TWI440068B - 基材接合方法以及半導體元件 - Google Patents

基材接合方法以及半導體元件 Download PDF

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Publication number
TWI440068B
TWI440068B TW097115869A TW97115869A TWI440068B TW I440068 B TWI440068 B TW I440068B TW 097115869 A TW097115869 A TW 097115869A TW 97115869 A TW97115869 A TW 97115869A TW I440068 B TWI440068 B TW I440068B
Authority
TW
Taiwan
Prior art keywords
layer
substrate
absorbing
bonding
relative proportion
Prior art date
Application number
TW097115869A
Other languages
English (en)
Chinese (zh)
Other versions
TW200903575A (en
Inventor
世古利裕
Original Assignee
史坦雷電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 史坦雷電氣股份有限公司 filed Critical 史坦雷電氣股份有限公司
Publication of TW200903575A publication Critical patent/TW200903575A/zh
Application granted granted Critical
Publication of TWI440068B publication Critical patent/TWI440068B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
TW097115869A 2007-06-20 2008-04-30 基材接合方法以及半導體元件 TWI440068B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007162508A JP5426081B2 (ja) 2007-06-20 2007-06-20 基板接合方法及び半導体装置

Publications (2)

Publication Number Publication Date
TW200903575A TW200903575A (en) 2009-01-16
TWI440068B true TWI440068B (zh) 2014-06-01

Family

ID=40135641

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097115869A TWI440068B (zh) 2007-06-20 2008-04-30 基材接合方法以及半導體元件

Country Status (4)

Country Link
US (2) US8158459B2 (https=)
JP (1) JP5426081B2 (https=)
KR (1) KR101459517B1 (https=)
TW (1) TWI440068B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5519355B2 (ja) 2010-03-19 2014-06-11 スタンレー電気株式会社 半導体発光素子及びその製造方法
US8569889B1 (en) * 2011-02-09 2013-10-29 Nlight Photonics Corporation Nano thick Pt metallization layer
JP6005957B2 (ja) * 2012-03-19 2016-10-12 スタンレー電気株式会社 半導体素子及びその製造方法
JP6067982B2 (ja) * 2012-03-19 2017-01-25 スタンレー電気株式会社 半導体素子の製造方法
EP2893565B1 (en) 2012-09-05 2021-04-28 Lumileds LLC Laser de-bond of carrier wafer from device wafer
US9676047B2 (en) 2013-03-15 2017-06-13 Samsung Electronics Co., Ltd. Method of forming metal bonding layer and method of manufacturing semiconductor light emitting device using the same
US9327361B2 (en) 2014-08-04 2016-05-03 Ok International Inc. Intelligent soldering cartridge for automatic soldering connection validation
US9516762B2 (en) 2014-08-04 2016-12-06 Ok International Inc. Soldering iron with automatic soldering connection validation
US10716220B2 (en) 2014-08-04 2020-07-14 Ok International, Inc. Variable temperature controlled soldering iron
US10688578B2 (en) 2014-08-04 2020-06-23 OK International, Inc Variable temperature controlled soldering iron
WO2018008168A1 (ja) * 2016-07-04 2018-01-11 三菱電機株式会社 半導体装置及びその製造方法
CN115621835B (zh) * 2022-10-26 2026-03-27 武汉英飞光创科技有限公司 一种光模块coc基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235323A (ja) 1992-02-20 1993-09-10 Olympus Optical Co Ltd 半導体装置
JP4514400B2 (ja) * 2001-09-27 2010-07-28 古河電気工業株式会社 部材の接合方法、その方法で得られた接合部材
JP4814503B2 (ja) 2004-09-14 2011-11-16 スタンレー電気株式会社 半導体素子とその製造方法、及び電子部品ユニット
JP4891556B2 (ja) * 2005-03-24 2012-03-07 株式会社東芝 半導体装置の製造方法
JP2006332435A (ja) 2005-05-27 2006-12-07 Sharp Corp サブマウント、半導体レーザ装置およびその製造方法、ホログラムレーザ装置、並びに光ピックアップ装置
US7910945B2 (en) * 2006-06-30 2011-03-22 Cree, Inc. Nickel tin bonding system with barrier layer for semiconductor wafers and devices
US8643195B2 (en) * 2006-06-30 2014-02-04 Cree, Inc. Nickel tin bonding system for semiconductor wafers and devices
US7855459B2 (en) * 2006-09-22 2010-12-21 Cree, Inc. Modified gold-tin system with increased melting temperature for wafer bonding
US7795054B2 (en) * 2006-12-08 2010-09-14 Samsung Led Co., Ltd. Vertical structure LED device and method of manufacturing the same
JP5376866B2 (ja) * 2008-08-22 2013-12-25 スタンレー電気株式会社 半導体発光装置の製造方法及び半導体発光装置

Also Published As

Publication number Publication date
US8158459B2 (en) 2012-04-17
TW200903575A (en) 2009-01-16
JP2009004487A (ja) 2009-01-08
KR20080112106A (ko) 2008-12-24
KR101459517B1 (ko) 2014-11-07
JP5426081B2 (ja) 2014-02-26
US20120168954A1 (en) 2012-07-05
US20080315427A1 (en) 2008-12-25
US8288868B2 (en) 2012-10-16

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