TW201139025A - Processing method for brittle material substrate and laser processing apparatus used therein - Google Patents

Processing method for brittle material substrate and laser processing apparatus used therein Download PDF

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TW201139025A
TW201139025A TW100108060A TW100108060A TW201139025A TW 201139025 A TW201139025 A TW 201139025A TW 100108060 A TW100108060 A TW 100108060A TW 100108060 A TW100108060 A TW 100108060A TW 201139025 A TW201139025 A TW 201139025A
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Taiwan
Prior art keywords
substrate
crack
cooling
roller
brittle material
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TW100108060A
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Chinese (zh)
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TWI454330B (en
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Atsushi Imura
Yusuke Hirauchi
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Mitsuboshi Diamond Ind Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

To provide a substrate cutting method to cut a substrate along a predetermined cutting line with good accuracy. The method includes: a heating step for moving a substrate (W) along the predetermined cutting line (L) while irradiating laser in order to make the substrate (W) generate partial compression stress; a cooling step for cooling the heated regions to generate tensile stress, and making the crack (10) proceed along the predetermined cutting line (L); and, during the period of time when residual tensile stress is present and the opening section of the crack (10) still opened, a breaking step for applying external force on the opening section in order to make the crack to penetrate in the thickness direction.

Description

201139025 六、發明說明： 【發明所屬之技術領域】 本發明係關於藉由對玻璃、矽、陶瓷、半導體等脆性 材料基板沿分斷預定線照射雷射光而局部加熱後喷射冷媒 而局°卩冷卻，於該基板形成龜裂之加工方法。在此所謂「加 工」雖係指藉由加熱與冷卻使基板產生熱應力分布而於該基 板形成龜裂之加工’但亦包含使被形成之龜裂從基板表面 到達背® α使％ >斷之場合與於分斷預定線形成深龜裂 (基板厚度之80%以上之龜裂）以使成為即將完全分斷之 狀態之加工。 【先前技術】 以在’做為分冑（割斷）脆性材料即玻璃基板之方法， =知例如f利文獻丨與專利文獻2所揭示將基板局部加熱 ’#由#時產生之熱應力（壓縮應力與拉伸應力） =::成於基板之端部之初期龜裂（觸發）為起點使龜 & 主所要之方向進展，# 1r t 厚極薄時等)之加工方法 刻劃線或完全分斷(板 上之而言’係使用雷射光束做為熱源，將保持於平台 定線:⑽目對雷射光束移動，使雷射光束沿基板之分斷預 此時制因、射加熱’亚隨之從冷部單元之喷嘴喷射冷媒。 庳力所導致加熱而產生之壓縮應力與因急冷而產生之拉伸 ::所：致之應力分布使龜裂往分斷預定線之方向進展， 形成一條刻劃線。 』疋敬 201139025 之後’除了在基板極薄之場合等被完全分斷外，藉由 沿刻劃線（龜裂）#壓折斷棒或壓接轉動滾輪，使基板彎 曲以將基板分斷。 專利文獻1 :曰本特開2004_1 8253〇號公報 專利文獻2:日本特開2005_263578號公報 【發明内容】 [發明欲解決之課題] 而以上述之以往方法，在進行加熱、冷卻後，於 施加外力使基板彎曲以分斷時，被分斷而形成之端面間可 能互相按壓，無法精度良好地沿分斷預定線分斷。此外， 亦有分斷面變粗縫之問題。 針對上述問題，本發明係以提供解決本課題，可沿分 斷預定線L精度良好地分斷之基板之分斷方法為目的。 [解決課題之技術手段] 在檢讨上述課題後，由發明者之反覆實驗得知被分斷 而形成之端面間互相按壓係因以下各點。圖6係顯示於局 部加熱後，追隨加熱部分剛喷射冷媒冷卻後之基板之狀態 之剖面圖。另外，為了說明之方便，誇張顯示龜裂等。 在將基板W以雷射光束局部加熱後，若將此加熱部分 以來自冷卻裝置之噴嘴13之冷媒急冷，會有拉伸應力產 生。藉由此拉伸應力，如圖6 ( a )所示龜裂i i產生。此龜 裂11之開口部會隨著從冷媒被喷射之冷卻點離開而關閉， 如圖ό ( b)所示成為目視無法看見之盲裂痕12。盲裂痕12 201139025 係因冷卻而有拉伸應力產生之區域隨時間經過而溫度緩 和，表面溫度再上升時，變為壓縮應力，龜裂面被壓縮而 龜裂關閉。若在有此種盲裂纟（曾經產生之龜裂之開口部 雖再度關閉而以目視無法看見但於内部仍有龜裂殘留之狀 態）產生之狀態下施加外力使基板變曲以進行折斷，因於 龜裂之開口部有壓縮應力殘留而關閉，故需有較大外力， 純勉強分斷則被分斷而形成之端面間會互相按壓。此壓 縮應力為無法精度良好地沿分斷預定線分斷之場合之要 因。 σ 因此， 術手段。亦 為了達成上述目的，在本發明係採用如下之技 即，在本發明之脆性材料基板之加工方法係由 藉由沿脆性材料基板之分斷預定線使雷射光束相對移動同 時照射來加熱而使基板產生局部性之壓縮應力之加熱步 驟、藉由使對已被加熱之區域之後方近處喷射冷媒而形成 之冷卻區域追隨雷射光束移動同時局部冷卻脆性材料基板 來使拉伸應力產生並沿分斷預定線使龜裂進展之冷卻步 驟、在此拉伸應力殘留而龜裂之開口部開啟期間對此龜裂 之開口部產生之區域施加外力使龜裂往厚度方向滲透之折 斷步驟構成。 