TWI397776B - Exposing apparatus - Google Patents

Exposing apparatus Download PDF

Info

Publication number
TWI397776B
TWI397776B TW094121819A TW94121819A TWI397776B TW I397776 B TWI397776 B TW I397776B TW 094121819 A TW094121819 A TW 094121819A TW 94121819 A TW94121819 A TW 94121819A TW I397776 B TWI397776 B TW I397776B
Authority
TW
Taiwan
Prior art keywords
exposure
exposed
optical system
light
opening
Prior art date
Application number
TW094121819A
Other languages
Chinese (zh)
Other versions
TW200600981A (en
Inventor
Ito Miyoshi
Original Assignee
V Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Publication of TW200600981A publication Critical patent/TW200600981A/en
Application granted granted Critical
Publication of TWI397776B publication Critical patent/TWI397776B/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Color Television Image Signal Generators (AREA)

Description

曝光裝置Exposure device

本發明係關於一種曝光裝置,其係以曝光光學系照射曝光光線於該曝光光學系途徑上介裝的光罩開口部之像,而使其曝露於被曝光體上。更詳言之,一方面以一定速度移動被曝光體,而以預先設定於形成於該被曝光體的基準圖型上之基準位置為基準,來控制曝光位置的設定及曝光光線的照射時機,藉此利用光罩有效率的在廣大曝光領域施行曝光者。The present invention relates to an exposure apparatus that exposes an image of an opening of a mask to which exposure light is applied to the exposure optical system by an exposure optical system, thereby exposing it to an object to be exposed. More specifically, on the one hand, the object to be exposed is moved at a constant speed, and the setting of the exposure position and the timing of exposure of the exposure light are controlled based on a reference position set in advance on the reference pattern formed on the object to be exposed. Thereby, the reticle is efficiently used to perform exposure in a wide range of exposure fields.

以往這種曝光裝置,保持基板的感光材面向上,使基板可在X、Y、Z軸方向及θ方向控制其移動,而且具備至少可在X、Y方向之一方向以步級移動設定距離的基台;保持光罩於基板上側的光罩基台;從光罩上方向基板側照射曝光光線的光源部;自動對準基台上基板與光罩位置的自動對準機構;及用以控制基板與光罩間空隙之空隙控制機構。藉此,利用對準機構與空隙控制機構對準基板與光罩的位置,一俟完成空隙調整,以設定時間從光源部照射曝光光線施行第一次曝光,其次例如以設定節距移動基台於X方向而再度對準位置。完成空隙調整後施行第二次曝光,如此反覆操作,即可曝露設定圖型於大型基板之全面(例如參照特開平9-127702號公報)。Conventionally, such an exposure apparatus maintains the photosensitive material of the substrate facing upward, and controls the movement of the substrate in the X, Y, Z-axis directions and the θ direction, and has a set distance in steps of at least one of the X and Y directions. a base of the reticle holding the reticle on the upper side of the substrate; a light source portion for illuminating the light from the smear on the substrate side; an automatic alignment mechanism for automatically aligning the position of the substrate and the reticle on the base; A gap control mechanism that controls a gap between the substrate and the mask. Thereby, the alignment mechanism and the gap control mechanism are used to align the position of the substrate and the mask, and the gap adjustment is completed, the first exposure is performed by irradiating the exposure light from the light source portion at a set time, and then the base is moved, for example, at a set pitch. Realign the position in the X direction. After the gap adjustment is performed, the second exposure is performed, and the operation is repeated to expose the entire pattern to the large substrate (see, for example, Japanese Laid-Open Patent Publication No. Hei 9-127702).

但是這樣的傳統曝光裝置,一經完成對設定領域的曝光,即終止曝光動作,而將光罩對基板相對的以步級移動,再度施行基板與光罩的位置對準,及空隙調整而曝光。如此施行多次對準位置及空隙調整,需冗長時間,曝光須經長時間才能完成。However, in such a conventional exposure apparatus, once the exposure to the set field is completed, the exposure operation is terminated, and the mask is moved relative to the substrate in steps, the positional alignment of the substrate and the mask is performed again, and the gap is adjusted to be exposed. Such a plurality of alignment positions and gap adjustments are required to take a long time, and the exposure takes a long time to complete.

又上述之傳統曝光裝置,係使用小面積光罩得以在大型基板全面曝露設定圖型,有抑減所使用光罩成本之優點,但如光罩面積愈小,上述對準位置及調整空隙次數須愈多,調整時間冗長,曝光所需時間亦拉長。In the above conventional exposure apparatus, the small-area mask is used to fully expose the setting pattern on the large substrate, which has the advantage of reducing the cost of the mask used, but if the mask area is smaller, the alignment position and the number of adjustment gaps are used. The more you have to make, the longer the adjustment time, and the longer the exposure time.

此外,為了縮短上述對準位置及調整空隙時間,須要使用稍大的光罩,此場合下曝光光線能量必須增大,為光源功率所限,曝光光線照射時間須拉長,結果無法縮短曝光時間。In addition, in order to shorten the above alignment position and adjust the gap time, it is necessary to use a slightly larger mask. In this case, the exposure light energy must be increased, the light source power is limited, and the exposure light irradiation time must be lengthened, and the exposure time cannot be shortened as a result. .

為了解決上述問題,本發明以提供能夠利用小型光罩來有效在廣大的曝光領域進行曝光的曝光裝置為目的。In order to solve the above problems, the present invention has an object of providing an exposure apparatus capable of efficiently performing exposure in a wide range of exposure fields by using a small photomask.

為了達成上述目的,本發明之第一種實施形態的曝光裝置,係具有從光源對被曝光體照射曝光光線的曝光光學系;及對向配置於該曝光光學系,並搭載該被曝光體而以一定速度搬運的搬運機構。該曝光裝置可曝露介裝於該曝光光學系光路上的光罩開口部之像於該被曝光體上,其具備有以在該搬運機構移動方向該曝光光學系曝光位置的前方為攝影位置,而攝取預先形成於該曝光體的基準圖型之攝影機構;及用以檢出預先設定於該攝影機構所攝得該基準圖型之基準位置,並以該基準位置為基準來控制該曝光光學系的曝光光線的照射時機,藉此把該光罩開口部之像曝露於該被曝光體的設定位置之控制機構。In order to achieve the above object, an exposure apparatus according to a first embodiment of the present invention includes an exposure optical system that irradiates an exposure target with an exposure light from a light source, and an alignment optical system that is disposed opposite to the exposure optical system. A transport mechanism that is transported at a constant speed. The exposure device exposes an image of the opening of the mask that is interposed on the optical path of the exposure optical system to the object to be exposed, and is provided with a photographing position in front of the exposure position of the exposure optical system in the moving direction of the transport mechanism. And capturing a photographing mechanism pre-formed on the reference pattern of the exposing body; and detecting a reference position preset to the reference pattern captured by the photographing mechanism, and controlling the exposure optics based on the reference position The irradiation timing of the exposure light is used to expose the image of the opening of the mask to the control unit of the set position of the object to be exposed.

藉此構成,利用搬運機構以一定速度搬運被曝光體,利用攝影機構攝取預先形成於被曝光體上的基準圖型,利用控制機構檢出預先形成於該基準圖型之基準位置,而以該基準位置為基準來控制來自曝光光學系光源的曝光光線之照射時機,並利用曝光光學系曝露介裝於光路上之光罩開口部的像於被曝光體之設定位置。由是可利用光罩有效率的在廣大曝光領域曝光。又由於可在被曝光體搬運方向以攝影機構攝得曝光光學系曝光位置之前方位置,一方面移動被曝光體,並依據攝影機構所攝得該基準圖型的基準位置而設定曝光位置於被曝光體上,因而得以提高曝光精度。According to this configuration, the object to be exposed is conveyed at a constant speed by the transport mechanism, and the reference pattern previously formed on the object to be exposed is picked up by the photographing means, and the reference position previously formed in the reference pattern is detected by the control means. The reference position is used as a reference to control the timing of the exposure of the exposure light from the exposure optical source, and the exposure optical system exposes the image of the opening of the mask that is interposed on the optical path to the set position of the object to be exposed. It is possible to use the reticle to be effective in exposure to a wide range of exposure fields. Moreover, since the position of the exposure optical system exposure position can be captured by the photographing mechanism in the direction in which the object is to be exposed, the object to be exposed is moved on the one hand, and the exposure position is set according to the reference position of the reference pattern captured by the photographing mechanism. The exposure is improved, thereby improving the exposure accuracy.

此外,該曝光光學系具有用以把該光罩開口部之像聚像於該被曝光體上之聚像透鏡。由是藉聚像透鏡把光罩開口部之像聚集於被曝光體上而予以曝露。又,亦可對被曝光體移離光罩而配置,故可減小污染或損壞光罩之虞。Further, the exposure optical system has a condenser lens for focusing an image of the opening of the mask on the object to be exposed. The image of the opening of the mask is focused on the object to be exposed by the condenser lens. Further, since the object to be exposed can be disposed away from the mask, contamination or damage to the mask can be reduced.

