TWI414389B - Substrate breaking device - Google Patents
Substrate breaking device Download PDFInfo
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- TWI414389B TWI414389B TW100108061A TW100108061A TWI414389B TW I414389 B TWI414389 B TW I414389B TW 100108061 A TW100108061 A TW 100108061A TW 100108061 A TW100108061 A TW 100108061A TW I414389 B TWI414389 B TW I414389B
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- substrate
- trigger portion
- glass substrate
- trigger
- laser beam
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
Description
本發明係關於由玻璃等脆性材料構成之基板分斷方法，特別是關於對0.1mm以下之薄玻璃基板沿分斷預定線使雷射光移動同時照射，將玻璃基板分斷為個別之單位要素之方法。The present invention relates to a substrate breaking method comprising a brittle material such as glass, and more particularly relates to a thin glass substrate of 0.1 mm or less, which is irradiated with laser light while being separated by a predetermined line, and the glass substrate is divided into individual unit elements. method.
圖5係顯示針對板厚為0.5mm以上之玻璃基板，在格子狀地形成刻劃槽後(交叉刻劃)將基板分斷為個別之單位要素(製品)之場合之以往例之圖。一般在玻璃基板之板厚為0.5mm以上而較厚之場合，可對基板以雷射照射形成刻劃槽(不貫通基板之裂痕)。FIG. 5 is a view showing a conventional example in the case where a substrate is divided into individual unit elements (products) after forming a scribed groove in a lattice shape on a glass substrate having a thickness of 0.5 mm or more. Generally, when the thickness of the glass substrate is 0.5 mm or more and the thickness is thick, the substrate can be irradiated with a laser to form a scribed groove (a crack that does not penetrate the substrate).
在此場合，先使刀輪等輕微衝撞玻璃基板G之一端緣形成觸發部T1 (初期龜裂)。之後從已形成之觸發部T1 往第1方向(X方向)掃瞄雷射光束之光束點，接著以追隨後方近處之方式噴射冷媒，利用基板內之深度方向之熱應力分布形成第1刻劃槽S1 。其次，於玻璃基板G之與設有觸發部T1 之端緣正交之端緣形成觸發部T2 ，從觸發部T2 往與第1刻劃槽S1 正交之第2方向(Y方向)利用深度方向之熱應力形成第2刻劃槽S2 。In this case, the trigger wheel T 1 (initial crack) is formed by first causing a cutter wheel or the like to slightly collide with one end edge of the glass substrate G. After T 1 from the trigger portion to the first direction (X direction) of the beam spot of the scanning laser beam, and then to follow the way of sprayed coolant near the rear, using the depth direction of the substrate within the thermal stress distribution in the formation of the first formed The groove S 1 is scribed. Next, the glass substrate G is provided with an edge perpendicular to the edge portion of the trigger the trigger portion T is formed T 2, T 2 from the trigger portion to the first scribed groove S 1 perpendicular to the second direction (Y Direction) The second scribed groove S 2 is formed by thermal stress in the depth direction.
此等第1刻劃槽S1 、第2刻劃槽S2 並非完全分斷基板者，而係以半切之狀態被保持。之後，藉由施加外力使玻璃基板G彎曲並沿刻劃槽(裂痕)分斷，取出形成於基板 上之個別之單位要素(製品)。The first scribed groove S 1 and the second scribed groove S 2 are not completely separated from the substrate, but are held in a half-cut state. Thereafter, the glass substrate G is bent by an external force and cut along the scribed grooves (cracks), and individual unit elements (products) formed on the substrate are taken out.
