JP5324577B2 - 自動化された接点位置合わせツール - Google Patents

自動化された接点位置合わせツール Download PDF

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Publication number
JP5324577B2
JP5324577B2 JP2010521141A JP2010521141A JP5324577B2 JP 5324577 B2 JP5324577 B2 JP 5324577B2 JP 2010521141 A JP2010521141 A JP 2010521141A JP 2010521141 A JP2010521141 A JP 2010521141A JP 5324577 B2 JP5324577 B2 JP 5324577B2
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JP
Japan
Prior art keywords
test
electronic component
contact
contacts
electrical measurements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010521141A
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English (en)
Japanese (ja)
Other versions
JP2010537169A (ja
JP2010537169A5 (enExample
Inventor
ニュートン，ディビッド
ポールセン，ジョン
クリンガー，バリー
リー，シィ
バレット，スペンサー
リュ，ジャスミン
ロビンソン，ケント
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2010537169A publication Critical patent/JP2010537169A/ja
Publication of JP2010537169A5 publication Critical patent/JP2010537169A5/ja
Application granted granted Critical
Publication of JP5324577B2 publication Critical patent/JP5324577B2/ja
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2010521141A 2007-08-14 2008-08-13 自動化された接点位置合わせツール Expired - Fee Related JP5324577B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/838,706 US7557594B2 (en) 2007-08-14 2007-08-14 Automated contact alignment tool
US11/838,706 2007-08-14
PCT/US2008/073048 WO2009023727A2 (en) 2007-08-14 2008-08-13 Automated contact alignment tool

Publications (3)

Publication Number Publication Date
JP2010537169A JP2010537169A (ja) 2010-12-02
JP2010537169A5 JP2010537169A5 (enExample) 2011-09-22
JP5324577B2 true JP5324577B2 (ja) 2013-10-23

Family

ID=40351470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010521141A Expired - Fee Related JP5324577B2 (ja) 2007-08-14 2008-08-13 自動化された接点位置合わせツール

Country Status (6)

Country Link
US (2) US7557594B2 (enExample)
JP (1) JP5324577B2 (enExample)
KR (1) KR101209556B1 (enExample)
CN (1) CN101779135B (enExample)
TW (1) TWI429929B (enExample)
WO (1) WO2009023727A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8159243B2 (en) * 2008-11-13 2012-04-17 Dcg Systems, Inc. Probe tip to device pad alignment in obscured view probing applications
JP4807890B2 (ja) * 2009-07-13 2011-11-02 ハイメカ株式会社 電子部品の整列装置および整列方法
TWM430614U (en) * 2011-12-21 2012-06-01 Youngtek Electronics Corp Fiber optic light guiding top cover structure
CN112845167B (zh) * 2021-01-05 2024-01-26 常熟市天银机电股份有限公司 电机保护器的动触点弹簧片弹性全自动检测装置
CN114415000B (zh) * 2022-03-29 2022-07-12 深圳市永达电子信息股份有限公司 一种mark点的假压对齐装置及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05196681A (ja) * 1991-06-26 1993-08-06 Digital Equip Corp <Dec> 連続移動する電気回路の相互接続試験方法及び装置
US5842579A (en) * 1995-11-16 1998-12-01 Electro Scientific Industries, Inc. Electrical circuit component handler
CA2174784C (en) * 1996-04-23 1999-07-13 George Guozhen Zhong Automatic multi-probe pwb tester
JPH11271374A (ja) * 1998-03-20 1999-10-08 Anritsu Corp 電子部品検査装置及び方法
JP4803959B2 (ja) * 2002-03-22 2011-10-26 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 試験プローブ整列装置
AU2003249276A1 (en) * 2002-07-16 2004-02-02 Aehr Test Systems Assembly for connecting a test device to an object to be tested
US20060026224A1 (en) * 2004-07-30 2006-02-02 Merkli Patrick P Method and circuit for combined multiplication and division
GB2434211B (en) 2004-11-22 2009-09-23 Electro Scient Ind Inc Method and machine for repetitive testing of an electrical component

Also Published As

Publication number Publication date
TWI429929B (zh) 2014-03-11
TW200931444A (en) 2009-07-16
WO2009023727A2 (en) 2009-02-19
JP2010537169A (ja) 2010-12-02
WO2009023727A3 (en) 2009-04-23
KR101209556B1 (ko) 2012-12-10
KR20100049054A (ko) 2010-05-11
US20090045830A1 (en) 2009-02-19
US7557594B2 (en) 2009-07-07
CN101779135A (zh) 2010-07-14
US20090224789A1 (en) 2009-09-10
US7750653B2 (en) 2010-07-06
CN101779135B (zh) 2013-08-28

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