TWI446124B - Exposure apparatus - Google Patents
Exposure apparatus Download PDFInfo
- Publication number
- TWI446124B TWI446124B TW95139074A TW95139074A TWI446124B TW I446124 B TWI446124 B TW I446124B TW 95139074 A TW95139074 A TW 95139074A TW 95139074 A TW95139074 A TW 95139074A TW I446124 B TWI446124 B TW I446124B
- Authority
- TW
- Taiwan
- Prior art keywords
- exposure
- light
- exposed
- reticle
- stage
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
本發明係有關一種曝光裝置，係邊將一被曝光體朝一特定方向搬送的同時，邊透過一光罩，對沿著搬送方向以特定間隔設定於被曝光體表面之多個曝光區域，形成特定的曝光圖案列；詳細地說，係有關一種用於防止在該多個曝光區域外部、互相鄰接之曝光區域間之部分被曝光的曝光裝置。The present invention relates to an exposure apparatus which, while transporting an object to be exposed in a specific direction, is formed by a plurality of exposure regions which are set at a specific interval along the conveyance direction on the surface of the object to be exposed while passing through a mask. The exposure pattern column; in detail, relates to an exposure device for preventing a portion between the exposure regions adjacent to each other outside the plurality of exposure regions from being exposed.
習知的曝光裝置係使載置基板之載台以及與應曝光之層相對應之光罩相對移動，俾使該基板之多個曝光區域，分別曝光一層分的光罩圖案；其係包含：該多個曝光區域曝光時之光罩所對應之該載台之位置，依各區域逐一測定，同時以相對於基板上的特定位置識別用標記而對準過位置之狀態之光罩為基準，以取得該多個曝光區域所對應的曝光時之該載台之相對位置之手段；以及檢測出該位置識別用標記，以對準該光罩的位置，並以當時之光罩為基準，邊測定光罩所對應之該載台的位置，邊使該載台與光罩相對移動，俾使該已取得之相對位置再現之手段；其中，在使載台與光罩相對移動，以相對於基板上的多個曝光區域分別對準位置，而曝光形成第一層的圖案時，記住以一個曝光區域為基準之另一曝光區域之該相對位置的資料，要曝光形成第二層的圖案時，即根據該相對位置資料，相對移動該載台與光罩，以定位並進行曝光(參照例如特開2004－246025號公報)。The conventional exposure apparatus moves the stage on which the substrate is placed and the mask corresponding to the layer to be exposed, and exposes a plurality of exposed areas of the substrate to a layer of the mask pattern, respectively. The position of the stage corresponding to the reticle when the plurality of exposure areas are exposed is measured one by one according to each area, and the reticle in a state in which the mark is aligned with respect to the specific position on the substrate is used as a reference. a means for obtaining a relative position of the stage at the time of exposure corresponding to the plurality of exposure regions; and detecting the position identification mark to align the position of the reticle with the reticle as the reference Measuring the position of the stage corresponding to the reticle, and moving the stage relative to the reticle to reproduce the obtained relative position; wherein the stage and the reticle are relatively moved to The plurality of exposed areas on the substrate are respectively aligned with the position, and when the pattern of the first layer is exposed, the data of the relative position of another exposed area based on one exposed area is memorized, and the second layer is exposed to be exposed. , That is based on the relative position information, the relative movement of the mask stage, and to locate exposure (for example, see Patent Publication Laid-Open No. 2004-246025).
可是，在該習知的曝光裝置中，係將基板逐步地移動，使設於基板上之多個曝光區域逐一切換，以進行光罩之光罩圖案之曝光，而不是朝向與光罩上所形成之多個光罩圖案之排列方向垂直的方向，邊以一定速度搬送迫近光罩且被裝設於對面之基板，邊針對多個曝光區域進行曝光。However, in the conventional exposure apparatus, the substrate is gradually moved to switch the plurality of exposure regions provided on the substrate one by one to perform exposure of the mask pattern of the mask, instead of facing the mask. The plurality of mask patterns are formed in a direction perpendicular to the direction in which the mask is applied at a constant speed and mounted on the opposite substrate, and exposed to a plurality of exposure regions.
另一方面，在朝向與光罩上所形成之多個光罩圖案之排列方向垂直的方向，邊以一定速度搬送基板，邊針對多個曝光區域曝光的曝光裝置的情形下，如圖11所示，例如，在設定於彩色濾光片基板1之搬送方向(箭頭A的方向)之多個曝光區域2中，可能在第1曝光區域2a與第2曝光區域2b之間的部分3a、或第2曝光區域2b與第3曝光區域2c之間的部分3b，也形成該多個光罩圖案的曝光圖案列4，而有降低產品的外觀品質之虞。On the other hand, in the case of an exposure apparatus that exposes a plurality of exposure areas in a direction perpendicular to the arrangement direction of the plurality of mask patterns formed on the photomask, as shown in FIG. For example, in the plurality of exposure regions 2 set in the transport direction of the color filter substrate 1 (the direction of the arrow A), there may be a portion 3a between the first exposure region 2a and the second exposure region 2b, or The portion 3b between the second exposure region 2b and the third exposure region 2c also forms the exposure pattern row 4 of the plurality of mask patterns, and has the advantage of lowering the appearance quality of the product.
因此，本發明之目的在提供一種曝光裝置，以對應處理此種問題，並防止在被曝光體上沿著搬送方向所設定之多個曝光區域之外部、互相鄰接的曝光區域之間的部分被曝光。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an exposure apparatus for coping with such a problem and preventing a portion between an exposure area adjacent to each other outside a plurality of exposure areas set along a conveyance direction on an object to be exposed exposure.
為達成上述目的，第1發明之曝光裝置包含：一載台，上面載置有一被曝光體，該被曝光體設有排成至少一列的多個曝光區域，該載台並朝該多個曝光區域之一設定方向搬送該被曝光體；一光罩載台，配置於該載台上方，使一光罩迫近面對該被曝光體並加以保持；一光源，在對該被曝光體曝光期間中始終亮燈，以對被保持於該光罩載台之該光罩照射曝光光線；以及一聚光透鏡，配置於該光罩載台與該光源之間，用以將照射於該光罩之曝光光線變成平行光；其特徵為包含：一成像透鏡，裝設於該光源與該聚光透鏡之間，以將該光源之像成像於該聚光透鏡之前面；以及一光閥(Shutter)，裝設於依該成像透鏡所形成的該光源之像的成像位置附近，在藉由該被曝光體之搬送而使該多個曝光區域依次通過該光罩下側時，同步進行曝光光線之照射與遮斷之切換。In order to achieve the above object, an exposure apparatus according to a first aspect of the invention includes: a stage on which an exposed body is placed, the exposed body is provided with a plurality of exposure regions arranged in at least one column, and the stage is exposed to the plurality of exposures One of the regions is disposed to convey the exposed object; a mask carrier is disposed above the carrier such that a photomask is brought into close proximity to the exposed object and held; and a light source is exposed during exposure to the exposed object The light is always illuminated to illuminate the reticle held by the reticle stage; and a concentrating lens is disposed between the reticle stage and the light source for illuminating the reticle The exposure light becomes parallel light; characterized by: an imaging lens disposed between the light source and the collecting lens to image the image of the light source in front of the collecting lens; and a light valve (Shutter) Provided in the vicinity of an imaging position of the image of the light source formed by the imaging lens, and simultaneously exposing the plurality of exposure regions to the lower side of the mask by the conveyance of the object to be exposed Switching between illumination and occlusion.
利用此種構造，在載台上面載置有多個曝光區域被設為排成至少一列的被曝光體，並將該被曝光體朝該多個曝光區域之設定方向搬送；利用光罩載台將光罩保持迫近面對被曝光體，並利用對被曝光體之曝光期間中始終亮燈之光源，對被保持於光罩載台之光罩照射曝光光線。此時，利用成像透鏡將光源之像成像於聚光透鏡的前面，再以聚光透鏡將照射於光罩之曝光光線變成平行光。此時，利用裝設於依成像透鏡所形成之光源之像的成像位置附近之光閥，在藉由被曝光體之搬送而使多個曝光區域依次通過光罩下側時，同步進行曝光光線之照射與遮斷之切換。藉此，可以防止在被曝光體上沿著搬送方向所設定之排成一列之多個曝光區域之外部、互相鄰接的曝光區域之間的部分被曝光。因此，可以提升產品之外觀品質。另外，因為將光閥裝設於依成像透鏡所形成之光源之像的成像位置附近，所以可以縮小光閥，並避免周邊構成零件間之干擾。With such a configuration, a plurality of exposure regions are placed on the stage, and the object to be exposed is arranged in at least one row, and the object to be exposed is conveyed in a direction in which the plurality of exposure regions are set; The reticle is held close to the exposed body, and the illuminator held by the reticle stage is irradiated with the exposure light by the light source that is always lit during the exposure period of the exposed object. At this time, the image of the light source is imaged on the front surface of the condensing lens by the imaging lens, and the exposure light irradiated to the reticle is converted into parallel light by the condensing lens. At this time, when a plurality of exposure regions are sequentially passed through the lower side of the mask by the light valve installed in the vicinity of the imaging position of the image of the light source formed by the imaging lens, the exposure light is simultaneously performed. Switching between illumination and occlusion. Thereby, it is possible to prevent a portion between the adjacent exposure regions of the plurality of exposure regions arranged in a line set along the conveyance direction on the object to be exposed from being exposed. Therefore, the appearance quality of the product can be improved. Further, since the light valve is disposed near the image forming position of the image of the light source formed by the imaging lens, the light valve can be reduced and interference between the peripheral components can be avoided.
