TWI455794B - 研磨布用修整輪 - Google Patents

研磨布用修整輪 Download PDF

Info

Publication number
TWI455794B
TWI455794B TW098105440A TW98105440A TWI455794B TW I455794 B TWI455794 B TW I455794B TW 098105440 A TW098105440 A TW 098105440A TW 98105440 A TW98105440 A TW 98105440A TW I455794 B TWI455794 B TW I455794B
Authority
TW
Taiwan
Prior art keywords
metal substrate
dressing wheel
polishing cloth
cloth according
abrasive material
Prior art date
Application number
TW098105440A
Other languages
English (en)
Other versions
TW200936317A (en
Inventor
Hiroaki Sakamoto
Toshiya Kinoshita
Original Assignee
Nippon Steel Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Materials Co Ltd filed Critical Nippon Steel Materials Co Ltd
Publication of TW200936317A publication Critical patent/TW200936317A/zh
Application granted granted Critical
Publication of TWI455794B publication Critical patent/TWI455794B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Claims (8)

  1. 一種研磨布用修整輪，其特徵係於該修整輪之金屬基材表面上，以單層方式黏著多個研磨材，前述金屬基材的研磨材黏著面之表面形狀呈現突起狀，前述表面的端部與中心部之高度差為3μm以上40μm以下，並且，假設前述研磨材之粒徑為d，該研磨材之粒徑滿足3μmd<100μm的關係式，當相鄰之研磨材間的中心-中心距離為L時，該金屬基材表面上之研磨材佈置滿足dL<2d關係之總數至少是該研磨材總數的70%。
  2. 如申請專利範圍第1項所述之研磨布用修整輪，其前述金屬基材之研磨材黏著面的端部與中心部間之高度差為5μm以上、20μm以下。
  3. 如申請專利範圍第1或第2項所述之研磨布用修整輪，其前述的研磨材係以硬焊黏著於前述金屬基材的表面上。
  4. 如申請專利範圍第3項所述之研磨布用修整輪，其前述金屬基材為不鏽鋼材質。
  5. 如申請專利範圍第1項或第2項所述之研磨布用修整輪，其前述研磨材至少為鑽石、立方晶氮化硼、碳化硼、碳化矽，或是氧化鋁之一。
  6. 如申請專利範圍第5項所述之研磨布用修整輪，其前述研磨材係以硬焊黏著於前述金屬基材的表面上。
  7. 如申請專利範圍第6項所述之研磨布用修整輪，其前述之金屬基材為不鏽鋼材質。
  8. 如申請專利範圍第1或第2項所述之研磨布用修整輪，其前述之金屬基材為不鏽鋼材質。
TW098105440A 2008-02-20 2009-02-20 研磨布用修整輪 TWI455794B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008039218A JP5255860B2 (ja) 2008-02-20 2008-02-20 研磨布用ドレッサー

Publications (2)

Publication Number Publication Date
TW200936317A TW200936317A (en) 2009-09-01
TWI455794B true TWI455794B (zh) 2014-10-11

Family

ID=40985120

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098105440A TWI455794B (zh) 2008-02-20 2009-02-20 研磨布用修整輪

Country Status (5)

Country Link
US (1) US20100291844A1 (zh)
JP (1) JP5255860B2 (zh)
MY (1) MY153268A (zh)
TW (1) TWI455794B (zh)
WO (1) WO2009104224A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201246342A (en) * 2010-12-13 2012-11-16 Saint Gobain Abrasives Inc Chemical mechanical planarization (CMP) pad conditioner and method of making
TWI422466B (zh) * 2011-01-28 2014-01-11 Advanced Surface Tech Inc 鑽石研磨工具及其製造方法
JP5809880B2 (ja) * 2011-08-25 2015-11-11 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
MY190012A (en) * 2013-09-30 2022-03-22 Hoya Corp Method for manufacturing magnetic-disk glass substrate and method for manufacturing magnetic disk
JP6900523B2 (ja) * 2015-09-07 2021-07-07 日鉄ケミカル＆マテリアル株式会社 研磨布用ドレッサー
JP2017052019A (ja) * 2015-09-07 2017-03-16 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
JP6666749B2 (ja) * 2016-02-29 2020-03-18 日鉄ケミカル＆マテリアル株式会社 研磨布用ドレッサー
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
JP7309772B2 (ja) * 2021-03-25 2023-07-18 株式会社ノリタケカンパニーリミテド ロータリードレッサ