如上述操作而獲得之玻璃基板之單位要素之中，除形成有觸發部之端緣部分之單位要素G1 外，佔大多數之中間部分之單位要素G2 (以交叉剖面線顯示之部分)無觸發部，形成有平滑且漂亮之分斷端面。亦即，觸發部T1 、T2 在以雷射光束形成刻劃槽之場合雖係為了使龜裂進展而為必要，但在分斷為單位要素而成為製品之場合，觸發部會成為傷痕殘存。因此，觸發部殘存之區域之單位要素G1 被從製品排除，從位於其餘之區域之單位要素G2 取出製品。Among the unit elements of the glass substrate obtained as described above, except for the unit element G 1 in which the edge portion of the trigger portion is formed, the unit element G 2 (the portion shown by the cross hatching) which is the middle portion of the majority portion is formed. There is no triggering part, and a smooth and beautiful breaking end face is formed. In other words, when the triggering portions T 1 and T 2 form the scribed groove by the laser beam, it is necessary to make the crack progress. However, when the component is broken into a product, the trigger portion becomes a flaw. Remaining. Thus, the unit area of the remaining portion of the trigger element G 1 is excluded from the article, the article 2 removed from the rest of the area is located in the unit element G.
另一方面，若基板之板厚變薄成為0.3mm以下，玻璃基板內之深度方向之熱應力分布不易被形成，其結果，形成刻劃槽為困難。在板厚較薄之場合係例如揭示於專利文獻1、專利文獻2，若將玻璃基板局部性地加熱且將加熱後方近處冷卻，會因前後方向之熱應力而以先形成於基板之端緣之觸發部為起點貫通基板之裂痕進展。因此，已知基板會突然被完全分斷(全切)。On the other hand, when the thickness of the substrate is reduced to 0.3 mm or less, the thermal stress distribution in the depth direction in the glass substrate is not easily formed, and as a result, it is difficult to form the scribed groove. In the case where the sheet thickness is thin, for example, Patent Document 1 and Patent Document 2 disclose that if the glass substrate is locally heated and the heating is cooled in the vicinity of the heat, it is formed at the end of the substrate due to thermal stress in the front-rear direction. The trigger portion of the edge is a crack originating from the substrate. Therefore, it is known that the substrate is suddenly completely broken (full cut).
具體而言，係使用由雷射光束形成之光束點，對保持於平台上之玻璃基板G使光束點相對移動同時從先於玻璃基板G之端緣形成之觸發部使光束點沿分斷預定線掃瞄並加熱。藉此於分斷預定線上使壓縮應力產生。接著，以冷卻機構以追隨已被加熱之部分之方式急冷。如上述操作使壓縮應力區域之後部產生拉伸應力區域，以前後方向之應力分布使貫通玻璃基板G之裂痕產生而分斷基板。藉此分斷為形成於基板之各個別之單位要素(製品)。Specifically, the beam spot formed by the laser beam is used, and the beam spot is relatively moved to the glass substrate G held on the stage while the beam spot is separated from the trigger portion formed before the edge of the glass substrate G. The line is scanned and heated. Thereby, a compressive stress is generated on the predetermined line. Then, the cooling mechanism is quenched so as to follow the heated portion. As described above, a tensile stress region is generated in the rear portion of the compressive stress region, and the stress distribution in the front and rear directions causes cracks to pass through the glass substrate G to separate the substrate. Thereby, it is divided into individual unit elements (products) formed on the substrate.
專利文獻1：日本特開2004-155159號公報Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-155159
專利文獻2：日本特開2001-170786號公報Patent Document 2: Japanese Laid-Open Patent Publication No. 2001-170786
近年來，為了追求單位要素(製品)之輕量化，被要求使玻璃基板之板厚較薄。因此，逐漸使用板厚0.1mm以下之薄玻璃基板做為基板。In recent years, in order to reduce the weight of a unit element (product), it is required to make the thickness of the glass substrate thin. Therefore, a thin glass substrate having a thickness of 0.1 mm or less is gradually used as a substrate.
然而，若欲使用雷射光束於X-Y方向交叉切割，在於X方向或Y方向之任一方掃瞄雷射光束時，由於板厚非常薄而被完全分斷(全切)，無法交叉切割。因此，在使用此種薄玻璃基板之場合，如圖6(a)所示，先於玻璃基板G之一端緣形成X方向用之觸發部T1 ，從此觸發部T1 往X方向掃瞄雷射光束而將如圖6(b)所示之長方形之玻璃基板G3 完全分斷(全切)。其次，於長方形玻璃基板G3 之端緣設Y方向用之觸發部T3 ，從此觸發部T3 往Y方向掃瞄雷射光束而完全分斷(全切)為個別之單位要素。However, if the laser beam is to be cross-cut in the XY direction, and the laser beam is scanned in either the X direction or the Y direction, it is completely broken (full cut) due to the very thin thickness, and it is impossible to cross-cut. Thus, in the case of using such a thin glass substrate, FIG. 6 (a), the first glass substrate G on one edge of the trigger is formed with a portion of the X-direction T 1, T 1 from the trigger portion to scanning direction X Ray The light beam is irradiated to completely separate (completely cut) the rectangular glass substrate G 3 as shown in Fig. 6(b). Next, in the rectangular glass substrate G 3 in the Y direction is provided with edge portions of the trigger T 3, T 3 from the trigger section in the Y direction while scanning the laser beam completely breaking (full cut) for individual elements of the unit.
如上述操作而被分斷之單位要素G4 係如圖6(c)所示，於全部皆於雷射光束照射面側之端緣有觸發部T1 或觸發部T3 之痕跡殘留。觸發部之存在使外觀變差。因此，若將觸發部做為傷痕殘存之單位要素從製品排除，會連一個良品都無法獲得。As shown in FIG. 6(c), the unit element G 4 that has been divided as described above has traces of the trigger portion T 1 or the trigger portion T 3 remaining on the edge of the laser beam irradiation surface side. The presence of the trigger portion deteriorates the appearance. Therefore, if the trigger unit is excluded from the product as a unit element of the residual flaw, even a good product cannot be obtained.
此外，即使容許有觸發部之痕跡殘留之單位要素做為製品，如圖7所示，可能於觸發部做成時於觸發部前端附 近有小傷痕產生，此等觸發部、傷痕會於作為表面之玻璃基板之雷射光束照射面之一部分成為誘發微小裂痕之原因，故端面強度會劣化。此外，有導致對形成於單位要素之表面之電子電路等帶來電路切斷等重大之惡影響之虞。In addition, even if the unit element remaining with the trace of the trigger portion is allowed to be used as the product, as shown in FIG. 7, it may be attached to the front end of the trigger portion when the trigger portion is formed. There is a small flaw in the vicinity, and such a trigger portion or a flaw causes a slight crack in the portion of the laser beam irradiation surface of the glass substrate as the surface, so that the end surface strength is deteriorated. Further, there is a significant adverse effect on the electronic circuit or the like formed on the surface of the unit element.
另外，若以形成電子電路等之側之面為「表面」，將觸發部形成於「背面」側，從「背面」側進行雷射照射及冷媒噴射，關於表面便不會有觸發部之傷痕產生。然而，若為了向「背面」照射雷射而載置為將反面即「表面」側接觸平台並進行雷射照射，會因與平台面之摩擦而有電子電路之破損或污損等問題產生。因此，有持續載置為「背面」側接觸平台面並加工之必要。在此場合，由於雷射光束不得不從「背面」接觸之平台之下側照射，故加工裝置之構成或加工步驟無論如何都會變複雜，技術上之困難度增加且裝置成本増大。In addition, when the surface on the side where the electronic circuit or the like is formed is the "surface", the trigger portion is formed on the "back surface" side, and the laser irradiation and the refrigerant ejection are performed from the "back surface" side, and the trigger portion is not scratched on the surface. produce. However, if the laser is irradiated to the "back surface" and the "surface" side is placed on the opposite side and the laser beam is irradiated, there is a problem that the electronic circuit is damaged or stained due to friction with the land surface. Therefore, it is necessary to continuously place the "back side" side contact platform surface and process it. In this case, since the laser beam has to be irradiated from the lower side of the platform on which the "back surface" is in contact, the composition or processing steps of the processing apparatus are complicated in any case, the technical difficulty is increased and the apparatus cost is large.
