JP2001170786A - Method and device for machining substrate of non- metallic material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for machining a substrate of a nonmetallic material in which the substrate of non-metallic material is firmly sucked by a vacuum when the substrate of non-metallic material is cut with a laser beam. SOLUTION: In a method for machining a substrate of non-metallic material, i.e., when a substrate 8 of non-metallic material is cut into tips of substrate with a laser beam 2-3, the substrate 8 is placed on a porous plate 17, and the substrate 8 is sucked with a vacuum on the porous plate 17 by evacuating from the lower side of the porous plate 8 and is cut with the laser beam 2-3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for processing a non-metallic material substrate for cutting a non-metallic material substrate with a laser beam into chips.

[0002]

2. Description of the Related Art A non-metallic substrate such as a glass substrate, a ceramic substrate, a semiconductor with an insulating film (Si, GaAs, InP, etc.) substrate, a sapphire substrate, a crystal substrate such as LiNbO ₃ or LiTaO ₅ is precisely formed into a small chip. There is an increasing demand for a technique for cutting.

In particular, no particles are generated at the time of division,
There is a strong demand for a technique of performing a cutting process without causing chipping to a size of several mm square in a dry process.

[0004] In response to the above demand, a technique of cutting by a non-contact, dry process using a CO ₂ laser beam has been receiving attention.

FIG. 9 is a schematic view of a conventional processing apparatus for a non-metallic material substrate using a CO ₂ laser beam.

The CO emitted from the CO ₂ laser oscillator 1
_{2 The} laser beam (parallel beam) 2-1 propagates through the hood 6 and is bent at a right angle by the
-2, and is incident on the condenser lens 4, where the beam 2-3 is condensed as indicated by the arrow, and the beam 2-3 is condensed.
3 passes through the conical gas nozzle tube 7 and passes through the non-metallic material substrate 8
Irradiated on top. The assist gases 5-1 and 5-2 are also blown onto the metal material substrate 8 through the gas nozzle tube 7.

[0007] The non-metallic material substrate 8 is placed on a work table 9 on an XYZθ moving device (or XYθ moving device) 12.
Absorbed on top.

[0010] Reference numeral 10 denotes a vacuum suction hole, and 11 denotes a vacuum exhaust device for vacuum-sucking the back surface of the substrate 8 onto the work table 9 through the vacuum suction hole 10.

The CO ₂ laser beam 2-3 is irradiated from one end of the non-metallic material substrate 8 moving in the X (or Y) direction to the other end. Thereby, the substrate 8
The substrate 8 is cracked by thermal stress, and the substrate 8 is divided by the cracking caused by the propagation of the crack.

FIG. 10 is a schematic view showing a method of dividing the non-metallic material substrate 8 into a lattice to obtain chips 13-1, 13-2,.

First, the non-metallic material substrate 8 is moved by the arrow 14-2.
Cracks 15-1, 15-2, 1
5-3,..., 15-7 are successively generated. Next, after rotating the substrate 8 by 90 °, while moving the substrate 8 in the direction of arrow 14-1, cracks 16-1, 16-2, 16-3,
16-4, and the chips 13-1, 13-
This is a method for obtaining 2.

Each of the chips 13-1, 13-2, 13-
3, the vacuum suction holes 10-1, 10-2, 10
-3,... 10-64 are provided.

[0013] When the second harmonic light and the third harmonic light of the YAG laser are used in place of the CO ₂ laser, the cutting is performed in the same manner.

[0014]

However, the conventional method and apparatus for cutting using a laser still have the following problems.

(1) When the chip size becomes several mm square or smaller, the vacuum suction holes 10 provided on the back surface of the chip surface to be divided must also have a diameter of several mm or smaller. This is because each of the divided chips must be firmly vacuum-adsorbed so as not to be blown off during the cutting process. However, when the diameter is 1 mm or smaller,
The vacuum suction force is greatly reduced, making vacuum suction difficult. It is also difficult to provide a large number of the vacuum suction holes 10 on the work table at 1 mm intervals in terms of machine dimensional accuracy (flatness of the work table).

(2) Due to the above-mentioned weak vacuum suction force, a gap is generated in the crack portion during the cleaving process, and the crack is generated when the cracks are generated in a lattice at right angles. It is difficult to divide a quadrangular (or rectangular) chip with high dimensional accuracy due to the difficulty in performing the cutting or the occurrence of discontinuous cracks in the grid-like intersection. In the worst case, there is a problem that chips are scattered during the cutting process.

(3) It is difficult to take out and transport each chip separated at the end of the cutting in a well-aligned manner.

Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a method and an apparatus for processing a non-metallic material substrate capable of firmly adsorbing the non-metallic material substrate when the non-metallic material substrate is cut by a laser beam. Is to provide.

[0019]

According to a first aspect of the present invention, there is provided a method for processing a non-metallic material substrate by cutting a non-metallic material substrate with a laser beam to form a chip-shaped substrate. A non-metallic material substrate is placed on a porous plate plate that can withstand a temperature of at least 500 ° C., and a vacuum beam is evacuated from under the porous plate plate, and the non-metallic material substrate is vacuum-adsorbed on the porous plate plate by a laser beam. This is a method for processing a nonmetallic material substrate that is to be cut.

A second aspect of the present invention is a method of processing a non-metallic material substrate by cutting a non-metallic material substrate with a laser beam to form a chip-shaped substrate, and separating and extracting each chip. Place the non-metallic material substrate on the top, evacuate the vacuum from below the porous plate plate, cut the non-metallic material substrate on the porous plate plate with the laser beam, and then cut the non-metallic material substrate with the laser beam. After bonding the UV adhesive sheet to the sheet and breaking the vacuum suction, the non-metallic material substrate is separated from the porous plate with the UV adhesive sheet, and then the UV adhesive sheet is irradiated with UV light to weaken the adhesive strength. This is a method of processing a nonmetallic material substrate in which each chip-shaped substrate is separated and taken out.

According to a third aspect of the present invention, there is provided a method of processing a non-metallic material substrate by cutting a non-metallic material substrate with a laser beam to form a chip-like substrate. Step 1 of placing a metal material substrate, and evacuating from below the porous plate plate to vacuum-adsorb the non-metal material substrate on the porous plate plate; the above-described movement while irradiating the non-metal material substrate with a laser beam Operating the device to move the non-metallic material substrate at a desired speed in the X-axis direction to generate a split crack from one end to the other end of the non-metallic material substrate; Repeating the step of generating a crack in the axial direction a plurality of times; step 2; rotating the non-metallic material substrate by 90 ° with the moving device, and irradiating the laser beam onto the non-metallic material substrate again while moving the non-metallic material substrate; Make Causing the non-metallic material substrate to move at a desired speed in the Y-axis direction to generate a split crack from one end to the other end thereof; and shifting the desired pitch in the X-axis direction to cut the split crack again in the X-axis direction. Repeating the step of generating a plurality of times; step 3; attaching a UV adhesive sheet on the surface of the non-metallic material substrate on which the lattice-shaped split cracks have occurred in the X and Y axis directions; 4; To separate the non-metallic material substrate with the UV adhesive sheet from the porous plate plate and transfer it to the transport mechanism to transport the UV adhesive sheet with UV light to weaken the adhesive force of the adhesive sheet and cut it Step 6 of separating and taking out the cracked chip-shaped substrate; a method of processing a nonmetallic material substrate comprising the above six steps.

[0022] The invention of claim 4 is characterized in that between step 1 and step 2,
Mark a scribe line in advance on one end or the other end of the non-metallic material substrate on the irradiation locus of the laser beam in the X-axis direction, or from one end to the other end, or in the vicinity of the intersection of the parts to be cut in a lattice shape. Step A is added, and between the steps 2 and 3, the non-metallic material substrate Y
4. The non-metallic material according to claim 3, further comprising a step B of engraving a scribe line in advance at one end or the other end in the axial direction, from one end to the other end, or in the vicinity of an intersection of a portion to be cut in a grid shape. This is a method for processing a material substrate.

According to a fifth aspect of the present invention, there is provided a method comprising the steps of:
A scribing line is placed in advance at one end or the other end of the non-metallic material substrate on the irradiation locus of the laser beam in the X-axis direction and the Y-axis direction, or from one end to the other end, or in the vicinity of the intersection of the portions to be cut in a grid. 3. A step C for engraving is added.
It is a processing method of the nonmetallic material substrate described in the above.

According to a sixth aspect of the present invention, there is provided a non-volatile memory device according to the fourth aspect, wherein a step D for performing the step A and the step 2 in conjunction with each other and a step E for performing the step B and the step 3 continuously. This is a method for processing a metal material substrate.

According to a seventh aspect of the present invention, as the laser beam,
7. The method for processing a nonmetallic material substrate according to claim 1, wherein a CO ₂ laser beam, a CO laser beam, a YAG laser beam, a harmonic laser beam of the YAG laser beam, and an excimer laser beam are used.

An eighth aspect of the present invention is the method for processing a nonmetallic material substrate according to any one of the first to seventh aspects, wherein the assist gas is caused to flow along the laser beam.