又,本發明之第二種實施形態之曝光裝置,係可透過具有設定開口部的光罩照射來自光源的曝光光線於被曝光體,並曝露該光罩開口部之像於被搬運之被曝光體上。該曝光裝置具有以一定速度搬運該被曝光體之搬運機構;配置於該搬運機構之上方,而把介裝於自該光源至該被曝光體的光路上之該光罩開口部聚像於該被曝光體上的聚像透鏡及以傾斜狀配置於該聚像透鏡與該光罩間的光路上具有光束狹縫之曝光光學系;以可以接受該光束狹縫在聚像透鏡側反射面之反射光方式配置,而透過該聚像透鏡攝取預先形成於該被曝光體的基準圖型之攝影機構;及用以檢出該攝影機構所攝得之預先設定於該基準圖型的基準位置,並以該基準位置為基準來控制該曝光光學系曝光光線的照射時機,而曝露該光罩開口部之像於該被曝光體設定位置之控制機構。Further, in the exposure apparatus according to the second embodiment of the present invention, the exposure light from the light source is irradiated to the object to be exposed through the mask having the set opening, and the image of the opening of the mask is exposed to be exposed. Physically. The exposure apparatus includes a transport mechanism that transports the object to be exposed at a constant speed, and is disposed above the transport mechanism to collect the mask opening that is interposed on the optical path from the light source to the object to be exposed a focusing lens on the object to be exposed and an exposure optical system having a beam slit disposed on an optical path between the focusing lens and the reticle; the light beam slit can be received on the reflecting surface of the condensing lens side And a photographing mechanism configured to receive a reference pattern formed in advance on the object to be exposed through the image lens; and detecting a reference position preset by the photographing mechanism and set in the reference pattern, And controlling the exposure timing of the exposure light of the exposure optical system based on the reference position, and exposing the control mechanism of the opening position of the reticle to the position at which the exposure body is set.

藉此構成,用搬運機構以一定速度搬運被曝光體,用攝影機構透過曝光光學系之聚像透鏡攝取預先形成於被曝光體上的基準圖型,用控制機構檢出預先設定於該基準圖型的基準位置,而以該基準位置為基準來控制曝光光學系所備光源曝光光線之照射時機,用該聚像透鏡把介裝於其光路上的光罩開口部之像聚焦於被曝光體之設定位置而予以曝露。由是使曝光光學系的曝光位置與攝影機構的攝影位置成為一致,得以提高曝光精度。According to this configuration, the object to be exposed is conveyed at a constant speed by the transport mechanism, and the reference pattern previously formed on the object to be exposed is taken by the image pickup mechanism through the image pickup lens of the exposure optical system, and is detected by the control unit in advance in the reference pattern. a reference position of the type, and controlling the timing of the exposure light of the light source provided by the exposure optical system based on the reference position, and focusing the image of the opening of the mask interposed on the optical path with the exposure lens by the image lens It is exposed by setting the position. The exposure accuracy is improved by making the exposure position of the exposure optical system coincide with the imaging position of the photographing mechanism.

再者,該光源係屬間歇發射曝光光線的閃光燈。藉此閃光燈間歇發射曝光光線。又由於使用閃光燈為光源,可易於控制曝光光線的照射時機。Furthermore, the light source is a flash lamp that intermittently emits exposure light. The flash light intermittently emits the exposure light. Also, since the flash is used as a light source, it is easy to control the timing of exposure of the exposure light.

再者,在該搬運機構或曝光光學系之任一方,備有根據該基準位置,演算出設定於該基準圖型的該光罩開口部之曝光預定位置與實際曝光位置之偏差而修正該偏差之對準機構。Further, in either of the transport mechanism or the exposure optical system, the deviation between the exposure target position and the actual exposure position of the mask opening set in the reference pattern is calculated based on the reference position, and the deviation is corrected. Alignment mechanism.

藉此對準機構,根據基準位置來演算設定於基準圖型的光罩開口部曝光預定位置與實際曝光位置之偏差,並修正該偏差,在被曝光體移動至下一個曝光位置之間進行調整校正。因此可以縮短校正時間,同時可以在曝光領域內之任何場所,都可以進行高精度的曝光。By using the alignment mechanism, the deviation between the predetermined exposure position of the mask opening set in the reference pattern and the actual exposure position is calculated based on the reference position, and the deviation is corrected, and the adjustment is performed between the exposure target and the next exposure position. Correction. Therefore, the correction time can be shortened, and high-precision exposure can be performed in any place in the field of exposure.

又,該光罩係在形成於透明玻璃基板上的不透明膜上,對應於該曝光光學系所曝光之曝光領域之寬度,正交於該被曝光體移動方向所形成的一個細長狀的開口部。藉此形成於與被曝光體移動方向正交方向的一個細長狀開口部之光罩來進行曝光。此時可減小光罩尺寸來節省光罩成本,同時可把曝光光學系小型化而抑減裝置成本。Further, the mask is formed on the opaque film formed on the transparent glass substrate, and corresponds to a width of the exposure field exposed by the exposure optical system, and an elongated opening portion orthogonal to the moving direction of the object to be exposed . Thereby, exposure is performed by a mask formed in one elongated opening in a direction orthogonal to the moving direction of the object to be exposed. At this time, the size of the mask can be reduced to save the cost of the mask, and the exposure optical system can be miniaturized to reduce the cost of the device.

再者,該光罩係在不透明的材料上,對應於該曝光光學系所曝光之曝光領域之寬度,正交於該被曝光體移動方向所形成的一個細長狀的開口部,而使該開口部長度為可以調節者。因此應必要時調節形成於被曝光體移動方向正交之方向的一個細長狀開口部之長度。於此情形下對不同長度的曝光圖型,亦可調節開口部長度而應對之。Furthermore, the reticle is on the opaque material, corresponding to the width of the exposure field exposed by the exposure optical system, and an elongated opening formed orthogonal to the moving direction of the exposed object, and the opening is made The length of the part is adjustable. Therefore, the length of one elongated opening formed in the direction orthogonal to the moving direction of the exposed body should be adjusted as necessary. In this case, for different lengths of exposure patterns, the length of the opening can also be adjusted to cope with it.

下文中參照所附圖示詳細說明本發明之實施形態。第1圖為本發明之曝光裝置的第一實施形態之概念圖。此曝光裝置1用曝光光學系之曝光光線照射於介裝於該曝光光學系途徑上光罩開口之像而使其曝露於被曝光體上,係具備有曝光光學系2,攝影機構3,搬運機構4,及控制機構5。以下係以液晶顯示元件的彩色濾光器基板做為被曝光體做說明。Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Fig. 1 is a conceptual view showing a first embodiment of an exposure apparatus of the present invention. The exposure apparatus 1 exposes an image of the opening of the mask attached to the exposure optical system to the object to be exposed by the exposure light of the exposure optical system, and includes an exposure optical system 2, an imaging mechanism 3, and conveyance. Mechanism 4, and control mechanism 5. Hereinafter, a color filter substrate of a liquid crystal display element will be described as an object to be exposed.

該曝光光學系2係照射曝光光線於塗佈有感光劑的彩色濾光器基板6而曝露設定之彩色濾光器圖型者,其具備有光源7,光罩基台8,及聚像透鏡9。The exposure optical system 2 is configured to irradiate exposure light onto a color filter substrate 6 coated with a sensitizer to expose a set color filter pattern, and includes a light source 7, a reticle base 8, and a condensing lens. 9.

該光源7例如為發射紫外線的燈泡,而為後述之控制機構5所控制而間歇發光之閃光燈。又光罩基台8係利用以搭載而保持光罩10者,其係介裝於光源7與後述之聚像透鏡9間之光路上。而且該聚像透鏡9係用以將光罩10的開口部10a聚像於彩色濾光器基板6上,與彩色濾光器基板6成對向配置。又該光罩10,係在形成於透明玻璃基板上的不透明膜,形成對應於該曝光光學系2所曝光的曝光領域寬度而在彩色濾光器基板6的移動方向(箭頭A方向)成正交方向形成的一個細長狀開口部10a,在第一實施形態中,該開口部10a,係如第2圖所示,對應於在黑色矩陣11的橫方向,以一列狀態排成之例如5個畫素12,形成狹縫狀。又光源7,除閃光燈外,亦可使用通常的紫外線燈。此時曝光光線的間歇照射,例如可設置快門於曝光光線照射方向前方,而控制此快門的啟閉。The light source 7 is, for example, a light bulb that emits ultraviolet light, and is a flash lamp that is controlled to be intermittently controlled by a control unit 5 to be described later. Further, the reticle base 8 is attached to the optical path between the light source 7 and the condensing lens 9 to be described later, by holding the reticle 10 for mounting. Further, the condensing lens 9 is used to condense the opening 10a of the reticle 10 on the color filter substrate 6, and is disposed opposite to the color filter substrate 6. Further, the photomask 10 is formed on an opaque film formed on a transparent glass substrate, and is formed to be positive in the moving direction (arrow A direction) of the color filter substrate 6 in accordance with the width of the exposure region exposed by the exposure optical system 2. In the first embodiment, the opening 10a is formed in a row in a row in the horizontal direction of the black matrix 11 as shown in FIG. 2, for example, as shown in FIG. The pixel 12 is formed in a slit shape. In addition to the flashlight, a light source 7 can also be used with a conventional ultraviolet lamp. At this time, intermittent irradiation of the exposure light, for example, the shutter can be set in front of the exposure light irradiation direction to control the opening and closing of the shutter.

又在該彩色濾光器基板6的移動方向(箭頭A方向),該曝光光學系2的曝光位置前方為攝影位置,設有攝影機構3。此攝影機構3,係用以攝取預先形成於彩色濾光器基板6做為基準圖型的黑色矩陣11之畫素12,其受光元件排成一列狀,例如為行CCD。於此如第2圖所示,該攝影機構3的攝影位置與該曝光光學系2的曝光位置,相距設定的距離D,以攝影機構3攝得該畫素12後經過設定時間畫素12就可到達該曝光位置。又該距離D乃愈小愈好。由是可減小彩色濾光器基板6之移動誤差,對於該畫素12可正確定位曝光位置。又如同圖所示,攝影機構3的攝影中心與該光罩10的開口部10a中心,在彩色濾光器基板6的搬運方向(箭頭A方向)成為一致,並將該光罩10之開口部10a中心配置成與該聚像透鏡9之光軸中心成為一致。而且在該攝影機構3之近傍部,設有未圖示之照明機構,用以照明攝影機構3的攝影領域。Further, in the moving direction (arrow A direction) of the color filter substrate 6, the exposure position of the exposure optical system 2 is the imaging position, and the imaging mechanism 3 is provided. The photographing mechanism 3 is for picking up the pixels 12 of the black matrix 11 which are formed in advance on the color filter substrate 6 as a reference pattern, and the light receiving elements are arranged in a line, for example, a line CCD. As shown in FIG. 2, the photographing position of the photographing mechanism 3 and the exposure position of the exposure optical system 2 are separated by a set distance D, and the photographing mechanism 3 picks up the pixel 12 and then passes the set time pixel 12 The exposure position can be reached. The distance D is as small as possible. The movement error of the color filter substrate 6 can be reduced, and the exposure position can be correctly positioned for the pixel 12. As shown in the figure, the center of the photographing mechanism 3 and the center of the opening 10a of the mask 10 are aligned in the transport direction (arrow A direction) of the color filter substrate 6, and the opening of the mask 10 is opened. The center of 10a is arranged to coincide with the center of the optical axis of the concentrating lens 9. Further, an illumination mechanism (not shown) is provided in the vicinity of the photographing mechanism 3 to illuminate the photographing field of the photographing mechanism 3.

再者,在該曝光光學系2之下方設有搬運機構4。此搬運機構4可搭載彩色濾光器基板6於基台上而移動於XY軸方向,而以控制機構5控制未圖示之搬運用馬達來移動基台4a。又該X軸方向係與彩色濾光器基板6之搬運方向(箭頭A方向)一致,而Y軸方向則為與之成正交之方向。又該搬運機構4設有未圖示之例如編碼器及線型傳感器等位置檢出傳感器及速度傳感器,將其輸出回饋於控制機構5俾可執行位置控制及速度控制。再者,搬運機構4設有對準機構29,用以根據該基準位置演算黑色矩陣11上的曝光預定位置與該光罩10的開口部10a之曝光位置間之偏差,而移動基台4a的回轉角度及Y軸方向的位置以修正該偏差。又基台4a的角度可用角度傳感器檢出。Further, a transport mechanism 4 is provided below the exposure optical system 2. The transport mechanism 4 can mount the color filter substrate 6 on the base and move in the XY-axis direction, and the control mechanism 5 controls the transport motor (not shown) to move the base 4a. Further, the X-axis direction coincides with the conveyance direction (arrow A direction) of the color filter substrate 6, and the Y-axis direction is a direction orthogonal thereto. Further, the transport mechanism 4 is provided with a position detecting sensor such as an encoder and a line sensor (not shown) and a speed sensor, and the output is fed back to the control unit 5 to perform position control and speed control. Furthermore, the transport mechanism 4 is provided with an alignment mechanism 29 for calculating the deviation between the predetermined exposure position on the black matrix 11 and the exposure position of the opening 10a of the reticle 10 based on the reference position, and moving the base 4a The position of the swivel angle and the Y-axis direction is corrected to correct the deviation. Further, the angle of the base 4a can be detected by an angle sensor.

此外,控制機構5係連接於上述之光源7,攝影機構3,及搬運機構4。此控制機構5係用以控制整個裝置做適當的動作,其具備有用以檢出預先設定於攝影機構3所攝得該畫素12上的基準位置之畫像處理部13;用以記憶黑色矩陣11的設計資料及相當於該基準位置的觀察桌(LUT)等數據之記憶部14;使用該攝影位置與曝光位置間之距離D與彩色濾光器基板6之移動速度V來演算畫素12自攝影位置移動至曝光位置之時間t,及根據該基準位置求得之曝光預定位置(以下記載為「被曝光領域」)與光罩10的開口部10a間的位置偏差等之演算部15;以該基準位置為基準來控制該光源7曝光光線照射時機之燈光控制器16;用以沿X軸方向以一定速度驅動搬運機構4的基台,同時驅動設於搬運機構4的對準機構之搬運機構控制器17;及用以統合控制整個裝置之控制部18。Further, the control unit 5 is connected to the above-described light source 7, imaging unit 3, and transport mechanism 4. The control mechanism 5 is for controlling the entire device to perform an appropriate operation, and includes an image processing unit 13 for detecting a reference position previously set on the pixel 12 captured by the photographing unit 3; for storing the black matrix 11 The design data and the memory unit 14 corresponding to the data such as the observation table (LUT) of the reference position; using the distance D between the photographing position and the exposure position and the moving speed V of the color filter substrate 6 to calculate the pixel 12 The calculation unit 15 for the time t at which the photographing position is moved to the exposure position, and the positional deviation between the exposure predetermined position (hereinafter referred to as "exposed area") and the opening portion 10a of the mask 10, which is obtained from the reference position; The reference position is used as a reference to control the light controller 16 that exposes the light irradiation timing of the light source 7; the base for driving the transport mechanism 4 at a constant speed in the X-axis direction, and simultaneously drives the alignment mechanism provided in the transport mechanism 4 The mechanism controller 17; and a control unit 18 for integrally controlling the entire device.

第3圖及第4圖為畫像處理部13一構成例之方塊圖。如第3圖所示,畫像處理部13具備有例如三個並聯的環狀緩衝記憶體19A、19B、19C;各並聯於該等環狀緩衝記憶體19A、19B、19C的例如三個列緩衝記憶體20A、20B、20C;連接於該等列緩衝記憶體20A、20B、20C,與既定之臨界值相比較,而2值化灰階數據並予輸出之比較回路21;用以將該等9個列緩衝記憶體20A、20B、20C的輸出數據與從第1個所示記憶部14得來的決定被曝光領域左端的第1基準位置相當之畫像數據LUT(以下記載為「左端用LUT」)相比較,當兩數據一致時輸出左端判定結果之左端判定回路22;及用以將該等9個列緩衝記憶體20A、20B、20C的輸出數據與從第1圖所示記憶部14得來的決定被曝光領域右端的第2基準位置相當之畫像數據LUT(以下記載為「右端用LUT」)相比較,當兩數據一致時輸出右端判定結果之右端判定回路23。3 and 4 are block diagrams showing a configuration example of the image processing unit 13. As shown in Fig. 3, the image processing unit 13 includes, for example, three parallel ring buffer memories 19A, 19B, and 19C, and three column buffers each connected in parallel to the ring buffer memories 19A, 19B, and 19C. The memory 20A, 20B, 20C; a comparison loop 21 connected to the column buffer memories 20A, 20B, 20C, compared with a predetermined threshold value, and binarized gray scale data and outputted; The output data of the nine column buffer memories 20A, 20B, and 20C and the image data LUT corresponding to the first reference position determined at the left end of the exposure area from the first memory unit 14 (hereinafter referred to as "LUT for the left end" In comparison, when the two data match, the left end determination circuit 22 outputs the left end determination result; and the output data for the nine column buffer memories 20A, 20B, and 20C and the memory unit 14 shown in FIG. The obtained decision is compared with the image data LUT (hereinafter referred to as "right end LUT") corresponding to the second reference position at the right end of the exposure field, and the right end determination circuit 23 of the right end determination result is output when the two data match.

又如第4圖所示,畫像處理部13具備有用以輸入該左端判定結果,並計算相當於第1基準位置的畫像數據一致次數之計數回路24A;用以比較該計數回路24A的輸出與第1圖所示記憶部14得來的左端畫素號碼,當兩數值一致時輸出左端指定信號於該記憶部14之比較回路25A;用以輸入該右端判定結果,並計算相當於第2基準位置的畫像數據一致次數之計數回路24B;用以比較該計數回路24B的輸出與第1圖所示記憶部14得來的右端畫素號碼,當兩數值一致時輸出右端指定信號於該記憶部14之比較回路25B;用以依據該計數回路24A之輸出來計算左端畫素n之左端畫素計數回路26;及用以比較該左端畫素計數回路26的輸出與第1圖所示記憶部14得的曝光終了畫素列號碼N,當兩數值一致時輸出曝光終了畫素列指定信號於該記憶部14之比較回路27。又該計數回路24A、24B,攝影機構3之讀取動作一開始,就依其讀取開始信號而重整。又左端計數回路26,在對預先指定領域的曝光終了時依曝光終了信號而重整。Further, as shown in FIG. 4, the image processing unit 13 includes a counter circuit 24A for inputting the left end determination result and calculating the number of coincidences of the image data corresponding to the first reference position, and comparing the output of the counter circuit 24A with the first 1 shows the left-end pixel number obtained by the memory unit 14. When the two values match, the left-end designation signal is outputted to the comparison circuit 25A of the memory unit 14; the right-end determination result is input, and the second reference position is calculated. The image data matching count circuit 24B is configured to compare the output of the counting circuit 24B with the right-end pixel number obtained by the memory unit 14 shown in FIG. 1, and output the right end designating signal to the memory unit 14 when the two values match. a comparison loop 25B for calculating a left-end pixel count loop 26 of the left-end pixel n according to the output of the count loop 24A; and comparing the output of the left-end pixel count loop 26 with the memory portion 14 shown in FIG. The obtained exposure ends with the prime number N, and when the two values match, the exposure end pixel specified signal is output to the comparison loop 27 of the memory unit 14. Further, the counting circuits 24A and 24B, at the beginning of the reading operation of the photographing unit 3, are reformed according to the reading start signal. Further, the left end counting circuit 26 is reformed by the exposure end signal when the exposure to the predetermined area is terminated.