另外，第2發明的曝光裝置包含：一載台，上面載置有一被曝光體，該被曝光體設有排成至少一列的多個曝光區域，該載台並朝該多個曝光區域之一設定方向搬送該被曝光體；一光罩載台，配置於該載台上方，使一光罩迫近面對該被曝光體並加以保持；一光源，在對該被曝光體曝光期間中始終亮燈，以對被保持於該光罩載台之該光罩照射曝光光線；一光學積分器，裝設於該光罩載台與該光源之間，以使照射於該光罩之曝光光線之亮度均勻化，以及一聚光透鏡，裝設於該光罩載台與該光學積分器之間，用以將照射於該光罩之曝光光線變成平行光；其特徵為包含：一成像透鏡，裝設於該光學積分器與該聚光透鏡之間，以將該光學積分器之一端面之像成像於該聚光透鏡的前面，以及一光閥，係裝設於依該成像透鏡所形成之該光學積分器之該端面之像的成像位置附近，在藉由該被曝光體之搬送而使該多個曝光區域依次通過該光罩下側時，同步進行曝光光線之照射與遮斷之切換。Further, an exposure apparatus according to a second aspect of the invention includes: a stage on which an exposed body is placed, the exposed body is provided with a plurality of exposure areas arranged in at least one column, and the stage is directed to one of the plurality of exposure areas And the reticle stage is disposed above the stage, so that a reticle is pressed close to the exposed body and held; a light source is always bright during exposure to the exposed object a light for illuminating the reticle held by the reticle stage; an optical integrator is disposed between the reticle stage and the light source to illuminate the exposure light of the reticle Uniform brightness, and a concentrating lens is disposed between the reticle stage and the optical integrator for converting the exposure light irradiated to the reticle into parallel light; characterized by: an imaging lens, An optical integrator is disposed between the optical integrator and the collecting lens to image an end face of the optical integrator in front of the collecting lens, and a light valve is disposed on the imaging lens Imaging of the image of the end face of the optical integrator In the vicinity of the position, when the plurality of exposure regions are sequentially passed through the lower side of the mask by the conveyance of the object to be exposed, the irradiation of the exposure light and the interruption are simultaneously switched.
利用此種構造，在載台上面載置有多個曝光區域被設為排成至少一列的被曝光體，並將該被曝光體朝該多個曝光區域之設定方向搬送；利用光罩載台將光罩保持迫近面對被曝光體，並利用對被曝光體之曝光期間中始終亮燈之光源，對被保持於光罩載台之光罩照射曝光光線。此時，利用光學積分器使照射於光罩之曝光之亮度分布均勻化，並以成像透鏡將光學積分器之端面之像成像於聚光透鏡的前面，再以聚光透鏡將照射於光罩之曝光光線變成平行光。此時，利用裝設於依成像透鏡所形成的光源之像的成像位置附近之光閥，在藉由該被曝光之搬送而使該多個曝光區域依次通過光罩下側時，同步進行曝光光線之照射與遮斷之切換。藉此，可以防止在被曝光體上沿著搬送方向所設定之排成一列之多個曝光區域之外部、互相鄰接之曝光區域之間的部分被曝光。因此，可以提升產品之外觀品質。另外，因為將光閥裝設於依成像透鏡所形成之光學積分器之端面之像之結像位置附近，所以可以縮小光閥，並避免周邊的構成零件間之干擾。With such a configuration, a plurality of exposure regions are placed on the stage, and the object to be exposed is arranged in at least one row, and the object to be exposed is conveyed in a direction in which the plurality of exposure regions are set; The reticle is held close to the exposed body, and the illuminator held by the reticle stage is irradiated with the exposure light by the light source that is always lit during the exposure period of the exposed object. At this time, the optical integrator is used to uniformize the brightness distribution of the exposure to the reticle, and the image of the end face of the optical integrator is imaged on the front side of the concentrating lens by the imaging lens, and then the concentrating lens is irradiated to the reticle. The exposure light becomes parallel light. At this time, when the plurality of exposure regions are sequentially passed through the lower side of the mask by the light valve installed in the vicinity of the imaging position of the image of the light source formed by the imaging lens, the exposure is simultaneously performed. Switching between illumination and occlusion of light. Thereby, it is possible to prevent a portion between the adjacent exposure regions of the plurality of exposure regions arranged in one line set along the conveyance direction on the object to be exposed from being exposed. Therefore, the appearance quality of the product can be improved. Further, since the light valve is disposed near the image position of the image of the end face of the optical integrator formed by the imaging lens, the light valve can be reduced and interference between the peripheral components can be avoided.
此外，該光閥可以朝向與該被曝光體之搬送方向相反的方向移動，並沿著該移動方向形成有與該被曝光體之多個曝光區域相同數目之狹縫(Slit)。藉此，將沿著移動方向形成有與被曝光體之多個曝光區域相同數目之狹縫的光閥，朝向與被曝光體的搬送方向相反之方向移動，並利用該光閥，在藉由被曝光體之移動而使多個曝光區域依次通過光罩下側時，同步進行曝光光線之照射與遮斷的切換。從而，可以利用狹縫的部分對被曝光體之曝光區域照射曝光光線，而利用鄰接的狹縫之間的部分遮斷曝光光線，以防止曝光光線照射到被曝光體之鄰接的曝光區域之間的部分。Further, the light valve may be moved in a direction opposite to the conveying direction of the object to be exposed, and the same number of slits (Slit) as the plurality of exposure regions of the object to be exposed are formed along the moving direction. Thereby, the light valve having the same number of slits as the plurality of exposure regions of the object to be exposed along the moving direction is moved in a direction opposite to the conveying direction of the object to be exposed, and the light valve is used by When the plurality of exposure regions are sequentially passed through the lower side of the mask by the movement of the exposed body, the irradiation of the exposure light and the interruption of the interruption are simultaneously performed. Therefore, the exposed portion of the exposed body can be irradiated with the exposure light by the portion of the slit, and the exposure light is blocked by the portion between the adjacent slits to prevent the exposure light from being irradiated between the adjacent exposed regions of the exposed object. part.
以下，根據附圖詳細說明本發明之實施形態。圖1為表示本發明之曝光裝置的實施形態之概略構造之正面圖。該曝光裝置係邊將被曝光體朝特定方向搬送的同時，邊透過光罩，對沿著搬送方向以特定間隔設定於被曝光體表面之多個曝光區域，形成特定之曝光圖案列，而包含：載台5、光罩載台6、光源7、光學積分器8、聚光透鏡9、成像透鏡10、光閥11、與攝影手段12。另外，在下面說明中，係就被曝光體為塗敷有彩色光阻(Color resist)的彩色濾光片基板1的情形加以說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a front elevational view showing a schematic configuration of an embodiment of an exposure apparatus according to the present invention. In the exposure apparatus, while the object to be exposed is conveyed in a specific direction, a plurality of exposure regions which are set on the surface of the object to be exposed at a predetermined interval along the conveyance direction are formed through the mask to form a specific exposure pattern array. The stage 5, the mask stage 6, the light source 7, the optical integrator 8, the collecting lens 9, the imaging lens 10, the light valve 11, and the imaging means 12. In the following description, a case where the object to be exposed is a color filter substrate 1 coated with a color resist will be described.
如圖2所示，該載台5係在上面5a載置多個曝光區域2以間隔G1至少排成一列設定之彩色濾光片基板1(同圖中顯示二列)，係朝該多個曝光區域2之設定方向搬送彩色濾光片基板1，利用搬送手段13，以特定速度(V)，朝向圖1中之箭號A所示之方向移動。此外，圖2中，符號2a表示第1曝光區域，符號2b表示第2曝光區域，符號2c表示第3曝光區域。再者，符號3a表示第1與第2曝光區域2a、2b之間的部分(以下記述為「第1非曝光區域」)，符號3b表示第2與第3曝光區域2b、2c之間的部分(以下記述為「第2非曝光區域」)。As shown in FIG. 2, the stage 5 is a color filter substrate 1 (shown in two rows in the same figure) in which a plurality of exposure regions 2 are placed on the upper surface 5a at intervals G1 and arranged in a row. The color filter substrate 1 is transported in the set direction of the exposure region 2, and is moved toward the direction indicated by the arrow A in FIG. 1 at a specific speed (V) by the transport means 13. In FIG. 2, reference numeral 2a denotes a first exposure region, reference numeral 2b denotes a second exposure region, and reference numeral 2c denotes a third exposure region. Further, reference numeral 3a denotes a portion between the first and second exposure regions 2a and 2b (hereinafter referred to as "first non-exposed region"), and reference numeral 3b denotes a portion between the second and third exposure regions 2b and 2c. (Hereinafter, it is described as "the second non-exposed area").