According to a ninth aspect of the present invention, the non-metallic material according to any one of claims 1 to 8, wherein the laser beam is irradiated on the non-metallic material substrate with an elongated linear beam having a width W and a length L. This is a method for processing a substrate.

According to a tenth aspect of the present invention, the non-metallic material substrate is processed while cooling the immediately rear side of the laser beam irradiated on the non-metallic material substrate. This is a method for processing a substrate.

According to an eleventh aspect of the present invention, in a non-metallic material processing apparatus for cutting a non-metallic material substrate with a laser beam to form a chip-like substrate, the laser beam is irradiated on a moving device in a chip-like manner. A non-metallic material substrate processing apparatus in which a porous plate plate on which a non-metallic material substrate to be cut is installed is provided, a vacuum exhaust port is formed on the lower surface of the porous plate plate, and a vacuum exhaust device is connected to the vacuum exhaust port. is there.

According to a twelfth aspect of the present invention, in a non-metallic material processing apparatus for cutting a non-metallic material substrate with a laser beam to form a chip-shaped substrate, the non-metallic material substrate is placed on a porous plate plate installed on a moving device. A first means for placing a metal material substrate, evacuating the porous plate plate from underneath and vacuum-sucking the non-metallic material substrate onto the porous plate plate, and irradiating the non-metallic material substrate with a laser beam Operating the moving device to move the non-metallic material substrate at a desired speed in the X-axis direction to generate a split crack from one end to the other end of the non-metallic material substrate, and shifting the desired pitch in the Y-axis direction. X again
A second means for repeating the step of generating a split crack in the axial direction a plurality of times;
While rotating the non-metallic substrate by 0 ° and irradiating the laser beam again on the non-metallic substrate, the moving device is operated to move the non-metallic substrate
The step of moving at a desired speed in the axial direction to generate a split crack from one end to the other end thereof, and the step of shifting the desired pitch in the X-axis direction and generating a split crack in the X-axis direction again,
A third means which is repeated a plurality of times, and a UV light is applied on the surface of the non-metallic material substrate having a lattice-shaped split crack in the X and Y axis directions.
Fourth means for attaching an adhesive sheet, fifth means for performing a vacuum break of a vacuum exhaust device to separate the non-metallic material substrate with a UV adhesive sheet from the porous plate plate, and to transfer and transfer the substrate to a transfer mechanism; A sixth means for irradiating the UV adhesive sheet with UV light to weaken the adhesive force of the adhesive sheet, and separating and taking out the chip-shaped substrate which has been split and torn; is there.

According to a thirteenth aspect, between the first means and the second means, one end or the other end in the X-axis direction of the non-metallic material substrate on the irradiation locus of the laser beam or from one end to the other end. A means (means A) for marking a scribe line in advance in the vicinity of or at the intersection of the parts to be cut into a lattice, and irradiating a laser beam between the second means and the third means One end or the other end in the Y-axis direction of the non-metallic material substrate on the trajectory,
13. The apparatus for processing a non-metallic material substrate according to claim 12, further comprising a means (means B) for engraving a scribe line in advance from one end to the other end or in the vicinity of the intersection of the parts to be cut in a grid shape. is there.

According to a fourteenth aspect of the present invention, one end or the other end or one end of the non-metallic material substrate in the X-axis direction and the Y-axis direction on the irradiation locus of the laser beam is provided between the first means and the second means. Means for marking a scribe line in advance from the end to the other end or in the vicinity of the intersection of the parts to be cut in a grid (means C)
14. The apparatus for processing a nonmetallic material substrate according to claim 13, further comprising:

According to a fifteenth aspect of the present invention, there is provided a means for performing the means A and the second means in conjunction with each other, and a means for performing the means B and the third means continuously. An apparatus for processing a non-metallic material substrate as described above.

According to a sixteenth aspect of the present invention, the laser beam is a CO ₂ laser beam, a CO laser beam, a YAG laser beam, a harmonic laser beam of the YAG laser beam, or an excimer laser beam. An apparatus for processing a non-metallic material substrate as described above.

The invention according to claim 17 is the apparatus for processing a nonmetallic material substrate according to any one of claims 11 to 16, wherein a porous plate made of ceramics or metal is used as the porous plate.

The invention of claim 18 is the apparatus for processing a nonmetallic material substrate according to any one of claims 11 to 17, wherein the assist gas is caused to flow along the laser beam.

According to a nineteenth aspect of the present invention, the non-metallic material according to any one of claims 11 to 18, wherein the laser beam is irradiated on the non-metallic material substrate with an elongated linear beam having a width W and a length L. This is a substrate processing device.

According to a twentieth aspect of the present invention, the non-metallic material substrate is processed while cooling the rear side immediately after the laser beam irradiated on the non-metallic material substrate. This is a substrate processing device.

[0039]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings.

First, the configuration of the device for cleaving a nonmetallic material substrate will be described with reference to FIG.

In FIG. 5, the same components as those described with reference to FIG. 9 have the same functions.

That is, the CO ₂ laser beam (parallel beam) 2-1 emitted from the CO ₂ laser oscillator 1 propagates in the hood 6, is bent at a right angle by the total reflection mirror 3, and propagates as indicated by the arrow. The beam 2-2 is incident on the optical lens 4, where the beam 2-2 is converged as indicated by an arrow, and the beam 2-3 passes through the conical gas nozzle tube 7 and is irradiated onto the non-metallic material substrate 8. Assist gases 5-1 and 5-
2 is also sprayed onto the metal material substrate 8 through the gas nozzle tube 7.

The non-metallic material substrate 8 is mounted on the work table 1 on the XYZθ moving device (or the XYθ moving device) 12.
9 is vacuum-adsorbed.

In the present invention, the work table 1
9 is an improvement.

That is, the work table 19 is provided with a porous plate plate 17 capable of withstanding a temperature of at least 500 ° C., the non-metallic material substrate 8 is placed on the porous plate plate 17, and the porous plate plate A work table 19 on the lower surface of 17 is provided with a vacuum exhaust port 18,
A vacuum exhaust device 11 is connected to the vacuum exhaust port 18, and the vacuum exhaust device 18 is evacuated by the vacuum exhaust device 11, so that the lower surface of the nonmetallic material substrate 8 has a porous plate 17 and a vacuum exhaust port 18. , And is suctioned onto the porous plate 17.

In the cutting process using the CO ₂ laser beam 2-3, since the instantaneous temperature rise on the back surface of the nonmetallic material substrate 8 is 500 ° C. or less, the material of the porous plate 17 is made of metal, Ceramics can be used without any problems.

The porous plate 17 has a thickness of several μm to 1 μm.
It has a structure having a large number of pores of about 00 μm. Even when the chip is divided into chips of about 1 mm square by a split crack, it is possible to sufficiently hold the non-metallic material substrate 8 on the porous plate 17 by vacuum suction. it can.

Since the surface of the porous plate 17 is much smoother than the surface of the work table 9 provided with a large number of conventional vacuum suction holes 10, the back surface of the nonmetallic material substrate 8 is smooth. Even if it is not, vacuum suction can be sufficiently performed.

FIG. 1 shows a first embodiment of the method for cleaving a non-metallic material substrate according to the present invention, and this cleaving method comprises six steps.

Non-metallic material substrates include glass, ceramics, and semiconductors with insulating films (Si, GaAs, InP,
Etc.), crystals (sapphire, LiNbO ₃ , LiTa)
O ₅ , etc.) can be used. This non-metallic material substrate is This is a method in which a small chip of about several mm square is divided by cutting into a large chip of several mm square or several tens mm square.

Step 1: First, in step 1 (S1), X
A non-metallic material substrate is placed on a porous plate installed on a moving device that can be electrically driven in the YZθ directions. This porous plate can be made of metal, ceramic, or the like. Porous plate plates from a few μm to 100 μm
It is a plate plate having a large number of pores, and if a mechanism for evacuating from below this porous plate plate is provided, the non-metallic material substrate is evacuated to the porous plate plate, and even at the time of cutting processing. It does not blow off when spraying assists. In addition, micro-sized chips (0.1 mm
Corner) is also adsorbed and fixed on the porous plate in a state where it is sufficiently adsorbed in vacuum.

Step 2: Next, in Step 2 (S2), the assisting gas is blown onto the non-metallic material substrate that has been vacuum-adsorbed, and the moving device is moved to move the non-metallic material substrate on the moving device in the X direction. While moving at the desired speed,
₂ Irradiate the laser beam from one end to the other end on the non-metallic material substrate. Thereby, a crack is generated from one end of the non-metallic material substrate and propagates to the other end. The same operation is performed to shift the non-metallic material substrate in the Y direction by a desired pitch to generate a split crack in the X direction again. Further, by repeating the above operation a plurality of times, split cracks are formed at a desired pitch in the Y direction of the non-metallic material substrate from one end to the other end of the substrate.

Step 3: Next, in step 3 (S3), the substrate is rotated by 90 ° by a moving device, and the moving device is operated while irradiating the CO ₂ laser beam onto the non-metallic material substrate while blowing the assist gas again. Then, the nonmetallic material substrate is moved at a desired speed in the Y direction to generate a split crack from one end to the other end. Then, the process of shifting the desired pitch in the X direction again to generate a split crack in the Y direction is repeated a plurality of times.

By the operation as described above, split cracks are generated on the nonmetallic material substrate in an XY lattice shape.

In the above steps 2 and 3, a CO ₂ laser having a wavelength of 10.6 μm is used as a laser oscillator. In addition, a CO laser, a YAG laser, a YAG laser A harmonic laser of a laser, an excimer laser, or the like can be used.

Next, a description will be given of a process of taking out and transporting a large number of micro-sized chips separated in the step 3 without disturbing the arrangement and finally separating and taking out each chip.

Step 4: First, in step 4 (S4), the non-metallic material substrate in which the crack was generated in step 3 is vacuum-adsorbed, and a UV adhesive sheet is attached to the substrate surface. The UV adhesive sheet uses, for example, a dicing tape manufactured by Lintec Corporation. This tape has an adhesive layer formed on the surface to which a sheet of polyolefin material is attached, and can be attached on the substrate surface.

Step 5: Next, in step 5 (S5), the vacuum of the evacuation device is broken to separate the non-metallic material substrate with the UV adhesive sheet from the porous plate substrate, transfer it to the transport mechanism and transport it. Since each chip is attached to the UV adhesive sheet, it does not peel off during transportation and fall apart.

Step 6: In the final step 6 (S6),
UV light is irradiated from the opposite side (the surface to which the non-metallic material substrate is not attached) of the UV adhesive sheet. By this UV light irradiation, the adhesive force of the UV adhesive sheet is significantly reduced (for example, the adhesive force of 300 mN / 25 mm □ is reduced to 50 mN / 25 mm □ by UV light irradiation), and each of the split and torn pieces is cut. The chips are separated and can be easily taken out from the UV adhesive sheet. Then, evaluation can be performed for each electrical or optical chip of each chip, and the chip can be mounted on a device or an apparatus.

As described above, the chip is not blown off during laser cutting and unnecessary gaps are not generated in the crack portion, and even a very small chip size can be sufficiently vacuum-adsorbed to hold the position. In addition, when removing the chip, the chip is not separated and becomes unclear, such as the position of the chip on the substrate. Finally, each chip can be tested and inspected as it is, and each chip can be taken out, or each chip can be taken out and then tested and inspected.

FIG. 2 shows a second embodiment of the method for cleaving a non-metallic material substrate according to the present invention.

In the second embodiment, the first embodiment shown in FIG.
In this embodiment, a step A is provided between steps 1 and 2, and a step B is provided between steps 2 and 3.

The above step A is performed at one end or the other end in the X direction of the non-metallic material substrate on the irradiation locus of the CO ₂ laser beam, from one end to the other end, or in the vicinity of the intersection of the portions to be cut in a lattice shape. This is a step of marking a scribe line in advance.

In the step B, one end or the other end in the Y direction of the non-metallic material substrate on the irradiation locus of the CO ₂ laser beam, or from one end to the other end, or the vicinity of the intersection of the portions to be cut in a lattice shape. This is a step of marking a scribe line in advance.

As the marking method of the scribe line, there are various conventional methods, for example, a method of forming a scribe line by irradiating a laser (YAG laser, excimer laser, etc.), a scribe line using diamond or a carbide cutter. A method of forming a scribe line using an ultrasonic vibrator,
A method of forming a scribe line with a metal file or sharpness having a sharp tip can be used.

If the scribing line is inserted in advance in the trajectory line of the laser beam as described above, it is possible to improve the promotion of the crack, the straightness of the crack, the squareness of the intersection, and the like.

FIG. 3 shows a third embodiment of the method for cutting a nonmetallic material substrate according to the present invention.

In the third embodiment, a step C is provided between steps 1 and 2 of the first embodiment shown in FIG.

In this step C, one end or the other end, or one end to the other end of the non-metallic material substrate on the irradiation locus of the CO ₂ laser beam in the X direction and the Y direction, or the portion to be cut in a lattice shape is used. This is a step of marking a scribe line in the vicinity of the intersection in advance.

FIG. 4 shows a fourth embodiment of the method for cutting a nonmetallic material substrate according to the present invention.

In the fourth embodiment, the step A and the step 2 of the second embodiment shown in FIG. 2 are performed in conjunction (step D), and the step B and the step 3 are performed. That is, the process is performed in conjunction with the process (process E).

FIG. 6 shows a specific example of the method for processing a non-metallic material substrate according to the present invention.