在此’折斷步驟中之使外力施加之位置配置於從由冷 卻步驟產生之冷卻區域之冷卻中心往冷卻區域之移動方向 後方側20mm及往冷卻區域之移動方向前方側5mm之範圍 較理想。特別是因冷卻而產生之龜裂之開口部開啟為最大 之位置最理想’從基板之冷卻中心（Cp )往冷卻區域之移動 201139025 方向為相反方向之後方側0〜1 0mm之範圍内之位置為適 當0 [發明之效果] 利用本發明之加工方法，由於係使在折斷步驟之施加 外力之位置為因冷卻步驟之急速冷卻而產生之龜裂不成為 盲裂痕而龜裂之開口部開啟之區域内，故只要稍微施加外 力’亦即只要以外力使龜裂之開口部開啟之區域稍微f 曲’便可順利使龜裂滲透而分斷。藉此，可消除被分斷而 形成之端面間互相按壓之現象’可沿分斷預定線精度良好 地分斷’可獲得平滑且漂亮之分斷面。 於本發明，可使用壓接於基板之滾輪做為折斷步驟中 之外力之施加手段’將此滾輪配置於與基板之雷射照射面 為相反側’藉由壓接滾輪來施加外力。 藉此’可確實使龜裂之開口部開啟之區域彎曲，可順 利使龜裂滲透而分斷。 【實施方式】 以下，基於顯示其實施形態之圖式詳細說明本發明之 加工方法之詳細。 圖1為顯示實施本發明之加工方法之雷射加工裝置 一例之概略立體圖’圖2為說明加工方法之圖。 雷射加工裝置具備載置玻璃基板W之被二分割之平二 lc平台1具有載置基板w之平坦之上面2,於上設二 多數之空氣吸引孔3。此线吸引孔3係吸引保持被載置之 6 201139025 基板w者，透過設於平a〗 十口1内部之分歧管（不圖示）連通 於空氣吸引泵（不圖示）。另外，設有將載置於平自！之 基板w透過吸盤4拾起並搬送之搬送機械手臂5。 此外，設有做為為了將載置於平台1上之基板W沿分 斷預定線加工而使基板w產生局部性之壓縮應力之加執手 段之雷射照射機構6、藉由追隨由此雷射照射機構6產生之 加熱區域（雷射點）以冷媒喷射使加熱區域之後方近處冷 卻來使拉伸應力產生並使龜裂沿分斷預定線進展之冷卻機 構7、以及在此拉伸應力殘留期間對冷卻區域附近（龜裂之 開口部產生之區域）施加外力使龜裂往厚度方向滲透之折 斷機構8。 冷郃機構7具備從前端喷射冷媒之喷嘴7a。此外，折 斷機構8具備配置於基板w之下方側之滾輪8a，藉由使此 滚輪8a在被分割後之平台丨之間隙從下方按壓而按壓基板 並分斷。另外，相對於滾輪8a於基板w之上方側配設具有 凹面狀之周面之承接滾輪8b較理想。 雷射照射機構6、冷卻機構7、折斷機構8係形成為以 雷射照射機構6為首依序排列於一直線上並被共通之保持 構件保持，且可藉由驅動機構（不圖示）相對载置有基板w 之平台1沿排列方向移動。 折辦機構8之滾輪8a係配置於因來自喷嘴7a之冷媒喷 射導致之急速冷卻而產生之龜裂10(參照圖4)不成為盲 裂痕而龜裂10之開口部開啟之區域。 具體而言，係假設應加工之玻璃基板W之厚度為〇 4 201139025 〜l.lmm程度、基板w之搬送速度為5〇mm/秒〜5〇〇mm/秒 時，滾輪8a被配置於從喷嘴7a導致之冷卻點之中心a(圖 2)往喷嘴7a之相對於基板w之移動方向（箭頭方向）相 反方向即後方側之2〇mm及移動方向前方側5麵之範圍。 特別是因冷卻而產生之龜裂1〇之開口部大幅開啟之位 置最理想’從冷卻點之中心cp (圖2)往喷嘴^之相對於 基板W之移動方向為相反方向之後方側G〜⑺麵之範圍内 之位置為適當。附帶—& ’以往有刻劃與折斷應以個別步 驟進行之想法，認為在進行滾輪折斷之場合盡量不給予振 動較理想’且認為於基板w被充分冷卻且龜裂往基板之厚 度方向充分進展後設折斷步驟較理想，滾輪被配置於從冷 媒喷射位置充分離開之位置（從冷卻點之中心㈣後方側 離開20mm以上）。 另外，於將滾輪8a配置於比從冷卻點之中心cp往喷嘴 ?之相對於基板W之移動方向前方側離開5賴之位置之 場合，無法觀察到使龜裂滲透之效果。 其次，針對加卫動作說明。於將基板W沿分斷預定線 L加工時，定位為基板W之分斷預定線£來到雷射加工裝 置中之既定加工位置同時保持於平台1。之後，藉由使雷射 照射機構6 (保持構件9)沿分斷預定線"目對移動同時對 基板W照射雷射光束，如圖3所示，使基板w產生局部性 之壓縮應力場P1°其次’如圖4所示，使追隨雷射光束將 已被雷射光束加熱之區域之後方近處（因此，ρι會稍微往 基板内部移動）以來自冷卻機構7之噴嘴7a之冷媒嗔射急 201139025 冷而使拉伸應力P 2產生。 藉此，龜裂10沿分斷預定線L (圖1 )被形成。另外， 如圖5所示，使折斷機構8之滾輪8a上升，使因冷卻步驟 而龜裂1 0產生之區域彎曲，使龜裂深度滲透至板厚之i 〇〇% (完全分斷）至80%。 此時，由於係使折斷機構8之滾輪8a之壓接位置為因 噴嘴7a之急速冷卻而產生之龜裂1〇不成為盲裂痕而龜裂 10之開口部開啟之區域，故只要使滾輪8a稍微按壓亦即 以滚輪8a使龜裂10之開口部開啟之區域稍微彎曲，便可順 利使龜裂滲透。藉此，可消除被分斷而形成之端面間互相 按壓之現象，可沿分斷預定線精度良好地分斷，可獲得平 ί月且漂免之分斷面。 以上雖已針對本發明之代表性之實施例說明，但本發 月並非必須文限於特定於上述之實施形態者，可在達成其 目的且不超出申請專利範圍之範圍内適當修正、變更。 [產業上之可利用性] 本發明之加工方法可利 料構成之基板。 用於加工由玻璃基板等脆性材 L園八間單說明】 圖1為顯示實施本發明夕+ , 赞月之加工方法之雷射加工裝置之 例之立體圖。 圖2為說明本發明之加工方法之圖。 圖3為顯示本發明+ 甲之加工時之熱應力之產生狀態之 201139025 擴大剖面圖，翻__ .，、、員不有壓縮應力產生之狀態。 圖4為gg __丄# *’、不本發明中之加工時之熱應力之產生狀態之 擴大剖面圖，龜_ 、•，肩不有拉伸應力產生之狀態。 ^為顯示施加有外力之狀態之擴大剖面圖。 6為顯示於雷射加熱後，剛噴射冷媒冷卻後之基板 之狀態之剖面圖。 【主要元件符號說明】 W 基板 L 分斷預定線 1 平台 6 雷射照射機構 7 冷卻機構 7a 喷嘴 8 折斷機構 8a 滾輪 10 龜裂 10201139025 VI. Description of the Invention: [Technical Field] The present invention relates to a partial heating of a brittle material substrate such as glass, enamel, ceramics, or a semiconductor, which is irradiated with laser light along a predetermined line, and is locally heated and then cooled. A method of forming a crack on the substrate. The term "processing" as used herein refers to the process of forming a thermal stress distribution on a substrate by heating and cooling to form a crack on the substrate, but also includes causing the formed crack to reach the back surface of the substrate from the surface of the substrate. In the case of the break, a deep crack (a crack of 80% or more of the thickness of the substrate) is formed in the predetermined line to be processed so as to be in a state of being completely broken. [Prior Art] In the method of 'dividing (cutting) a brittle material, that is, a glass substrate, it is known that, for example, the thermal stress generated by locally heating the substrate by ## is disclosed in Patent Document 2 (compression) Stress and tensile stress) =:: The initial crack (trigger) at the end of the substrate is the starting point for the turtle & the main direction is desired, #1r t is extremely thin, etc.) Completely disconnected (in the case of the board, the laser beam is used as the heat source, which will remain on the platform alignment: (10) the laser beam is moved, so that the laser beam is separated along the substrate. 'Asia then ejects the refrigerant from the nozzle of the cold unit. The compressive stress caused by the heating caused by the force and the stretching caused by the quenching: the stress distribution causes the crack to progress in the direction of the broken line , Form a scribe line. 疋 疋 2011 201139025 After 'except when the substrate is extremely thin, etc. is completely broken, by bending the broken line along the scribe line (crack) # crimping or crimping the rotating roller, the substrate is bent To break the substrate. Patent Document 1: 曰本特[Problems to be Solved by the Invention] In the above-described conventional method, after heating and cooling, an external force is applied to bend the substrate to be broken. The end faces formed by being separated may be pressed against each other, and may not be accurately separated along the predetermined line of division. In addition, there is also a problem that the cross-section becomes thick and thick. The present invention provides a solution to the problem. It is an object of the method of breaking the substrate which is accurately separated by the predetermined line L. [Technical means for solving the problem] After reviewing the above-mentioned problems, the inventor's repeated experiment revealed that the substrate was broken. The mutual pressing between the end faces is due to the following points. Fig. 6 is a cross-sectional view showing the state of the substrate which has been cooled by the injection of the refrigerant immediately after the local heating, and the cracks and the like are exaggerated for convenience of explanation. After the substrate W is locally heated by the laser beam, if the heating portion is quenched by the refrigerant from the nozzle 13 of the cooling device, tensile stress is generated. The force is generated as shown in Fig. 6 (a). The opening of the crack 11 is closed as it exits from the cooling point where the refrigerant is sprayed, and becomes visually invisible as shown in Fig. (b). Crack 12: Blind crack 12 201139025 The area where tensile stress is generated due to cooling and the temperature is moderated over time. When the surface temperature rises again, it becomes compressive stress, and the crack surface is compressed and the crack is closed. An external force is applied to bend the substrate to break due to the occurrence of a blind crack (the opening of the crack that has once been closed and is invisible to the eye but still has a crack inside). The opening portion has a compressive stress remaining and is closed, so that a large external force is required, and the end faces which are formed by breaking apart by purely strong breaking are pressed against each other. This compressive stress is a factor that cannot be accurately separated along the predetermined line. σ Therefore, the means of surgery. In order to achieve the above object, in the present invention, the method for processing a brittle material substrate of the present invention is heated by irradiating a laser beam while moving along a predetermined line of a brittle material substrate while irradiating. a heating step of causing a localized compressive stress of the substrate, and a cooling region formed by injecting a refrigerant near the heated region follows the laser beam while locally cooling the brittle material substrate to generate tensile stress and a step of cooling the crack along the predetermined line, and a step of breaking the crack in the thickness direction by applying an external force to the region where the crack is generated during the opening of the crack and opening the opening of the crack . In the breaking step, the position at which the external force is applied is preferably set in a range from the cooling center of the cooling region generated by the cooling step to the rear side of the moving direction of the cooling region by 20 mm and the front side of the moving direction of the cooling region by 5 mm. In particular, the position at which the opening of the crack due to cooling is maximized is the most ideal. 'The movement from the cooling center (Cp) of the substrate to the cooling area is 201139025. The direction is the opposite direction and the position within the range of 0 to 1 0 mm. [Effect of the Invention] According to the processing method of the present invention, since the position at which the external force is applied in the breaking step is such that the crack generated by the rapid cooling of the cooling step does not become a blind crack, the opening of the crack is opened. In the area, if the external force is applied a little, that is, if the area where the opening of the crack is opened by an external force is slightly curved, the crack can be smoothly penetrated and broken. Thereby, it is possible to eliminate the phenomenon in which the end faces formed by the division are pressed against each other, and can be accurately divided along the line to be divided, and a smooth and beautiful cross section can be obtained. In the present invention, the roller which is pressed against the substrate can be used as a means for applying an external force in the breaking step. The roller is disposed on the side opposite to the laser irradiation surface of the substrate. An external force is applied by the pressure roller. By this, it is possible to bend the region where the opening of the crack is opened, and it is possible to smoothly break the crack and penetrate. [Embodiment] Hereinafter, the details of the processing method of the present invention will be described in detail based on the drawings showing the