該載台5上方裝設有光罩載台6。該光罩載台6係相對於彩色濾光片基板1隔著特定之間隙，例如100至300 μ m的間隔，使光罩14迫近面對並加以保持。A mask holder 6 is mounted on the top of the stage 5. The mask stage 6 is placed close to and held by the mask 14 with a predetermined gap, for example, at intervals of 100 to 300 μm, with respect to the color filter substrate 1.
在此，該光罩14藉由曝光光線之照射，使形成於其上面之光罩圖案，轉印到彩色濾光片基板1的彩色光阻(Color resist)，如圖3所示，係由透明基材15、遮光膜16、光罩圖案17、觀察窗18、以及光罩側對準標記19所構成。Here, the mask 14 is transferred to the color resist of the color filter substrate 1 by the irradiation of the exposure light, and the color resist formed on the color filter substrate 1 is as shown in FIG. The transparent substrate 15, the light shielding film 16, the mask pattern 17, the observation window 18, and the mask side alignment mark 19 are comprised.
該透明基材15是由可高效率穿透紫外線與可見光之透明玻璃基材所構成，例如，石英玻璃。The transparent substrate 15 is composed of a transparent glass substrate that can efficiently penetrate ultraviolet rays and visible light, for example, quartz glass.
如圖1所示，在該透明基材15之其中一面15a形成有遮光膜16。該遮光膜16係用於遮住曝光光線，是以不透明的例如鉻(Cr)的薄膜所形成。As shown in FIG. 1, a light shielding film 16 is formed on one surface 15a of the transparent substrate 15. The light shielding film 16 is used to cover the exposure light, and is formed of an opaque film such as chromium (Cr).
該遮光膜16，如圖3所示，形成有排列於一個方向之多個光罩圖案17。該多個光罩圖案17係用於通過曝光光線的特定形狀之開口，可以對位於對面被搬送之彩色濾光片基板1照射曝光光線，而轉印在圖4所示之彩色濾光片基板1上所形成之黑矩陣框(Black matrix)20的像素21上。然後，例如，使其具有與該像素21之寬度約略一致之寬度，而且在與該排列方向垂直的方向上，作成長矩形形狀，並且以與該像素21之3節距(pitch)之間隔一致之間隔所形成。另外，如圖3所示，將例如位於中央部之光罩圖案17a的左邊緣部，預先設定為基準位置R1。As shown in FIG. 3, the light shielding film 16 is formed with a plurality of mask patterns 17 arranged in one direction. The plurality of mask patterns 17 are used to expose the color filter substrate 1 that is transported on the opposite side to the color filter substrate shown in FIG. 4 by the opening of the specific shape of the exposure light. 1 is formed on the pixel 21 of the black matrix 20 formed on the black matrix. Then, for example, it has a width which is approximately coincident with the width of the pixel 21, and is formed in a rectangular shape in a direction perpendicular to the arrangement direction, and is in accordance with an interval of 3 pitches of the pixel 21. The interval is formed. Further, as shown in FIG. 3, for example, the left edge portion of the mask pattern 17a located at the center portion is set in advance as the reference position R1.
如圖3所示，該遮光膜16在靠近該多個光罩圖案17並與其並排方向之一側，形成有觀察窗18。該觀察窗18係用於觀察位於對面被搬送之圖4所示之彩色濾光片基板1上所形成之基板側對準標記22、以及黑矩陣框20之像素21，可以後述之攝影手段12，檢測出該基板側對準標記22之位置、以及預先設定位於黑矩陣框20之例如圖4所示之中央部之像素21a之左上角部位置之基準位置R2。然後，如圖3所示，與該多個光罩圖案17之排列方向平行，由中央側朝向一方的端部14a延伸而形成矩形狀。As shown in FIG. 3, the light shielding film 16 is formed with an observation window 18 on one side of the plurality of mask patterns 17 in the direction in which they are arranged. The observation window 18 is for observing the substrate-side alignment mark 22 formed on the color filter substrate 1 shown in FIG. 4 on the opposite side, and the pixel 21 of the black matrix frame 20, which can be described later. The position of the substrate-side alignment mark 22 is detected, and the reference position R2 at the position of the upper left corner of the pixel 21a of the central portion of the black matrix frame 20, for example, is detected in advance. Then, as shown in FIG. 3, in parallel with the arrangement direction of the plurality of mask patterns 17, the center side is extended toward one end portion 14a to form a rectangular shape.
如圖3所示，該遮光膜16係在該觀察窗18之一端側，形成有由中央側朝向另一方之端部14b排列的多個光罩側對準標記19。該多個光罩側對準標記19係用於對準預先設定於該光罩圖案17之基準位置R1、以及預先設定於該彩色濾光片基板1之像素21之基準位置R2之位置，係對應該光罩圖案17而形成。另外，其形成位置與圖3光罩側對準標記19之左邊緣部相對應的光罩圖案17之左邊緣部相一致。然後，例如，將遮光膜16之中央部側所形成之光罩側對準標記19，預先設定為基準標記19a。藉此，依位置之調整，使該基準標記19a與該彩色濾光片基板1之基板側對準標記22成為特定之位置關係，即可以將該光罩圖案17之基準位置R1以及彩色濾光片基板1之基準位置R2加以對位。As shown in FIG. 3, the light shielding film 16 is formed on one end side of the observation window 18, and a plurality of mask side alignment marks 19 arranged from the center side toward the other end portion 14b are formed. The plurality of mask side alignment marks 19 are used for aligning the reference position R1 set in advance in the mask pattern 17 and the reference position R2 set in advance in the pixel 21 of the color filter substrate 1. It is formed corresponding to the mask pattern 17. Further, the formation position thereof coincides with the left edge portion of the mask pattern 17 corresponding to the left edge portion of the mask side alignment mark 19 of FIG. Then, for example, the mask side alignment mark 19 formed on the central portion side of the light shielding film 16 is set in advance as the reference mark 19a. Thereby, the reference mark 19a and the substrate-side alignment mark 22 of the color filter substrate 1 have a specific positional relationship depending on the position adjustment, that is, the reference position R1 and the color filter of the mask pattern 17 can be made. The reference position R2 of the sheet substrate 1 is aligned.
而且如圖1所示，該光罩14被保持於光罩載台6且以形成有該遮光膜16一側朝向下面。Further, as shown in FIG. 1, the mask 14 is held by the mask stage 6 and the side on which the light shielding film 16 is formed faces downward.
在該光罩載台6上方裝設有光源7。該光源7係在對彩色濾光片基板1曝光期間中始終亮燈，並對被保持於該光罩載台6之光罩14照射曝光光線，為可散發出包含有紫外線之曝光光線之光源，例如超高壓水銀燈、氙燈、或紫外線發光雷射。A light source 7 is mounted above the mask stage 6. The light source 7 is always turned on during the exposure period of the color filter substrate 1, and irradiates the mask 14 held by the mask stage 6 with exposure light to emit a light source containing ultraviolet light. For example, ultra high pressure mercury lamps, xenon lamps, or ultraviolet ray lasers.
該光罩載台6與光源7之間裝設有光學積分器8。該光學積分器8係用於使照射於光罩14之曝光光線的亮度分布均勻化，例如，萬花筒(Kaleidoscope)或複眼透鏡(Fly's eye lens)等。此外，在本實施形態中，係以萬花筒表示，而其端面8a之形狀係被設成長方形，而曝光光線僅照射於光罩14之多個光罩圖案17之形成區域。再者，若形成反射或吸收紫外線而穿透可見光之濾光器，以覆蓋光罩14之觀察窗18與光罩側對準標記19時，則曝光光線也可以照射光罩14整體。An optical integrator 8 is mounted between the mask stage 6 and the light source 7. The optical integrator 8 is used to uniformize the luminance distribution of the exposure light irradiated to the reticle 14, for example, a Kaleidoscope or a Fly's eye lens. Further, in the present embodiment, the end face 8a is formed in a rectangular shape, and the exposure light is irradiated only to the formation region of the plurality of mask patterns 17 of the mask 14. Further, when a filter that reflects or absorbs ultraviolet light and penetrates visible light is formed to cover the observation window 18 of the photomask 14 and the mask side alignment mark 19, the exposure light may be irradiated to the entire photomask 14.
該光罩載台6與光學積分器8之間裝設有聚光透鏡9。該聚光透鏡9係將其前焦點放在依後述之成像透鏡10所形成的該光學積分器8的端面8a之像的成像位置附近，以將曝光光線變成平行光，俾垂直地照射於光罩14，其為聚光透鏡。A collecting lens 9 is mounted between the mask stage 6 and the optical integrator 8. The condensing lens 9 has its front focus placed near the imaging position of the image of the end face 8a of the optical integrator 8 formed by the imaging lens 10 to be described later, so that the exposure light is converted into parallel light, and the illuminating light is vertically irradiated. A cover 14, which is a concentrating lens.
在該光學積分器8與聚光透鏡9之間裝設有成像透鏡10。該成像透鏡10係用於將光學積分器8之端面之像暫時成像於該聚光透鏡9之前面，其為凸透鏡。An imaging lens 10 is mounted between the optical integrator 8 and the collecting lens 9. The imaging lens 10 is for temporarily imaging an image of an end surface of the optical integrator 8 on the front surface of the condensing lens 9, which is a convex lens.
在依該成像透鏡10所形成之該光學積分器8之端面之像的成像位置附近，設有光閥(Shutter)11。該光閥11係在藉由彩色濾光片基板1之移動而使多個曝光區域2依次通過該光罩14之光罩圖案17下側時，同步進行曝光光線之照射與遮斷間之切換，可以於圖1中箭號A所示之彩色濾光片基板1之移動方向與相反方向(箭號B方向)移動或停止，以防止曝光光線照射到該彩色濾光片基板1之鄰接的第1與第2非曝光區域3a、3b。然後，如圖5所示，沿著箭號B所示之移動方向，形成與該彩色濾光片基板1之第1至第3之曝光區域2a至2c的數目相同之狹縫23。另外，與該彩色濾光片基板1之第1至第3之曝光區域2a至2c相對應之狹縫23，分別為第1狹縫23a、第2狹縫23b、與第3狹縫23c。此外，與第1與第2非曝光區域相對應之第1與第2狹縫23a、23b之間的部分，為第1遮光區域30a，第2與第3狹縫23b、23c之間的部分，為第2遮光區域30b。A shutter 11 is provided in the vicinity of the image forming position of the image of the end face of the optical integrator 8 formed by the imaging lens 10. When the plurality of exposure regions 2 are sequentially passed through the lower side of the mask pattern 17 of the mask 14 by the movement of the color filter substrate 1, the light valve 11 is switched between the irradiation of the exposure light and the interruption. It can be moved or stopped in the moving direction and the opposite direction (arrow B direction) of the color filter substrate 1 shown by the arrow A in FIG. 1 to prevent the exposure light from being irradiated to the adjacent side of the color filter substrate 1. The first and second non-exposed regions 3a and 3b. Then, as shown in FIG. 5, slits 23 having the same number as the first to third exposure regions 2a to 2c of the color filter substrate 1 are formed along the moving direction indicated by the arrow B. Further, the slits 23 corresponding to the first to third exposure regions 2a to 2c of the color filter substrate 1 are the first slit 23a, the second slit 23b, and the third slit 23c, respectively. Further, the portion between the first and second slits 23a and 23b corresponding to the first and second non-exposed regions is the first light-shielding region 30a, and the portion between the second and third slits 23b and 23c. It is the second light-shielding area 30b.
此時，圖5所示之該光閥11之狹縫23之尺寸大小(w×d)，若假設聚光透鏡9之倍率為M，圖3所示之光罩14之多個光罩圖案17之總寬度為W，以及光罩圖案17之長度為D時，則至少形成w＝W/M與d＝D/M。另外，鄰接的狹縫23之間隔G2，若假設圖2所示之彩色濾光片基板1之鄰接的曝光區域2之間隔為G1時，即設定為G2＝G1/M。另外，若假設光閥11朝箭號B方向之移動速度為v，彩色濾光片基板1之搬送速度為V時，則成為v＝V/M。此外，在圖5中，附加斜線所表示之區域為曝光光線之照射區域31。At this time, the size (w×d) of the slit 23 of the light valve 11 shown in FIG. 5, if the magnification of the collecting lens 9 is assumed to be M, the plurality of mask patterns of the mask 14 shown in FIG. When the total width of 17 is W, and the length of the reticle pattern 17 is D, at least w = W / M and d = D / M are formed. Further, when the interval G2 between the adjacent slits 23 is assumed to be G1 at the interval between the adjacent exposure regions 2 of the color filter substrate 1 shown in Fig. 2, G2 = G1/M is set. In addition, when the moving speed of the light valve 11 in the direction of the arrow B is v, and the conveying speed of the color filter substrate 1 is V, it is v=V/M. Further, in Fig. 5, the area indicated by the additional oblique line is the irradiation area 31 of the exposure light.
此外，曝光光學系統24係由該光源7、光學積分器8、成像透鏡10、聚光透鏡9、光罩載台6、與光閥11所構成。Further, the exposure optical system 24 is composed of the light source 7, the optical integrator 8, the imaging lens 10, the collecting lens 9, the mask stage 6, and the light valve 11.
該載台5之上方裝設有攝影手段12。該攝影手段12透過鏡25，將形成於彩色濾光片基板1之基板側對準標記22、以及形成於光罩14之光罩側對準標記19，分別捕捉於同一視野內拍攝，而包含：將接受光線之多個受光元件排列成一直線狀之線型電荷耦合裝置(Line CCD)26，以及攝影透鏡27，係配置於前方，而使形成於彩色濾光片基板1之基板側對準標記22、與形成於像素21或光罩14之光罩側對準標記19，分別成像於該線型CCD 26上。A photographing means 12 is mounted above the stage 5. The photographing means 12 transmits the substrate-side alignment mark 22 formed on the color filter substrate 1 and the mask-side alignment mark 19 formed on the mask 14 through the mirror 25, and captures the same in the same field of view, and includes A line type charge coupled device (Line CCD) 26 in which a plurality of light receiving elements that receive light are arranged in a line shape, and a photographic lens 27 are disposed in front to form a substrate side alignment mark formed on the color filter substrate 1. 22. The mask side alignment marks 19 formed on the mask 21 or the mask 14 are respectively formed on the line type CCD 26.
再者，如圖1所示，在該攝影手段12之光路上，於線型CCD 26與攝影透鏡27之間，裝設有光學距離修正手段28。該光學距離修正手段28係用於使攝影手段12之線型CCD 26與彩色濾光片基板1之間的光學距離、以及攝影手段12之線型CCD 26與光罩14之間的光學距離，大致相符；係由具有比空氣之折射率大的特定折射率的透明基材所構成，例如玻璃板。具體地說，該光學距離修正手段28係裝設於隔著形成於光罩14之觀察窗18而連接攝影手段12之線型CCD 26與彩色濾光片基板1之光路上。藉此，可以使位置偏離攝影手段12之光軸方向之彩色濾光片基板1的基板側對準標記22等的像、以及光罩14之光罩側對準標記19的像，同時成像在上述線型CCD 26上。Further, as shown in FIG. 1, an optical distance correcting means 28 is disposed between the linear CCD 26 and the photographing lens 27 on the optical path of the photographing means 12. The optical distance correction means 28 is for substantially matching the optical distance between the linear CCD 26 of the imaging means 12 and the color filter substrate 1, and the optical distance between the linear CCD 26 of the imaging means 12 and the reticle 14. It consists of a transparent substrate having a specific refractive index greater than the refractive index of air, such as a glass plate. Specifically, the optical distance correcting means 28 is mounted on the optical path of the linear CCD 26 and the color filter substrate 1 which are connected to the imaging means 12 via the observation window 18 formed in the reticle 14. Thereby, the image of the substrate side alignment mark 22 of the color filter substrate 1 whose position is deviated from the optical axis direction of the imaging means 12, and the image of the mask side alignment mark 19 of the mask 14 can be imaged at the same time. Above the line type CCD 26.
其次，要說明如此構成之曝光裝置之操作。Next, the operation of the exposure apparatus thus constituted will be explained.
