KR101178785B1 - 적층판, 금속박 클래드 적층판, 프린트 배선판 및 회로 기판 및 led 백라이트 유닛, led 조명 장치, 적층판의 제조 방법 - Google Patents

적층판, 금속박 클래드 적층판, 프린트 배선판 및 회로 기판 및 led 백라이트 유닛, led 조명 장치, 적층판의 제조 방법 Download PDF

Info

Publication number
KR101178785B1
KR101178785B1 KR1020127016523A KR20127016523A KR101178785B1 KR 101178785 B1 KR101178785 B1 KR 101178785B1 KR 1020127016523 A KR1020127016523 A KR 1020127016523A KR 20127016523 A KR20127016523 A KR 20127016523A KR 101178785 B1 KR101178785 B1 KR 101178785B1
Authority
KR
South Korea
Prior art keywords
laminated board
thermosetting resin
nonwoven fabric
component
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020127016523A
Other languages
English (en)
Korean (ko)
Other versions
KR20120082037A (ko
Inventor
히로우미 시미즈
다카유키 스즈에
아키요시 노즈에
데루오 나카가와
Original Assignee
파나소닉 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파나소닉 주식회사 filed Critical 파나소닉 주식회사
Publication of KR20120082037A publication Critical patent/KR20120082037A/ko
Application granted granted Critical
Publication of KR101178785B1 publication Critical patent/KR101178785B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Epoxy Resins (AREA)
KR1020127016523A 2009-11-25 2010-11-24 적층판, 금속박 클래드 적층판, 프린트 배선판 및 회로 기판 및 led 백라이트 유닛, led 조명 장치, 적층판의 제조 방법 Active KR101178785B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009268078 2009-11-25
JPJP-P-2009-268078 2009-11-25
PCT/JP2010/070910 WO2011065372A1 (ja) 2009-11-25 2010-11-24 積層板、その用途及びその製造方法

Publications (2)

Publication Number Publication Date
KR20120082037A KR20120082037A (ko) 2012-07-20
KR101178785B1 true KR101178785B1 (ko) 2012-09-07

Family

ID=44066477

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127016523A Active KR101178785B1 (ko) 2009-11-25 2010-11-24 적층판, 금속박 클래드 적층판, 프린트 배선판 및 회로 기판 및 led 백라이트 유닛, led 조명 장치, 적층판의 제조 방법

Country Status (5)

Country Link
JP (3) JP4853599B2 (https=)
KR (1) KR101178785B1 (https=)
CN (1) CN102695612B (https=)
TW (1) TWI436893B (https=)
WO (1) WO2011065372A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103582564B (zh) * 2011-05-30 2016-03-02 松下知识产权经营株式会社 层叠板、其用途及其制造方法
CN103131133A (zh) * 2011-12-02 2013-06-05 达航工业股份有限公司 用于印刷电路板的充填用热固化型组成物
TWI610786B (zh) * 2012-03-30 2018-01-11 Hitachi Chemical Company, Ltd. 熱傳導片的製造方法
WO2013156906A1 (en) * 2012-04-16 2013-10-24 Koninklijke Philips N.V. Pcb laminate material
CN103790092A (zh) * 2012-10-29 2014-05-14 3M新设资产公司 不织布透水砖及其制造方法
JP6225643B2 (ja) * 2013-10-31 2017-11-08 味の素株式会社 積層板の製造方法
JP6277543B2 (ja) * 2013-11-27 2018-02-14 パナソニックＩｐマネジメント株式会社 コンポジット積層板及びその製造方法
KR102413224B1 (ko) * 2015-10-01 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자, 발광 소자 제조방법 및 발광 모듈
JP6986696B2 (ja) * 2017-05-18 2021-12-22 パナソニックＩｐマネジメント株式会社 コンポジット積層板
CN111566162A (zh) * 2017-12-22 2020-08-21 日立化成株式会社 密封组合物和半导体装置
GB2575242B (en) * 2018-05-30 2022-11-23 Acell Ind Ltd Vacuum forming process
CN109705532B (zh) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板
KR20240132464A (ko) * 2021-12-17 2024-09-03 베르시브 컴포지츠 리미티드 유전체 기판 및 그 형성 방법
KR20240136347A (ko) * 2021-12-17 2024-09-13 베르시브 컴포지츠 리미티드 유전체 기판 및 그 형성 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10182985A (ja) 1996-12-24 1998-07-07 Matsushita Electric Works Ltd 積層板用樹脂組成物及び積層板
JPH11179841A (ja) 1997-12-24 1999-07-06 Shin Kobe Electric Mach Co Ltd コンポジット金属箔張り積層板
JPH11200218A (ja) 1998-01-14 1999-07-27 Oji Paper Co Ltd 耐熱性不織布

