JP2009078502A - Dividing apparatus and dividing method of brittle material substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dividing apparatus and a method for dividing a workpiece while keeping it in a nearly free supported state. <P>SOLUTION: The dividing apparatus of the brittle material substrate with at least an initial crack formed therein, having the brittle material substrate placed on a processing table 1 so that the vicinity of a dividing scheduled line becomes a nearly free supported state, is constituted of a crack growing means and a crack growth suppressing means. A dividing control device 5 wherein the crack growth suppressing means is placed ahead of the crack growing means, is kept in a nearly non-contact state with the brittle material substrate, and is moved from the initial crack of the brittle material along the dividing scheduled line to divide the brittle material substrate linearly or curvedly. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cleaving apparatus for a brittle material substrate such as glass, ceramics, and a semiconductor wafer, and a bonded substrate such as a liquid crystal display panel substrate, and a cleaving method thereof.

In general, when a plurality of unit substrates are manufactured from a mother substrate by cleaving (dividing) the mother substrate made of the brittle material substrate as described above, the brittle material substrate to be the mother substrate (hereinafter, unless otherwise specified) The "work" is positioned and fixed on the processing table of the scribing device, and a scribe line is first formed and then cleaved (divided). As means for forming a scribe line, a processing apparatus using a cutter wheel as disclosed in Patent Document 1 and a processing apparatus using a laser as disclosed in Patent Document 2 are known. On the other hand, as means for dividing (breaking), there are known a device using a break bar as described in Patent Document 3 and Patent Document 4, and a device using pressurized air as described in Patent Document 5 and Patent Document 6.
JP-A-9-188534 Japanese National Patent Publication No. 8-509947 JP-A-6-279042 JP 63-166734 A JP 2001-347497 A JP 2004-214262 A

However, even if the techniques disclosed in the above patent documents are used, no means for cleaving a workpiece that are superior in terms of straightness of the scribe line, cross-sectional quality after cutting, and production efficiency has been found. It is.
The main cause is thought to depend on the attributes of the brittle material. That is, for example, when a glass substrate is scribed with a cutter wheel, the crack progresses linearly at a high speed over a length of about 2 to 5 times the plate thickness (preceding phenomenon or unstable fracture) and stops. This is thought to be due to the large energy of initiation when cracks (breaking), one of the attributes of brittle materials, begin to develop. For example, even when it is desired to cleave in a circle, the actual cleaving process is easy to bend the scribe line, and it is difficult to cleave the curved curve. What is particularly necessary when cleaving a plate made of a brittle material is that it is technically capable of cleaving on a so-called curve with a complicated shape, and chipping and minute damage in the cleaved section and its vicinity during cleaving It is no exaggeration to say that the two points are not accompanied by cracks. In particular, chipping and fine cracks remarkably reduce the strength of the product. Therefore, it can be said that in order to maintain the strength of the product, it is necessary to maintain the state of the processed surface well (no scratches and smooth).

  Let us take a concrete look at these phenomena. First, regarding the relationship between the workpiece and the machining table, the machining is usually performed with the workpiece positioned and fixed on the machining table. Taking the break as an example, the following problems occur. If it demonstrates based on Fig.17 (a), it will be a relationship with friction resistance first. Here, for convenience of explanation, the lower surface of the workpiece is supported at two points A and B (exactly two lines), and the load is applied from one point on the upper surface (one line). We will explain in. That is, when a load (P) is applied to the workpiece, the circumference of the workpiece is extended, so the friction resistance between the fulcrum (A, B) and the workpiece [= 1/2 × P × μ × b (μ: friction coefficient, b: width)] acts, it is necessary to use a load P that is large enough to overcome it. Further, when an elastic body 70 such as a mat is laid between the processing table and the work in order to prevent the work from being damaged during breaks (breaking) (see FIG. 18 described later), the elastic body is subjected to shear deformation. Resistance acts on the workpiece, increasing the load (P).

  On the other hand, if the workpiece is not fixed by being lifted from the processing table (hereinafter referred to as “free support state” or “a state close to the free support state”), the friction coefficient (μ) of gas and solid (work) is Although it is known that the load (P) can be reduced by that amount because it is close to 0, at this time, the workpiece is held in a free support state or a state close to a free support state, and the workpiece is cleaved. This method is not used in actual production lines. FIG. 17B shows a case where cracks are formed obliquely and a draft is given to the work, but the phenomenon that occurs in the work is the same as in FIG. 17A.

In addition, the workpiece is positioned and fixed on the work table and divided (breaked), but the exact opposite side of the scribe line formed in the scribe process is positioned and pressed by the pressing means (for example, break bar). It is important to consider that even loads are applied to the left and right sides of the scribe line, and the workpiece size will increase in terms of the flatness of the work table in the break device and the straightness of the break bar. In this case, it becomes difficult to make the break bar come into contact with the position opposite to the scribe line formation position on the side opposite to the surface on which the scribe line is formed. Problems occur.
More specifically, there is a possibility that the pressed portion and the portion where the scribe line is formed may be slightly shifted, and the vertical crack straightness shifts when the vertical crack develops from the workpiece surface. Can happen. In addition, even if a break pressure (breaking pressure) is applied from the opposite side of the scribe line exactly over the entire length of the scribe line, there are mechanical (physical) restraint points on the left and right sides of the scribe line. In addition, there is a slight imbalance in the load change on the left and right, and as a result, vertical cracks with excellent straightness cannot be formed because the vertical crack progresses starting from a new location where the left and right loads are balanced. Situation.

  Furthermore, when an elastic body 70 such as a mat is laid between the processing table and the workpiece as shown in FIG. 18, the workpiece is processed in close contact with the elastic body even after the workpiece is split into two pieces. Since the workpiece remains adsorbed and fixed to the table and the coefficient of friction with the elastic body is large, the workpiece does not shift laterally even after being divided. Therefore, after the break bar moves upward, when the elastic body returns to its original state, the end faces of the glass pieces rub against each other, causing a problem that cullet is likely to occur at that location.

  In addition, as described above, in order to cleave a workpiece, usually, at least two steps of scribe and break (splitting) are necessary, and various devices and equipments associated therewith are necessary, and there are inconveniences and disadvantages in various aspects. It is necessary to accompany it.