在此，如圖4所示，所使用之彩色濾光片基板1，係在透明的玻璃基板之一面，形成由鉻(Cr)等所構成之不透明膜，如同圖所示，在曝光區域2內多個像素21係形成矩陣狀。另外，在其一端部1a側之大致中央部，形成細長形的基板側對準標記22，用於修正並對準預先設定於該光罩14之基準位置R1、與預先設定於該彩色濾光片基板1之基準位置R2之位置偏移。另外，在該基板側對準標記22之一側，由中央側朝一方的側端部1b排列的多個對準確認標記29，係對應像素21並以像素21之排列的3節距間隔相一致的間隔形成。此外，該基板側對準標記22與對準確認標記29，在圖4中分別被形成為與各標記之左邊緣部所相對應之像素21之左邊緣部一致。Here, as shown in FIG. 4, the color filter substrate 1 used is formed on one surface of a transparent glass substrate to form an opaque film made of chromium (Cr) or the like, as shown in the drawing, in the exposed region 2 The plurality of pixels 21 are formed in a matrix shape. Further, an elongated substrate-side alignment mark 22 is formed on a substantially central portion of the one end portion 1a side for correcting and aligning a reference position R1 set in advance in the mask 14, and is previously set in the color filter. The position of the reference position R2 of the sheet substrate 1 is shifted. Further, on one side of the substrate-side alignment mark 22, a plurality of alignment confirmation marks 29 arranged from the center side toward the one side end portion 1b are corresponding to the pixels 21 and are spaced by three pitches of the arrangement of the pixels 21. Consistent spacing is formed. Further, the substrate-side alignment mark 22 and the alignment confirmation mark 29 are formed to coincide with the left edge portion of the pixel 21 corresponding to the left edge portion of each mark, respectively, in FIG.
如此形成的彩色濾光片基板1，上面塗敷有特定之彩色光阻(Color resist)，形成有該基板側對準標記22之端部1a側，係位於圖4中以箭號A所示之搬送方向之前方，而被載置於載台5之上面5a，並且藉由搬送手段13，以特定之速度V，朝箭號A的方向搬送。The color filter substrate 1 thus formed is coated with a specific color resist, and the end portion 1a side of the substrate-side alignment mark 22 is formed, as shown by an arrow A in FIG. The conveyance direction is placed on the upper surface 5a of the stage 5, and is conveyed in the direction of the arrow A at a specific speed V by the conveyance means 13.
另一方面，光罩14如圖3所示，將形成有觀察窗18的端部14c側，係位於箭號A所示之搬送方向之前面，並且如圖1所示將形成有遮光膜16之面朝向下面而保持於光罩載台6。然後，接近而面對被搬送之彩色濾光片基板1的上面。On the other hand, as shown in FIG. 3, the photomask 14 is formed on the side of the end portion 14c where the observation window 18 is formed, and is placed in front of the conveyance direction indicated by the arrow A, and a light shielding film 16 is formed as shown in FIG. The face is held toward the lower surface and held on the mask stage 6. Then, it approaches the upper surface of the color filter substrate 1 to be transported.
在此種狀態下，利用攝影手段12，透過光罩14所形成之觀察窗18，拍攝彩色濾光片基板1上的基板側對準標記22、對準確認標記29、以及像素21。此時，隔著形成於光罩14之觀察窗18，在攝影手段12之線型CCD 26與彩色濾光片基板1所連結成之光路上，裝設有光學距離修正手段28，由於其光學距離設成大致等於攝影手段12之線型CCD 26與光罩14之間的光學距離，因此，位於偏離攝影手段12之光軸方向之彩色濾光片基板1上之基板側對準標記22等之像、以及光罩14之光罩側對準標記19之像，會同時成像於攝影手段12之線型CCD 26上。從而，以攝影手段12同時拍攝到的基板側對準標記22等之影像、以及光罩側對準標記19之影像，可同時在省略圖示之影像處理部被處理。In this state, the substrate side alignment mark 22, the alignment confirmation mark 29, and the pixel 21 on the color filter substrate 1 are imaged by the imaging means 12 through the observation window 18 formed by the mask 14. At this time, the optical distance correcting means 28 is mounted on the optical path connecting the linear CCD 26 of the photographing means 12 and the color filter substrate 1 via the observation window 18 formed in the mask 14, because of the optical distance The optical distance between the linear CCD 26 and the photomask 14 of the photographing means 12 is set to be substantially equal to that of the substrate side alignment mark 22 on the color filter substrate 1 which is offset from the optical axis direction of the photographing means 12. And the image of the mask side alignment mark 19 of the mask 14 is simultaneously imaged on the line type CCD 26 of the photographing means 12. Therefore, the image of the substrate-side alignment mark 22 or the like and the image of the mask-side alignment mark 19 which are simultaneously captured by the imaging means 12 can be simultaneously processed by the image processing unit (not shown).
在此，首先，以攝影手段12，如圖6所示，同時拍攝透過光罩14之觀察窗18所觀察到的彩色濾光片基板1之基板側對準標記22、以及光罩14之光罩側對準標記19。此時，讀取檢測出基板側對準標記22之線型CCD 26之受光元件之單元(cell)號碼、以及檢測出該光罩14之基準標記19a之線型CCD 26之受光元件之單元號碼，並以省略圖示之運算部計算其距離L。然後，與預先設定而記憶之特定距離L0 比較。Here, first, the substrate side alignment mark 22 of the color filter substrate 1 and the light of the reticle 14 observed by the observation window 18 of the reticle 14 are simultaneously photographed by the photographing means 12 as shown in FIG. The cover side is aligned with the mark 19. At this time, the cell number of the light-receiving element of the linear CCD 26 on which the substrate-side alignment mark 22 is detected, and the unit number of the light-receiving element of the linear CCD 26 which detects the reference mark 19a of the reticle 14 are read, and The distance L is calculated by a calculation unit (not shown). Then, it is compared with a specific distance L 0 that is set and memorized in advance.
然後，如圖6所示，使光罩14朝向箭號X、Y方向移動，俾使基板側對準標記22與基準標記19a之距離L，成為L0 或L0 ±x(x為容許值(tolerance；或稱公差))。如此一來，光罩14之基準位置R1、與彩色濾光片基板1之基準位置R2，在特定容許範圍內成為一致。Then, as shown in FIG. 6, the mask 14 is moved in the direction of the arrows X and Y, and the distance L between the substrate-side alignment mark 22 and the reference mark 19a is made L 0 or L 0 ± x (x is an allowable value). (tolerance; or tolerance)). As a result, the reference position R1 of the photomask 14 and the reference position R2 of the color filter substrate 1 match within a specific allowable range.
接著，透過光罩14之觀察窗18，利用攝影手段12拍攝彩色濾光片基板1之對準確認標記29。然後，讀取檢測出各對準確認標記29之線型CCD 26之受光元件的單元號碼、以及檢測出光罩14之各光罩側對準標記19之線型CCD 26之受光元件的單元號碼，並以運算部計算各單元號碼之平均值。該平均值在對準調整後，即與檢測出該彩色濾光片基板1之基板側對準標記22之線型CCD 26之受光元件的單元號碼比較，若兩者在特定之容許範圍內一致時，即判定為確實進行過對準，而對光罩14照射曝光光線。如此一來，光罩14之光罩圖案17之像，即被轉印到彩色濾光片基板1之像素21上。另外，若該平均值與單元號碼不一致時，例如判定彩色濾光片基板1為其他種類者，或判斷為黑矩陣框(Black matrix)20之形成不良品時，此時即停止曝光並示警。Next, the alignment confirmation mark 29 of the color filter substrate 1 is imaged by the photographing means 12 through the observation window 18 of the mask 14. Then, the unit number of the light-receiving element of the linear CCD 26 of each of the alignment confirmation marks 29 and the unit number of the light-receiving element of the linear CCD 26 that detects the respective mask-side alignment marks 19 of the mask 14 are read and The calculation unit calculates the average value of each unit number. The average value is compared with the unit number of the light-receiving element of the linear CCD 26 that detects the substrate-side alignment mark 22 of the color filter substrate 1 after alignment adjustment, and if the two are within a specific allowable range, That is, it is determined that the alignment is actually performed, and the reticle 14 is irradiated with the exposure light. As a result, the image of the mask pattern 17 of the photomask 14 is transferred onto the pixels 21 of the color filter substrate 1. When the average value does not match the cell number, for example, it is determined that the color filter substrate 1 is of another type, or when it is determined that the black matrix 20 is defective, the exposure is stopped and an alarm is displayed.
然後，將攝影手段13所拍攝的影像資料以及記憶於省略圖示之記憶部之彩色濾光片基板1之基準位置R2之查找表(Look up table,LUT)互相比較，以檢測出基準位置R2。然後，比較檢測出該基準位置R2之線型CCD 26之受光元件的單元號碼、以及檢測出光罩14之基準標記19a之線型CCD 26之受光元件之單元號碼，並朝箭號X、Y方向微動光罩14，俾使兩者的距離L成為L0 或L0 ±x。此外，必要時，光罩14以該面之中心為中心軸作轉動調整。藉此，彩色濾光片基板1即使朝向箭號A所示之方向，邊偏轉(Yawing)邊被搬送，光罩14也會追踪它而移動。如此，光罩14之光罩圖案17被複製於被搬送之彩色濾光片基板1，而在彩色濾光片基板1之特定像素21上很精確地形成條紋狀的曝光圖案列4。Then, the image data captured by the photographing means 13 and the lookup table (LUT) of the reference position R2 of the color filter substrate 1 stored in the memory portion (not shown) are compared with each other to detect the reference position R2. . Then, the unit number of the light receiving element of the linear CCD 26 that detected the reference position R2 and the unit number of the light receiving element of the linear CCD 26 that detected the reference mark 19a of the mask 14 are compared, and the light is slightly moved toward the arrows X and Y. The cover 14 is such that the distance L between them becomes L 0 or L 0 ±x. Further, if necessary, the photomask 14 is rotationally adjusted with the center of the surface as a central axis. Thereby, the color filter substrate 1 is conveyed while being deflected in the direction indicated by the arrow A, and the mask 14 is moved and moved. In this manner, the mask pattern 17 of the photomask 14 is copied onto the transported color filter substrate 1, and the stripe-shaped exposure pattern array 4 is formed accurately on the specific pixels 21 of the color filter substrate 1.