embodiments thereof. Fig. 1 is a schematic perspective view showing an example of a laser processing apparatus for carrying out the processing method of the present invention. Fig. 2 is a view for explaining a processing method. The laser processing apparatus includes a flattened upper surface 2 on which the substrate substrate w is placed, and a plurality of air suction holes 3 are provided thereon. The line suction hole 3 is sucked and held by the 6 201139025 substrate w, and is connected to the air suction pump (not shown) through a branch pipe (not shown) provided in the inside of the ten port. In addition, the set will be placed in the flat! The substrate w is picked up by the suction pad 4 and transported by the transfer robot arm 5. In addition, a laser irradiation mechanism 6 is provided as a means for applying a local compressive stress to the substrate W for processing the substrate W placed on the stage 1 along the predetermined line to be broken, thereby following this Ray The heating region (laser spot) generated by the radiation irradiation mechanism 6 is cooled by the refrigerant to cool the vicinity of the heating region to generate tensile stress and to cause the crack to progress along the breaking predetermined line, and to stretch there. During the stress residual period, a breaking mechanism 8 that applies an external force to the vicinity of the cooling region (the region where the opening of the crack is generated) so that the crack penetrates in the thickness direction. The cold heading mechanism 7 is provided with a nozzle 7a that ejects a refrigerant from the tip end. Further, the breaking mechanism 8 includes a roller 8a disposed on the lower side of the substrate w, and the roller 8a is pressed from below by the gap of the divided platform 而, and the substrate is pressed and divided. Further, it is preferable that the receiving roller 8b having a concave peripheral surface is disposed on the upper side of the substrate w with respect to the roller 8a. The laser irradiation mechanism 6, the cooling mechanism 7, and the breaking mechanism 8 are formed so that the laser irradiation mechanism 6 is sequentially arranged on the straight line and held by the common holding member, and can be relatively loaded by a driving mechanism (not shown). The stage 1 on which the substrate w is placed moves in the arrangement direction. The roller 8a of the folding mechanism 8 is disposed in a region where the crack 10 (see Fig. 4) which is generated by the rapid cooling of the refrigerant from the nozzle 7a does not become a blind crack and the opening of the crack 10 is opened. Specifically, it is assumed that the thickness of the glass substrate W to be processed is 〇4 201139025 to l.lmm, and the transport speed of the substrate w is 5〇mm/sec to 5〇〇mm/sec, the roller 8a is disposed in the slave The center a (Fig. 2) of the cooling point caused by the nozzle 7a is in the direction opposite to the moving direction (arrow direction) of the nozzle 7a with respect to the substrate w, that is, 2 〇 mm on the rear side and 5 sides on the front side in the moving direction. In particular, the position at which the opening of the crack due to cooling is greatly opened is preferably 