KR101191569B1 - 성막 장치 - Google Patents

성막 장치 Download PDF

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Publication number
KR101191569B1
KR101191569B1 KR1020100061602A KR20100061602A KR101191569B1 KR 101191569 B1 KR101191569 B1 KR 101191569B1 KR 1020100061602 A KR1020100061602 A KR 1020100061602A KR 20100061602 A KR20100061602 A KR 20100061602A KR 101191569 B1 KR101191569 B1 KR 101191569B1
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KR
South Korea
Prior art keywords
container
evaporation source
forming apparatus
gas
vapor deposition
Prior art date
Application number
KR1020100061602A
Other languages
English (en)
Korean (ko)
Other versions
KR20110005636A (ko
Inventor
히로야스 마쯔우라
히데아끼 도이
노보루 가또오
노부히로 니라사와
Original Assignee
가부시키가이샤 히다치 하이테크놀로지즈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 히다치 하이테크놀로지즈 filed Critical 가부시키가이샤 히다치 하이테크놀로지즈
Publication of KR20110005636A publication Critical patent/KR20110005636A/ko
Application granted granted Critical
Publication of KR101191569B1 publication Critical patent/KR101191569B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
KR1020100061602A 2009-07-10 2010-06-29 성막 장치 KR101191569B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-163894 2009-07-10
JP2009163894A JP5244723B2 (ja) 2009-07-10 2009-07-10 成膜装置

Publications (2)

Publication Number Publication Date
KR20110005636A KR20110005636A (ko) 2011-01-18
KR101191569B1 true KR101191569B1 (ko) 2012-10-15

Family

ID=43452624

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100061602A KR101191569B1 (ko) 2009-07-10 2010-06-29 성막 장치

Country Status (4)

Country Link
JP (1) JP5244723B2 (ja)
KR (1) KR101191569B1 (ja)
CN (1) CN101949002B (ja)
TW (1) TWI431136B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140133641A (ko) * 2013-05-09 2014-11-20 (주)지오엘리먼트 기화기

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103726020B (zh) * 2013-12-30 2016-09-14 深圳市华星光电技术有限公司 真空蒸镀装置及蒸镀方法
JP6584067B2 (ja) * 2014-05-30 2019-10-02 日立造船株式会社 真空蒸着装置
CN104451583B (zh) 2015-01-05 2017-05-10 合肥京东方显示光源有限公司 磁控溅射真空室进气装置及磁控溅射设备
TWI624554B (zh) * 2015-08-21 2018-05-21 弗里松股份有限公司 蒸發源
WO2017033053A1 (en) 2015-08-21 2017-03-02 Flisom Ag Homogeneous linear evaporation source
WO2018199184A1 (ja) * 2017-04-26 2018-11-01 株式会社アルバック 蒸発源及び成膜装置
US11946131B2 (en) * 2017-05-26 2024-04-02 Universal Display Corporation Sublimation cell with time stability of output vapor pressure
JP6526880B1 (ja) * 2018-06-29 2019-06-05 キヤノントッキ株式会社 蒸発源及び蒸着装置
CN112176290B (zh) * 2020-10-27 2022-12-13 南京昀光科技有限公司 一种蒸发源系统
CN115094383B (zh) * 2022-07-01 2023-06-30 江阴纳力新材料科技有限公司 一种基于蒸镀的复合正极集流体制备装置及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005015869A (ja) 2003-06-27 2005-01-20 Semiconductor Energy Lab Co Ltd 製造装置
JP2006152326A (ja) * 2004-11-25 2006-06-15 Tokyo Electron Ltd 蒸着装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19753656C1 (de) * 1997-12-03 1998-12-03 Fraunhofer Ges Forschung Einrichtung zur Vakuumbeschichtung von Gleitlagern
JP4455937B2 (ja) * 2004-06-01 2010-04-21 東北パイオニア株式会社 成膜源、真空成膜装置、有機ｅｌパネルの製造方法
US7484315B2 (en) * 2004-11-29 2009-02-03 Tokyo Electron Limited Replaceable precursor tray for use in a multi-tray solid precursor delivery system
JP4847365B2 (ja) * 2006-03-22 2011-12-28 キヤノン株式会社 蒸着源および蒸着装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005015869A (ja) 2003-06-27 2005-01-20 Semiconductor Energy Lab Co Ltd 製造装置
JP2006152326A (ja) * 2004-11-25 2006-06-15 Tokyo Electron Ltd 蒸着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140133641A (ko) * 2013-05-09 2014-11-20 (주)지오엘리먼트 기화기
KR102024830B1 (ko) * 2013-05-09 2019-09-25 (주)지오엘리먼트 기화기

Also Published As

Publication number Publication date
TWI431136B (zh) 2014-03-21
CN101949002B (zh) 2012-10-10
JP5244723B2 (ja) 2013-07-24
TW201102449A (en) 2011-01-16
KR20110005636A (ko) 2011-01-18
CN101949002A (zh) 2011-01-19
JP2011017065A (ja) 2011-01-27

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