (zh) * | 2010-07-23 | 2010-12-08 | 广东汕头超声电子股份有限公司覆铜板厂 | 一种无卤阻燃树脂组合物及其在制备覆铜板中的应用 |
| CN102432836B (zh) * | 2011-08-16 | 2013-06-19 | 苏州生益科技有限公司 | 无卤热固性树脂组合物及使用其制作的预浸料及层压板 |
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2012
- 2012-12-25 CN CN201210572175.0A patent/CN103897338B/zh active Active
-
2013
- 2013-02-26 TW TW102106695A patent/TWI455992B/zh active
- 2013-03-15 US US13/834,473 patent/US9185801B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201041927A (en) * | 2009-05-19 | 2010-12-01 | Albemarle Corp | DOPO-derived flame retardant and epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103897338A (zh) | 2014-07-02 |
| CN103897338B (zh) | 2016-04-20 |
| US9185801B2 (en) | 2015-11-10 |
| US20140178697A1 (en) | 2014-06-26 |
| TW201425446A (zh) | 2014-07-01 |
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