'from the center cp of the cooling point (Fig. 2) to the opposite direction to the direction of movement of the nozzle with respect to the substrate W. (7) The position within the range is appropriate. Incidental-& 'In the past, there was an idea that scribing and breaking should be carried out in individual steps. It is considered that the vibration is preferably not applied when the roller is broken. It is considered that the substrate w is sufficiently cooled and the crack is sufficiently thick toward the substrate. After the progress, the breaking step is preferably performed, and the roller is disposed at a position sufficiently away from the refrigerant ejection position (20 mm or more from the rear side of the center (four) of the cooling point). Further, when the roller 8a is disposed at a position apart from the center cp of the cooling point toward the front side of the nozzle W in the moving direction of the substrate W, the effect of allowing the crack to penetrate can not be observed. Second, for the action of the defending action. When the substrate W is processed along the predetermined line L, the predetermined predetermined line of the substrate W is positioned to arrive at the predetermined processing position in the laser processing apparatus while being held on the stage 1. Thereafter, by causing the laser irradiation mechanism 6 (holding member 9) to move the laser beam while illuminating the substrate W while moving the target line, as shown in FIG. 3, the substrate w is subjected to a local compressive stress field. P1° secondly, as shown in Fig. 4, the vicinity of the area where the laser beam has been heated by the laser beam is moved (so that ρι moves slightly inside the substrate) to the refrigerant 喷嘴 from the nozzle 7a of the cooling mechanism 7 The emergency 201139025 is cold and the tensile stress P 2 is generated. Thereby, the crack 10 is formed along the breaking planned line L (Fig. 1). Further, as shown in Fig. 5, the roller 8a of the breaking mechanism 8 is raised, and the region where the crack 10 is generated by the cooling step is bent, so that the crack depth penetrates to the plate thickness i 〇〇 % (completely broken) to 80%. At this time, since the crimping position of the roller 8a of the breaking mechanism 8 is a region in which the crack 1 caused by the rapid cooling of the nozzle 7a does not become a blind crack and the opening of the crack 10 is opened, it is only necessary to make the roller 8a When the roller 8a is slightly pressed, the region where the opening of the crack 10 is opened is slightly bent, and the crack can be smoothly penetrated. Thereby, it is possible to eliminate the phenomenon in which the end faces formed by the division are pressed against each other, and it is possible to accurately divide along the predetermined line to be divided, and to obtain a section which is flat and floated. The above is a description of the representative embodiments of the present invention. However, the present invention is not limited to the embodiments described above, and may be appropriately modified or changed within the scope of the invention without departing from the scope of the invention. [Industrial Applicability] The processing