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953055A (en) * 1996-08-08 1999-09-14 Ncr Corporation System and method for detecting and analyzing a queue
JP4645726B2 (ja) * 2008-05-19 2011-03-09 パナソニック電工株式会社 積層板、プリプレグ、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
WO2009142192A1 (ja) * 2008-05-19 2009-11-26 パナソニック電工株式会社 積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP4788799B2 (ja) * 2009-04-24 2011-10-05 パナソニック電工株式会社 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP2011102394A (ja) * 2010-12-20 2011-05-26 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板、及びｌｅｄ搭載用回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10182985A (ja) 1996-12-24 1998-07-07 Matsushita Electric Works Ltd 積層板用樹脂組成物及び積層板
JPH11179841A (ja) 1997-12-24 1999-07-06 Shin Kobe Electric Mach Co Ltd コンポジット金属箔張り積層板
JPH11200218A (ja) 1998-01-14 1999-07-27 Oji Paper Co Ltd 耐熱性不織布

Also Published As

Publication number Publication date
JP2012064955A (ja) 2012-03-29
JPWO2011065372A1 (ja) 2013-04-18
CN102695612A (zh) 2012-09-26
CN102695612B (zh) 2014-06-25
JP4853599B2 (ja) 2012-01-11
KR20120082037A (ko) 2012-07-20
WO2011065372A1 (ja) 2011-06-03
TW201134671A (en) 2011-10-16
TWI436893B (zh) 2014-05-11
JP4893873B1 (ja) 2012-03-07
JP2011132540A (ja) 2011-07-07

Similar Documents

Publication Publication Date Title
KR101178785B1 (ko) 적층판, 금속박 클래드 적층판, 프린트 배선판 및 회로 기판 및 led 백라이트 유닛, led 조명 장치, 적층판의 제조 방법
KR101776560B1 (ko) 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판
CN103547634B (zh) 热固化性树脂组合物、预浸料、层压板、覆金属箔层压板以及电路基板
KR101715717B1 (ko) 적층판, 그 용도 및 그 제조 방법
CN102725334B (zh) 半固化片、层压板、覆金属箔层压板、电路基板及led搭载用电路基板
TW201008778A (en) Laminate, metal-foil-clad laminate, circuit board, and circuit board for led mounting
WO2009142192A1 (ja) 積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
CN103180371B (zh) 预浸料、层压板、覆金属箔层压板、电路基板及led模块
JP4788799B2 (ja) 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP2011102394A (ja) 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板、及びｌｅｄ搭載用回路基板
JP2012227417A (ja) 積層板、金属張り積層板、回路基板およびｌｅｄ実装基板、並びに積層体の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
PA0105 International application

Patent event date: 20120625

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20120625

Comment text: Request for Examination of Application

PA0302 Request for accelerated examination

Patent event date: 20120625

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

PG1501 Laying open of application
E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20120723

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20120827

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20120827

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20150716

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20150716

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20160720

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20160720

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20170720

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20170720

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20180719

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20180719

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20200721

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20220704

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20230628

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20240701

Start annual number: 13

End annual number: 13

PR1001 Payment of annual fee

Payment date: 20250630

Start annual number: 14

End annual number: 14