其次，要參照圖7的流程圖，說明利用本發明之曝光裝置進行之曝光順序。Next, the exposure sequence by the exposure apparatus of the present invention will be described with reference to the flowchart of Fig. 7.
首先，使圖5所示之光閥11停止，俾使該第1狹縫23a之中心與曝光光線之光軸中心相一致。另外，此時，光源7是被熄滅。在此狀態下，彩色濾光片基板1被載置於載台5之上面5a，而以特定之速度V，朝圖1所示之箭號A之方向搬送。First, the light valve 11 shown in Fig. 5 is stopped, and the center of the first slit 23a is aligned with the center of the optical axis of the exposure light. In addition, at this time, the light source 7 is turned off. In this state, the color filter substrate 1 is placed on the upper surface 5a of the stage 5, and is transported in the direction of the arrow A shown in Fig. 1 at a specific speed V.
然後，當彩色濾光片基板1之基板側對準標記22到達光罩14之觀察窗18之下側時，在步驟S1中，利用攝影手段12檢測出基板側對準標記22。Then, when the substrate-side alignment mark 22 of the color filter substrate 1 reaches the lower side of the observation window 18 of the photomask 14, the substrate-side alignment mark 22 is detected by the photographing means 12 in step S1.
接著，在步驟S2中，一檢測出基板側對準標記22，即以其做為啟動器(Trigger)以啟動省略圖示之計時器，俾計時t1。Next, in step S2, the substrate-side alignment mark 22 is detected, that is, it is used as a starter (Trigger) to start a timer (not shown), and the timer t1 is set.
在步驟S3中，如圖8(b)所示，從檢測出基板側對準標記22起經過時間t1時，光源7即亮燈。藉此，曝光光線即通過光閥11之第1狹縫23a而照射於光罩14開始曝光。另外，在檢測到基板側對準標記22起經過時間t1後，若設定搬送速度V，使彩色濾光片基板1之第1曝光區域2a之搬送方向(箭號A的方向)之前端部、與光罩14之光罩圖案17之搬送方向(箭號A的方向)之前端部，約略相一致，則如同圖(c)所示，可以配合彩色濾光片基板1之第1曝光區域2a通過光罩14之光罩圖案17下側之時序(Timing)開始曝光。In step S3, as shown in FIG. 8(b), when the time t1 elapses from the detection of the substrate-side alignment mark 22, the light source 7 is turned on. Thereby, the exposure light is irradiated to the photomask 14 through the first slit 23a of the light valve 11, and exposure is started. In addition, after the elapse of time t1 after the detection of the substrate-side alignment mark 22, the conveyance speed V is set, and the end direction of the conveyance direction (direction of the arrow A) of the first exposure region 2a of the color filter substrate 1 is The first end portion of the color filter substrate 1 can be matched with the front end portion of the reticle pattern 17 of the reticle 14 in the direction of the transport direction (the direction of the arrow A). Exposure is started by the timing of the underside of the mask pattern 17 of the mask 14.
在步驟S4中，利用計時器計算開始曝光後所經過之時間t2。此時，若適當地設定時間t2，則曝光開始後經過時間t2後，如圖9(a)所示，藉由彩色濾光片基板1朝向箭號A之方向移動，第1曝光區域2a之搬送方向之後端部、與光罩14之光罩圖案17之搬送方向之後端部，大致上趨於一致。另外，與該第1曝光區域2a與光罩圖案17之搬送方向之後端部相一致的同時，光閥11開始以速度V朝向箭號B的方向移動。In step S4, the timer t is used to calculate the time t2 elapsed after the exposure is started. At this time, if the time t2 is appropriately set, after the elapse of the time t2 after the start of the exposure, as shown in FIG. 9(a), the color filter substrate 1 is moved in the direction of the arrow A, and the first exposure region 2a is The end portion after the conveyance direction and the end portion in the conveyance direction of the mask pattern 17 of the mask 14 substantially coincide with each other. Further, while the first exposure region 2a and the end portion of the mask pattern 17 in the transport direction are aligned, the light valve 11 starts moving in the direction of the arrow B at the speed V.
在步驟S5中，對最後端之曝光區域2(例如在圖2中第3區域2c)之曝光是否已結束，係根據檢測出基板側對準標記22後之經過時間，在省略圖示之判定部來作判定。在此，例如，尚在僅僅結束對第1曝光區域2a的曝光的狀況時，判定為"NO"而進行至步驟S6。In step S5, whether or not the exposure of the exposure region 2 at the rear end (for example, the third region 2c in Fig. 2) has been completed is determined based on the elapsed time after the substrate-side alignment mark 22 is detected, and the illustration is omitted. The Ministry made a decision. Here, for example, when only the state of exposure to the first exposure region 2a is completed, it is determined as "NO", and the process proceeds to step S6.
在步驟S6中，如圖8(c)、(d)所示，配合第1曝光區域2a與第2曝光區域2b之間的第1非曝光區域3a通過光罩14之光罩圖案17下側，光閥11以速度V朝向圖9(b)所示之箭號B的方向移動。藉此，如同圖所示，光閥11之第1狹縫23a與第2狹縫23b之間的第1遮光區域30a，與彩色濾光片基板1之第1非曝光區域3a朝箭號A的方向移動，係同步移動，利用該第1遮光區域30a遮斷曝光光線，而防止對該第1非曝光區域3a曝光。In step S6, as shown in FIGS. 8(c) and 8(d), the first non-exposed region 3a between the first exposure region 2a and the second exposure region 2b is passed through the lower side of the mask pattern 17 of the mask 14. The light valve 11 is moved at a speed V toward the direction of the arrow B shown in Fig. 9(b). Thereby, as shown in the figure, the first light-shielding region 30a between the first slit 23a and the second slit 23b of the light valve 11 and the first non-exposure region 3a of the color filter substrate 1 are directed to the arrow A. The movement in the direction is synchronously moved, and the exposure light is blocked by the first light-shielding region 30a, and exposure to the first non-exposure region 3a is prevented.
在步驟S7中，利用計時器由光閥11開始移動起計時經過之時間t3。此時，一旦經過時間t3，如圖9(c)所示，光閥11再朝向箭號B的方向移動，而第2狹縫23b的中心被定位於曝光光線之光軸中心。同時，彩色濾光片基板1朝箭號A的方向被搬送，第1非曝光區域3a通過光罩14之光罩圖案17下方，第2曝光區域2b之搬送方向之前端部與該光罩圖案17之搬送方向前端部相一致。In step S7, the time t3 elapsed from the start of the movement of the light valve 11 by the timer is used. At this time, once the time t3 has elapsed, as shown in FIG. 9(c), the light valve 11 is moved further in the direction of the arrow B, and the center of the second slit 23b is positioned at the center of the optical axis of the exposure light. At the same time, the color filter substrate 1 is conveyed in the direction of the arrow A, the first non-exposed region 3a passes under the mask pattern 17 of the mask 14, and the end portion of the second exposure region 2b in the transport direction and the mask pattern are The front end of the conveying direction of 17 is the same.
在步驟S8中，如圖8(d)所示，停止光閥11之移動，而返回步驟S4以執行對第2曝光區域2b之曝光。然後，重複執行步驟S4至S8，俾對設定於彩色濾光片基板1之搬送方向之所有曝光區域2進行曝光。In step S8, as shown in Fig. 8(d), the movement of the light valve 11 is stopped, and the process returns to step S4 to perform exposure to the second exposure region 2b. Then, steps S4 to S8 are repeatedly performed to expose all of the exposure regions 2 set in the transport direction of the color filter substrate 1.
如上述，在結束對最後之曝光區域2之曝光後，在步驟S5中，判定為"YES"而進行至步驟S9。As described above, after the exposure to the last exposure region 2 is ended, the determination in step S5 is "YES", and the process proceeds to step S9.