Therefore, as a result of seriously reviewing the attribute of the brittle material once again when the present inventors cleave the brittle material substrate, for example, in Non-Patent Document 1, it is divided by applying an equal force on the left and right of the scribe line. If the workpiece is placed on the processing table in a free support state or a state close to the free support state, the workpiece can be moved without having to previously form a scribe line. If a notch or initial crack is formed at the beginning of the planned cutting line and a means is applied to both sides of the planned cutting line of the workpiece, and at the same time a means to suppress the pre-cracking phenomenon is provided, Therefore, the present invention has been completed in view of the fact that it is possible to obtain a workpiece having excellent straightness and cross-sectional quality after splitting with less force.
"Glass Construction Law (Vol. 1)" 60-61 (editor: National Board Glass Commerce and Cooperative Federation Vocational Training Act Business Committee, Publisher: Foundation for Vocational Training Teaching Materials, February 10, 1993, 5th edition issued )

  In order to achieve the above object, the present invention takes the following technical means. That is, the present invention is a brittle material substrate cleaving device having at least a notch, a notch or an initial crack, the cleaving plan having the notch or notch or the initial crack as a starting end and the other end as a terminating end. The brittle material substrate is placed on the processing table so that the vicinity of the line is close to a free support state, and is composed of crack growth means and crack growth suppression means, and the crack growth suppression means is located in front of the crack growth means. The cleaving control device disposed on the brittle material substrate is moved along a planned cutting line from the notch or notch or initial crack of the brittle material substrate while maintaining a state close to a non-contact state with the brittle material substrate in the previous period. Is.

  Since the cleaving apparatus of the present invention processes a workpiece while maintaining a non-contact state with the workpiece from beginning to end, damage to the workpiece is unlikely at first. Further, in order to grow and cleave while cracks are sequentially induced from a notch or an initial crack, it is possible to cleave along a straight or free-curved scribe line. Further, when pressurized air is used for the crack growth means and the crack growth suppression means, the cleaving cost per unit is extremely low. The other effects are unmistakable, but typical ones are as follows. The fractured surface is close to a mirror surface and the surface roughness is good. The split section is perpendicular to the glass surface. There is no adhesion of cullet to the cut surface. Processes such as polishing and cleaning can be greatly shortened. Since the multilayer structure plate can be cleaved, it can be applied to glass substrates for liquid crystal panel displays and plasma panel displays. Furthermore, it is only necessary to form at least a notch or an initial crack in the work, and various facilities for forming a scribe line are not required. Of course, it is needless to say that the present invention can be applied to a workpiece in which a scribe line is formed.

The details of the present invention will be described below with reference to the drawings.
FIG. 1 (a) is a schematic perspective view showing an embodiment of the cleaving device according to the present invention, and FIG. 1 (b) is a partial sectional view taken along the line AA in FIG. 1 (a). is there. A groove is formed so as to cut the central portion of the processing table 1 vertically, a porous member 3b is disposed inside the groove over the entire length, and a cavity 31 and an air supply hole 32 communicate with each other below the porous member 3b. Is formed. The workpiece 2 is placed so as to cross the porous member 3b, and the planned cutting line of the workpiece 2 is placed on the porous member 3b.

  The workpiece 2 has a notch or an initial crack 21 (hereinafter referred to as an initial crack for short notch or initial crack) formed in the center of the start end on the back side when the front side surface is the starting end, and is porous. It is mounted on the processing table 1 in a state close to a free support state in contact with the member 3b. Here, the free support state is seen at the other end (free end) of the work 2 when one end of the work 2 is depressurized (adsorbed) and fixed to the pedestal 1a as shown in FIG. 4 (a). As shown in FIGS. 4B and 4C, for example, when the both ends of a thin workpiece 2 are decompressed (adsorbed) and fixed to the processing table 1, as shown in FIGS. A state in which the center portion of the work 2 hangs down in an unforced state due to gravity. In general, when the plate thickness of the workpiece 2 is thick, the zone in a state close to such free support (the region indicated by the chain line Sb on both sides of the cutting line (dashed line Sa) in FIG. 4B) is widened. When it is thin, it becomes narrow.

The crack growth means 3 is a porous material such as a pressurizing nozzle 3a disposed on the surface side of the work 2 and close to the work 2 and a porous ceramic disposed on the back surface side of the work 2 with the work 2 interposed therebetween. And a material member 3b.
Like the crack growth means 3, the crack growth suppression means 4 is composed of a nozzle 4a disposed on both sides of the work 2 and a porous member 3b. The nozzle 4a has a wide diameter so that the pressure surface is larger than that of the nozzle 3a. The crack growth suppressing means 4 is arranged in front of the crack growing means 3 with respect to the planned cutting line of the workpiece 2, and the cleaving control device 5 is constituted by a pair of the crack growing means 3 and the crack growth suppressing means 4. Is configured.

  Here, “front” refers to the front side in the traveling direction (of cutting). Accordingly, the crack growth means 3 moves following the crack growth suppression means 4, but the separation distance between the both means 3 and 4 may be appropriately determined in consideration of the plate thickness of the workpiece 2 and the like. The drive means for both means 3 and 4 may be a normally used motor or the like, and may be determined in consideration of the environment in which the cleaving device is installed. Furthermore, the pressurizing mechanism such as air may be a commonly used compressor. Moreover, although embodiment which moves the cleaving control apparatus 5 was demonstrated here, it cannot be overemphasized that it is applicable also to embodiment which moves the workpiece | work 2 by air.

  Next, the pressure distribution of the pressurized air supplied from the air supply hole 32 to the porous member 3b through the cavity 31 is shown in FIG. 3A (however, it is shown upside down from FIG. 1). When the pressurized air is jetted from the porous member 3b, the pressure distribution is as shown in FIG. 3 if the work 2 does not exist on the surface of the porous member 3b due to the static pressure bearing action. As shown in (b), the central part and the end part are at equal pressure. (2) On the other hand, if the work 2 is present, as shown in FIG.

