TWI433753B - 用於研磨頭之撓性膜 - Google Patents

用於研磨頭之撓性膜 Download PDF

Info

Publication number
TWI433753B
TWI433753B TW096144348A TW96144348A TWI433753B TW I433753 B TWI433753 B TW I433753B TW 096144348 A TW096144348 A TW 096144348A TW 96144348 A TW96144348 A TW 96144348A TW I433753 B TWI433753 B TW I433753B
Authority
TW
Taiwan
Prior art keywords
annular
flexible film
ring
concentric
main portion
Prior art date
Application number
TW096144348A
Other languages
English (en)
Chinese (zh)
Other versions
TW200902227A (en
Inventor
努尼佳史帝文Ｍ
納根葛斯特安德魯Ｊ
吳正勳
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW200902227A publication Critical patent/TW200902227A/zh
Application granted granted Critical
Publication of TWI433753B publication Critical patent/TWI433753B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y10T428/24182—Inward from edge of web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Packages (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
TW096144348A 2006-11-22 2007-11-22 用於研磨頭之撓性膜 TWI433753B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86709006P 2006-11-22 2006-11-22
US89170507P 2007-02-26 2007-02-26
US11/741,692 US7727055B2 (en) 2006-11-22 2007-04-27 Flexible membrane for carrier head

Publications (2)

Publication Number Publication Date
TW200902227A TW200902227A (en) 2009-01-16
TWI433753B true TWI433753B (zh) 2014-04-11

Family

ID=38996609

Family Applications (2)

Application Number Title Priority Date Filing Date
TW096144348A TWI433753B (zh) 2006-11-22 2007-11-22 用於研磨頭之撓性膜
TW103105901A TWI552829B (zh) 2006-11-22 2007-11-22 用於硏磨頭之撓性膜

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103105901A TWI552829B (zh) 2006-11-22 2007-11-22 用於硏磨頭之撓性膜

Country Status (8)

Country Link
US (3) US7727055B2 (https=)
EP (1) EP1925399B1 (https=)
JP (2) JP5250243B2 (https=)
KR (1) KR100942620B1 (https=)
CN (1) CN101293334B (https=)
AT (1) ATE529220T1 (https=)
SG (2) SG143191A1 (https=)
TW (2) TWI433753B (https=)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
JP5042778B2 (ja) * 2007-10-31 2012-10-03 信越半導体株式会社 ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置
KR20100094466A (ko) * 2007-11-20 2010-08-26 신에쯔 한도타이 가부시키가이샤 연마 헤드 및 연마 장치
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
KR101814185B1 (ko) * 2010-08-06 2018-01-02 어플라이드 머티어리얼스, 인코포레이티드 유지 링에 의한 기판 엣지 튜닝
US8591286B2 (en) 2010-08-11 2013-11-26 Applied Materials, Inc. Apparatus and method for temperature control during polishing
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
JP5807580B2 (ja) 2012-02-15 2015-11-10 信越半導体株式会社 研磨ヘッド及び研磨装置
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
WO2015051134A1 (en) * 2013-10-04 2015-04-09 Applied Materials, Inc. Coated retaining ring
TWI628043B (zh) 2014-03-27 2018-07-01 Ebara Corporation 彈性膜、基板保持裝置、及研磨裝置
CN104308736A (zh) * 2014-08-27 2015-01-28 上海华力微电子有限公司 研磨头膜片的缺陷检测方法
KR101673140B1 (ko) * 2014-12-22 2016-11-08 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 및 이를 구비한 캐리어 헤드
KR102264785B1 (ko) * 2015-02-16 2021-06-14 삼성전자주식회사 연마 헤드 및 이를 갖는 연마 캐리어 장치
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
JP7021863B2 (ja) * 2017-03-30 2022-02-17 富士紡ホールディングス株式会社 保持具
JP7141222B2 (ja) * 2017-04-12 2022-09-22 株式会社荏原製作所 弾性膜、基板保持装置、及び研磨装置
US11088011B2 (en) 2017-04-12 2021-08-10 Ebara Corporation Elastic membrane, substrate holding device, and polishing apparatus
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11267099B2 (en) * 2017-09-27 2022-03-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization membrane
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
WO2019145559A1 (de) * 2018-01-29 2019-08-01 Menzer Gmbh Gleitring für schleifgerät und verfahren zur herstellung des gleitrings
KR102637832B1 (ko) * 2018-11-09 2024-02-19 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
CN109202697A (zh) * 2018-11-20 2019-01-15 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光头、抛光设备以及抛光头的使用方法
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
SG10202008012WA (en) * 2019-08-29 2021-03-30 Ebara Corp Elastic membrane and substrate holding apparatus
US12138732B2 (en) 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
CN115741427B (zh) * 2022-12-01 2026-04-10 华海清科股份有限公司 一种用于化学机械抛光的承载头、抛光系统和抛光方法
KR102867407B1 (ko) * 2023-03-15 2025-09-30 헤마 마쉬넨 운트 아파라테슈츠 게엠베하 공압 클램핑 및/또는 제동장치
WO2024188534A1 (de) 2023-03-15 2024-09-19 Hema Maschinen- Und Apparateschutz Gmbh Gehäuseteil für eine pneumatische klemm- und/oder bremsvorrichtung
CN117798813A (zh) * 2024-02-02 2024-04-02 华海清科股份有限公司 一种用于化学机械抛光的弹性膜和承载头