針對上述問題，本發明係以提供在於板厚0.1mm以下之薄玻璃基板上形成有單位要素(製品)之場合，以不影響單位要素之方式分斷之方法為目的。In order to solve the above problems, the present invention has been made in such a manner that a unit element (product) is formed on a thin glass substrate having a thickness of 0.1 mm or less, and the method is not affected by the unit element.
為了達成上述目的，在本發明係採用如下之技術手段。亦即，本發明之基板分斷方法係一種脆性材料基板之分斷方法，在板厚0.1mm以下之脆性材料基板單側面之端緣於分斷預定線之基端部形成觸發部；藉由從設有此觸發部之面之相反側之面以相對於觸發部之位置為起點使雷射光束之光束點沿分斷預定線掃瞄並隨之使冷媒對加熱部分 噴射而將基板從分斷預定線分斷。In order to achieve the above object, the following technical means are employed in the present invention. That is, the substrate breaking method of the present invention is a method for breaking a substrate of a brittle material, and a trigger portion is formed at a base end portion of a single side surface of the brittle material substrate having a thickness of 0.1 mm or less at a base end portion of the breaking predetermined line; Scanning the beam spot of the laser beam along the predetermined line from the surface opposite to the surface on which the trigger portion is provided with respect to the position of the trigger portion, and then bringing the refrigerant to the heating portion The substrate is separated by the ejection from the predetermined line of division.
根據本發明之分斷方法，在板厚0.1mm以下之基板係與板厚較厚之場合(0.3mm以上)不同，即使在於基板端形成龜裂時從與設有龜裂之面之相反側之面照射雷射之場合，龜裂亦可做為觸發部發揮作用。因此，從與設有觸發部(初期龜裂)之面之相反側之面以相對於觸發部之位置為起點使雷射光束沿分斷預定線掃瞄而分斷。因此可以於分斷後於雷射光束照射面側之端緣沒有觸發部且無傷痕之漂亮之狀態分斷。藉此，於分斷後之製品沒有觸發部之漂亮之表面(雷射光束照射面)與有觸發部或小傷痕被明確區分，可選擇漂亮之表面做為電子電路形成等之使用面，可將起因於微小裂痕之電路之切斷等防患於未然。According to the breaking method of the present invention, when the thickness of the substrate having a thickness of 0.1 mm or less is different from the thickness of the substrate (0.3 mm or more), the crack is formed on the opposite side of the surface from which the crack is formed. When the surface is irradiated with a laser, the crack can also function as a trigger. Therefore, the laser beam is scanned along the predetermined line from the surface on the side opposite to the surface on which the trigger portion (initial crack) is provided, and the laser beam is cut along the line to be broken. Therefore, it is possible to break the state in which the end portion of the laser beam irradiation surface side has no trigger portion and no flaws after the break. Therefore, the beautiful surface (the laser beam irradiation surface) of the product without the trigger portion is clearly distinguished from the trigger portion or the small flaw, and the beautiful surface can be selected as the use surface for forming an electronic circuit or the like. The cutting of the circuit caused by the micro cracks is prevented.
本發明中，在板厚0.1mm以下之脆性材料基板單側面之端緣於第1分斷預定線之基端部形成第1觸發部；藉由從設有此第1觸發部之面之相反側之面以相對於第1觸發部之位置為起點使雷射光束之光束點沿第1分斷預定線掃瞄並隨之使冷媒對加熱部分噴射而將基板分斷為長方形；其次，在被分斷為長方形之基板之形成有前述第1觸發部之相同單側面之端緣於與前述第1分斷預定線正交之第2分斷預定線之基端部形成第2觸發部；藉由從設有此第2觸發部之面之相反側之面以相對於第2觸發部之位置為起點使雷射光束之光束點沿第2分斷預定線掃瞄並隨之使冷媒對加熱部分噴射而將基板分斷為單位要素亦可。In the present invention, the first trigger portion is formed at the end portion of the first side of the first breaking line at the edge of one side of the brittle material substrate having a thickness of 0.1 mm or less; by the opposite side from the surface on which the first trigger portion is provided The side surface scans the beam spot of the laser beam along the first predetermined line with respect to the position of the first trigger portion, and then causes the refrigerant to be ejected to the heating portion to break the substrate into a rectangle; secondly, a second trigger portion is formed on a base end portion of the substrate on which the first trigger portion is formed, and the end portion of the same one side surface of the first trigger portion is formed on a second branch line that is orthogonal to the first predetermined line to be broken; By scanning the beam spot of the laser beam from the position opposite to the surface on which the second trigger portion is provided with respect to the position of the second trigger portion along the second predetermined line, and then bringing the refrigerant pair The heating portion may be ejected to separate the substrate into unit elements.
藉此，可不於表面形成觸發部痕跡而確實製作於縱橫具有分斷面之單位要素(製品)。Thereby, it is possible to surely produce a unit element (product) having a cross section in the vertical and horizontal directions without forming a trace of the trigger portion on the surface.
於以下基於顯示其實施形態之圖式詳細說明本發明之分斷方法之詳細。The details of the breaking method of the present invention will be described in detail below based on the drawings showing the embodiments thereof.
圖1為顯示本發明之分斷方法之實施態樣之立體圖，圖2為顯示第1觸發部與第1方向(X方向)之分斷預定線之玻璃基板之立體圖，圖3為顯示第2觸發部與第2方向(Y方向)之分斷預定線之長方形玻璃基板之立體圖，圖4為被分斷為單位要素之玻璃基板之立體圖。1 is a perspective view showing an embodiment of a breaking method of the present invention, and FIG. 2 is a perspective view showing a glass substrate in which a first trigger portion and a first direction (X direction) are divided, and FIG. 3 is a second view. A perspective view of a rectangular glass substrate in which a trigger portion is separated from a predetermined direction in the second direction (Y direction), and FIG. 4 is a perspective view of a glass substrate that is divided into unit elements.
以本發明方法分斷之玻璃基板1係以0.1mm以下之薄板厚形成，被以適當之固定機構，例如空氣吸引機構等保持於支持平台2。於玻璃基板1上縱橫地形成有多數之單位要素(成為製品之單位)。The glass substrate 1 divided by the method of the present invention is formed to have a thin plate thickness of 0.1 mm or less, and is held by the support platform 2 by an appropriate fixing means such as an air suction mechanism. A plurality of unit elements (units of products) are formed vertically and horizontally on the glass substrate 1.
於支持平台2之上方設有做為為了將載置於支持平台2上之玻璃基板1沿分斷預定線分斷而使基板1產生局部性之壓縮應力之加熱手段之雷射光學系統3、以及藉由追隨此雷射光學系統3並冷卻已加熱之區域來使拉伸應力產生並使貫通裂痕沿分斷預定線進展之冷卻機構4。於冷卻機構4之前端安裝有噴射冷煤之噴嘴4a。Above the support platform 2, a laser optical system 3 is provided as a heating means for causing the substrate 1 to generate a local compressive stress in order to break the glass substrate 1 placed on the support platform 2 along the predetermined dividing line. And a cooling mechanism 4 that generates tensile stress by following the laser optical system 3 and cooling the heated region, and progressing through the crack along the predetermined line. A nozzle 4a for spraying cold coal is attached to the front end of the cooling mechanism 4.
雷射光學系統3及冷卻機構4係以雷射光學系統3在前排列為一列，被共通之保持構件5支持，形成為可相對搭載玻璃基板1之支持平台2沿排列方向移動。The laser optical system 3 and the cooling mechanism 4 are arranged in a row in front of the laser optical system 3, and are supported by the common holding member 5 so as to be movable in the arrangement direction with respect to the support platform 2 on which the glass substrate 1 is mounted.
於支持平台2之下方設有可藉由升降機構上下移動之刀輪8。Below the support platform 2, a cutter wheel 8 that can be moved up and down by a lifting mechanism is provided.
基板1之端緣係以比支持平台2之端稍往外側伸出之狀態被載置。在沿分斷預定線分斷時，在玻璃基板1之端緣於沿X方向之第1分斷預定線6a之基端部形成第1觸發部7a。第1觸發部7a係藉由使刀輪衝撞端緣來形成。The end edge of the substrate 1 is placed in a state of being slightly extended outward from the end of the support platform 2. When the cutting is performed along the line to be divided, the first trigger portion 7a is formed at the base end portion of the first predetermined breaking line 6a in the X direction at the edge of the glass substrate 1. The first trigger portion 7a is formed by causing the cutter wheel to collide with the end edge.
如圖1、圖2所示，對設有此第1觸發部7a之面之背面側，以相對於第1觸發部7a之位置為起點使雷射光學系統3及冷卻機構4沿第1分斷預定線6a相對移動。藉此，以因雷射光束之加熱而產生之壓縮應力與因冷卻機構4之急冷而產生之拉伸應力之前後方向之分布將玻璃基板1分斷為如圖3所示之橫長之長方形之基板1a。在此場合，由於玻璃基板1之板厚為0.1mm以下而較薄，故不會因前後方向之壓縮應力與拉伸應力而以位於相反面之第1觸發部7a為起點形成刻劃槽而會被突然分斷。As shown in FIG. 1 and FIG. 2, the laser optical system 3 and the cooling mechanism 4 are along the first point with respect to the position of the first trigger portion 7a on the back side of the surface on which the first trigger portion 7a is provided. The broken planned line 6a is relatively moved. Thereby, the glass substrate 1 is divided into a horizontally long rectangular shape as shown in FIG. 3 by the distribution of the compressive stress generated by the heating of the laser beam and the tensile stress generated by the rapid cooling of the cooling mechanism 4. Substrate 1a. In this case, since the thickness of the glass substrate 1 is 0.1 mm or less, the dicing groove is not formed by the first trigger portion 7a located on the opposite side from the compressive stress in the front-rear direction and the tensile stress. Will be suddenly broken.
其次，在被分斷為長方形之玻璃基板1a之形成有第1觸發部7a之相同面之端緣使用刀輪8於與第1分斷預定線6a正交而於Y方向延伸之第2分斷預定線6b之基端部形成第2觸發部7b。Then, the edge of the same surface on which the first trigger portion 7a is formed in the rectangular glass substrate 1a is divided into the second branch extending in the Y direction orthogonal to the first dividing line 6a using the cutter wheel 8 The base end portion of the broken planned line 6b forms the second trigger portion 7b.
對設有此第2觸發部7b之面之背面側，以相對於第2觸發部7b之位置為起點使雷射光學系統3、冷卻機構4沿第2分斷預定線6b相對移動。On the back side of the surface on which the second trigger portion 7b is provided, the laser optical system 3 and the cooling mechanism 4 are relatively moved along the second predetermined line 6b with respect to the position of the second trigger portion 7b.
藉此，以位於相反面之第2觸發部7b為起點，以前後方向之壓縮應力與拉伸應力之應力分布將玻璃基板1a分斷 為如圖4所示之單位要素1b。Thereby, the glass substrate 1a is separated by the stress distribution of the compressive stress and the tensile stress in the front and rear directions starting from the second trigger portion 7b on the opposite side. It is a unit element 1b as shown in FIG.
如上述被分斷之單位要素1b於雷射光束照射面側之端緣沒有觸發部之痕跡殘留。藉此，分斷後之製品係以無觸發部之漂亮之表面形成。因此，可選擇無觸發部之漂亮之表面做為電子電路等之使用面，可將起因於微小裂痕之電路之切斷等防患於未然。The unit element 1b that has been divided as described above has no trace of the trigger portion on the edge of the laser beam irradiation surface side. Thereby, the product after the division is formed with a beautiful surface without a trigger portion. Therefore, the beautiful surface of the non-trigger portion can be selected as the use surface of the electronic circuit or the like, and the cutting of the circuit due to the micro crack can be prevented.
