JP4853599B2 - 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置 - Google Patents

積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置 Download PDF

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Publication number
JP4853599B2
JP4853599B2 JP2011508733A JP2011508733A JP4853599B2 JP 4853599 B2 JP4853599 B2 JP 4853599B2 JP 2011508733 A JP2011508733 A JP 2011508733A JP 2011508733 A JP2011508733 A JP 2011508733A JP 4853599 B2 JP4853599 B2 JP 4853599B2
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JP
Japan
Prior art keywords
thermosetting resin
laminate
component
laminated board
nonwoven fabric
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Application number
JP2011508733A
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English (en)
Japanese (ja)
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JPWO2011065372A1 (ja
Inventor
広海 清水
隆之 鈴江
明義 野末
照雄 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Electric Works Co Ltd
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Panasonic Corp
Matsushita Electric Works Ltd
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Priority to JP2011508733A priority Critical patent/JP4853599B2/ja
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Publication of JPWO2011065372A1 publication Critical patent/JPWO2011065372A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Epoxy Resins (AREA)
JP2011508733A 2009-11-25 2010-11-24 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置 Active JP4853599B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011508733A JP4853599B2 (ja) 2009-11-25 2010-11-24 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009268078 2009-11-25
JP2009268078 2009-11-25
PCT/JP2010/070910 WO2011065372A1 (ja) 2009-11-25 2010-11-24 積層板、その用途及びその製造方法
JP2011508733A JP4853599B2 (ja) 2009-11-25 2010-11-24 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011060859A Division JP2011132540A (ja) 2009-11-25 2011-03-18 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置、積層板の製造方法

Publications (2)

Publication Number Publication Date
JP4853599B2 true JP4853599B2 (ja) 2012-01-11
JPWO2011065372A1 JPWO2011065372A1 (ja) 2013-04-18

Family

ID=44066477

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2011508733A Active JP4853599B2 (ja) 2009-11-25 2010-11-24 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置
JP2011060859A Pending JP2011132540A (ja) 2009-11-25 2011-03-18 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置、積層板の製造方法
JP2011231912A Active JP4893873B1 (ja) 2009-11-25 2011-10-21 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置、積層板の製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2011060859A Pending JP2011132540A (ja) 2009-11-25 2011-03-18 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置、積層板の製造方法
JP2011231912A Active JP4893873B1 (ja) 2009-11-25 2011-10-21 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置、積層板の製造方法

Country Status (5)

Country Link
JP (3) JP4853599B2 (https=)
KR (1) KR101178785B1 (https=)
CN (1) CN102695612B (https=)
TW (1) TWI436893B (https=)
WO (1) WO2011065372A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103582564B (zh) * 2011-05-30 2016-03-02 松下知识产权经营株式会社 层叠板、其用途及其制造方法
CN103131133A (zh) * 2011-12-02 2013-06-05 达航工业股份有限公司 用于印刷电路板的充填用热固化型组成物
TWI610786B (zh) * 2012-03-30 2018-01-11 Hitachi Chemical Company, Ltd. 熱傳導片的製造方法
WO2013156906A1 (en) * 2012-04-16 2013-10-24 Koninklijke Philips N.V. Pcb laminate material
CN103790092A (zh) * 2012-10-29 2014-05-14 3M新设资产公司 不织布透水砖及其制造方法
JP6225643B2 (ja) * 2013-10-31 2017-11-08 味の素株式会社 積層板の製造方法
JP6277543B2 (ja) * 2013-11-27 2018-02-14 パナソニックＩｐマネジメント株式会社 コンポジット積層板及びその製造方法
KR102413224B1 (ko) * 2015-10-01 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자, 발광 소자 제조방법 및 발광 모듈
JP6986696B2 (ja) * 2017-05-18 2021-12-22 パナソニックＩｐマネジメント株式会社 コンポジット積層板
CN111566162A (zh) * 2017-12-22 2020-08-21 日立化成株式会社 密封组合物和半导体装置
GB2575242B (en) * 2018-05-30 2022-11-23 Acell Ind Ltd Vacuum forming process
CN109705532B (zh) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板
KR20240132464A (ko) * 2021-12-17 2024-09-03 베르시브 컴포지츠 리미티드 유전체 기판 및 그 형성 방법
KR20240136347A (ko) * 2021-12-17 2024-09-13 베르시브 컴포지츠 리미티드 유전체 기판 및 그 형성 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254807A (ja) * 2009-04-24 2010-11-11 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP4645726B2 (ja) * 2008-05-19 2011-03-09 パナソニック電工株式会社 積層板、プリプレグ、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP2011102394A (ja) * 2010-12-20 2011-05-26 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板、及びｌｅｄ搭載用回路基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953055A (en) * 1996-08-08 1999-09-14 Ncr Corporation System and method for detecting and analyzing a queue
JPH10182985A (ja) * 1996-12-24 1998-07-07 Matsushita Electric Works Ltd 積層板用樹脂組成物及び積層板
JPH11179841A (ja) * 1997-12-24 1999-07-06 Shin Kobe Electric Mach Co Ltd コンポジット金属箔張り積層板
JPH11200218A (ja) * 1998-01-14 1999-07-27 Oji Paper Co Ltd 耐熱性不織布
WO2009142192A1 (ja) * 2008-05-19 2009-11-26 パナソニック電工株式会社 積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4645726B2 (ja) * 2008-05-19 2011-03-09 パナソニック電工株式会社 積層板、プリプレグ、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP2010254807A (ja) * 2009-04-24 2010-11-11 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP2011102394A (ja) * 2010-12-20 2011-05-26 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板、及びｌｅｄ搭載用回路基板

Also Published As

Publication number Publication date
JP2012064955A (ja) 2012-03-29
JPWO2011065372A1 (ja) 2013-04-18
CN102695612A (zh) 2012-09-26
CN102695612B (zh) 2014-06-25
KR20120082037A (ko) 2012-07-20
KR101178785B1 (ko) 2012-09-07
WO2011065372A1 (ja) 2011-06-03
TW201134671A (en) 2011-10-16
TWI436893B (zh) 2014-05-11
JP4893873B1 (ja) 2012-03-07
JP2011132540A (ja) 2011-07-07

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