  In order to make the pressure uniform even when the workpiece 2 is present, for example, the size of the powder particles (in other words, the average diameter of the porous material) of the porous member 3b, that is, the density distribution is made nonuniform. More specifically, the central part is finer powder particles to increase the density and lower the gas permeability, while the end part is enlarged to lower the density and increase the gas permeability. do it. What is necessary is just to use properly by the kind etc. of the workpiece | work to cut.

  Next, the phenomenon which the crack growth means 3 (3a, 3b) which comprises a part of the cleaving control apparatus 5 exerts on the workpiece 2 will be described. As described above, the pressurized air supplied from the porous member 3b is formed on the lower surface of the workpiece 2 because the pressure distribution is high because the workpiece 2 is present, and the central portion is high and the pressure decreases toward the end portion. Although the work 2 tends to be deformed in an inverted semicircular shape with the initial crack 21 as the center (fulcrum), a part of the crack growth means 3 is placed on the surface side of the work 2 at a position facing the initial crack 21. As a result of the pressurized air being sequentially blown toward the workpiece 2 from the nozzle 3a constituting the crack, the crack grows from the initial crack 21 toward the planned cutting line and is broken. In addition, it is preferable that the air pressure of the air sprayed toward the workpiece | work 2 from the nozzle 3a and the porous member 3b is respectively equal, or the nozzle 3a is made high pressure.

  Next, the crack growth suppressing means 4 (4a, 3b) which is arranged in front of the crack growing means 3 and constitutes the cleaving control device 5 together with the crack growing means 3 will be described. The basic configuration is the same as that of the crack growth means 3. That is, a pressure nozzle 4a (a pressure pipe 4a (surface on the surface side opposite to the surface on which the initial crack 21 is formed) across the workpiece 2 and a rectangular pipe disposed close to the workpiece 2 ( The crack growth suppressing means 4 is configured by the porous member 3b disposed on the back surface side of the workpiece 2 at a position facing the nozzle 4a and having a larger area to be sprayed than the nozzle 3a.

  The operation of the crack growth suppressing means 4 configured in this way will be described. Pressurized air blown from the nozzle 4a toward the front surface side of the work 2 and blown from the porous member 3b toward the back surface side of the work 2. The part of the workpiece that is exposed to the pressurized air is in a state of being sandwiched between the air on both sides by the applied pressurized air. Since the air pressure blown from the nozzle 4a is equal to or higher than the air pressure supplied from the nozzle 3a, the elastic deformation of the work 2 elastically deformed by the crack growth means 3 is corrected, and the preceding phenomenon of the work 2 occurs. Can be prevented. When the cleaving control device 5 composed of the crack growth means 3 and the crack growth suppression means 4 configured in this way is run at a constant speed along the planned cutting line, the preceding phenomenon does not occur in the workpiece 2, Cleaving with excellent straightness and cross-section quality is performed, and gradually cleaved cross-sections are formed on the workpiece.

When the work 2 is cleaved, an air nozzle 71 for positioning is installed around the work 2 as shown in FIG. 19, or the work 2 as shown in FIGS. If a positioning pin 11 that makes point contact is used, or if a positioning mechanism comprising the positioning pin 11 and the pressing mechanism 72 that presses with a pressing spring (or air nozzle) as shown in FIG. More accurate cleaving becomes possible.
In addition, this cleaving apparatus has an advantage that it can be applied immediately by slightly changing the currently operating equipment.

  In the case of FIG. 1 (a), the member disposed on the back side of the workpiece 2 among the crack growth means 3 and the crack growth suppression means 4 constituting the cleaving control device 5 is made common as the porous member 3b. However, it may of course be configured separately.

  Next, another embodiment shown in FIG. 2 will be described. In this embodiment, the crack growth means 3 is provided with a porous member 3b at a position close to the work 2 from both sides of the work 2 and pressurizes (Pr), while the initial formed on the lower surface of the work 2 A suction device (not shown) is provided at a position close to the crack 21. That is, the suction hole 3c connected to a vacuum pump or the like is disposed at a portion of the lower surface side porous member 3b facing the initial crack 21 and sucked (Ab), thereby operating as a suction device.

  Next, crack growth suppression means is substantially the same principle as in FIG. 1 (a), and a description thereof is omitted. However, a porous member 3b disposed on both surfaces of the work 2 is provided in place of the nozzle 4a. Then, pressurized air is blown toward the work 2 from the porous members 3b on both sides of the work 2 (Pr), and at the same time, the vicinity of the initial crack 21 is gradually cleaved by the suction device disposed close to the initial crack 21. If suction (Ab) is performed along the planned line, the workpiece 2 is cleaved from the initial crack 21 without being advanced along the planned cutting line.

  Next, the embodiment shown in FIG. 5 will be described. FIG. 5 (a) is a schematic perspective view of another embodiment, FIG. 5 (b) is a cross-sectional view taken along line AA in FIG. 5 (a), and FIG. FIG. 5A is a plan view of FIG. 5A, and FIG. 5D is a schematic cross-sectional view showing a state where the workpiece 2 is in point contact with a positioning pin 11 described later. First, the configuration will be described. The processing table 1 is provided with a groove 1a at the center thereof. Contrary to the workpiece 2 described in FIG. 1, the workpiece 2 has an initial crack 21 formed on the surface side of the workpiece 2. Then, the initial crack 21 is placed at the center of the groove 1a and is placed on the processing table 1 in a state close to a free support state. The cleaving control device 5 is composed of crack growth means 3 and crack growth suppression means 4 in substantially the same manner as described in FIGS. 1 (a) and 1 (b), although the detailed structure is different. .

The crack growth means 3 will be described. On the surface side of the workpiece 2 (the side where the initial crack 21 is formed), nozzles 31a and 32a are respectively disposed on both sides of the planned cutting line starting from the initial crack 21. The crack growing means 3 is configured by disposing the nozzle 3b on the back side of the work 2 at a position substantially opposite to the initial crack 21.
The pressurized air blown from the nozzle 3b is blown from the back side of the work 2 toward the front side. The pressure distribution of the pressurized air is highest at the center position of the nozzle 3b as shown in FIG. On the other hand, the pressurized air blown from the nozzle 3a (31a, 32a) is blown from the front side to the back side of the work 2, and the pressure is equivalent to the pressure blown from the pressurizing nozzle 3b. Is preferred, but some variation is allowed. As a result, the stress is concentrated on the initial crack 21 due to the pressurized air blown from the pressure nozzles on both sides of the workpiece 2, and the crack of the workpiece 2 grows.

  Next, regarding the structure of the crack growth suppressing means 4, a nozzle 4 a is formed at a position close to the work 2 on the front surface side of the work 2, a position facing the nozzle 4 a on the back surface side of the work 2, and the work 2 The nozzle 4b is formed at a position close to the nozzle, and these form a pair to constitute the crack growth suppressing means 4. The nozzles 4a and 4b are each provided with a rectangular parallelepiped ejection body on the nozzle tip side, that is, on the side close to the workpiece 2. The pressurized air is supplied to the rectangular parallelepiped injection body through the pipes of the nozzles 4a and 4b, and plays a role of correcting the elastic deformation of the workpiece 2. In addition, the crack growth suppressing means 4 has an effect of preventing the crack from running ahead, in combination with the relationship of being arranged forward with respect to the planned cutting line from the crack growing means 3. When the cleaving control device 5 including the crack growing means 3 and the crack growth suppressing means 4 is run along the planned cutting line with the initial crack 21 of the work 2 as a starting end, the work 2 is gradually cracked, Work 2 is gradually cleaved without causing the first run.

  For reference, the nozzle 3b is arranged on the back side of the work 2 and the crack growth suppressing means 4 (4a, 4b) is arranged in front of the work 2 and these are simultaneously operated along the planned cutting line. FIG. 6A is a three-dimensional and schematic depiction of the phenomenon that occurs (for the sake of convenience, the deformation of the substrate is emphasized), and FIG. b).

  Next, the embodiment shown in FIG. 7 will be described. 7 (a) is a schematic perspective view of another embodiment, and FIG. 7 (b) is a cross-sectional view of a main part along the line AA in FIG. 7 (a). FIG. 7C is a plan view of FIG. The crack growth means 3 is substantially the same as that shown in FIG. Here, the characteristic part is the crack growth suppressing means 4 (4a, 4b), and the structure thereof will be described. First of all, it consists of a pair of hollow body nozzles 4a and 4b in the shape of alphabets U-shaped, V-shaped or horseshoe-shaped, and air is blown toward the work 2 on the surface close to the work 2 A small hole is formed. The center part (411a) of the U-shaped, V-shaped or horseshoe-shaped member is positioned on the planned cutting line starting from the initial crack 21 so as to face the front side and the back side across the workpiece 2 It is arranged. As a result of being able to correct the elastic deformation applied to the work 2 by the crack growth means 3 (3a, 3b) by the pressurized air blown toward the work 2 from the crack growth suppressing means 4, the crack pre-run phenomenon of the work 2 Can be suppressed. That is, the cleaving control device 5 including the crack growing means 3 and the crack growth suppressing means 4 disposed in front of the crack growing means 3 is moved along the planned cutting line of the work 2 while maintaining a non-contact state with the work 2. In addition, it is possible to realize excellent cleaving such as straightness and cross-sectional quality.

  Further, the embodiment shown in FIG. 8 will be described. FIG. 8 (a) is a schematic perspective view of another embodiment, and FIG. 8 (b) is a cross-sectional view of the main part along the line AA in FIG. 8 (a). FIG. 8A is a plan view of FIG. 8A, and FIGS. 8D and 8E are schematic plan views of hollow body nozzles 4 a and 4 b showing a part of the cleaving control device 5. An initial crack 21 is formed at a substantially central portion on the surface side of the workpiece 2. The workpiece 2 is placed on the separated processing table 1 in a state close to a free support state.

  The hollow body nozzle 6 having an alphabetic U shape, V shape or horseshoe shape and constituting a part of the cleaving control device 5 will be described. The U-shaped V shape or horseshoe shape is formed on the surface side of the work 2. The central portion 61 of the hollow body is arranged so as to be located on the planned cutting line starting from the initial crack 21. And the part 6a of the both-ends part of this hollow body nozzle 6 forms a part of cleaving growth means 3, and the remaining part 6b forms a part of crack growth suppression means. On the other hand, on the back surface side of the work 2, a hollow body nozzle 7 that is in a position facing the aforementioned portion 6 b and has the same shape as the portion 6 b and constituting a part of the crack growth suppressing means 4 is provided on the work 2. Place them in close proximity to each other. These portions 6a, 6b, and 7b (the entire hollow body nozzle 7 becomes 7b) are provided with small holes for blowing out pressurized air on the surface facing the workpiece 2. The nozzle 3 b is a pressurizing nozzle that constitutes a part of the crack growth means disposed on the back side of the work 2 and at a position facing the initial crack 21.

  Next, the cleaving operation of the workpiece 2 will be described. First, the crack growth means 3 (3b, 6a) is configured such that pressurized air is blown toward the workpiece 2 from the pair of left and right portions 6a, 6a and the nozzle 3b. The work 2 is deformed downward with the initial crack 21 as a center and is gradually cleaved from the initial crack 21 along the planned cutting line, but at a position facing the work 2 in front of it, that is, A portion 6b of the nozzle 6 is disposed symmetrically on the front surface side of the work 2, and a nozzle 7 (portion 7b) is disposed on the back surface side. When pressurized air is blown from these portions 6b and 7b, the work 2 that has been elastically deformed downward is corrected by the crack growth means 3, so that no pre-run phenomenon occurs in the work 2, and the cleaving control device 5 The workpiece 2 is cleaved with excellent straightness, cross-sectional quality, and the like by traveling along the planned cutting line.

Subsequently, the embodiment shown in FIG. 9 will be described. FIG. 9A is a schematic perspective view of another embodiment, and FIG. 9B is a plan view schematically showing the surface of the processing table 81 in FIG. 9A. c) is a schematic plan view of an alphabetic U-shaped, V-shaped or horseshoe-shaped hollow body nozzle 6. An air outlet 82 is provided on the surface of the processing table 81. The air jets 82 are formed on the entire surface at a predetermined pitch. For example, in the case of the processing table 81 in which a suction hole is formed to fix the work 2, the suction hole is utilized to switch the flow path connected to the vacuum pump to the flow path connected to the compressor. You can do it. In addition, an air outlet may be provided separately from the suction hole. The workpiece 2 is placed so that the initial crack 21 is on the surface side.
An alphabet U-shaped, V-shaped or horseshoe-shaped hollow body nozzle 6 constituting a part of the cleaving control device 5 is attached to the surface side of the workpiece 2. This is substantially the same in structure and function as the hollow nozzle 6 disclosed in FIG.

  A feature of the present embodiment is that an existing air outlet (suction hole) 82 provided on the upper surface of the processing table 81 is used. The work 2 is placed on the processing table 1 in a state close to a free support state so that the air jet outlet 82a at a position facing the initial crack 21 of the work 2 is on the planned cutting line starting from the initial crack 21.

Then, air is blown toward the back side of the work 2 by allowing the air ejection state of the air ejection port 82a to be sequentially switched along the planned cutting line of the work 2 by an electric valve or the like. Like that.
On the other hand, of the alphabetic U-shaped, V-shaped or horseshoe-shaped hollow body nozzle 6 (6a, 6b) constituting a part of the cleaving control device 5, an air outlet 83 (part) facing the part 6b 7) is sequentially blown out in a U-shape, V-shape or horseshoe shape by an electric valve.
The workpiece 2 is elastically deformed downward and cracked by the pressurized air blown out from the air jet 11a and the parts 6a and 6a which are both ends of the U-shaped, V-shaped or horseshoe-shaped hollow body nozzle 6 of the alphabet. Although it grows, from the part 6b of the hollow body nozzle 6 constituting the crack growth suppressing means (6b, 11) in front of the part and the part 7 formed by the air jet 83 having the same shape, the work 2 Since air is blown toward the surface, the elastic deformation of the workpiece 2 is corrected. That is, the U-shaped, V-shaped or horseshoe-shaped hollow body nozzle 6 of the alphabet is moved while blowing pressurized air toward the workpiece 2 along the planned cutting line with the initial crack 21 as a starting end, If the air is blown out appropriately in conjunction with the movement of the hollow body nozzle 6 from each air outlet 82 (82a, 83) provided in the processing table 81, the fractured surface is excellent in straightness, sectional quality, etc. Is formed on the workpiece 2.

  Subsequently, the embodiment of FIG. 10 will be described. FIG. 10 (a) is a schematic plan view of another embodiment, and FIG. 10 (b) is a cross-sectional view of the main part of the cleaving control device along the line AA in FIG. 10 (a). FIG. 10 (c) is a plan view of FIG. 10 (a). 11 (a), 11 (c) and 11 (e) are schematic cross-sectional views of the main part of the cleaving control device, in which laser irradiation is performed from both sides of the workpiece, and laser irradiation is performed on the upper surface of the workpiece. Irradiating from the bottom of the workpiece. FIGS. 11B, 11D, and 11F show the shapes of cracks (rib marks 22) that occur in the fractured surface of the workpiece. Note that FIG. 11 (a) and FIG. 11 (b), FIG. 11 (c) and FIG. 11 (d), and FIG. 11 (e) and FIG.

  The crack growth means 3 (3a, 3b) is substantially the same as that of the embodiment of FIG. The feature of this embodiment is that a heating device, in particular, laser irradiation is used as the crack growth suppressing means 4. That is, when the glass substrate 2 is irradiated with the laser beam 8 having a high energy density, cracks are generated radially as a result of rapid heating. However, the energy density of the laser beam 8 is lower than the level at which cracks can be generated. In this case, the glass substrate is only heated and no melting or cracking occurs. In this case, the glass substrate 2 tries to thermally expand, but cannot expand due to local heating, and compressive stress is generated around the irradiation point. The present invention utilizes this compressive stress. Although the workpiece 2 is cleaved by the cleaving growth means 3 (3a, 3b), the preceding phenomenon does not occur due to the compressive stress due to the heating of the laser irradiation. FIG. 11A shows the laser beam 8 irradiated from the upper and lower surfaces of the work 2 and is the most preferred embodiment. FIG. 11 (c) shows a case where the upper surface of the workpiece 2 is irradiated with the laser beam 8, and FIG. 11 (e) shows a case where the lower surface of the workpiece 2 is irradiated with the laser beam 8. Which mode should be adopted may be comprehensively determined in consideration of the material of the workpiece, the arrangement status of other devices, and the like.

  FIG. 12 is a diagram schematically and three-dimensionally depicting the phenomenon that occurs in the workpiece in the embodiment shown in FIG. 10 (for the sake of convenience, the deformation of the substrate is emphasized). FIGS. 12 (a) and 12 (b) substantially correspond to FIGS. 6 (a) and 6 (b), and a description thereof will be omitted. 12 (c) and 12 (d) are plan views schematically showing the size of the irradiation range 8a by the laser beam 8. FIG. If the irradiation range 8a is small as shown in FIG. 12 (c), it is considered that the preceding phenomenon occurs. However, if the irradiation range 8a has a sufficient size as shown in FIG. 12 (d), the cleaving is 90%. ° Because it is impossible to turn and advance, there is no pre-run phenomenon. What is necessary is just to determine the magnitude of this irradiation range 8a in consideration of the material etc. of the workpiece | work 2. FIG. Note that the laser beam 8 irradiation has been described as an example of the heating device, but is not limited to the laser beam irradiation. For example, light beam heating, plasma jet heating, high temperature air injection, high temperature gas banner heating, A xenon lamp may be used.

  The crack growth means 3 has been described by taking pressurized air as an example. However, the crack growing means 3 is not limited to pressurized air as long as it can maintain a non-contact state with the workpiece 2. For example, it goes without saying that a pressurized liquid or a means for injecting a cooling liquid after laser beam irradiation can be applied.