This processing method shows a specific example of the step D of the fourth embodiment described with reference to FIG.

[0074] That is, a CO ₂ laser beam method of fracturing while generating a crack been irradiated with CO ₂ laser beam on its scribe line while engraved marking line on the irradiation locus of.

In this example, the scribe line 20 is provided with a scribe line marking part 22 whose tip 21 is formed of a rotary diamond cutter in front of the CO ₂ laser beam.
, And then place CO ₂ on the scribe line 20.
This is a method in which a crack is generated by irradiating a laser beam 2-3, and the crack is propagated and cut.

FIG. 7 shows an embodiment in which a scribe line is imprinted on the non-metallic material substrate 8 in advance.

20-5, 20-6,... (Or 20-5) on one end 23-1 (or 23-3) of the non-metallic material substrate 8.
-1, 20-2,...), Or two marks on the other end side 23-2 (or 23-4).
0-9, 20-10 ... (or 20-11, 20-1)
Mark the scribe line as in 1, ..., or from one end 23-1 (or 23-3) to the other end 23-2.
(Or 23-4) creates a continuous scribe line at 20-7,
20-8... (Or 20-3, 20-4,...), Or 20-9, 20-10, 20-11, 20-12, You may engrave a scribe line like ...

FIG. 8 shows the non-metallic material substrate of the present invention with the UV adhesive sheet 24 taken out of the porous plate plate 17 by using the apparatus shown in FIG. And the UV light source 25 irradiates UV light 25a from the back side of the UV adhesive sheet 24 to weaken the adhesive force of the adhesive layer.
, 13-N are separated from the UV adhesive sheet 24 and taken out.

The non-metallic material substrate 8 used in the present invention has electric circuits such as ICs and LSIs, elements such as resistors, inductances and capacitors, electric wiring patterns, optical circuits and optical wirings on the front surface, the back surface or the substrate. A pattern may be formed. The laser irradiation surface may be on either the front side or the back side of the non-metallic material substrate. Further, the shape of the non-metallic material substrate may be any shape such as a square, a circle, an ellipse and the like. Laser beam 2-
The irradiation shape on the non-metallic material substrate 3 is preferably a linear beam or an elliptical beam having a width of 1 mm or less and a length of 10 mm or more, but may be a substantially circular beam. Further, the rear side of the laser beam irradiation unit on the non-metallic material substrate 8 may be locally cooled rapidly. As a quenching method, a method of blowing a refrigerant gas is preferable.

[0080]

In summary, according to the present invention, the following effects can be obtained.

(1) Since the entire back surface of the substrate is uniformly and very strongly vacuum-sucked, when the chip is cut into small-sized chips, the cut chip may be blown off by an assist gas, or the chips may be separated from each other. Even if there is a gap between them, the cutting dimensional accuracy does not decrease.

(2) At the end of cleaving, the state of the cleaved substrate is kept as it is, that is, a UV adhesive sheet can be attached to the surface of the substrate so as to prevent chips from falling apart and conveyed to another location. . Then, the electrical or optical characteristics of each chip on the cut substrate that has been transported can be evaluated without separating the chips, or a UV light source is irradiated on the UV adhesive sheet to apply each chip. It can be separated and evaluated for electrical or optical properties as described above.

(3) Since the porous plate plate has a very smooth surface, even if the cut chip is a minute one having a size of mm, the chip is not blown off during the cutting process and is placed on the porous plate plate. Vacuum adsorption is possible.

(4) The whole substrate can be taken out of the processing apparatus and transported, so that the total throughput time can be shortened. That is, it is possible to greatly reduce the time as compared with removing each chip one by one from the processing device after the cutting.

(5) Also, the cut substrate is taken out of the processing apparatus, and the chip surface pattern can be inspected, the electrical or optical characteristics can be evaluated on the substrate, and only non-defective products can be separated. Even in the above-described steps, the time can be significantly reduced, and as a result, chips can be produced at low cost.

(6) Since a porous plate plate is used, a single porous plate plate can be generally used even when cutting chips of an arbitrary size, and manufacturing equipment costs and trial calculation costs are reduced. Can be cheaper.

[Brief description of the drawings]

FIG. 1 is a view showing a first embodiment of a processing method according to the present invention.

FIG. 2 is a view showing a second embodiment of the processing method of the present invention.

FIG. 3 is a view showing a third embodiment of the processing method of the present invention.

FIG. 4 is a view showing a fourth embodiment of the processing method of the present invention.

FIG. 5 is a diagram showing an embodiment of the processing apparatus of the present invention.