method of the present invention can be used as a substrate. For the processing of a brittle material such as a glass substrate, the description of the laser processing apparatus is as follows. Fig. 1 is a perspective view showing an example of a laser processing apparatus for carrying out the processing method of the present invention. Fig. 2 is a view for explaining the processing method of the present invention. Fig. 3 is an enlarged cross-sectional view showing the state of occurrence of thermal stress in the processing of the +A of the present invention, in which the __. Fig. 4 is an enlarged cross-sectional view showing the state of generation of thermal stress during processing in the gg __丄#*', in which the turtle _, •, the shoulder does not have a tensile stress. ^ An enlarged sectional view showing the state in which an external force is applied. 6 is a cross-sectional view showing the state of the substrate immediately after the cooling of the cooling medium after the laser heating. [Description of main component symbols] W Substrate L Partition line 1 Platform 6 Laser irradiation mechanism 7 Cooling mechanism 7a Nozzle 8 Broken mechanism 8a Roller 10 Crack 10

Claims (1)

201139025 七、申請專利範圍： 1. 一種脆性材料基板之加工方法’由藉由沿脆性材料基 板之分斷預定線使雷射光束相對移動同時照射來加熱而使 基板產生局部性之壓縮應力之加熱步驟、藉由使對已加熱 之區域之後方近處噴射冷媒而形成之冷卻區域追隨雷射光 束移動同時局部冷卻脆性材料基板來使拉伸應力產生並沿 分斷預定線使龜裂進展之冷卻步驟、以及在此拉伸應力殘 留而龜裂之開口部開啟期間對此龜裂之開口部產生之區域 施加外力使龜裂往厚度方向滲透之折斷步驟構成。 2. 如申請專利範圍第丨項記載之脆性材料基板之加工 方法，其中，在前述折斷步驟使用滾輪，將此滾輪配置於 與基板之雷射照射面為相反側，藉由壓接滾輪來施加外力。 3. 如申請專利範圍第丨或2項記載之脆性材料基板之加 工方法，#中’前述折斷步驟中之使外力施加之位置，係 從由冷卻步驟產生之冷卻區域之冷卻“往冷卻區域之移 動方向後方側2〇麵及往冷卻區域之移動方向前方側5職 之範圍。 4·一種雷射加工裝置，具備： 猎由沿載置於平台上之月斋极士士冰1』 、 ^ 尤·脆性材科基板之分斷預定線從 前述基板之上方使雷射光束相對㈣同時照射來加熱而使 基板產生局部性之I缩應力之雷射照射機構；以及 藉由使對已加熱之區域之德 之後方近處喷射冷媒而形成之 冷卻區域追隨雷射光走孩# — 釆移動而局部冷卻脆性材料基板來使 拉伸應力產生並沿分斷預宕娃他盗别 哪頂疋線使龜裂進展之冷卻機構，· 201139025 其特徵在於： 前述平台係隔著用以使前述基板之分割預定線之下面 側露出之間隙被分割為兩側； 具備在因冷媒之喷射而產生之拉伸應力殘留而龜裂之 開口部開啟期間對此龜裂之開口部產生之區域從前述基板 下方施加外力使龜裂往厚度方向滲透之折斷機構。 二5_如申請專利範圍第4項記載之雷射加工裝置，其中， 月J述折斷機構係、由相對前述平台沿前述間隙移動同時按壓 基板之分割預定線之下面之滾輪構成。 6.如申a月專利範圍第5項記載之雷射加工裝置，其中 前述冷卻機構具有噴射冷媒之喷 '、 ^ ^ 則述滾輪被配置於. 冷媒破喷射之冷卻點之中心往與 ^ ^ . 、貝贾之相對於基板之移 向為相反側即後方側2〇mm及 範圍I ㈣方“方側5mm. 中 板 ，前專利範圍第5或6項記載之雷射加工裝置 :斷機構進一步具備相對於前述滚輪之於❸ 方之位置具有凹面狀之周面之承接滚輪。 八、圖式： (如次頁） 12201139025 VII. Patent application scope: 1. A method for processing a brittle material substrate 'heating the local compressive stress caused by the relative movement of the laser beam along the predetermined line of the brittle material substrate while being heated by irradiation. a step of causing a tensile stress to be generated by causing a cooling region formed by injecting a refrigerant in the vicinity of the heated region to follow the laser beam while locally cooling the brittle material substrate, and cooling the crack along the predetermined line In the step and the opening portion where the tensile stress remains and the opening of the crack is opened, an external force is applied to the region where the opening of the crack is generated, so that the crack penetrates in the thickness direction. 2. The method for processing a substrate of a brittle material according to the invention of claim 2, wherein the roller is disposed on the opposite side of the laser irradiation surface of the substrate by the roller in the breaking step, and is applied by a pressure roller. external force. 