在步驟S9中，如圖8(b)所示，對最後的曝光區域2(例如第3曝光區域2c)之曝光結束(參照同圖(c))之同時，光源7即熄燈。如此一來，設定於彩色濾光片基板1之搬送方向之一列分曝光區域2之曝光即告結束。In step S9, as shown in FIG. 8(b), the exposure of the last exposure region 2 (for example, the third exposure region 2c) is completed (refer to the same figure (c)), and the light source 7 is turned off. As a result, the exposure of the exposure region 2 set in one of the transport directions of the color filter substrate 1 is completed.
此外，若在平行於載台5的上面5a之面內，在與搬送方向(箭號A的方向)垂直的方向，並列裝設例如2台之曝光光學系統24時，則同時也對第1至第3的曝光區域2a至2c隔壁之曝光區域2進行曝光，如圖10所示，也可對所有的曝光區域2形成曝光圖案列4。In addition, when two exposure optical systems 24 are arranged in parallel in the direction perpendicular to the conveyance direction (the direction of the arrow A) in the plane parallel to the upper surface 5a of the stage 5, the first is also applied to the first The exposure regions 2 to the third exposure regions 2a to 2c are exposed, and as shown in FIG. 10, the exposure pattern rows 4 may be formed for all of the exposure regions 2.
在以上的說明中，係針對光源7與成像透鏡10之間設有光學積分器8之情形加以說明，惟本發明並不侷限於此，也可以沒有光學積分器8。此時，若能將成像透鏡10裝設於可使光源7之像成像於聚光透鏡9之面前的位置為理想。In the above description, the case where the optical integrator 8 is provided between the light source 7 and the imaging lens 10 will be described, but the present invention is not limited thereto, and the optical integrator 8 may not be provided. At this time, it is preferable that the imaging lens 10 can be mounted at a position where the image of the light source 7 can be imaged in front of the collecting lens 9.
另外，在以上的說明中，係就開始曝光前，光閥11是在其第1狹縫23a之中心與曝光光線的光軸中心相一致之狀態時停止，光源7熄滅，然後光源7被點亮而開始曝光之情形加以說明，惟本發明並非侷限於此，光源7也可以從開始曝光之前點亮一直持續，光閥11係在開始曝光前，利用其第1狹縫23a之移動方向前端側之遮光區域，遮斷曝光光線的光路之狀態下停止，然後，彩色濾光片基板1之基板側對準標記22，一被攝影手段11檢測出，即開始移動，其第1狹縫23a之中心，一被定位於曝光光線之光軸中心時，即開始曝光。Further, in the above description, before the start of exposure, the light valve 11 is stopped when the center of the first slit 23a coincides with the center of the optical axis of the exposure light, the light source 7 is turned off, and then the light source 7 is turned off. The case where the exposure is started and the exposure is started is described. However, the present invention is not limited thereto, and the light source 7 may be continuously turned on from the start of the exposure, and the light valve 11 is used in the moving direction front end of the first slit 23a before the start of the exposure. The light-shielding region on the side is stopped in a state where the light path of the exposure light is blocked, and then the substrate-side alignment mark 22 of the color filter substrate 1 is detected by the photographing means 11, that is, the movement starts, and the first slit 23a is opened. At the center, the exposure begins when it is positioned at the center of the optical axis of the exposure light.
此外，在以上的說明中，係就光閥11係沿著其移動方向形成與彩色濾光片基板1之多個曝光區域2相同數目的狹縫23之情形加以說明，惟本發明並不侷限於此，光閥11也可以由1片遮光板來形成。此時，光閥11較佳係設成與多個曝光區域2重複通過光罩14下側時同步開閉。Further, in the above description, the case where the light valve 11 forms the same number of slits 23 as the plurality of exposure regions 2 of the color filter substrate 1 along the moving direction thereof is explained, but the present invention is not limited. Here, the light valve 11 may be formed by one light shielding plate. At this time, it is preferable that the light valve 11 is opened and closed in synchronization with the plurality of exposure regions 2 repeatedly passing through the lower side of the mask 14.
而且，在以上的說明中，係就被曝光體為彩色濾光片基板1之情形加以說明，惟本發明並不侷限於此，只要在多個曝光區域2形成條紋狀之曝光圖案列4之基板，則任何基板皆可使用。Further, in the above description, the case where the exposed object is the color filter substrate 1 will be described, but the present invention is not limited thereto, as long as the stripe-shaped exposure pattern array 4 is formed in the plurality of exposure regions 2. For the substrate, any substrate can be used.
1．．．彩色濾光片基板1. . . Color filter substrate
2．．．曝光區域2. . . Exposure area
5．．．載台5. . . Loading platform
6．．．光罩載台6. . . Photomask stage
7．．．光源7. . . light source
8．．．光學積分器8. . . Optical integrator
9．．．聚光透鏡9. . . Condenser lens
10．．．成像透鏡10. . . Imaging lens
11．．．光閥11. . . Light valve
12．．．攝影手段12. . . Photography means
13．．．搬送手段13. . . Transport means
14．．．光罩14. . . Mask
15．．．透明基材15. . . Transparent substrate
16．．．遮光膜16. . . Sunscreen
17．．．光罩圖案17. . . Mask pattern
18．．．觀察窗18. . . Observation window
19．．．光罩側對準標記19. . . Mask side alignment mark
20．．．黑矩陣框20. . . Black matrix box
21．．．像素twenty one. . . Pixel
22．．．基板側對準標記twenty two. . . Substrate side alignment mark
23．．．狹縫twenty three. . . Slit
24．．．曝光光學系統twenty four. . . Exposure optical system
25．．．鏡25. . . mirror
26．．．線型CCD26. . . Linear CCD
27．．．攝影透鏡27. . . Photographic lens
28．．．光學距離修正手段28. . . Optical distance correction
30a．．．第1遮光區域30a. . . First shading area
30b．．．第2遮光區域30b. . . Second shading area
圖1為表示本發明之曝光裝置之實施形態之概略構造的正面圖；圖2為表示使用於該曝光裝置之彩色濾光片基板上所設定之多個曝光區域之一例的平面圖；圖3為表示使用於該曝光裝置之光罩之一構造例的平面圖；圖4為表示使用於該曝光裝置之彩色濾光片基板之一構造例的平面圖；圖5為表示使用於該曝光裝置之光閥之一構造例的平面圖；圖6為表示該光罩與彩色濾光片基板之位置對準的說明圖；圖7為用於說明利用該曝光裝置進行之曝光順序之流程圖；圖8為用於說明與該彩色濾光片基板之多個曝光區域依次通過光罩下側時同步的光閥之操作之時序圖(Timing chart)；圖9為表示，在該曝光裝置之曝光操作中，針對彩色濾光片基板之第1非曝光區域，防止曝光操作之說明圖；圖10為表示利用該曝光裝置，在彩色濾光片基板之多個曝光區域形成曝光圖案列之狀態的平面圖；以及圖11為表示設定於彩色濾光片基板之搬送方向之多個曝光區域之外部、互相鄰接的曝光區域之間的部分，形成有曝光圖案列之狀態的平面圖。1 is a front view showing a schematic configuration of an embodiment of an exposure apparatus according to the present invention; and FIG. 2 is a plan view showing an example of a plurality of exposure regions set on a color filter substrate of the exposure apparatus; FIG. 4 is a plan view showing a configuration example of a color filter substrate used in the exposure device; FIG. 5 is a plan view showing a light filter used in the exposure device; Figure 6 is a plan view showing the alignment of the photomask and the color filter substrate; Figure 7 is a flow chart for explaining the exposure sequence by the exposure device; A timing chart for explaining the operation of the light valve synchronized with the plurality of exposure regions of the color filter substrate sequentially passing through the lower side of the mask; FIG. 9 is a view showing, in the exposure operation of the exposure device, FIG. 10 is a view showing a state in which an exposure operation is prevented in a first non-exposed region of a color filter substrate; and FIG. 10 is a view showing a state in which an exposure pattern is formed in a plurality of exposure regions of the color filter substrate by the exposure device. FIG surface; and a plurality of external exposed area 11 is a color filter substrate set in the conveying direction, the portion between the exposed regions adjacent to each other, is formed with a plan view showing a state of the exposure pattern columns.