其次參照第5圖的流程圖來說明具此構成的曝光裝置之動作。Next, the operation of the exposure apparatus having the above configuration will be described with reference to the flowchart of Fig. 5.

首先,將電源投入於曝光裝置1,第1圖所示攝影機構3,照明機構及控制機構5即起動而成待機狀態。其次搭載彩色濾光器基板6於搬運機構4的基台4a上,操作未圖示之開關,搬運機構4受控制機構5的搬運機構控制器17之控制而以一定速度沿箭頭A方向搬運彩色濾光器基板6。於是該彩色濾光器基板6到達於攝影機構3的攝影位置時,即藉以下的步驟進行曝光動作。First, the power is supplied to the exposure device 1. The imaging unit 3 shown in Fig. 1 is activated, and the illumination unit and the control unit 5 are activated. Next, the color filter substrate 6 is mounted on the base 4a of the transport mechanism 4, and a switch (not shown) is operated. The transport mechanism 4 is transported in the direction of the arrow A at a constant speed under the control of the transport mechanism controller 17 of the control unit 5. Filter substrate 6. When the color filter substrate 6 reaches the photographing position of the photographing mechanism 3, the exposure operation is performed by the following procedure.

首先,在步驟S1中,以攝影機構3取得黑色矩陣11的畫素12之畫像。此取得的畫像數據,送進第3圖所示畫像處理部13的3個環狀緩衝記憶體19A、19B、19C中加以處理。於是有最新的3個數據分別從環狀緩衝記憶體19A、19B、19C輸出。此時,例如從環狀緩衝記憶體19A輸出前面第2個數據,從環狀緩衝記憶體19B輸出前面第1個數據,從環狀緩衝記憶體19C輸出最新數據。再者,各該數據分別由3個列緩衝記憶體20A、20B、20C,例如將3×3的CCD畫素的畫像配置於同一時鐘(時間軸)。其結果可得例如第6圖(a)所示之畫像。此畫像經數值化後就可對應於如第6圖(b)之3×3數值。這些經數值化之畫像,因係排列於同一時鐘上,故可以比較回路與臨界值比比較而將其2值化。例如臨界值為〝45〞,則第6圖(a)之畫像被2值化成為如第6圖(c)所示。First, in step S1, an image of the pixel 12 of the black matrix 11 is acquired by the photographing unit 3. The image data thus obtained is sent to the three ring buffer memories 19A, 19B, and 19C of the image processing unit 13 shown in Fig. 3 for processing. Then, the latest three data are output from the ring buffer memories 19A, 19B, and 19C, respectively. At this time, for example, the previous second data is output from the ring buffer memory 19A, the first data is outputted from the ring buffer memory 19B, and the latest data is output from the ring buffer memory 19C. Further, each of the data is composed of three column buffer memories 20A, 20B, and 20C, and for example, an image of a 3 × 3 CCD pixel is placed on the same clock (time axis). As a result, for example, an image shown in Fig. 6(a) can be obtained. This image is numerically converted to a value of 3 x 3 as shown in Fig. 6(b). Since these numerical images are arranged on the same clock, the loop can be binarized by comparison with the critical value ratio. For example, if the critical value is 〝45〞, the image of Fig. 6(a) is binarized as shown in Fig. 6(c).

在步驟S2中,進行檢出被曝光領域左右端之基準位置。具體而言,基準位置之檢出於左端判定回路22,將這2值化數據與第1圖所示記憶部14所得左端用LUT之數據進行比較。In step S2, the reference position of the left and right ends of the exposure area is detected. Specifically, the reference position is detected by the left end determination circuit 22, and the binarized data is compared with the data of the left end LUT obtained by the memory unit 14 shown in Fig. 1.

例如指定被曝光領域左端的第1基準位置係設定於第7圖(a)所示的黑色矩陣11之畫素12左上端角落的場合,該左端用LUT就成第7圖(b)所示者,此時之左端LUT數據成〝000011011〞。是以該2值化數據被與該左端用LUT數據〝000011011〞相比較,當兩數據一致時,即判定攝影機構3所取得的畫像數據為第1基準位置,而從左端判定回路22輸出左端判定結果。又如第10圖所示,有5個畫素12並排時,各畫素12的左上端角落相當於第1基準位置。For example, when the first reference position at the left end of the exposure area is set to the upper left corner of the pixel 12 of the black matrix 11 shown in Fig. 7(a), the LUT at the left end is shown in Fig. 7(b). At this time, the LUT data at the left end is 〝 000011011〞. The binary data is compared with the left end LUT data 〝 000011011 ,. When the two data match, the image data acquired by the imaging unit 3 is determined to be the first reference position, and the left end determination circuit 22 outputs the left end. judgement result. Further, as shown in Fig. 10, when five pixels 12 are arranged side by side, the upper left corner of each pixel 12 corresponds to the first reference position.

依據上述判定結果,以第4圖之計數回路24A計算該一致之次數。於是,其計得次數在比較回路25A中,與第1圖之記憶部14所得左端畫素號碼相比較,當兩數值一致時,即輸出左端指定信號於該記憶部14。此時如第10圖所示,例如決定第1個畫素121為左端畫素號碼,則此畫素121的左上端角落部被設定為第1基準位置。由是對應於該第1基準位置之攝影機構3的列CCD之元件地址,例如EL1被記憶部14記憶。Based on the above determination result, the number of coincidences is calculated by the counting circuit 24A of Fig. 4. Then, the counted number is compared with the left-end pixel number obtained by the memory unit 14 of Fig. 1 in the comparison circuit 25A, and when the two values match, the left end designation signal is outputted to the memory unit 14. At this time, as shown in FIG. 10, for example, when the first pixel 121 is determined to be the left-end pixel number, the upper left corner portion of the pixel 121 is set as the first reference position. The element address of the column CCD of the imaging unit 3 corresponding to the first reference position is stored, for example, by the memory unit 14.

另一方面,該2值化數據在右端判定回路23中被與第1圖之記憶部14得來的右端用LUT數據比較。例如指定被曝光領域右端的第2基準位置被設定於第8圖(a)所示黑色矩陣11的畫素12右上端角落部之場合,該右端用LUT即成如第8圖(b)所示者,此時右端LUT數據為〝000110110〞。是以該2值化數據被與該右端用LUT數據〝000110110〞相比較,當兩數據一致時,即判定攝影機構3所取得的畫像數據為被曝光體右端之基準位置,而由右端判定回路23輸出右端判定結果。又如同前述情形,如第10圖所示例如有5個畫素12並列時,各畫素12的右上端角落相當於第二基準位置。On the other hand, the binarized data is compared with the right end LUT data obtained by the memory unit 14 of the first figure in the right end decision circuit 23. For example, when the second reference position at the right end of the exposure area is set to the upper right corner portion of the pixel 12 of the black matrix 11 shown in Fig. 8(a), the LUT at the right end is as shown in Fig. 8(b). At this time, the right end LUT data is 〝000110110〞. The binary data is compared with the right end LUT data 〝000110110〞, and when the two data match, it is determined that the image data acquired by the imaging unit 3 is the reference position of the right end of the object to be exposed, and the right end determination circuit 23 Output the result of the right end decision. As in the foregoing case, as shown in Fig. 10, for example, when five pixels 12 are juxtaposed, the upper right corner of each pixel 12 corresponds to the second reference position.

依據上述判定結果,以第4圖之計數回路24B計算該一致之次數。於是,其計得次數在比較回路25B中,與第1圖之記憶部14所得右端畫素號碼相比較,當兩數值一致時,即輸出右端指定信號於該記憶部14。此時如第10圖所示,例如決定第5個畫素125為右端畫素號碼,則此畫素121的右上端角落部被設定為第2基準位置。由是對應於該第2基準位置之攝影機構3的列CCD之元件地址,例如EL5被記憶部記憶。於是如上述情形檢出被曝光領域左端及右端基準位置後,即進入步驟S3。Based on the above determination result, the number of coincidences is calculated by the counting circuit 24B of Fig. 4. Then, the counted number is compared with the right-end pixel number obtained by the memory unit 14 of Fig. 1 in the comparison circuit 25B, and when the two values match, the right end designation signal is outputted to the memory unit 14. At this time, as shown in FIG. 10, for example, when the fifth pixel 125 is determined to be the right-end pixel number, the upper right corner portion of the pixel 121 is set to the second reference position. The component address of the column CCD of the imaging unit 3 corresponding to the second reference position is stored, for example, by the memory unit. Then, after detecting the left end and the right end reference position of the exposed area as described above, the process proceeds to step S3.