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000121418A (ja) * 1998-10-13 2000-04-28 Omron Corp 軸重計の配置方法および軸重計測装置
JP2000141204A (ja) * 1998-09-08 2000-05-23 Sumitomo Metal Ind Ltd ドレッシング装置並びにこれを用いた研磨装置及びｃｍｐ装置
JP2001025973A (ja) * 1999-07-15 2001-01-30 Noritake Co Ltd ビトリファイドボンド工具及びその製造方法
JP2001105326A (ja) * 1999-09-29 2001-04-17 Chugoku Sarin Kigyo Kofun Yugenkoshi 化学機械的ポリシングマット修整ディスク及びその製法
CN1197687C (zh) * 1998-06-29 2005-04-20 台湾积体电路制造股份有限公司 化学机械研磨机台
JP2006055944A (ja) * 2004-08-20 2006-03-02 Allied Material Corp Ｃｍｐパッドコンディショナー
JP2006305659A (ja) * 2005-04-27 2006-11-09 Nippon Steel Corp 研磨布用ドレッサー
US20070051355A1 (en) * 1997-04-04 2007-03-08 Chien-Min Sung Brazed diamond tools and methods for making the same
JP2007083352A (ja) * 2005-09-22 2007-04-05 Nippon Steel Materials Co Ltd 研磨布用ドレッサー
US20070254566A1 (en) * 1999-11-22 2007-11-01 Chien-Min Sung Contoured CMP pad dresser and associated methods
US20080014845A1 (en) * 2006-07-11 2008-01-17 Alpay Yilmaz Conditioning disk having uniform structures
TWI315691B (en) * 2005-09-09 2009-10-11 Chien Min Sung Methods of bonding superabrasive particles in an organic matrix

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2564950B2 (ja) * 1989-05-30 1996-12-18 富士電機株式会社 飲料水殺菌装置
US6190240B1 (en) * 1996-10-15 2001-02-20 Nippon Steel Corporation Method for producing pad conditioner for semiconductor substrates
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US20040112359A1 (en) * 1997-04-04 2004-06-17 Chien-Min Sung Brazed diamond tools and methods for making the same
US7323049B2 (en) * 1997-04-04 2008-01-29 Chien-Min Sung High pressure superabrasive particle synthesis
US9463552B2 (en) * 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
JP2000106353A (ja) * 1998-07-31 2000-04-11 Nippon Steel Corp 半導体基板用研磨布のドレッサ―
JP2000218512A (ja) * 1999-01-28 2000-08-08 Osaka Diamond Ind Co Ltd Ｃｍｐ用パッドコンディショナーおよびその製造方法
JP2001018172A (ja) * 1999-07-08 2001-01-23 Osaka Diamond Ind Co Ltd ポリシング工具の修正用工具
JP3072991U (ja) * 2000-02-24 2000-11-07 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
US7011134B2 (en) * 2000-10-13 2006-03-14 Chien-Min Sung Casting method for producing surface acoustic wave devices
US6659161B1 (en) * 2000-10-13 2003-12-09 Chien-Min Sung Molding process for making diamond tools
US6814130B2 (en) * 2000-10-13 2004-11-09 Chien-Min Sung Methods of making diamond tools using reverse casting of chemical vapor deposition
CN100361786C (zh) * 2000-12-21 2008-01-16 新日本制铁株式会社 Cmp调节器、用于cmp调节器的硬质磨粒的排列方法以及cmp调节器的制造方法
JP4216025B2 (ja) * 2002-09-09 2009-01-28 株式会社リード 研磨布用ドレッサー及びそれを用いた研磨布のドレッシング方法
US20060213128A1 (en) * 2002-09-24 2006-09-28 Chien-Min Sung Methods of maximizing retention of superabrasive particles in a metal matrix
JP3801551B2 (ja) * 2002-10-11 2006-07-26 株式会社ノリタケスーパーアブレーシブ Ｃｍｐパッドコンディショナー
US7258708B2 (en) * 2004-12-30 2007-08-21 Chien-Min Sung Chemical mechanical polishing pad dresser
US8393934B2 (en) * 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8622787B2 (en) * 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8398466B2 (en) * 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US20110275288A1 (en) * 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US20070128994A1 (en) * 2005-12-02 2007-06-07 Chien-Min Sung Electroplated abrasive tools, methods, and molds
JP5008969B2 (ja) * 2006-01-31 2012-08-22 新日本製鐵株式会社 液相拡散接合用合金
CN103962943A (zh) * 2009-03-24 2014-08-06 圣戈班磨料磨具有限公司 用作化学机械平坦化垫修整器的研磨工具