Next, the embodiment of FIG. 13 will be described. FIG. 13A is a schematic perspective view showing only the main part of another embodiment, and FIG. 13B is a schematic front view of the non-contact suction device 33a in FIG. Including partial cross-section). FIG. 13C is a cross-sectional view of the main part along the line AA in FIG. The feature of this embodiment is that the non-contact suction device 33a is used as a part of the crack growth means. The non-contact suction device 33a is disposed in a state in which the non-contact suction device 33a can be moved to a position above and adjacent to the planned cutting line of the workpiece 2.
The nozzle 4 a constitutes a part of the crack growth suppressing means 4. The surface of the processing table 1 is formed of a porous member 3b, and a suction hole 11a is formed in part. An initial crack 21 is formed on the surface side of the workpiece 2.

Next, the operation of the non-contact device 33a will be described. When pressurized air is introduced as primary air from the air intake port 333a and air is discharged from the circumferential nozzle 333b formed in the apparatus, negative pressure is generated in the central portion and the opposing work 2 is sucked. Thus, the workpiece is moved from the initial crack 21 of the workpiece 2 along the planned cutting line by the suction force and the pressurized air blown toward the workpiece 2 from the porous member 3b disposed on the lower surface of the workpiece 2. 2 will be cleaved.
Since the non-contact suction device 33a releases air from the periphery of the surface facing the workpiece 2, the workpiece 2 and the non-contact suction device 33a do not come into contact with each other. Further, the direction of the pressurized air blown from the porous member 3b is mostly blown toward the work 2, but a part of the air is sucked in order to maintain the horizontalness of the work 2, the blow-up height from the table, and the like. The direction is preferably set (air blowing and suction are indicated by the directions of arrows in FIGS. 13B and 13C). In addition, since the description about the crack growth suppression means 4 is as substantially the same as the previous embodiment (refer FIG. 1), description is abbreviate | omitted.

  Furthermore, the embodiment of FIG. 14 will be described. This embodiment is a modification of the embodiment of FIG. FIG. 14A is a schematic perspective view showing only the main part, and FIG. 14B is a cross-sectional view of the main part along the line AA in FIG. 14A. A different part from the embodiment of FIG. 13 is the shape of the pressurized air outlet 333c of the non-contact suction device 33a. The shape of the outlet 333c may be a circle, an ellipse, an eight character, a V shape, or a horseshoe shape. Since other points are substantially the same, description thereof is omitted.

Next, an embodiment in which an inclination or draft is provided with respect to the thickness direction in order to punch the workpiece 2 in a circular shape from a different viewpoint will be described.
FIG. 15A is a schematic plan view of another embodiment, and FIGS. 15B, 15C, 15D, and 15E are cross-sectional views of the main part. The difference between FIG. 15 (b) and FIG. 15 (c) is the difference in the direction of inclination or draft. FIG. 15 (b) and FIG. 15 (d), FIG. 15 (c) and FIG. 15 (e) are in a corresponding relationship. The nozzle 3a (31a, 32a) and the nozzle 3b constitute the crack growth means 3, and the structure and function thereof are the same as those disclosed in FIG. 5A, so only the differences will be described.

  The case where the air pressure blown from the nozzle 31a and the nozzle 32a is the same will be described with reference to FIG. 15B. The distance from the initial crack 21 is A on the nozzle 32a side and B on the nozzle 31a side. Since there is a relationship of B> A, the nozzles 31 a and 32 a are arranged at asymmetric positions with respect to the initial crack 21. The inclination or draft formed on the workpiece 2 by the nozzles 3a (31a, 32a) and the nozzle 3b constituting the crack growth means 3 is as shown in FIG. On the other hand, when the distance from the initial crack 21 of the nozzle 32a and the nozzle 31a is changed, that is, when the distance between the two is A> B as shown in FIG. 15 (c), the nozzle 3a constituting the crack growth means 3 is used. The inclination or draft formed on the workpiece 2 from (31a, 32a) and the nozzle 3b is as shown in FIG. 15 (e). In addition, although it became asymmetric by changing the distance from the initial crack 21 of the nozzles 31a and 32a, when the distance from the initial crack is set to A = B, an asymmetric state is established by changing the air pressure. Needless to say, you can.

  Next, regarding the crack growth suppressing means 4 (4a, 4b), the structure of the crack growth suppressing means 4 (4a, 4b) in the embodiment of FIG. 15 (a) is the same as that of the embodiment of FIG. 7 (a). Also, the case of FIG. 16 is the same as that of the embodiment of FIG.

  The slope or cut-out slope forming means of the present invention is completed on the premise of the following technical matters. That is, when the workpiece 2 is punched into a circular shape, the air is blown so that the pressure distribution of the air pressure blown from the nozzles 31a and 32a is substantially symmetrical with respect to the tangent F at the position assumed to be the tip of the initial crack 21. Simultaneously with the spraying, both the means are moved (rotated as indicated by the arrows in FIG. 15a) while blowing air (or irradiating laser) from the crack growth suppressing means ((4a, 4b) or (8)). It is.

  Further, the embodiment in which the work 2 is a liquid crystal display panel substrate will be described by changing the viewpoint. FIG. 21A is a schematic cross-sectional view seen from the front, FIG. 21B is a schematic cross-sectional view seen from the side, and FIG. 21C is a schematic plan view. FIG. 21D is a schematic cross-sectional view of the case where the initial crack 21 is formed in the lower substrate GD, and the initial crack 21 is deformed and cleaved as a center when viewed from the front. FIG. 22 is a schematic cross-sectional view of the case where the initial crack 21a is formed in the upper substrate GU and then cleaved therefrom, as viewed from the front. Hereinafter, description will be made centering on the embodiment of FIG. 19 (however, the nozzles 31b and 32b are used instead of the grooves 3b). First, the case where the initial crack 21 is formed in the lower substrate GD and then cleaved therefrom will be described. First, the crack growth means 3 will be described. Nozzles 31b and 32b are disposed on both the left and right sides of the initial crack 21 formed on the lower substrate GD, while the initial crack 21 and the upper crack GU are disposed on the upper substrate GU side. The nozzles 31a and 32a are disposed on the left and right sides of the opposing positions. Note that the distance (span) between the nozzles 31b and 32b is longer (wider) than the distance (span) formed between the nozzles 31a and 32a from the viewpoint of four-point bending (JIS R1621). It must be located. When air is blown out from each nozzle toward the workpiece 2 in such a state, the crack is deformed upward from the initial crack 21 and the crack grows as shown in FIG. Since (4a, 4b) is disposed in front of the crack growth means 3, the elastic deformation is corrected, so that the lower substrate GD is cleaved from the initial crack 21 along the planned cleaving line without leading the crack. The On the other hand, when cleaving from the initial crack 21a formed in the upper substrate GU along the planned cutting line, if the nozzle is disposed in the same positional relationship as that in FIG. 21A (see FIG. 22), the initial crack 21a is formed. The crack grows along the planned cutting line (toward the rear of the drawing) and starts to break, but since the crack growth suppressing means 4 is arranged in front of the crack, the pre-run phenomenon does not occur, The upper substrate is cleaved. The feature of this embodiment is that the position of the nozzle can be freely changed, so that it can be cleaved regardless of the size of the liquid crystal display panel substrate. Moreover, if this apparatus is used, it is not necessary to reverse the workpiece 2 to break (divide), which greatly contributes to the improvement of production efficiency.

  The embodiment shown in FIGS. 23A to 23C will be described. First, a target work is the same as the embodiment shown in FIGS. 21 to 22 and is a substrate for a liquid crystal display panel. FIGS. 23 (a) to 23 (c) are schematic cross-sectional views of the main part viewed from the front of the cleaving apparatus, and no crack growth suppression means is shown. Each figure will be briefly described. FIG. 23A shows a case where the initial crack 21a is formed in the upper substrate GU, and the initial crack 21a exists between the seals S, and the initial crack 21a is cleaved from the initial crack 21a. The non-contact suction device 33a described with reference to FIG. 13 is disposed above the initial crack 21a and in the vicinity of the upper substrate GU.

  On the other hand, the porous member 3b is disposed below and adjacent to the lower substrate GD. As shown in the drawing, when the upper substrate GU is sucked by the non-contact suction device 33a and at the same time, the pressurized air is blown from the porous member 3b toward the lower substrate, the cutting line (the longitudinal direction of the paper) from the initial crack 21. The upper substrate GU is gradually cleaved along the upper surface GU. However, since crack growth suppression means (not shown) is disposed in front of the non-contact suction device 33a, the upper substrate GU does not run ahead.

  Next, in the case of FIG. 23B, the difference from FIG. 23A is the position where the initial crack 21a is formed. In the case of this figure, the initial crack 21a is formed outside the seal S. Since other points are not substantially different, the description is omitted.

  Further, the case of FIG. 23 (c) will be described. The initial crack 21 is formed in the lower substrate GD, and the initial crack 21 exists between the seals S. The porous member 3b is disposed below and in the vicinity of the lower substrate GD. On the other hand, the nozzle 3a is positioned above and close to the upper substrate GU and opposed to the initial crack 21. Is disposed. Then, as shown in the figure, when pressurized air is blown from the nozzle 3a and the porous member 3b toward the respective substrates, the lower substrate is gradually cleaved from the initial crack 21 of the lower substrate GD along the planned cutting line. However, since a crack growth suppressing means (not shown) is disposed in front of it, it does not run ahead. Since the effect of the case of FIG. 23 is the same as that of FIG. 22, description thereof is omitted.

  Finally, the embodiment of FIG. 23 (d) will be described. As in the embodiment of FIG. 21, the feature of this embodiment is that it is not necessary to invert the workpiece 2 in order to break the workpiece 2, and this greatly contributes to an improvement in production efficiency. FIG.23 (d) is sectional drawing of the typical principal part seen from the front of the cleaving apparatus. In the present embodiment, the porous member 3b is provided close to the upper substrate GU and the lower substrate GD, respectively, but the porous member 3b is provided with a suction hole 33b, and each porous member 3b is connected to each porous member 3b. The workpiece 2 is balanced by a balance between the applied pressure Pr sprayed toward the substrate and the suction pressure Ab (the upper substrate is upward and the lower substrate is downward), which is sucked from the suction holes 33b provided in the porous member 3b. Is processed while floating between the porous members 3b-3b. More specifically, the initial crack 21 is formed in the lower substrate GD, and the non-contact suction device 33a is disposed at a position close to and opposed to the initial crack 21. Usually, it is cleaved by the method of FIG. 23 (b), but for this purpose, the work 2 must be reversed. In this embodiment, this reversal operation can be omitted. That is, the non-contact suction device 33a is arranged in a state that it can move not only on the lower substrate GD side but also on the upper substrate GU side. At the same time, by making the porous member 3b movable, the workpiece 2 can be cleaved without being inverted. Since the cleaving action is substantially the same as in FIGS. 23 (a) and (b), description thereof is omitted. Although crack growth suppression means is not shown, it goes without saying that the crack growth suppression means is disposed in front of the non-contact suction device 33a.

  The workpiece cutting apparatus and method according to the present invention include an organic EL element substrate, a PDF (plasma display panel) substrate, and a glass substrate in addition to a single plate and a liquid crystal display substrate in which glass substrates are bonded to each other as shown in the above embodiments. And a reflective liquid crystal display substrate obtained by bonding a silicon substrate and glass, ceramics of a sintered material, single crystal silicon, a semiconductor wafer, a ceramic substrate, or the like.

The typical structure figure showing the cleaving device which is one embodiment of the present invention. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The typical conceptual diagram for demonstrating the static pressure bearing effect | action by pressurized air. The typical conceptual diagram for demonstrating a free support state or the state close | similar to a free support state. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The schematic diagram which showed the influence which a workpiece | work produces by the crack growth means and crack growth suppression means of the cleaving apparatus of FIG. 5 in three dimensions. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The figure which shows the cutting state and split surface of the workpiece | work by the cutting apparatus of FIG. The schematic diagram which showed the influence which a workpiece | work produces by the crack growth means and crack growth suppression means of the cleaving apparatus of FIG. 10 in three dimensions. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. The schematic diagram for demonstrating the load added to the workpiece | work on a process table. The schematic diagram of the state which laid the mat between the processing table and the workpiece. The schematic diagram explaining the processing table in which the air nozzle was installed. The schematic diagram explaining the process table provided with the pressing mechanism. The typical structure figure showing the cleaving device which is other one embodiment of the present invention. FIG. 22 is a schematic structural diagram showing another state in the cleaving apparatus of FIG. 21. The typical structure figure showing the cleaving device which is other one embodiment of the present invention.