1．．．彩色濾光片基板1. . . Color filter substrate
2．．．曝光區域2. . . Exposure area
5．．．載台5. . . Loading platform
6．．．光罩載台6. . . Photomask stage
7．．．光源7. . . light source
8．．．光學積分器8. . . Optical integrator
9．．．聚光透鏡9. . . Condenser lens
10．．．成像透鏡10. . . Imaging lens
11．．．光閥11. . . Light valve
12．．．攝影手段12. . . Photography means
13．．．搬送手段13. . . Transport means
14．．．光罩14. . . Mask
15．．．透明基材15. . . Transparent substrate
16．．．遮光膜16. . . Sunscreen
17．．．光罩圖案17. . . Mask pattern
18．．．觀察窗18. . . Observation window
19．．．光罩側對準標記19. . . Mask side alignment mark
20．．．黑矩陣框20. . . Black matrix box
21．．．像素twenty one. . . Pixel
22．．．基板側對準標記twenty two. . . Substrate side alignment mark
23．．．狹縫twenty three. . . Slit
24．．．曝光光學系統twenty four. . . Exposure optical system
25．．．鏡25. . . mirror
26．．．線型CCD26. . . Linear CCD
27．．．攝影透鏡27. . . Photographic lens
28．．．光學距離修正手段28. . . Optical distance correction
30a．．．第1遮光區域30a. . . First shading area
30b．．．第2遮光區域30b. . . Second shading area
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005309205A JP5382899B2 (en) | 2005-10-25 | 2005-10-25 | Exposure equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200731033A TW200731033A (en) | 2007-08-16 |
| TWI446124B true TWI446124B (en) | 2014-07-21 |
Family
ID=37967554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95139074A TWI446124B (en) | 2005-10-25 | 2006-10-24 | Exposure apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5382899B2 (en) |
| KR (1) | KR101306917B1 (en) |
| CN (1) | CN101268420B (en) |
| TW (1) | TWI446124B (en) |
| WO (1) | WO2007049436A1 (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5235061B2 (en) * | 2007-08-30 | 2013-07-10 | 株式会社ブイ・テクノロジー | Exposure equipment |
| JP5098041B2 (en) * | 2007-08-31 | 2012-12-12 | 株式会社ブイ・テクノロジー | Exposure method |
| JP5256434B2 (en) * | 2008-06-11 | 2013-08-07 | 株式会社ブイ・テクノロジー | Proximity exposure equipment |
| WO2010070988A1 (en) * | 2008-12-16 | 2010-06-24 | 株式会社ブイ・テクノロジー | Method for forming projected pattern, exposure apparatus and photomask |
| KR101254442B1 (en) * | 2009-02-26 | 2013-04-12 | 도판 인사츠 가부시키가이샤 | Color filter and manufacturing method for a color filter |
| JP5258051B2 (en) * | 2009-04-03 | 2013-08-07 | 株式会社ブイ・テクノロジー | Exposure method and exposure apparatus |
| JP5622052B2 (en) * | 2009-04-28 | 2014-11-12 | 凸版印刷株式会社 | Color filter, liquid crystal display device, and method of manufacturing color filter |
| KR20120022908A (en) | 2009-04-30 | 2012-03-12 | 도판 인사츠 가부시키가이샤 | Liquid crystal display device |
| US8605237B2 (en) | 2009-04-30 | 2013-12-10 | Toppan Printing Co., Ltd. | Color filter and liquid crystal display device, and exposure mask |
| JP5633021B2 (en) * | 2009-06-29 | 2014-12-03 | 株式会社ブイ・テクノロジー | Alignment method, alignment apparatus, and exposure apparatus |
| TWI421546B (en) * | 2009-10-02 | 2014-01-01 | Unique Instr Co Ltd | A Method for Copying Production of 3D Parallax Gratings |
| US8778576B2 (en) | 2009-12-24 | 2014-07-15 | Toppan Printing Co., Ltd. | Exposure method and exposure device |
| JP5542456B2 (en) | 2010-01-18 | 2014-07-09 | 凸版印刷株式会社 | Color filter substrate exposure method |
| JP5549233B2 (en) * | 2010-01-18 | 2014-07-16 | 凸版印刷株式会社 | Color filter substrate exposure method |
| JPWO2011105461A1 (en) * | 2010-02-24 | 2013-06-20 | Ｎｓｋテクノロジー株式会社 | Light irradiation apparatus for exposure apparatus, exposure apparatus, exposure method, substrate manufacturing method, mask, and substrate to be exposed |
| JP5382456B2 (en) * | 2010-04-08 | 2014-01-08 | 株式会社ブイ・テクノロジー | Exposure method and exposure apparatus |
| KR101681143B1 (en) | 2010-07-19 | 2016-12-02 | 삼성디스플레이 주식회사 | Exposure apparatus and exposure method using the same |
| KR101104367B1 (en) * | 2011-07-27 | 2012-01-16 | 주식회사 필옵틱스 | Exposure apparatus using led |
| US9081297B2 (en) | 2012-05-01 | 2015-07-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography apparatus having dual reticle edge masking assemblies and method of use |
| CN103955088B (en) * | 2014-05-12 | 2017-02-22 | 青岛斯博锐意电子技术有限公司 | Liquid crystal photomask and application thereof |
| CN103955087B (en) * | 2014-05-12 | 2017-01-04 | 青岛斯博锐意电子技术有限公司 | Liquid crystal photomask, application thereof and plate making device |
| CN106324892B (en) * | 2016-10-11 | 2019-08-02 | 武汉华星光电技术有限公司 | A kind of exposure system being used to prepare display base plate and exposal control method |
| CN114252014A (en) * | 2021-12-24 | 2022-03-29 | 长飞光纤光缆股份有限公司 | System and method for testing mark size of photomask substrate |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177317A (en) * | 1988-12-28 | 1990-07-10 | Canon Inc | Exposure device |
| JP3348476B2 (en) * | 1993-08-09 | 2002-11-20 | 株式会社ニコン | Scanning exposure apparatus and scanning exposure method |
| JPH09199402A (en) * | 1996-01-12 | 1997-07-31 | Canon Inc | Scanning aligner |
| JPH09274323A (en) * | 1996-04-04 | 1997-10-21 | Toppan Printing Co Ltd | Pattern exposing method |
| JPH1010745A (en) * | 1996-06-19 | 1998-01-16 | Toppan Printing Co Ltd | Pattern exposure method |
| JPH1197343A (en) * | 1997-09-24 | 1999-04-09 | Canon Inc | Exposing device |
| JP4581262B2 (en) * | 2000-02-18 | 2010-11-17 | 株式会社ニコン | Exposure apparatus and exposure method |
| JP2002222761A (en) * | 2000-11-22 | 2002-08-09 | Nikon Corp | Illuminating optical device and aligner provided therewith |
| JP4346320B2 (en) * | 2003-02-05 | 2009-10-21 | 大日本印刷株式会社 | Exposure method and exposure apparatus |
| JP2005221596A (en) * | 2004-02-04 | 2005-08-18 | Dainippon Screen Mfg Co Ltd | Pattern drawing system |
-
2005
- 2005-10-25 JP JP2005309205A patent/JP5382899B2/en active Active
-
2006
- 2006-10-04 WO PCT/JP2006/319853 patent/WO2007049436A1/en active Application Filing
- 2006-10-04 KR KR1020087001979A patent/KR101306917B1/en active IP Right Grant
- 2006-10-04 CN CN2006800349340A patent/CN101268420B/en not_active Expired - Fee Related
- 2006-10-24 TW TW95139074A patent/TWI446124B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN101268420A (en) | 2008-09-17 |
| KR20080059546A (en) | 2008-06-30 |
| JP5382899B2 (en) | 2014-01-08 |
| WO2007049436A1 (en) | 2007-05-03 |
| JP2007121344A (en) | 2007-05-17 |
| TW200731033A (en) | 2007-08-16 |
| CN101268420B (en) | 2010-10-27 |
| KR101306917B1 (en) | 2013-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI446124B (en) | Exposure apparatus | |
| TWI446122B (en) | Exposure apparatus | |
| TWI397776B (en) | Exposing apparatus | |
| JP5224341B2 (en) | Exposure apparatus and photomask | |
| TWI467345B (en) | Exposure apparatus and photomask | |
| JPH03211813A (en) | Exposure aligner | |
| TWI475337B (en) | Alignment method, alignment apparatus and exposure apparatus | |
| JPH0140490B2 (en) | ||
| JP5235061B2 (en) | Exposure equipment | |
| US6927854B2 (en) | Projection exposure device and position alignment device and position alignment method | |
| JP4764237B2 (en) | Exposure equipment | |
| TWI391796B (en) | Exposure apparatus and exposed substance | |
| TWI407246B (en) | Photomask and exposure method using same | |
| KR101660918B1 (en) | Exposure device and photo mask | |
| KR101650116B1 (en) | Exposure apparatus and photomask used therein | |
| JP4971835B2 (en) | Exposure method and exposure apparatus | |
| TWI512388B (en) | Photomask, laser beam annealing apparatus and exposure apparatus therewith | |
| TWI472885B (en) | Alignment method, alignment apparatus and exposure apparatus | |
| WO2010070988A1 (en) | Method for forming projected pattern, exposure apparatus and photomask | |
| TWI548947B (en) | Exposure apparatus and photomask | |
| JP2010262212A (en) | Exposure apparatus and exposure method | |
| JP2011203152A (en) | Shape defect inspection method and device therefor | |
| TWI490657B (en) | Exposure apparatus and photomask to be used for same | |
| JP3634032B2 (en) | Projection exposure apparatus and exposure method | |
| JP2004354230A (en) | Position detection device, exposure apparatus and exposure method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |