TWI436893B - Laminated board, laminated sheet with metal foil, printed wiring board, circuit board, LED backlight module, LED lighting device and laminated board manufacturing method - Google Patents

Laminated board, laminated sheet with metal foil, printed wiring board, circuit board, LED backlight module, LED lighting device and laminated board manufacturing method Download PDF

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Publication number
TWI436893B
TWI436893B TW099140830A TW99140830A TWI436893B TW I436893 B TWI436893 B TW I436893B TW 099140830 A TW099140830 A TW 099140830A TW 99140830 A TW99140830 A TW 99140830A TW I436893 B TWI436893 B TW I436893B
Authority
TW
Taiwan
Prior art keywords
thermosetting resin
laminated
laminated board
component
laminate
Prior art date
Application number
TW099140830A
Other languages
English (en)
Chinese (zh)
Other versions
TW201134671A (en
Inventor
清水廣海
鈴江隆之
野末明義
中川照雄
Original Assignee
松下電器產業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器產業股份有限公司 filed Critical 松下電器產業股份有限公司
Publication of TW201134671A publication Critical patent/TW201134671A/zh
Application granted granted Critical
Publication of TWI436893B publication Critical patent/TWI436893B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Epoxy Resins (AREA)
TW099140830A 2009-11-25 2010-11-25 Laminated board, laminated sheet with metal foil, printed wiring board, circuit board, LED backlight module, LED lighting device and laminated board manufacturing method TWI436893B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009268078 2009-11-25

Publications (2)

Publication Number Publication Date
TW201134671A TW201134671A (en) 2011-10-16
TWI436893B true TWI436893B (zh) 2014-05-11

Family

ID=44066477

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099140830A TWI436893B (zh) 2009-11-25 2010-11-25 Laminated board, laminated sheet with metal foil, printed wiring board, circuit board, LED backlight module, LED lighting device and laminated board manufacturing method

Country Status (5)

Country Link
JP (3) JP4853599B2 (https=)
KR (1) KR101178785B1 (https=)
CN (1) CN102695612B (https=)
TW (1) TWI436893B (https=)
WO (1) WO2011065372A1 (https=)

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* Cited by examiner, † Cited by third party
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CN103582564B (zh) * 2011-05-30 2016-03-02 松下知识产权经营株式会社 层叠板、其用途及其制造方法
CN103131133A (zh) * 2011-12-02 2013-06-05 达航工业股份有限公司 用于印刷电路板的充填用热固化型组成物
TWI610786B (zh) * 2012-03-30 2018-01-11 Hitachi Chemical Company, Ltd. 熱傳導片的製造方法
WO2013156906A1 (en) * 2012-04-16 2013-10-24 Koninklijke Philips N.V. Pcb laminate material
CN103790092A (zh) * 2012-10-29 2014-05-14 3M新设资产公司 不织布透水砖及其制造方法
JP6225643B2 (ja) * 2013-10-31 2017-11-08 味の素株式会社 積層板の製造方法
JP6277543B2 (ja) * 2013-11-27 2018-02-14 パナソニックＩｐマネジメント株式会社 コンポジット積層板及びその製造方法
KR102413224B1 (ko) * 2015-10-01 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자, 발광 소자 제조방법 및 발광 모듈
JP6986696B2 (ja) * 2017-05-18 2021-12-22 パナソニックＩｐマネジメント株式会社 コンポジット積層板
CN111566162A (zh) * 2017-12-22 2020-08-21 日立化成株式会社 密封组合物和半导体装置
GB2575242B (en) * 2018-05-30 2022-11-23 Acell Ind Ltd Vacuum forming process
CN109705532B (zh) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板
KR20240132464A (ko) * 2021-12-17 2024-09-03 베르시브 컴포지츠 리미티드 유전체 기판 및 그 형성 방법
KR20240136347A (ko) * 2021-12-17 2024-09-13 베르시브 컴포지츠 리미티드 유전체 기판 및 그 형성 방법

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Publication number Priority date Publication date Assignee Title
US5953055A (en) * 1996-08-08 1999-09-14 Ncr Corporation System and method for detecting and analyzing a queue
JPH10182985A (ja) * 1996-12-24 1998-07-07 Matsushita Electric Works Ltd 積層板用樹脂組成物及び積層板
JPH11179841A (ja) * 1997-12-24 1999-07-06 Shin Kobe Electric Mach Co Ltd コンポジット金属箔張り積層板
JPH11200218A (ja) * 1998-01-14 1999-07-27 Oji Paper Co Ltd 耐熱性不織布
JP4645726B2 (ja) * 2008-05-19 2011-03-09 パナソニック電工株式会社 積層板、プリプレグ、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
WO2009142192A1 (ja) * 2008-05-19 2009-11-26 パナソニック電工株式会社 積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP4788799B2 (ja) * 2009-04-24 2011-10-05 パナソニック電工株式会社 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP2011102394A (ja) * 2010-12-20 2011-05-26 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板、及びｌｅｄ搭載用回路基板

Also Published As

Publication number Publication date
JP2012064955A (ja) 2012-03-29
JPWO2011065372A1 (ja) 2013-04-18
CN102695612A (zh) 2012-09-26
CN102695612B (zh) 2014-06-25
JP4853599B2 (ja) 2012-01-11
KR20120082037A (ko) 2012-07-20
KR101178785B1 (ko) 2012-09-07
WO2011065372A1 (ja) 2011-06-03
TW201134671A (en) 2011-10-16
JP4893873B1 (ja) 2012-03-07
JP2011132540A (ja) 2011-07-07

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