FIG. 6 is a schematic perspective view illustrating a specific example of a process D according to a fourth embodiment of the present invention.

FIG. 7 is a diagram showing an example of marking a scribe line in advance on a non-metallic material substrate by the processing method of the present invention.

FIG. 8 is a diagram showing a method for holding a non-metallic material substrate which has been subjected to a cleaving process, a conveying means, and a method for separating chips according to the present invention.

FIG. 9 is a view showing a conventional processing apparatus.

FIG. 10 is a view showing a conventional processing method.

[Explanation of symbols]

 2-3 Laser beam 8 Non-metallic material substrate 11 Vacuum exhaust device 17 Porous plate plate 18 Vacuum exhaust port 19 Moving device

Claims (20)

[Claims] In a method of processing a nonmetallic material substrate into a chip-like substrate by cutting the nonmetallic material substrate with a laser beam, the nonmetallic material substrate is placed on a porous plate plate that can withstand a temperature of at least 500 ° C. A method of processing a non-metallic material substrate, comprising evacuating from below the porous plate plate and cutting the non-metallic material substrate with a laser beam while vacuum-absorbing the non-metallic material substrate on the porous plate plate. 2. A method of processing a non-metallic material substrate by cutting a non-metallic material substrate with a laser beam into a chip-shaped substrate, and separating and taking out each chip. Place the substrate, evacuate the bottom of the porous plate and evacuate the non-metallic material substrate on the porous plate plate with the laser beam, and then apply the UV adhesive sheet to the cut non-metallic material substrate sheet. After breaking the vacuum suction, the non-metallic material substrate is separated from the porous plate plate together with the UV adhesive sheet, and then the UV adhesive sheet is irradiated with UV light to weaken the adhesive strength and each chip-shaped substrate A nonmetallic material substrate, wherein the substrate is separated and taken out. 3. A method of processing a non-metallic material substrate by cutting a non-metallic material substrate with a laser beam to form a chip-shaped substrate, wherein the non-metallic material substrate is placed on a porous plate plate installed on a moving device. Evacuating from below the porous plate plate and vacuum-sucking the non-metallic material substrate onto the porous plate plate; step 1: operating the moving device while irradiating the non-metallic material substrate with a laser beam. Non-metallic substrate X
A step of moving at a desired speed in the axial direction to generate a split crack from one end to the other end of the non-metallic material substrate; and a step of shifting the desired pitch in the Y-axis direction and generating a split crack again in the X-axis direction. Step 2 is repeated a plurality of times; rotating the non-metallic material substrate by 90 ° by the moving device, irradiating the laser beam onto the non-metallic material substrate again, and operating the moving device to move the non-metallic material substrate in the Y-axis direction. Moving at a desired speed in the direction to generate a split crack from one end to the other end,
Repeating the step of shifting the desired pitch in the X-axis direction and generating a crack again in the X-axis direction a plurality of times; Step 3; the surface of the non-metallic material substrate in which the lattice-shaped split cracks have occurred in the X- and Y-axis directions Step 4 of attaching a UV adhesive sheet thereon; Step 5 of performing a vacuum break of a vacuum exhaust device to separate a non-metallic material substrate with a UV adhesive sheet from a porous plate plate and transferring it to a transport mechanism for transport 5; Irradiating the substrate with UV light to weaken the adhesive strength of the adhesive sheet, and separating and taking out the cleaved chip-shaped substrate; 5; a non-metallic material substrate comprising: Processing method. 4. Between the step 1 and the step 2, a part of the non-metallic material substrate on the irradiation locus of the laser beam, which is cut at one end or the other end in the X-axis direction, or from one end to the other end, or in a lattice shape. A step A of marking a scribe line in the vicinity of the crossing portion of the non-metallic material substrate in the Y-axis direction on the irradiation locus of the laser beam between the second step and the third step. 4. The non-metallic substrate according to claim 3, further comprising a step B of engraving a scribe line in advance at one end or the other end, or from one end to the other end, or in the vicinity of an intersection of a portion to be cut in a lattice shape. Processing method. 5. A method according to claim 1, wherein the non-metallic material substrate on the irradiation locus of the laser beam in the X-axis direction and the Y-axis direction has one end or the other end, or one end to the other end, or a lattice shape. 4. The method for processing a nonmetallic material substrate according to claim 3, further comprising a step C of engraving a scribe line in the vicinity of the intersection of the part to be cut. 6. The processing of a non-metallic material substrate according to claim 4, wherein a step D in which step A and step 2 are performed in conjunction with each other and a step E in which step B and step 3 are performed in succession. Method. 