Explanation of symbols

1 Processing table 2 Work 3 Crack growth means
3a Nozzle 3b Porous member 3c Inlet hole 4 Crack growth suppression prevention means 4a, 4b Nozzle 5 Cleavage control device 6 Hollow body nozzle 7 Hollow body nozzle 8 Laser beam 8a Laser irradiation area 11 Positioning pin 11a Suction hole 21 Notch or initial crack 31a, 32a Nozzle 33a Non-contact suction device 70 Mat 71 Air nozzle 72 Pressing mechanism 81 Processing table 82, 83 Air outlet

Claims (13)

  A brittle material substrate cleaving apparatus in which at least a notch or an initial crack is formed, the vicinity of the planned cutting line starting from the notch or the initial crack and ending at the other end is close to a free support state The brittle material substrate is placed on the processing table as described above, and a cleaving control device comprising a crack growth means and a crack growth suppression means and having the crack growth suppression means arranged in front of the crack growth means is the brittle material substrate. A brittle material substrate cleaving apparatus, wherein the brittle material substrate is moved along a planned cutting line from a notch or initial crack of the brittle material substrate while maintaining a state close to a non-contact state.   The brittle material substrate cleaving apparatus according to claim 1, wherein the crack growth means constituting the cleaving control apparatus is moved following the crack growth suppressing means.   2. The brittle material substrate cleaving apparatus according to claim 1, wherein the crack growth suppressing means is a spraying device that blows pressurized gas or liquid from the upper and lower surfaces of the brittle material substrate in the vicinity of the planned fracture line of the brittle material substrate. .   The brittle material substrate cleaving apparatus according to claim 1, wherein the crack growth suppressing means is a heating device that heats the vicinity of the planned fracture line of the brittle material substrate.   The crack growth means is a spraying device that blows pressurized gas or liquid from the upper and lower surfaces of the brittle material substrate in the vicinity of the planned cutting line of the brittle material substrate, and the crack growth suppression means is in the vicinity of the planned cutting line of the brittle material substrate. 2. The apparatus for cleaving a brittle material substrate according to claim 1, wherein the apparatus is a spraying device that blows a pressurized gas or liquid locally from the upper and lower surfaces of the brittle material substrate.   The crack growth means is a spraying device that blows pressurized gas or liquid from the upper and lower surfaces of the brittle material substrate near the planned cutting line of the brittle material substrate, and the crack growth suppression means detects the vicinity of the planned cutting line of the brittle material substrate. 2. The brittle material substrate cleaving apparatus according to claim 1, which is a heating apparatus for locally heating.   The crack growth means is a device that heats and cools the planned cutting line of the brittle material substrate, and the crack growth suppression means is a gas that is locally pressurized from the upper and lower surfaces of the brittle material substrate near the planned cutting line of the brittle material substrate. Alternatively, the brittle material substrate cleaving apparatus according to claim 1, wherein the apparatus is a spraying apparatus for spraying a liquid.   The crack growth means is an apparatus that heats and cools the planned cutting line of the brittle material substrate, and the crack growth suppression means is a heating apparatus that locally heats the vicinity of the planned cutting line of the brittle material substrate. Item 1. A brittle material substrate cleaving apparatus according to Item 1. A crack growth means is a spraying device in which pressurized gas or liquid is sprayed from the upper and lower surfaces of the brittle material substrate in the vicinity of the planned cutting line of the brittle material substrate, and the spraying device is notched or an initial crack is formed. Are arranged asymmetrically with respect to the planned cutting line of the surface,
On the other hand, the crack growth suppressing means is a spraying device for spraying a pressurized gas or liquid locally from the upper and lower surfaces of the brittle material substrate in the vicinity of the planned cutting line of the brittle material substrate, wherein the crack growth means and the crack growth 2. The brittle material substrate cleaving apparatus according to claim 1, wherein a cleaving control device comprising a restraining means provides an inclination or a cutting gradient in the plate thickness direction of the planned cleaving line. The crack growth means is a spraying device that sprays pressurized gas or liquid from the upper and lower surfaces of the brittle material substrate in the vicinity of the planned cutting line of the brittle material substrate, and the spraying device is notched or an initial crack is formed. Are arranged asymmetrically with respect to the planned cutting line of the surface,
On the other hand, the crack growth suppressing means is a heating device that locally heats the vicinity of the planned cutting line of the brittle material substrate, and the cutting control line constituted by the crack growing means and the crack growth suppressing means The apparatus for cleaving a brittle material substrate according to claim 1, wherein an inclination or a cutting gradient is provided in the thickness direction.   The crack growth means is an apparatus that heats and then cools the fracture line of the brittle material substrate, while the crack growth suppression means pressurizes the vicinity of the fracture line of the brittle material substrate locally from the upper and lower surfaces of the brittle material substrate. A spraying device for spraying a gas or a liquid, characterized in that an inclination or a cutout gradient is provided in a plate thickness direction of the planned cutting line by a cutting control device comprising the crack growth means and the crack growth suppression means. The brittle material substrate cleaving apparatus according to claim 1.   The crack growth means is a device that heats the fracture line of the brittle material substrate after cooling, and the crack growth suppression means is a heating device that locally heats the vicinity of the fracture line of the brittle material substrate, the crack growth 2. A cleaving apparatus for a brittle material substrate according to claim 1, wherein a cleaving control apparatus comprising means and a crack growth suppressing means provides an inclination or a cutting gradient in the plate thickness direction of the cleaving line.   A method of cleaving at least a brittle material substrate having a notch or initial crack formed therein, the method of cleaving the brittle material substrate having a notch or initial crack formed therein, wherein the notch or initial crack is started. And after the brittle material substrate is placed on the processing table in the vicinity of the free support state in the vicinity of the planned cutting line that ends at the other end, the crack growth suppressing means is constituted by crack growing means and crack growth suppressing means. Is moved along a planned cutting line from a notch or initial crack of the brittle material substrate while maintaining a non-contact state with the brittle material substrate. A method for cleaving a brittle material substrate.