TWI454330B - A method for processing a brittle material substrate and a laser processing apparatus for use in the method - Google Patents

A method for processing a brittle material substrate and a laser processing apparatus for use in the method Download PDF

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Publication number
TWI454330B
TWI454330B TW100108060A TW100108060A TWI454330B TW I454330 B TWI454330 B TW I454330B TW 100108060 A TW100108060 A TW 100108060A TW 100108060 A TW100108060 A TW 100108060A TW I454330 B TWI454330 B TW I454330B
Authority
TW
Taiwan
Prior art keywords
substrate
cooling
crack
brittle material
breaking
Prior art date
Application number
TW100108060A
Other languages
English (en)
Chinese (zh)
Other versions
TW201139025A (en
Inventor
Atsushi Imura
Yusuke Hirauchi
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201139025A publication Critical patent/TW201139025A/zh
Application granted granted Critical
Publication of TWI454330B publication Critical patent/TWI454330B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW100108060A 2010-03-18 2011-03-10 A method for processing a brittle material substrate and a laser processing apparatus for use in the method TWI454330B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010062143A JP5249979B2 (ja) 2010-03-18 2010-03-18 脆性材料基板の加工方法およびこれに用いるレーザ加工装置

Publications (2)

Publication Number Publication Date
TW201139025A TW201139025A (en) 2011-11-16
TWI454330B true TWI454330B (zh) 2014-10-01

Family

ID=44775611

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100108060A TWI454330B (zh) 2010-03-18 2011-03-10 A method for processing a brittle material substrate and a laser processing apparatus for use in the method

Country Status (4)

Country Link
JP (1) JP5249979B2 (ko)
KR (1) KR101275539B1 (ko)
CN (1) CN102218778B (ko)
TW (1) TWI454330B (ko)

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CN102515494B (zh) * 2011-12-05 2014-04-09 深圳市华星光电技术有限公司 一种玻璃基板切割装置
JP6255595B2 (ja) 2012-10-12 2018-01-10 株式会社Ihi 割断装置
JP2014091134A (ja) * 2012-11-01 2014-05-19 Ihi Corp レーザ加工装置
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
CN103896483B (zh) * 2014-03-27 2016-08-17 深圳市华星光电技术有限公司 一种玻璃基板切割设备及切割方法
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
KR101659454B1 (ko) * 2014-08-21 2016-09-23 한국미쯔보시다이아몬드공업(주) 기판 브레이크 장치
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
EP3274306B1 (en) 2015-03-24 2021-04-14 Corning Incorporated Laser cutting and processing of display glass compositions
EP3274313A1 (en) 2015-03-27 2018-01-31 Corning Incorporated Gas permeable window and method of fabricating the same
EP3507057A1 (en) 2016-08-30 2019-07-10 Corning Incorporated Laser processing of transparent materials
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
EP3529214B1 (en) 2016-10-24 2020-12-23 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
JP2018183838A (ja) * 2017-04-26 2018-11-22 川崎重工業株式会社 脆性材料分断装置及び脆性材料分断方法
FR3066488B1 (fr) * 2017-05-19 2022-03-04 Saint Gobain Procede de rompage d'une feuille de verre
FR3066487B1 (fr) * 2017-05-19 2021-12-10 Saint Gobain Procede de rompage d'une feuille de verre
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
KR102022102B1 (ko) * 2017-12-21 2019-09-17 주식회사 넵시스 레이저 빔을 이용한 절단 장치
CN108751689A (zh) * 2018-07-11 2018-11-06 史千云 一种有效提高切口平整度的玻璃切割设备
CN115121747B (zh) * 2022-08-25 2022-12-06 泰州俊宇不锈钢材料有限公司 一种特种合金微丝用切断装置

Citations (2)

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JP2005262727A (ja) * 2004-03-19 2005-09-29 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
TW200817294A (en) * 2006-06-08 2008-04-16 Toray Eng Co Ltd Substrate splitting apparatus, substrate splitting method, and split substrate split by using the apparatus or method

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TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
CN101602230B (zh) * 2002-11-06 2015-06-10 三星钻石工业股份有限公司 划线形成方法
US20070051769A1 (en) * 2003-04-28 2007-03-08 Mitsuboshi Diamond Industrial Co., Ltd. Brittle substrate cutting system and brittle substrate cutting method
JP4818120B2 (ja) * 2004-10-13 2011-11-16 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。
WO2007049668A1 (ja) * 2005-10-28 2007-05-03 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のスクライブライン形成方法およびスクライブライン形成装置
JP2010138046A (ja) * 2008-12-15 2010-06-24 Japan Steel Works Ltd:The 被割断材の加工方法および加工装置
JP5464952B2 (ja) * 2009-09-28 2014-04-09 株式会社ナガセインテグレックス レーザ加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005262727A (ja) * 2004-03-19 2005-09-29 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
TW200817294A (en) * 2006-06-08 2008-04-16 Toray Eng Co Ltd Substrate splitting apparatus, substrate splitting method, and split substrate split by using the apparatus or method

Also Published As

Publication number Publication date
CN102218778B (zh) 2014-11-05
JP2011194644A (ja) 2011-10-06
JP5249979B2 (ja) 2013-07-31
KR101275539B1 (ko) 2013-06-17
TW201139025A (en) 2011-11-16
KR20110105343A (ko) 2011-09-26
CN102218778A (zh) 2011-10-19

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