TWI431136B - Film forming apparatus and its evaporation source apparatus, and its evaporation source container - Google Patents

Film forming apparatus and its evaporation source apparatus, and its evaporation source container Download PDF

Info

Publication number
TWI431136B
TWI431136B TW099121688A TW99121688A TWI431136B TW I431136 B TWI431136 B TW I431136B TW 099121688 A TW099121688 A TW 099121688A TW 99121688 A TW99121688 A TW 99121688A TW I431136 B TWI431136 B TW I431136B
Authority
TW
Taiwan
Prior art keywords
container
evaporation source
vapor deposition
gas
source device
Prior art date
Application number
TW099121688A
Other languages
English (en)
Chinese (zh)
Other versions
TW201102449A (en
Inventor
Hiroyasu Matsuura
Hideaki Doi
Noboru Kato
Nobuhiro Nirasawa
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TW201102449A publication Critical patent/TW201102449A/zh
Application granted granted Critical
Publication of TWI431136B publication Critical patent/TWI431136B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
TW099121688A 2009-07-10 2010-07-01 Film forming apparatus and its evaporation source apparatus, and its evaporation source container TWI431136B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009163894A JP5244723B2 (ja) 2009-07-10 2009-07-10 成膜装置

Publications (2)

Publication Number Publication Date
TW201102449A TW201102449A (en) 2011-01-16
TWI431136B true TWI431136B (zh) 2014-03-21

Family

ID=43452624

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099121688A TWI431136B (zh) 2009-07-10 2010-07-01 Film forming apparatus and its evaporation source apparatus, and its evaporation source container

Country Status (4)

Country Link
JP (1) JP5244723B2 (ja)
KR (1) KR101191569B1 (ja)
CN (1) CN101949002B (ja)
TW (1) TWI431136B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102024830B1 (ko) * 2013-05-09 2019-09-25 (주)지오엘리먼트 기화기
CN103726020B (zh) * 2013-12-30 2016-09-14 深圳市华星光电技术有限公司 真空蒸镀装置及蒸镀方法
JP6584067B2 (ja) * 2014-05-30 2019-10-02 日立造船株式会社 真空蒸着装置
CN104451583B (zh) 2015-01-05 2017-05-10 合肥京东方显示光源有限公司 磁控溅射真空室进气装置及磁控溅射设备
TWI624554B (zh) * 2015-08-21 2018-05-21 弗里松股份有限公司 蒸發源
WO2017033053A1 (en) 2015-08-21 2017-03-02 Flisom Ag Homogeneous linear evaporation source
WO2018199184A1 (ja) * 2017-04-26 2018-11-01 株式会社アルバック 蒸発源及び成膜装置
US11946131B2 (en) * 2017-05-26 2024-04-02 Universal Display Corporation Sublimation cell with time stability of output vapor pressure
JP6526880B1 (ja) * 2018-06-29 2019-06-05 キヤノントッキ株式会社 蒸発源及び蒸着装置
CN112176290B (zh) * 2020-10-27 2022-12-13 南京昀光科技有限公司 一种蒸发源系统
CN115094383B (zh) * 2022-07-01 2023-06-30 江阴纳力新材料科技有限公司 一种基于蒸镀的复合正极集流体制备装置及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19753656C1 (de) * 1997-12-03 1998-12-03 Fraunhofer Ges Forschung Einrichtung zur Vakuumbeschichtung von Gleitlagern
JP4447256B2 (ja) 2003-06-27 2010-04-07 株式会社半導体エネルギー研究所 発光装置の作製方法
JP4455937B2 (ja) * 2004-06-01 2010-04-21 東北パイオニア株式会社 成膜源、真空成膜装置、有機ｅｌパネルの製造方法
JP4602054B2 (ja) * 2004-11-25 2010-12-22 東京エレクトロン株式会社 蒸着装置
US7484315B2 (en) * 2004-11-29 2009-02-03 Tokyo Electron Limited Replaceable precursor tray for use in a multi-tray solid precursor delivery system
JP4847365B2 (ja) * 2006-03-22 2011-12-28 キヤノン株式会社 蒸着源および蒸着装置

Also Published As

Publication number Publication date
CN101949002B (zh) 2012-10-10
JP5244723B2 (ja) 2013-07-24
TW201102449A (en) 2011-01-16
KR20110005636A (ko) 2011-01-18
CN101949002A (zh) 2011-01-19
KR101191569B1 (ko) 2012-10-15
JP2011017065A (ja) 2011-01-27

Similar Documents

Publication Publication Date Title
TWI431136B (zh) Film forming apparatus and its evaporation source apparatus, and its evaporation source container
JP4013859B2 (ja) 有機薄膜の製造装置
US11121322B2 (en) Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP)
KR100711886B1 (ko) 무기 증착원 및 이의 가열원 제어방법
JP2008294003A (ja) 発光装置の作製方法
CN103361610A (zh) 蒸发源以及使用了它的真空蒸镀装置
JP2001319779A (ja) 発光素子
JP5512881B2 (ja) 蒸着処理システム及び蒸着処理方法
JP5798452B2 (ja) 蒸発源
US9142778B2 (en) High vacuum OLED deposition source and system
TWI516622B (zh) 蒸鍍裝置
JP5242549B2 (ja) 基板表面に共蒸着層を形成する方法
EP2137335B1 (en) Fine control of vaporized organic material
US20140295603A1 (en) Method for producing organic electroluminescence element
JP2020530531A (ja) Ｒｆスパッタリング装置を用いたｏｌｅｄ用有機薄膜層の形成方法及び前記ｒｆスパッタリング装置、並びに前記ｒｆスパッタリング装置で使用されるターゲットを成形する装置
KR101462592B1 (ko) 크루시블의 안정성 향상을 위한 증발 물질 피딩 장치
JP5839556B2 (ja) 成膜方法
JP3775909B2 (ja) 有機薄膜製造方法、及び有機蒸着装置
KR20200078851A (ko) 증착 소스 및 이를 구비하는 기판 증착장치
JP2007046098A (ja) 真空蒸着装置
JP2003031359A (ja) 薄膜製造装置およびそれを用いて製造された有機エレクトロルミネッセンス素子
Govindarajan Fabrication of Organic Light Emitting Diodes by Flash Vaporization
JP2008234862A (ja) 有機電子材料の蒸着膜形成方法及び有機電子材料の取り扱い方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees