KR101459517B1 - 기판 접합 방법 및 반도체 장치 - Google Patents

기판 접합 방법 및 반도체 장치 Download PDF

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Publication number
KR101459517B1
KR101459517B1 KR1020080049550A KR20080049550A KR101459517B1 KR 101459517 B1 KR101459517 B1 KR 101459517B1 KR 1020080049550 A KR1020080049550 A KR 1020080049550A KR 20080049550 A KR20080049550 A KR 20080049550A KR 101459517 B1 KR101459517 B1 KR 101459517B1
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KR
South Korea
Prior art keywords
layer
substrate
composition ratio
region
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020080049550A
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English (en)
Korean (ko)
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KR20080112106A (ko
Inventor
토시히로 세코
Original Assignee
스탠리 일렉트릭 컴퍼니, 리미티드
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Application filed by 스탠리 일렉트릭 컴퍼니, 리미티드 filed Critical 스탠리 일렉트릭 컴퍼니, 리미티드
Publication of KR20080112106A publication Critical patent/KR20080112106A/ko
Application granted granted Critical
Publication of KR101459517B1 publication Critical patent/KR101459517B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
KR1020080049550A 2007-06-20 2008-05-28 기판 접합 방법 및 반도체 장치 Expired - Fee Related KR101459517B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00162508 2007-06-20
JP2007162508A JP5426081B2 (ja) 2007-06-20 2007-06-20 基板接合方法及び半導体装置

Publications (2)

Publication Number Publication Date
KR20080112106A KR20080112106A (ko) 2008-12-24
KR101459517B1 true KR101459517B1 (ko) 2014-11-07

Family

ID=40135641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080049550A Expired - Fee Related KR101459517B1 (ko) 2007-06-20 2008-05-28 기판 접합 방법 및 반도체 장치

Country Status (4)

Country Link
US (2) US8158459B2 (https=)
JP (1) JP5426081B2 (https=)
KR (1) KR101459517B1 (https=)
TW (1) TWI440068B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5519355B2 (ja) 2010-03-19 2014-06-11 スタンレー電気株式会社 半導体発光素子及びその製造方法
US8569889B1 (en) * 2011-02-09 2013-10-29 Nlight Photonics Corporation Nano thick Pt metallization layer
JP6005957B2 (ja) * 2012-03-19 2016-10-12 スタンレー電気株式会社 半導体素子及びその製造方法
JP6067982B2 (ja) * 2012-03-19 2017-01-25 スタンレー電気株式会社 半導体素子の製造方法
EP2893565B1 (en) 2012-09-05 2021-04-28 Lumileds LLC Laser de-bond of carrier wafer from device wafer
US9676047B2 (en) 2013-03-15 2017-06-13 Samsung Electronics Co., Ltd. Method of forming metal bonding layer and method of manufacturing semiconductor light emitting device using the same
US9327361B2 (en) 2014-08-04 2016-05-03 Ok International Inc. Intelligent soldering cartridge for automatic soldering connection validation
US9516762B2 (en) 2014-08-04 2016-12-06 Ok International Inc. Soldering iron with automatic soldering connection validation
US10716220B2 (en) 2014-08-04 2020-07-14 Ok International, Inc. Variable temperature controlled soldering iron
US10688578B2 (en) 2014-08-04 2020-06-23 OK International, Inc Variable temperature controlled soldering iron
WO2018008168A1 (ja) * 2016-07-04 2018-01-11 三菱電機株式会社 半導体装置及びその製造方法
CN115621835B (zh) * 2022-10-26 2026-03-27 武汉英飞光创科技有限公司 一种光模块coc基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003200289A (ja) * 2001-09-27 2003-07-15 Furukawa Electric Co Ltd:The 部材の接合方法、その方法で得られた接合部材
JP2006269751A (ja) * 2005-03-24 2006-10-05 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2006332435A (ja) 2005-05-27 2006-12-07 Sharp Corp サブマウント、半導体レーザ装置およびその製造方法、ホログラムレーザ装置、並びに光ピックアップ装置
KR20100023772A (ko) * 2008-08-22 2010-03-04 스탄레 덴끼 가부시키가이샤 반도체 발광 장치의 제조 방법 및 반도체 발광 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235323A (ja) 1992-02-20 1993-09-10 Olympus Optical Co Ltd 半導体装置
JP4814503B2 (ja) 2004-09-14 2011-11-16 スタンレー電気株式会社 半導体素子とその製造方法、及び電子部品ユニット
US7910945B2 (en) * 2006-06-30 2011-03-22 Cree, Inc. Nickel tin bonding system with barrier layer for semiconductor wafers and devices
US8643195B2 (en) * 2006-06-30 2014-02-04 Cree, Inc. Nickel tin bonding system for semiconductor wafers and devices
US7855459B2 (en) * 2006-09-22 2010-12-21 Cree, Inc. Modified gold-tin system with increased melting temperature for wafer bonding
US7795054B2 (en) * 2006-12-08 2010-09-14 Samsung Led Co., Ltd. Vertical structure LED device and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003200289A (ja) * 2001-09-27 2003-07-15 Furukawa Electric Co Ltd:The 部材の接合方法、その方法で得られた接合部材
JP2006269751A (ja) * 2005-03-24 2006-10-05 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2006332435A (ja) 2005-05-27 2006-12-07 Sharp Corp サブマウント、半導体レーザ装置およびその製造方法、ホログラムレーザ装置、並びに光ピックアップ装置
KR20100023772A (ko) * 2008-08-22 2010-03-04 스탄레 덴끼 가부시키가이샤 반도체 발광 장치의 제조 방법 및 반도체 발광 장치

Also Published As

Publication number Publication date
US8158459B2 (en) 2012-04-17
TW200903575A (en) 2009-01-16
TWI440068B (zh) 2014-06-01
JP2009004487A (ja) 2009-01-08
KR20080112106A (ko) 2008-12-24
JP5426081B2 (ja) 2014-02-26
US20120168954A1 (en) 2012-07-05
US20080315427A1 (en) 2008-12-25
US8288868B2 (en) 2012-10-16

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