3. In the processing method of the brittle material substrate described in the second or second paragraph of the patent application, the position in the breaking step in which the external force is applied is the cooling from the cooling region generated by the cooling step to the cooling region. The direction of the rear side of the moving direction is 2, and the direction of the moving direction of the cooling area is 5th. 4) A laser processing device with: Hunting by the Moon on the platform, the Moon Ice 1", ^ a laser irradiation mechanism for dividing a predetermined line of the brittle material substrate from above the substrate to simultaneously irradiate the laser beam with respect to (four) heating to cause localized I contraction stress; and by heating the pair After the region's virtue, the cooling zone formed by the injection of the refrigerant follows the laser light. # — 釆 Move and locally cool the brittle material substrate to generate the tensile stress and break along with the top line. Cooling mechanism for crack progression, 201139025, characterized in that the platform is divided into two sides by a gap for exposing the lower side of the predetermined dividing line of the substrate In a region where the opening portion of the crack is opened during the opening of the crack due to the residual tensile stress generated by the injection of the refrigerant, a breaking mechanism is formed by applying an external force from the lower surface of the substrate to infiltrate the crack in the thickness direction. The laser processing apparatus according to claim 4, wherein the breaking mechanism is constituted by a roller that moves along the gap with respect to the platform and simultaneously presses a lower surface of the predetermined dividing line of the substrate. The laser processing apparatus according to the fifth aspect of the invention, wherein the cooling mechanism has a spray of a refrigerant jet, and wherein the roller is disposed at a center of a cooling point of the refrigerant jet to the ^^. The laser processing device according to the fifth or sixth aspect of the prior art, the cutting mechanism is further provided with respect to the opposite side, that is, the rear side 2 〇 mm and the range I (four) side "square side 5 mm. The roller has a concave roller-shaped peripheral surface at the position of the roller. Eight, the pattern: (such as the next page) 12
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US20090050610A1 (en) * 2004-10-13 2009-02-26 Mitsuboshi Diamond Industrial Co., Ltd. Method and apparatus for scribing brittle material board and system for breaking brittle material board
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WO2007142264A1 (en) * 2006-06-08 2007-12-13 Toray Engineering Co., Ltd. Substrate splitting apparatus, substrate splitting method, and split substrate split by using the apparatus or method
JP2010138046A (en) * 2008-12-15 2010-06-24 Japan Steel Works Ltd:The Method and device for working material to be cut
JP5464952B2 (en) * 2009-09-28 2014-04-09 株式会社ナガセインテグレックス Laser processing method

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