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070051355A1 (en) * 1997-04-04 2007-03-08 Chien-Min Sung Brazed diamond tools and methods for making the same
CN1197687C (zh) * 1998-06-29 2005-04-20 台湾积体电路制造股份有限公司 化学机械研磨机台
JP2000141204A (ja) * 1998-09-08 2000-05-23 Sumitomo Metal Ind Ltd ドレッシング装置並びにこれを用いた研磨装置及びｃｍｐ装置
JP2000121418A (ja) * 1998-10-13 2000-04-28 Omron Corp 軸重計の配置方法および軸重計測装置
JP2001025973A (ja) * 1999-07-15 2001-01-30 Noritake Co Ltd ビトリファイドボンド工具及びその製造方法
JP2001105326A (ja) * 1999-09-29 2001-04-17 Chugoku Sarin Kigyo Kofun Yugenkoshi 化学機械的ポリシングマット修整ディスク及びその製法
US20070254566A1 (en) * 1999-11-22 2007-11-01 Chien-Min Sung Contoured CMP pad dresser and associated methods
JP2006055944A (ja) * 2004-08-20 2006-03-02 Allied Material Corp Ｃｍｐパッドコンディショナー
JP2006305659A (ja) * 2005-04-27 2006-11-09 Nippon Steel Corp 研磨布用ドレッサー
TWI315691B (en) * 2005-09-09 2009-10-11 Chien Min Sung Methods of bonding superabrasive particles in an organic matrix
JP2007083352A (ja) * 2005-09-22 2007-04-05 Nippon Steel Materials Co Ltd 研磨布用ドレッサー
US20080014845A1 (en) * 2006-07-11 2008-01-17 Alpay Yilmaz Conditioning disk having uniform structures

Also Published As

Publication number Publication date
MY153268A (en) 2015-01-29
JP2009196025A (ja) 2009-09-03
US20100291844A1 (en) 2010-11-18
WO2009104224A1 (ja) 2009-08-27
TW200936317A (en) 2009-09-01
JP5255860B2 (ja) 2013-08-07

Similar Documents

Publication Publication Date Title
TWI455794B (zh) 研磨布用修整輪
US7771498B2 (en) Superabrasive tools having improved caustic resistance
US20090123705A1 (en) CMP Pad Dressers
US20130324021A1 (en) Diamond impregnated polishing pad with diamond pucks
JP5503150B2 (ja) 微細トリミングのための研削砥石、研削砥石の使用ならびにその製造方法及び装置
US20080096479A1 (en) Low-melting point superabrasive tools and associated methods
JP2013512786A5 (zh)
JP2009512566A5 (zh)
GB2458252A (en) Improved abrasive preparation device with an improved abrasive element assembly
KR20070063569A (ko) 윤곽지어진 ｃｍｐ 패드 드레서 및 관련 방법들
WO2013003831A3 (en) Liquid phase sintered silicon carbide abrasive particles
TWI599454B (zh) 磨料製品及使用方法
WO2009064345A3 (en) A chemical mechanical planarization pad conditioner and methods of forming thereof
ATE460468T1 (de) Beschichtete schleifmittel
EP2042268A3 (en) Grinding wheel
TWM513087U (zh) 平坦化之組合式化學機械研磨修整器
JP2008213126A (ja) 研削ホイール
TWI623382B (zh) Hybrid chemical mechanical polishing dresser
JP2019500225A5 (zh)
JP4960395B2 (ja) 研磨装置とそれを用いた半導体装置の製造方法
CN201940906U (zh) 一种金刚石砂布
TWI667102B (zh) 研磨工具
CN204868584U (zh) 一种聚合颗粒橡胶砂带
CN202037557U (zh) 一种带轴页轮
JP2009500186A5 (zh)