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
KR100485002B1 (ko) * 1996-02-16 2005-08-29 가부시키가이샤 에바라 세이사꾸쇼 작업물폴리싱장치및방법
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
JPH11188618A (ja) 1997-12-22 1999-07-13 Sumitomo Metal Ind Ltd ウェーハの研磨方法と研磨用ウェーハホルダー
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6251215B1 (en) 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6210255B1 (en) * 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6159079A (en) * 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6089961A (en) * 1998-12-07 2000-07-18 Speedfam-Ipec Corporation Wafer polishing carrier and ring extension therefor
US20020173242A1 (en) * 1999-04-19 2002-11-21 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
TW436382B (en) * 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6527624B1 (en) 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
JP2000288923A (ja) 1999-04-07 2000-10-17 Speedfam-Ipec Co Ltd キャリア及びｃｍｐ装置
GB9912356D0 (en) * 1999-05-26 1999-07-28 Btg Int Ltd Generation of microfoam
US6068549A (en) * 1999-06-28 2000-05-30 Mitsubishi Materials Corporation Structure and method for three chamber CMP polishing head
JP2001071250A (ja) * 1999-07-09 2001-03-21 Applied Materials Inc 固定研磨ベルトポリッシャ
US6186880B1 (en) * 1999-09-29 2001-02-13 Semiconductor Equipment Technology Recyclable retaining ring assembly for a chemical mechanical polishing apparatus
DE60024559T2 (de) * 1999-10-15 2006-08-24 Ebara Corp. Verfahren und Gerät zum Polieren eines Werkstückes
US6663466B2 (en) * 1999-11-17 2003-12-16 Applied Materials, Inc. Carrier head with a substrate detector
US6361419B1 (en) 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6483740B2 (en) * 2000-07-11 2002-11-19 Integrated Magnetoelectronics Corporation All metal giant magnetoresistive memory
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US7101273B2 (en) * 2000-07-25 2006-09-05 Applied Materials, Inc. Carrier head with gimbal mechanism
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
KR100437456B1 (ko) 2001-05-31 2004-06-23 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
US6483354B1 (en) * 2001-08-24 2002-11-19 Lsi Logic Corporation PCI-X driver control
US6890249B1 (en) * 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
JP5296985B2 (ja) 2003-11-13 2013-09-25 アプライド マテリアルズ インコーポレイテッド 整形面をもつリテーニングリング
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US7081042B2 (en) * 2004-07-22 2006-07-25 Applied Materials Substrate removal from polishing tool
JP2008511983A (ja) 2004-09-02 2008-04-17 カン，ジョン−モ 化学機械研磨のためのリテーニングリング
US20080076253A1 (en) 2004-09-30 2008-03-27 Hiroshi Fukada Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
KR101011788B1 (ko) 2004-11-01 2011-02-07 가부시키가이샤 에바라 세이사꾸쇼 톱링, 폴리싱장치 및 폴리싱방법
JP2006324413A (ja) 2005-05-18 2006-11-30 Ebara Corp 基板保持装置および研磨装置
JP5112614B2 (ja) * 2004-12-10 2013-01-09 株式会社荏原製作所 基板保持装置および研磨装置
US7101272B2 (en) * 2005-01-15 2006-09-05 Applied Materials, Inc. Carrier head for thermal drift compensation
JP2007007747A (ja) 2005-06-28 2007-01-18 Nitta Haas Inc 被研磨物保持枠材および研磨ヘッド
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers
JP4814677B2 (ja) 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US7654888B2 (en) 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7727055B2 (en) 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head

Also Published As

Publication number Publication date
US7950985B2 (en) 2011-05-31
US8469776B2 (en) 2013-06-25
KR100942620B1 (ko) 2010-02-17
EP1925399A2 (en) 2008-05-28
ATE529220T1 (de) 2011-11-15
CN101293334B (zh) 2016-03-23
TWI552829B (zh) 2016-10-11
TW201422364A (zh) 2014-06-16
CN101293334A (zh) 2008-10-29
JP2008142884A (ja) 2008-06-26
TW200902227A (en) 2009-01-16
EP1925399B1 (en) 2011-10-19
SG143191A1 (en) 2008-06-27
JP5568654B2 (ja) 2014-08-06
US20100240287A1 (en) 2010-09-23
JP5250243B2 (ja) 2013-07-31
EP1925399A3 (en) 2008-07-02
US20080119122A1 (en) 2008-05-22
JP2013116555A (ja) 2013-06-13
SG175554A1 (en) 2011-11-28
US20110212672A1 (en) 2011-09-01
US7727055B2 (en) 2010-06-01
KR20080046557A (ko) 2008-05-27

Similar Documents

Publication Publication Date Title
TWI433753B (zh) 用於研磨頭之撓性膜
TWI448356B (zh) 定位環、用於向定位環施加負載的撓性膜以及定位環組件
TWI423318B (zh) 具有定位環及夾持環之研磨頭
TWI430870B (zh) 用於研磨頭的夾持環