TWI429929B - 自動化之接點對準工具 - Google Patents

自動化之接點對準工具 Download PDF

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Publication number
TWI429929B
TWI429929B TW097130834A TW97130834A TWI429929B TW I429929 B TWI429929 B TW I429929B TW 097130834 A TW097130834 A TW 097130834A TW 97130834 A TW97130834 A TW 97130834A TW I429929 B TWI429929 B TW I429929B
Authority
TW
Taiwan
Prior art keywords
test
electronic component
contact
measurements
centerline
Prior art date
Application number
TW097130834A
Other languages
English (en)
Chinese (zh)
Other versions
TW200931444A (en
Inventor
David Newton
Jon Paulsen
Barry Klinger
Shi Li
Spencer Barrett
Jasmine Lu
Kent Robinson
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW200931444A publication Critical patent/TW200931444A/zh
Application granted granted Critical
Publication of TWI429929B publication Critical patent/TWI429929B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW097130834A 2007-08-14 2008-08-13 自動化之接點對準工具 TWI429929B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/838,706 US7557594B2 (en) 2007-08-14 2007-08-14 Automated contact alignment tool

Publications (2)

Publication Number Publication Date
TW200931444A TW200931444A (en) 2009-07-16
TWI429929B true TWI429929B (zh) 2014-03-11

Family

ID=40351470

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097130834A TWI429929B (zh) 2007-08-14 2008-08-13 自動化之接點對準工具

Country Status (6)

Country Link
US (2) US7557594B2 (enExample)
JP (1) JP5324577B2 (enExample)
KR (1) KR101209556B1 (enExample)
CN (1) CN101779135B (enExample)
TW (1) TWI429929B (enExample)
WO (1) WO2009023727A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8159243B2 (en) * 2008-11-13 2012-04-17 Dcg Systems, Inc. Probe tip to device pad alignment in obscured view probing applications
JP4807890B2 (ja) * 2009-07-13 2011-11-02 ハイメカ株式会社 電子部品の整列装置および整列方法
TWM430614U (en) * 2011-12-21 2012-06-01 Youngtek Electronics Corp Fiber optic light guiding top cover structure
CN112845167B (zh) * 2021-01-05 2024-01-26 常熟市天银机电股份有限公司 电机保护器的动触点弹簧片弹性全自动检测装置
CN114415000B (zh) * 2022-03-29 2022-07-12 深圳市永达电子信息股份有限公司 一种mark点的假压对齐装置及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05196681A (ja) * 1991-06-26 1993-08-06 Digital Equip Corp <Dec> 連続移動する電気回路の相互接続試験方法及び装置
US5842579A (en) * 1995-11-16 1998-12-01 Electro Scientific Industries, Inc. Electrical circuit component handler
CA2174784C (en) * 1996-04-23 1999-07-13 George Guozhen Zhong Automatic multi-probe pwb tester
JPH11271374A (ja) * 1998-03-20 1999-10-08 Anritsu Corp 電子部品検査装置及び方法
US7119566B2 (en) * 2002-03-22 2006-10-10 Electro Scientific Industries, Inc. Test probe alignment apparatus
JP2005533254A (ja) * 2002-07-16 2005-11-04 エイアー テスト システムズ 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体
US20060026224A1 (en) * 2004-07-30 2006-02-02 Merkli Patrick P Method and circuit for combined multiplication and division
GB2434211B (en) * 2004-11-22 2009-09-23 Electro Scient Ind Inc Method and machine for repetitive testing of an electrical component

Also Published As

Publication number Publication date
CN101779135B (zh) 2013-08-28
KR20100049054A (ko) 2010-05-11
CN101779135A (zh) 2010-07-14
US7557594B2 (en) 2009-07-07
US20090224789A1 (en) 2009-09-10
US20090045830A1 (en) 2009-02-19
TW200931444A (en) 2009-07-16
WO2009023727A3 (en) 2009-04-23
US7750653B2 (en) 2010-07-06
JP5324577B2 (ja) 2013-10-23
KR101209556B1 (ko) 2012-12-10
WO2009023727A2 (en) 2009-02-19
JP2010537169A (ja) 2010-12-02

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MM4A Annulment or lapse of patent due to non-payment of fees