7. The non-metallic material according to claim 1, wherein a CO ₂ laser beam, a CO laser beam, a YAG laser beam, a harmonic laser beam of the YAG laser beam, or an excimer laser beam is used as the laser beam. Substrate processing method. 8. The method for processing a nonmetallic material substrate according to claim 1, wherein an assist gas is caused to flow along the laser beam. 9. The method for processing a nonmetallic material substrate according to claim 1, wherein the laser beam is irradiated on the nonmetallic material substrate with an elongated linear beam having a width W and a length L. 10. The method for processing a non-metallic material substrate according to claim 1, wherein the non-metallic material substrate is processed while cooling immediately behind a laser beam irradiated on the non-metallic material substrate. 11. A non-metallic material processing apparatus for cutting a non-metallic material substrate by a laser beam into a chip-shaped substrate, wherein the non-metallic material is cut into chips in a moving device irradiated with the laser beam. An apparatus for processing a non-metallic material substrate, comprising: a porous plate on which a substrate is placed; a vacuum exhaust port formed on a lower surface of the porous plate; and a vacuum exhaust device connected to the vacuum exhaust port. 12. A non-metallic material substrate processing apparatus for cutting a non-metallic material substrate with a laser beam to form a chip-shaped substrate, wherein the non-metallic material substrate is placed on a porous plate placed on a moving device. First means for evacuating the non-metallic material substrate to vacuum on the porous plate plate by evacuating from the bottom of the porous plate plate, and operating the moving device while irradiating the non-metallic material substrate with a laser beam Causing the non-metallic material substrate to move at a desired speed in the X-axis direction to generate a split crack from one end to the other end of the non-metallic material substrate; and shifting the desired pitch in the Y-axis direction and again in the X-axis direction. A second means for repeating the step of generating a split crack a plurality of times; rotating the non-metallic material substrate by 90 ° with the moving device;
Irradiating the laser beam on the non-metallic material substrate again, operating the moving device to move the non-metallic material substrate at a desired speed in the Y-axis direction to generate a split crack from one end to the other end thereof; With the desired pitch shifted in the X-axis direction
A third means for repeating the step of generating a split crack in the axial direction a plurality of times, and applying a UV adhesive sheet on the surface of the non-metallic material substrate having the grid-shaped split crack in the X and Y axes. A fourth means for attaching, a fifth means for performing a vacuum break of a vacuum exhaust device to separate the non-metallic material substrate with the UV adhesive sheet from the porous plate plate, and transferring and transferring the same to the transport mechanism. Sixth means for irradiating UV light to weaken the adhesive force of the adhesive sheet and separating and taking out the cleaved chip-shaped substrate. 13. A non-metallic material substrate on a laser beam irradiation trajectory in the X-axis direction, between one end and the other end, or from one end to the other end, or in a lattice shape between the first means and the second means. A means (means A) for marking a scribe line in advance near the intersection of the part to be cut, and a non-metallic part on the laser beam irradiation locus between the second means and the third means. A means (means B) for marking a scribe line in advance at one end or the other end in the Y-axis direction of the material substrate, from one end to the other end, or near the intersection of the portion to be cut in a grid shape is added. The apparatus for processing a nonmetallic material substrate according to claim 12. 14. An X-axis direction and a Y-axis direction of a non-metallic material substrate on a laser beam irradiation locus between a first means and a second means.
14. A means (means C) for engraving a scribe line in advance at one end or the other end in the axial direction, from one end to the other end, or in the vicinity of an intersection of a part to be cut in a lattice shape. Non-metallic material substrate processing equipment. 15. The non-metallic material according to claim 14, further comprising means for performing the means A and the second means in conjunction with each other, and means for performing the means B and the third means continuously. Substrate processing equipment. 16. The laser beam may be a CO ₂ laser beam, a CO laser beam, a YAG laser beam, a YAG laser beam.
The non-metallic material substrate processing apparatus according to any one of claims 11 to 15, wherein a harmonic laser beam or an excimer laser beam of a laser beam is used. 17. A porous plate plate made of ceramics or metal is used as the porous plate plate.
6. The processing apparatus for a non-metallic material substrate according to any one of 6. 18. The non-metallic material substrate processing apparatus according to claim 11, wherein an assist gas is caused to flow along the laser beam. 19. The apparatus for processing a nonmetallic material substrate according to claim 11, wherein the laser beam is irradiated onto the nonmetallic material substrate with an elongated linear beam having a width W and a length L. 20. The non-metallic material processing apparatus according to claim 11, wherein the non-metallic material substrate is processed while cooling immediately behind the laser beam irradiated on the non-metallic material substrate.