以上雖已針對本發明之代表性之實施例說明，但本發明並非特定於上述之實施形態者，可在達成其目的且不超出申請專利範圍之範圍內適當修正、變更。The present invention has been described with reference to the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described above, and may be appropriately modified or changed without departing from the scope of the invention.
[產業上之可利用性][Industrial availability]
本發明之分斷方法除玻璃基板外，亦可利用於將由矽、陶瓷、化合物半導體等脆性材料構成之薄板厚之基板分斷之場合。In addition to the glass substrate, the breaking method of the present invention can also be used in the case of dividing a substrate having a thin plate thickness composed of a brittle material such as tantalum, ceramic or compound semiconductor.
1‧‧‧玻璃基板1‧‧‧ glass substrate
1a‧‧‧被分斷為長方形之玻璃基板1a‧‧‧ is divided into rectangular glass substrates
1b‧‧‧被分斷為單位要素之玻璃基板1b‧‧‧ glass substrate that was broken into unit elements
2‧‧‧支持平台2‧‧‧Support platform
3‧‧‧雷射光學系統3‧‧‧Laser optical system
4‧‧‧冷卻機構4‧‧‧Cooling mechanism
4a‧‧‧噴嘴4a‧‧‧Nozzles
6a‧‧‧第1分斷預定線6a‧‧‧1st break line
6b‧‧‧第2分斷預定線6b‧‧‧2nd break line
7a‧‧‧第1觸發部7a‧‧‧1st trigger
7b‧‧‧第2觸發部7b‧‧‧2nd trigger
圖1為顯示實施本發明之分斷方法之一實施態樣之立體圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an embodiment of a breaking method embodying the present invention.
圖2為顯示第1觸發部與第1方向(X方向)之分斷預定線之玻璃基板之立體圖。2 is a perspective view showing a glass substrate in which a first trigger portion and a predetermined line in the first direction (X direction) are separated.
圖3為被分斷為長方形之玻璃基板之立體圖。3 is a perspective view of a glass substrate that is divided into rectangles.
圖4為被分斷為單位要素之玻璃基板之立體圖。4 is a perspective view of a glass substrate that is broken into unit elements.
圖5為說明以往之玻璃基板之分斷方法之圖。Fig. 5 is a view for explaining a method of dividing a conventional glass substrate.
圖6為以使用以往之雷射光束之分斷方法分斷0.1mm以下之薄玻璃基板之場合之圖。Fig. 6 is a view showing a case where a thin glass substrate of 0.1 mm or less is cut by a breaking method using a conventional laser beam.
圖7為一般之觸發部形成部分之擴大立體圖。Fig. 7 is an enlarged perspective view showing a portion where a general trigger portion is formed.
1‧‧‧玻璃基板1‧‧‧ glass substrate
2‧‧‧支持平台2‧‧‧Support platform
3‧‧‧雷射光學系統3‧‧‧Laser optical system
4‧‧‧冷卻機構4‧‧‧Cooling mechanism
4a‧‧‧噴嘴4a‧‧‧Nozzles
5‧‧‧保持構件5‧‧‧Retaining components
6a‧‧‧第1分斷預定線6a‧‧‧1st break line
7a‧‧‧第1觸發部7a‧‧‧1st trigger
8‧‧‧刀輪8‧‧‧Cutter wheel
Claims (2)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010064262A JP5237318B2 (en) | 2010-03-19 | 2010-03-19 | Substrate cutting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201132443A TW201132443A (en) | 2011-10-01 |
| TWI414389B true TWI414389B (en) | 2013-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW100108061A TWI414389B (en) | 2010-03-19 | 2011-03-10 | Substrate breaking device |
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| Country | Link |
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| JP (1) | JP5237318B2 (en) |
| KR (1) | KR101256442B1 (en) |
| CN (1) | CN102219369B (en) |
| TW (1) | TWI414389B (en) |
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| JP5888158B2 (en) | 2012-04-05 | 2016-03-16 | 日本電気硝子株式会社 | Cleaving method of glass film |
| CN103848563A (en) * | 2012-11-28 | 2014-06-11 | 均豪精密工业股份有限公司 | Drilling method for brittle material |
| KR102503846B1 (en) * | 2015-10-30 | 2023-02-27 | 삼성디스플레이 주식회사 | Laser cutting apparatus |
| KR20190000792A (en) * | 2017-06-23 | 2019-01-03 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Cutter wheel and method for cutting multilayer substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1343542A (en) * | 2000-09-20 | 2002-04-10 | 精工爱普生株式会社 | Laser cutting off method, laser cutting off appts. method for mfg. liquid crystal device and appts. for mfg. same |
| JP2009078502A (en) * | 2007-09-27 | 2009-04-16 | Mitsuboshi Diamond Industrial Co Ltd | Dividing apparatus and dividing method of brittle material substrate |
| TW200950913A (en) * | 2008-04-14 | 2009-12-16 | Mitsuboshi Diamond Ind Co Ltd | Method for processing fragile material substrate |
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| JPH08231239A (en) * | 1994-12-27 | 1996-09-10 | Asahi Glass Co Ltd | Method for cutting glass ribbon and device therefor |
| JPH09150286A (en) * | 1995-06-26 | 1997-06-10 | Corning Inc | Method and apparatus for cutting brittle material |
| JP2000281375A (en) * | 1999-03-31 | 2000-10-10 | Nec Corp | Method for cracking glass substrate md cracking device therefor |
| JP2001170786A (en) * | 1999-12-10 | 2001-06-26 | Hitachi Cable Ltd | Method and device for machining substrate of non- metallic material |
| TW592868B (en) * | 2001-07-18 | 2004-06-21 | Mitsuboshi Diamond Ind Co Ltd | Device and method for scribing fragile material substrate |
| JP3792639B2 (en) * | 2002-11-08 | 2006-07-05 | 株式会社日本エミック | Cutting device |
| KR100497820B1 (en) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | Glass-plate cutting machine |
| JP2007099587A (en) * | 2005-10-07 | 2007-04-19 | Kyoto Seisakusho Co Ltd | Method of cutting brittle material |
| WO2008139585A1 (en) * | 2007-05-10 | 2008-11-20 | Toray Engineering Co., Ltd. | Mechanism for causing early crack |
| KR20090079342A (en) * | 2008-01-17 | 2009-07-22 | 케이 이엔지(주) | Glass cutting method utilizing a laser beam |
| CN101444875A (en) * | 2008-12-08 | 2009-06-03 | 浙江工业大学 | Cutting method of fragile material substrate |
-
2010
- 2010-03-19 JP JP2010064262A patent/JP5237318B2/en not_active Expired - Fee Related
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2011
- 2011-03-03 KR KR1020110018967A patent/KR101256442B1/en not_active IP Right Cessation
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1343542A (en) * | 2000-09-20 | 2002-04-10 | 精工爱普生株式会社 | Laser cutting off method, laser cutting off appts. method for mfg. liquid crystal device and appts. for mfg. same |
| JP2009078502A (en) * | 2007-09-27 | 2009-04-16 | Mitsuboshi Diamond Industrial Co Ltd | Dividing apparatus and dividing method of brittle material substrate |
| TW200950913A (en) * | 2008-04-14 | 2009-12-16 | Mitsuboshi Diamond Ind Co Ltd | Method for processing fragile material substrate |
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| Publication number | Publication date |
|---|---|
| KR101256442B1 (en) | 2013-04-19 |
| CN102219369B (en) | 2013-12-04 |
| KR20110105708A (en) | 2011-09-27 |
| JP5237318B2 (en) | 2013-07-17 |
| JP2011194723A (en) | 2011-10-06 |
| CN102219369A (en) | 2011-10-19 |
| TW201132443A (en) | 2011-10-01 |
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