在步驟S3中,如第9圖所示,依據該第1基準位置及第2基準位置之檢出時刻t1、t2來演算對搬運方向的彩色濾光器基板6之傾斜角θ。例如搬運速度為V,則在搬運方向的第1基準位置與第2基準位置的偏差量為(t1-t2)V。又第1基準位置與第2基準位置的間隔,如第10圖所示,可依據對應於第1基準位置的攝影機構3之元件地址EL1與對應於第2基準位置的攝影機構3之元件地址EL5,而以K(EL5-EL1)求得。又K為攝影位率,由是彩色濾光器基板6之傾斜角θ可由下式演算而得:θ=arctan(t1-t2)V/{K(EL5-EL1)}演算出該彩色濾光器基板6之傾斜角θ後,經搬運機構控制器17之控制,搬運機構4的對準機構29被驅動而回轉基台4a一個θ角度。由是如第10圖所示,黑色矩陣11的被曝光領域各邊與光罩10的開口部10a的各邊成平行。In step S3, as shown in Fig. 9, the inclination angle θ of the color filter substrate 6 in the conveyance direction is calculated based on the detection timings t1 and t2 of the first reference position and the second reference position. For example, if the conveyance speed is V, the amount of deviation between the first reference position and the second reference position in the conveyance direction is (t1 - t2)V. Further, as shown in FIG. 10, the interval between the first reference position and the second reference position can be based on the component address EL1 of the photographing mechanism 3 corresponding to the first reference position and the component address of the photographing mechanism 3 corresponding to the second reference position. EL5, and is obtained by K(EL5-EL1). Further, K is the photographing bit rate, and the tilt angle θ of the color filter substrate 6 can be calculated by the following equation: θ=arctan(t1-t2)V/{K(EL5-EL1)} After the inclination angle θ of the substrate 6 is controlled by the transport mechanism controller 17, the alignment mechanism 29 of the transport mechanism 4 is driven to rotate the base 4a by an angle θ. As shown in Fig. 10, each side of the exposed area of the black matrix 11 is parallel to each side of the opening 10a of the mask 10.

其次在步驟S4中,以演算部15演算出第1基準位置與第2基準位置之中間位置。具體而言,依據對應於記憶部14讀出的第1位置之攝影機構3之元件地址EL1與對應於第2位置的攝影機構3之元件地址EL5,可求得該中間位置為(EL1+EL5)/2。Next, in step S4, the calculation unit 15 calculates the intermediate position between the first reference position and the second reference position. Specifically, the intermediate position is determined to be (EL1+EL5)/based on the component address EL1 of the imaging unit 3 corresponding to the first position read by the storage unit 14 and the component address EL5 of the imaging unit 3 corresponding to the second position. 2.

其次在步驟S5中,判定S4中所求得的中間位置與攝影機構3的攝影中心(元件地址ELC)是否一致。如判定為〝No〞,即進入步驟S6。Next, in step S5, it is determined whether or not the intermediate position obtained in S4 coincides with the photographing center (element address ELC) of the photographing unit 3. If it is determined to be 〝No〞, the process proceeds to step S6.

在步驟S6中,藉搬運機構控制器17控制對準機構29,而如第10圖所示,沿Y軸的箭頭B方向移動基台4aK{ELC-(EL1+EL5)/2}。由是如第2圖所示,被曝光領域中心位置與攝影機構3的攝影中心(或光罩10的開口部10a中心位置)成為一致,於是進入步驟S7。In step S6, the alignment mechanism 29 is controlled by the transport mechanism controller 17, and as shown in Fig. 10, the base 4aK{ELC-(EL1+EL5)/2} is moved in the direction of the arrow B of the Y-axis. As shown in Fig. 2, the center of the exposure area coincides with the photographing center of the photographing mechanism 3 (or the center position of the opening 10a of the mask 10), and the flow proceeds to step S7.

另一方面,在步驟S5中,如判定為〝Yes〞的場合也進入步驟S7。On the other hand, if it is determined in step S5 that 〝Yes 〞, the process proceeds to step S7.

在步驟S7中,進行判定黑色矩陣11的被曝光領域是否設定於曝光光學系之曝光位置。此判定係依據記憶部14所記憶的第1基準位置檢出時刻t1,在第2圖所示搬運方向的畫素12寬度W及搬運速度V,及攝影位置與曝光位置間之距離D各數據,藉演算部15演算攝影機構3攝取畫素列中心位置後,彩色濾光器基板6被搬運距離D所需時間t,並管理該時間t。於此,如判定經過時間t,即黑色矩陣11的被曝光領域已被設定於曝光位置(判定〝YES〞)時,即進入步驟S8。In step S7, it is determined whether or not the area to be exposed of the black matrix 11 is set to the exposure position of the exposure optical system. This determination is based on the first reference position detection time t1 stored in the storage unit 14, the pixel width W and the conveyance speed V in the conveyance direction shown in FIG. 2, and the distance D between the shooting position and the exposure position. After the calculation unit 15 calculates the center position of the pixel column by the photographing unit 3, the color filter substrate 6 carries the time t required for the distance D, and manages the time t. Here, if it is determined that the elapsed time t, that is, the area to be exposed of the black matrix 11 has been set to the exposure position (decision 〝YES〞), the process proceeds to step S8.

在步驟S8中,起動燈光控制器16,使光源7發光預先設定的時間。此時因彩色濾光器基板6係以一定速度移動,曝露圖型在搬運方向之邊緣可能變模糊。故須預先設定搬運速度、曝光時間及光源7之功率,使模糊量在容許值以內。In step S8, the light controller 16 is activated to cause the light source 7 to emit light for a predetermined time. At this time, since the color filter substrate 6 is moved at a constant speed, the exposure pattern may be blurred at the edge of the conveyance direction. Therefore, the conveying speed, the exposure time, and the power of the light source 7 must be set in advance so that the amount of blur is within the allowable value.

在步驟S9中,左端畫素數n係以第4圖之左端畫素計數回路來計數。於是進入步驟10,以比較器27比較該左端畫素數n與預先設定而被記憶部14所記憶的曝光終了畫素列號碼N,並判定兩數值是否一致。In step S9, the left-end pixel number n is counted by the left-end pixel count loop of Fig. 4. Then, the process proceeds to step 10, where the comparator 27 compares the number of left-end pixels n with the exposure-finished pixel number N stored in advance by the memory unit 14, and determines whether the two values match.

在步驟S10中,如判定為〝No〞,即回歸步驟S1,並移行於下一基準位置之檢出動作。此時依照攝影機構3的讀取開始信號來重整第4圖之計數回路24A、24B。In step S10, if it is determined to be 〝No〞, the process returns to step S1, and the detection operation at the next reference position is performed. At this time, the counting circuits 24A and 24B of Fig. 4 are reformed in accordance with the reading start signal of the photographing unit 3.

另一方面,在步驟S10中,如判定為〝YES〞,則對彩色濾光器基板6設定領域中所有的曝光終了,依第4圖之曝光終了信號來重整左端畫素計數回路26。於是搬運機構4以高速運回基台4a至起始位置。On the other hand, if it is determined as YESYES in step S10, all the exposures in the field are set in the color filter substrate 6, and the left-end pixel count circuit 26 is reformed in accordance with the exposure end signal in Fig. 4. The transport mechanism 4 is then transported back to the base 4a at a high speed to the starting position.

再者,假如該曝光光學系2的可曝光領域狹於彩色濾光器基板6的寬度時,俟步驟S10終了,以步進方式沿Y方向移動基台4a設定之距離,並再度實行步驟S1~S10,並在鄰接於已經曝光之領域進行曝光。但亦可將曝光光學系2及攝影機構3沿Y軸方向以複數排成一列狀態,對彩色濾光器基板6全寬度一次進行曝光。此外,假如對被曝光領域攝影機構3的攝影領域狹窄時,亦可沿Y軸方向並列設置複數台的攝影機構3。Furthermore, if the exposable field of the exposure optical system 2 is narrower than the width of the color filter substrate 6, the step S10 is terminated, the distance set by the base 4a is moved in the Y direction in a stepwise manner, and the step S1 is performed again. ~S10, and exposure in the area adjacent to the already exposed. However, the exposure optical system 2 and the photographing mechanism 3 may be arranged in a plurality of rows in the Y-axis direction, and the full width of the color filter substrate 6 may be exposed once. Further, if the field of photography of the photographing unit 3 to be exposed is narrow, a plurality of photographing mechanisms 3 may be arranged in parallel along the Y-axis direction.

又為了說明上的方便,將步驟S1~S10說明為一連串的動作,但基準位置的檢出,係與各步驟並行實施,而隨時記憶檢出數據於記憶部14。因此,在步驟S3的彩色濾光器基板6的傾斜角θ的調整及步驟S6中彩色濾光器基板6的Y軸調整,係在從記憶部14讀出必要數據而彩色濾光器基板6從前一個曝光位置移動至下一個曝光位置之移動時間內進行。Further, for convenience of explanation, steps S1 to S10 are described as a series of operations, but the detection of the reference position is performed in parallel with each step, and the detected data is stored in the memory unit 14 at any time. Therefore, the adjustment of the tilt angle θ of the color filter substrate 6 in step S3 and the Y-axis adjustment of the color filter substrate 6 in step S6 are performed by reading the necessary data from the memory unit 14 and the color filter substrate 6 The movement time is moved from the previous exposure position to the next exposure position.

如此依照本發明之曝光裝置1,一方面以一定速度搬運彩色濾光器基板6,而以攝影機構3所攝得黑色矩陣11的畫素12上設定的基準位置為基準來控制光源7的發光時機,並使用對應於曝光光學系2所曝光之曝光領域寬度正交於彩色濾光器基板6移動方向形成細長狀之一開口部10a之光罩10,把該開口部10a之像曝濾於彩色濾光器基板6之設定位置。如此一來,可以使用小型光罩10即可高效率的對廣大曝光領域進行曝光。According to the exposure apparatus 1 of the present invention, the color filter substrate 6 is transported at a constant speed, and the light source 7 is controlled to be illuminated based on the reference position set on the pixel 12 of the black matrix 11 captured by the photographing mechanism 3. Timing, and using the mask 10 corresponding to the exposure field width exposed by the exposure optical system 2 to form an elongated opening 10a orthogonal to the moving direction of the color filter substrate 6, the image of the opening 10a is exposed to the filter The set position of the color filter substrate 6. In this way, the small exposure mask 10 can be used to efficiently expose a wide range of exposure fields.

又依據該基準位置,在彩色濾光器基板6自前一個曝光位置移動至下一個曝光位置之時間內進行基台4a之角度θ及Y軸的對準等調整工作,故可以縮短對準所需時間,同時對曝光領域之任何場所都可施行高精度的曝光。Further, according to the reference position, the adjustment operation of the angle θ of the base 4a and the alignment of the Y-axis is performed during the time when the color filter substrate 6 is moved from the previous exposure position to the next exposure position, so that the alignment can be shortened. Time, and high-precision exposure can be applied to any location in the field of exposure.

此外,在上述之第一實施形態中,係就對準機構29設於搬運機構4之場合所做之說明,但並非限定如此,亦可設置對準機構29於曝光光學系2及攝影機構3之保持機構內。在此場合如第11圖所示,Y軸方向的對準可移動保持光罩10的光罩基台8或聚像透鏡9來施行。例如移動光罩基台8做調整時,如第11圖(a)所示,位移光罩基台8於箭頭C方向,則彩色濾光器基板6上所聚之像移動於箭頭D之方向。由是變成將光罩基台8位移於曝光圖型調整方向相反之方向而做調整。又例如移動聚像透鏡9進行調整時,如第11圖(b)所示,係將聚像透鏡9移動於曝光圖型調整方向同一方向(箭頭E方向)而做調整者。Further, in the first embodiment described above, the alignment mechanism 29 is provided in the case where the transport mechanism 4 is provided. However, the present invention is not limited thereto, and the alignment mechanism 29 may be provided in the exposure optical system 2 and the photographing mechanism 3. Keep it inside the organization. In this case, as shown in Fig. 11, the alignment in the Y-axis direction can be performed by moving the mask base 8 or the condenser lens 9 of the mask 10. For example, when the moving reticle base 8 is adjusted, as shown in FIG. 11(a), the displacement reticle base 8 is in the direction of the arrow C, and the image collected on the color filter substrate 6 is moved in the direction of the arrow D. . The adjustment is made by shifting the mask base 8 in the opposite direction of the exposure pattern adjustment direction. Further, for example, when the concentrating lens 9 is moved and adjusted, as shown in FIG. 11(b), the concentrating lens 9 is moved in the same direction (arrow E direction) as the exposure pattern adjustment direction.

第12圖為光罩10之另一構成例圖。此光罩10係以黑氧化鋁處理之金屬材料28製成,而在對應於曝光光學系2的曝光領域寬度沿正交於彩色濾光器基板6的移動方向形成有一細長狀開口部10a’,該開口部10a’的縱長方向正交於搬運方向(Y軸方向)之兩端部材料28a分別可移動於Y軸方向,因而Y軸方向的對準,可分別以設定量移動此兩端部材料28a即可。因此,將兩端部材料28a分別向同一方向移動同一量,即可完成Y軸方向的對準。如果適當的設定兩端部材料28a的各移動量及移動方向,即可任意設定曝光領域的寬度。此一調整可藉控制機構5來自動控制。Fig. 12 is a view showing another example of the configuration of the reticle 10. The reticle 10 is made of a black alumina-treated metal material 28, and an elongated opening portion 10a' is formed along a moving direction orthogonal to the color filter substrate 6 in a width corresponding to the exposure field of the exposure optical system 2. The material of both ends of the opening 10a' perpendicular to the conveying direction (Y-axis direction) can be moved in the Y-axis direction, so that the alignment in the Y-axis direction can be moved by the set amount. The end material 28a is sufficient. Therefore, the alignment of the Y-axis direction can be completed by moving the both end portions 28a in the same direction by the same amount. If the amount of movement and the direction of movement of the both end portions 28a are appropriately set, the width of the exposure area can be arbitrarily set. This adjustment can be automatically controlled by the control mechanism 5.

此外,在第一實施形態中,係就利用聚像透鏡9使光罩10的開口部10a或10a’聚像於彩色濾光器基板6上之場合做說明者,但並不限定如此,亦可適用於將光罩10靠近彩色濾光器基板6而直接曝光之鄰近曝光裝置。Further, in the first embodiment, the case where the opening 10a or 10a' of the mask 10 is focused on the color filter substrate 6 by the condenser lens 9 is described, but the present invention is not limited thereto. It can be applied to a proximity exposure device that directly exposes the reticle 10 to the color filter substrate 6.

第13圖為表示本發明之曝光裝置第2實施形態主要部份之側面圖。在此第2實施形態中,配置分光鏡30於光罩基台8與聚像透鏡9之間而構成曝光光學系2,並配置攝影機構3,使其可接受該光束狹縫30的聚像透鏡側反射面30a的反射光,而共用該聚像透鏡9與用以把形成於彩色濾光器基板6的黑色矩陣11之像聚像於攝影機構3的受光元件面上之聚像透鏡。於此,在第13圖中,符號31表示照明光源,符號32表示半鏡面,可透過聚像透鏡9來照明攝影機構3的攝影位置。又,經選擇光源7的光波長,亦可將曝光用光源7兼用為照明用來代替攝影機構3的照明光源31。Figure 13 is a side elevational view showing the principal part of a second embodiment of the exposure apparatus of the present invention. In the second embodiment, the spectroscope 30 is disposed between the mask base 8 and the concentrating lens 9 to form the exposure optical system 2, and the imaging mechanism 3 is disposed so as to accept the image of the beam slit 30. The reflected light from the lens side reflecting surface 30a shares the image lens 9 and an image lens for focusing the image of the black matrix 11 formed on the color filter substrate 6 on the surface of the light receiving element of the photographing mechanism 3. Here, in Fig. 13, reference numeral 31 denotes an illumination light source, and reference numeral 32 denotes a half mirror surface, and the photographing position of the photographing mechanism 3 can be illuminated by the condenser lens 9. Further, by selecting the light wavelength of the light source 7, the exposure light source 7 can also be used as illumination for replacing the illumination light source 31 of the imaging unit 3.

具有如此構成的第2實施形態,係藉搬運機構4以一定速度搬運彩色濾光器基板6於箭頭A方向,一面透過聚像透鏡9用攝影機構3攝取彩色濾光器基板6上的黑色矩陣11之畫素12,而以控制機構5檢出預先設定於此被攝影機構3攝得的畫素12上的基準位置,依據該基準位置,與第一實施形態同樣,調整光罩10與彩色濾光器基板6之對準,同時使曝光光學系2的光源7發光,而以該聚像透鏡9在彩色濾光器基板6之設定位置聚集光罩10的開口部10a之像,並予曝露。In the second embodiment having such a configuration, the color filter substrate 6 is transported by the transport mechanism 4 at a constant speed in the direction of the arrow A, and the black matrix on the color filter substrate 6 is picked up by the photographing mechanism 3 while passing through the condenser lens 9. In the pixel 12 of Fig. 11, the control unit 5 detects the reference position previously set on the pixel 12 captured by the imaging unit 3, and adjusts the mask 10 and the color in accordance with the reference position in accordance with the reference position. The light source substrate 7 is aligned while the light source 7 of the exposure optical system 2 is illuminated, and the image of the opening 10a of the mask 10 is collected by the image lens 9 at the set position of the color filter substrate 6. exposure.

如此依照第2實施形態,由於共用了曝光光學系2的聚像透鏡9與攝影機構3的聚像透鏡,而使曝光光學系的曝光位置與攝影機構3的攝影位置,故一經以攝影機構3攝影而檢出彩色濾光器基板6之曝光預定位置, 立即可以曝光,其曝光精度較之第1實施形態者更加提高。According to the second embodiment, since the condensing lens of the exposure optical system 2 and the condensing lens of the imaging unit 3 are shared, the exposure position of the exposure optical system and the imaging position of the imaging unit 3 are used, and therefore, the imaging mechanism 3 is used. The exposure predetermined position of the color filter substrate 6 is detected by photography, Exposure is immediately possible, and the exposure accuracy is improved as compared with the first embodiment.

此外,於第1及第2實施形態中,係以備有對準機構之場合說明者,但,假如能夠只安置彩色濾光器基板6基台4a,就可約束曝光預定位置與實際曝光位置之偏差量於容許範圍內時,就不必使用對準機構。Further, in the first and second embodiments, the alignment mechanism is provided. However, if only the base 4a of the color filter substrate 6 can be placed, the predetermined exposure position and the actual exposure position can be restrained. When the amount of deviation is within the allowable range, it is not necessary to use an alignment mechanism.

又在第1及第2實施形態中,係以彩色濾光器基板6做為被曝光體的場合做說明,但並非限定於此,對以設定形狀的圖型矩陣狀配置之基板也可適用。In the first and second embodiments, the color filter substrate 6 is used as the object to be exposed. However, the present invention is not limited thereto, and is also applicable to substrates arranged in a matrix of a patterned shape. .

1...曝光裝置1. . . Exposure device

2...曝光光學系2. . . Exposure optics

3...攝影機構3. . . Photography agency

4...搬運機構4. . . Transport mechanism

5...控制機構5. . . Control mechanism

6...彩色濾光器基板6. . . Color filter substrate

7...光源7. . . light source

8...光罩基台8. . . Photomask abutment

9...聚像透鏡9. . . Focus lens

10...光罩10. . . Mask

10a...開口部10a. . . Opening

11...黑色矩陣11. . . Black matrix

12...畫素12. . . Pixel

29...對準機構29. . . Alignment mechanism

4a...基台4a. . . Abutment

13...畫像處理部13. . . Image processing department

14...記憶部14. . . Memory department

15...演算部15. . . Calculation department

17...搬運機構控制器17. . . Transport mechanism controller

16...燈光控制器16. . . Lighting controller

18...控制部18. . . Control department

19A、19B、19C...環狀緩衝記憶體19A, 19B, 19C. . . Ring buffer memory

20A、20B、20C...列緩衝記憶體20A, 20B, 20C. . . Column buffer memory

22...左端判定回路twenty two. . . Left end decision loop

23...右端判定回路twenty three. . . Right end decision loop

24A、24B‧‧‧計數回路24A, 24B‧‧‧ Counting loop

25A、25B‧‧‧比較回路25A, 25B‧‧‧ comparison loop

27‧‧‧比較回路27‧‧‧Comparative circuit

26‧‧‧左端畫素計數回路26‧‧‧ Left-end pixel counting loop

28a‧‧‧兩端部材料28a‧‧‧End material

29‧‧‧對準機構29‧‧‧Alignment mechanism

30‧‧‧分光鏡30‧‧‧beam splitter

31‧‧‧照明光源31‧‧‧Light source

32‧‧‧半鏡面32‧‧‧Half mirror

第1圖為本發明之曝光裝置第1實施形態之概念圖;第2圖為攝影機構,光罩開口部及黑色矩陣與被曝光領域關係說明圖;第3圖為表示畫像處理部內部構成中處理系統前半部的方塊圖;第4圖為表示畫像處理部內部構成中處理系統後半部的方塊圖;第5圖為說明本發明之曝光裝置動作的流程圖;第6圖為環狀緩衝記憶體輸出2值化方法說明圖;第7圖為表示預先設定於黑色矩陣畫素的第1基準位置畫像與其LUT的說明圖;第8圖為表示預先設定於黑色矩陣畫素的第2基準位置畫像與其LUT的說明圖;第9圖為彩色濾光器基板傾斜角調整方法的說明圖;第10圖為彩色濾光器基板沿Y軸方向對準調整方法的說明圖;第11圖為彩色濾光器基板沿Y軸方向對準調整之另一方法說明圖;第12圖為光罩其他構成例之例示圖,(a)為平面圖,(b)為橫斷面圖;第13圖為表示本發明之曝光裝置第2實施形態主要部份之側面圖。1 is a conceptual view of a first embodiment of an exposure apparatus according to the present invention; FIG. 2 is an explanatory view showing a relationship between a photographing mechanism, a mask opening, and a black matrix and an exposed area; and FIG. 3 is a view showing an internal configuration of the image processing unit. Block diagram of the first half of the processing system; Fig. 4 is a block diagram showing the latter half of the processing system in the internal configuration of the image processing unit; Fig. 5 is a flow chart for explaining the operation of the exposure apparatus of the present invention; and Fig. 6 is a circular buffer memory. FIG. 7 is an explanatory diagram showing a first reference position image and a LUT set in advance in a black matrix pixel, and FIG. 8 is a second reference position set in advance in a black matrix pixel. FIG. 9 is an explanatory diagram of a method for adjusting a tilt angle of a color filter substrate; FIG. 10 is an explanatory diagram of a method for adjusting alignment of a color filter substrate along a Y-axis direction; FIG. 12 is a view showing another example of the configuration of the photomask substrate in the Y-axis direction, wherein FIG. 12 is a plan view, (b) is a plan view, and (b) is a cross-sectional view; Indicates that the exposure apparatus of the present invention is the second The main part of the facilities form a side view.

1...曝光裝置1. . . Exposure device

2...曝光光學系2. . . Exposure optics

3...攝影機構3. . . Photography agency

4...搬運機構4. . . Transport mechanism

5...控制機構5. . . Control mechanism

6...彩色濾光器基板6. . . Color filter substrate

7...光源7. . . light source

8...光罩基台8. . . Photomask abutment

9...聚像透鏡9. . . Focus lens

10...光罩10. . . Mask

10a...開口部10a. . . Opening

4a...基台4a. . . Abutment

13...畫像處理部13. . . Image processing department

14...記憶部14. . . Memory department

15...演算部15. . . Calculation department

17...搬運機構控制器17. . . Transport mechanism controller

16...燈光控制器16. . . Lighting controller

18...控制部18. . . Control department

29...對準機構29. . . Alignment mechanism

Claims (7)

一種曝光裝置,具有從光源對被曝光體照射曝光光線的曝光光學系;及對向配置於該曝光光學系,並搭載該被曝光體而以一定速度搬運的搬運機構,該曝光裝置可曝露介裝於該曝光光學系光路上的光罩開口部之像於該被曝光體上,該曝光裝置具備有:該光罩開口部係,呈細長狀而形成在與該搬運機構搬運該被曝光體之移動方向成為正交之方向;該光罩開口部之縱向,有排列成一列狀的多數受光元件;且以在該被曝光體移動方向為該曝光光學系曝光位置的前方為攝影位置,而攝取預先形成於該曝光體的基準圖型之攝影機構;以及用以依照該攝影機構所攝得畫像之處理狀況,檢出預先設定於該畫素之基準位置,並以該基準位置為基準來控制該曝光光學系的曝光光線的照射時機,藉此把該光罩開口部之像曝露於該被曝光體設定位置之控制機構,且該多數個受光元件的排列間距係,較與該畫素之該被曝光體之移動方向成為正交方向的長度為小為其特徵者。 An exposure apparatus having an exposure optical system that irradiates an exposure target with an exposure light from a light source; and a transport mechanism that is disposed opposite to the exposure optical system and that carries the exposed object and transports at a constant speed, and the exposure apparatus can be exposed The exposure cover is mounted on the exposure target on the exposure optical path, and the exposure device includes an opening of the mask, and is formed in an elongated shape to convey the exposed object to the transport mechanism The moving direction is a direction orthogonal to each other; a plurality of light receiving elements arranged in a line in the longitudinal direction of the opening of the mask; and a front position of the exposed position of the exposure optical system in the moving direction of the exposed object is a photographing position, and a photographing mechanism that is formed in a reference pattern formed in advance on the exposure body; and a detection target position preset to the pixel in accordance with a processing state of the image captured by the photographing unit, and based on the reference position Controlling an irradiation timing of the exposure light of the exposure optical system, thereby exposing the image of the opening of the mask to a control mechanism of the position at which the exposure body is set, and the majority The length of the pitch-based light receiving element is arranged, compared with the pixels of the moving direction of the exposure to be orthogonal direction characterized by its small. 如申請專利範圍第1項之曝光裝置,其中所述該曝光光學系具有用以把該光罩開口部之像聚集於被曝光體之上之聚像透鏡。 The exposure apparatus of claim 1, wherein the exposure optical system has a condensing lens for collecting an image of the reticle opening on the object to be exposed. 一種曝光裝置,具有可透過具有設定開口部的光罩照 射來自光源的曝光光線於被曝光體,並曝露該光罩開口部之像於被搬運之被曝光體上,該曝光裝置具備有:以一定速度搬運該被曝光體之搬運機構;配置於該搬運機構之上方,而把介裝於自該光源至該被曝光體的光路上之該光罩開口部聚像於該被曝光體上的聚像透鏡,及以傾斜狀配置於該聚像透鏡與該光罩間的光路上具有分光鏡之曝光光學系;該光罩開口部係,呈細長狀而形成在與該搬運機構搬運該被曝光體之移動方向成為正交之方向;該光罩開口部之縱向,有排列成一列狀的多數受光元件;且以能夠接受該分光鏡在聚像透鏡側反射面之反射光方式配置,而透過該聚像透鏡攝取預先形成於該被曝光體而具有矩陣狀的畫素的基準圖型攝影機構;及用以依照該攝影機構所攝得畫像之處理狀況,檢出預先設定在該畫素的基準位置,並以該基準位置為基準來控制該曝光光學系曝光光線的照射時機,而依與該攝影機構之攝影位置一致的位置曝露該光罩開口部之像於該被曝光體設定位置之控制機構,且該多數個受光元件的排列間距係,較與該畫素之該被曝光體之移動方向成為正交方向的長度為小為其特徵者。 An exposure device having a photomask that can pass through a set opening Exposing the exposure light from the light source to the object to be exposed, and exposing the image of the opening of the mask to the object to be exposed, the exposure device comprising: a transport mechanism for transporting the object to be exposed at a constant speed; a condenser lens that is disposed on the light-receiving surface of the light-receiving body from the light source to the exposed object, and is disposed in an inclined manner on the image lens An exposure optical system having a spectroscope on an optical path between the reticle; the reticle opening portion is formed in an elongated shape and formed in a direction orthogonal to a moving direction of the object to be transported by the transport mechanism; the reticle a plurality of light-receiving elements arranged in a line in the longitudinal direction of the opening; and are disposed so as to receive reflected light from the focusing surface of the focusing lens, and are received by the focusing lens to be formed in advance on the object to be exposed a reference pattern type photographing unit having a matrix of pixels; and a reference position preset for the pixel in accordance with a processing state of the image taken by the photographing unit, and based on the reference position Controlling an exposure timing of the exposure light of the exposure optical system, and exposing a control mechanism of the opening portion of the reticle to the position at which the exposure body is set according to a position coincident with a photographing position of the photographing mechanism, and arranging the plurality of light receiving elements The pitch system is characterized by a smaller length in a direction orthogonal to the moving direction of the object to be exposed. 如申請專利範圍第1項或第3項之曝光裝置,其中所 述光源係屬於間歇發射曝光光線的閃光燈。 For example, in the exposure apparatus of claim 1 or 3, The light source is a flash lamp that intermittently emits exposure light. 如申請專利範圍第1項或第3項之曝光裝置,其中所述搬運機構或曝光光學系之任一方備有根據該基準位置演算出設定於該基準圖型的曝光預定位置與該光罩開口部之曝光位置之偏差而修正該偏差之對準機構。 The exposure apparatus of claim 1 or 3, wherein any one of the transport mechanism or the exposure optical system is provided with an exposure exposure position set to the reference pattern and the mask opening based on the reference position The alignment mechanism of the deviation is corrected by the deviation of the exposure position of the portion. 如申請專利範圍第1項或第3項之曝光裝置,其中所述光罩係在形成於透明玻璃基板上的不透明膜上,對應於該曝光光學系所曝光之曝光領域之寬度,正交於該被曝光體移動方向所形成的一個細長狀的開口部。 The exposure apparatus of claim 1 or 3, wherein the reticle is on an opaque film formed on a transparent glass substrate, corresponding to a width of an exposure field exposed by the exposure optical system, orthogonal to An elongated opening formed by the direction in which the exposed object is moved. 如申請專利範圍第1項或第3項之曝光裝置,其中所述光罩係在不透明的材料上,對應於該曝光光學系所曝光之曝光領域之寬度,正交於該被曝光體移動方向所形成的一個細長狀的開口部,而使該開口部長度為可以調節者。 The exposure apparatus of claim 1 or 3, wherein the reticle is on an opaque material, corresponding to a width of an exposure field exposed by the exposure optical system, orthogonal to a moving direction of the exposed object An elongated opening portion is formed, and the length of the opening portion is adjustable.
TW094121819A 2004-06-30 2005-06-29 Exposing apparatus TWI397776B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004194023A JP2006017895A (en) 2004-06-30 2004-06-30 Aligner

Publications (2)

Publication Number Publication Date
TW200600981A TW200600981A (en) 2006-01-01
TWI397776B true TWI397776B (en) 2013-06-01

Family

ID=35782672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121819A TWI397776B (en) 2004-06-30 2005-06-29 Exposing apparatus

Country Status (5)

Country Link
JP (1) JP2006017895A (en)
KR (1) KR101149089B1 (en)
CN (1) CN1981244B (en)
TW (1) TWI397776B (en)
WO (1) WO2006003863A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101547077B1 (en) 2003-04-09 2015-08-25 가부시키가이샤 니콘 Exposure method and apparatus, and device manufacturing method
TWI573175B (en) 2003-10-28 2017-03-01 尼康股份有限公司 Optical illumination device, exposure device, exposure method and device manufacturing method
TW201809801A (en) 2003-11-20 2018-03-16 日商尼康股份有限公司 Optical illuminating apparatus, exposure device, exposure method, and device manufacturing method
TWI389174B (en) 2004-02-06 2013-03-11 尼康股份有限公司 Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
KR101455551B1 (en) 2005-05-12 2014-10-27 가부시키가이샤 니콘 Projection optical system, exposure apparatus and exposure method
KR101749442B1 (en) * 2006-08-31 2017-06-20 가부시키가이샤 니콘 Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
JP2008076709A (en) * 2006-09-21 2008-04-03 V Technology Co Ltd Exposure device
US8431328B2 (en) 2007-02-22 2013-04-30 Nikon Corporation Exposure method, method for manufacturing flat panel display substrate, and exposure apparatus
JP4971835B2 (en) * 2007-03-02 2012-07-11 株式会社ブイ・テクノロジー Exposure method and exposure apparatus
JP5267029B2 (en) 2007-10-12 2013-08-21 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
JP2009251290A (en) * 2008-04-07 2009-10-29 V Technology Co Ltd Exposure apparatus
WO2010090018A1 (en) * 2009-02-05 2010-08-12 凸版印刷株式会社 Exposure method, color filter manufacturing method, and exposure device
KR101254442B1 (en) 2009-02-26 2013-04-12 도판 인사츠 가부시키가이샤 Color filter and manufacturing method for a color filter
JP5185158B2 (en) * 2009-02-26 2013-04-17 Hoya株式会社 Multi-tone photomask evaluation method
JP5261847B2 (en) * 2009-06-16 2013-08-14 株式会社ブイ・テクノロジー Alignment method, alignment apparatus, and exposure apparatus
TWI428688B (en) * 2009-07-29 2014-03-01 Hoya Corp Method for manufacturing multi - modal mask and pattern transfer method
US8988653B2 (en) 2009-08-20 2015-03-24 Asml Netherlands B.V. Lithographic apparatus, distortion determining method, and patterning device
CN102597881B (en) 2009-11-12 2015-07-08 株式会社V技术 Exposure apparatus and photomask used therein
TWI490657B (en) * 2009-11-26 2015-07-01 V Technology Co Ltd Exposure apparatus and photomask to be used for same
JP5630864B2 (en) * 2010-12-06 2014-11-26 凸版印刷株式会社 Exposure equipment
KR101711726B1 (en) * 2015-03-06 2017-03-03 아주하이텍(주) Exposure apparatus and exposure method using the same
JP6940873B2 (en) * 2017-12-08 2021-09-29 株式会社ブイ・テクノロジー Exposure equipment and exposure method
CN115278000A (en) * 2022-06-24 2022-11-01 维沃移动通信有限公司 Image sensor, image generation method, camera module and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09127702A (en) * 1995-10-30 1997-05-16 Dainippon Printing Co Ltd Exposing and exposing method device for large-size substrate
US20030147059A1 (en) * 1998-03-09 2003-08-07 Nikon Corporation Scanning exposure method, scanning exposure apparatus and its making method, and device and its manufacturing method
US20040070740A1 (en) * 1998-11-06 2004-04-15 Nikon Corporation Exposure method and exposure apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56105634A (en) * 1980-01-25 1981-08-22 Fujitsu Ltd X rays transcription device
JPS60257521A (en) * 1984-06-04 1985-12-19 Nippon Telegr & Teleph Corp <Ntt> Exposure apparatus for forming pattern
JPS6289328A (en) * 1985-10-16 1987-04-23 Canon Inc Exposure device
US4780615A (en) * 1985-02-01 1988-10-25 Canon Kabushiki Kaisha Alignment system for use in pattern transfer apparatus
JPH0677112A (en) * 1992-08-28 1994-03-18 Nec Kyushu Ltd Glare protection region control mechanism in aligner

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09127702A (en) * 1995-10-30 1997-05-16 Dainippon Printing Co Ltd Exposing and exposing method device for large-size substrate
US20030147059A1 (en) * 1998-03-09 2003-08-07 Nikon Corporation Scanning exposure method, scanning exposure apparatus and its making method, and device and its manufacturing method
US20040070740A1 (en) * 1998-11-06 2004-04-15 Nikon Corporation Exposure method and exposure apparatus

Also Published As

Publication number Publication date
CN1981244B (en) 2010-11-10
WO2006003863A1 (en) 2006-01-12
CN1981244A (en) 2007-06-13
JP2006017895A (en) 2006-01-19
KR101149089B1 (en) 2012-05-25
TW200600981A (en) 2006-01-01
KR20070024685A (en) 2007-03-02

Similar Documents

Publication Publication Date Title
TWI397776B (en) Exposing apparatus
TWI446124B (en) Exposure apparatus
TWI446122B (en) Exposure apparatus
TWI467345B (en) Exposure apparatus and photomask
EP0788032A1 (en) Process for exposing a peripheral area of a wafer and a device for executing the process
TWI475337B (en) Alignment method, alignment apparatus and exposure apparatus
TWI391796B (en) Exposure apparatus and exposed substance
KR20040002495A (en) Projection exposure device and position alignment device and position alignment method
KR101780368B1 (en) Photomask, and laser annealing device and exposure device which use same
JP5098041B2 (en) Exposure method
KR101650116B1 (en) Exposure apparatus and photomask used therein
JP4971835B2 (en) Exposure method and exposure apparatus
KR101660918B1 (en) Exposure device and photo mask
TWI472885B (en) Alignment method, alignment apparatus and exposure apparatus
KR20180037590A (en) Assist exposure apparatus and method of obtaining exposure distribution
CN111856886A (en) Direct writing type exposure device
JP4951036B2 (en) Exposure equipment
JP3531227B2 (en) Exposure method and exposure apparatus
JP6879484B2 (en) Image acquisition device, exposure device, and image acquisition method
CN113284822A (en) Information processing method, information processing apparatus, and computer-readable storage medium
JP2004012598A (en) Projection aligner
TWI490657B (en) Exposure apparatus and photomask to be used for same
JPH09320947A (en) Aligner and correction method of imaging characteristics