TWI427002B - Mems類型之噴墨列印頭 - Google Patents
Mems類型之噴墨列印頭 Download PDFInfo
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
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Description
本發明一般係有關於驅動器基板與微電機系統(MEMS,“Micro-eletromechanical System”)薄膜之整合,並且特別是關於這些元件在MEMS類型噴墨列印頭內之整合。
迄今,MEMS噴墨列印頭的製造因所加入元件之故而出現困難。尤其,MEMS噴墨列印頭併入MEMS薄膜裝置及驅動器基板,其等各藉由會對彼此造成損害的製程所構成。
可使用薄膜表面微加工技術來製造傳統的MEMS薄膜裝置。例如,多晶矽層沉積於犧牲矽玻璃層上,並且透過多個蝕刻孔洞而讓蝕刻劑在此等薄膜的下方流動以消解此等犧牲疊層。此蝕刻製程可能會對微電子元件所需鈍化性造成影響,並且在一些情況下,於蝕刻劑釋出之後,須將此等必要孔洞予以氣密地密封,藉此防止裝置故障。該侵犯性化學蝕刻通常是藉由氫氟酸(HF)進行,這對於設計者而言會限制材料的選擇。此外,使用化學蝕刻會如用於MEMS噴墨列印頭之基板驅動器,令MEMS裝置與傳統微電子元件的整合作業複雜化。此外,釋出之裝置難以使用傳統的微電子技術進行處理,因而造成產量損失或受侷限的設計選項。
被設計成CMOS裝置之傳統電路驅動器基板常用以驅動傳導器,並減少輸入/輸出線路。這些可為經氧化矽所鈍化之薄膜的複雜組裝。若此類型之裝置暴露於像是HF的強
蝕刻劑,則可能會無法運作。雖可採取多項步驟以保護這些鈍化層,然其他MEMS製程,尤其是多晶矽沉積及退火處理的高溫製程可能不利地影響到電晶體電路的運作。此問題又會因額外的微電子層複合產能效用而加劇。因此,CMOS及MEMS在整合上面臨挑戰。
第4A及4B圖顯示已知MEMS噴墨列印頭的一些基本特徵,並提供來說明在已知列印頭與示範性實施例者之間的差異。
在MEMS噴墨列印頭的已知多晶矽薄膜設計中中,使用一較龐大、較複雜的結構410於鄰近薄膜420之間使用。這些結構用以嵌封在該薄膜內的氫氟酸蝕刻劑釋出孔430,並且用於薄膜之間的公差調整。在本文所述之示範性實施例中,可形成較薄型、較簡化的液體邊壁,同時在該薄膜結構中並無孔洞。
為形成列印頭裝置,無孔薄膜必須非常微小,並且密度極高。對於每英吋600個噴嘴而言,該列印頭必須具備42.25μm的間距。這無法為各個噴注噴嘴間之疊層的嵌封處理和校準作業留有很大空間。
從而,需要克服先前技藝的此等及其他問題,並且提供一種用於MEMS靜電噴墨列印頭的方法及設備,其中是在將此等晶圓黏合於噴墨列印頭之前,於個別晶圓上製出靜電薄膜及驅動電極中此等。
根據本教示,茲提供一種製造MEMS噴墨類型之列印頭的方法。
該示範性方法可包含:提供驅動器元件;個別地設置可致動薄膜元件,該可致動薄膜元件係在沒有移除犧牲層移除之酸性蝕刻劑的情況下形成;將經個別地設置之可致動薄膜元件黏合於驅動器元件;以及在黏合處理後,將噴嘴平板附著於可致動薄膜元件。
根據本教示,提供一種MEMS類型之噴墨列印頭。該示範性裝置可包含:驅動器元件;以及MEMS元件,由驅動器元件個別製成,該MEMS元件是在沒有移除犧牲層之酸性蝕刻劑的情況下形成。提供將驅動器元件與MEMS元件以操作的方式接合的黏合特徵,並且將一噴嘴平板附著於MEMS元件。
應瞭解前揭一般敘述與後載詳細說明兩者皆僅具示範及解釋性質,而非為限制如所請求專利之本發明。
此等實施例一般屬於MEMS噴墨列印頭。MEMS噴墨列印頭係運用墨水列印的高速度、高密度隨生技術(follow-on technology)。尤其,靜電微電子機械系統(「MEMS」)噴墨列印頭可構成以精確及受控方式打散墨滴。
可使用矽晶圓製造技術來製造靜電MEMS薄膜及驅動電路,並且是在整合成該列印頭之前先個別地製造。此等示範性結構及方法包含將MEMS元件整合於像是CMOS驅動器的傳統微電子元件。
第1A圖顯示根據一實施例之MEMS噴墨列印頭100的示範性爆出視圖。第1B圖顯示第1A圖之MEMS噴墨列印頭的組裝視圖。熟於本技藝人士應容易暸解第1A及1B
圖中所示之MEMS噴墨列印頭100代表廣義性的示意圖示,並且可增置其他元件或者可移除或修改現有元件。
第1A及1B圖中所顯示的MEMS噴墨列印頭100包含驅動器元件110、液體薄膜元件112及噴嘴平板114。此等元件各者可含有進一步的子元件,如本文所將說明者。
基本上,此等示範性實施例的MEMS噴墨列印頭100可為個別製造的驅動器元件110及薄膜元件112所界定,其中此等元件係在其個別製造作業之後接合。完成的MEMS噴墨列印頭含有噴嘴平板114,透過該噴嘴平板114以噴散像是墨水等的液體。
如第1A及1B圖所示,驅動器元件110含有晶圓基板116、位於基板上的CMOS層118、形成形成於CMOS表面118上的鈍化介電120、薄膜電極122、接地電位電極123以及形成形成於鈍化介電上的黏合特徵124。
薄膜元件112包含例如一SOI晶圓,此者具有一矽晶圓基板126、一形成於基板126之表面上的氧化物層128,以及一形成於氧化物層128之上的裝置(薄膜)層130。此外,可在裝置層130上將此等黏合特徵132、134圖案化,藉以黏合於驅動器元件110的相對應黏合特徵124。如所述,薄膜元件的黏合特徵132、134可為構成於裝置層130中一面朝驅動器元件110之黏合特徵124的表面上。
須知噴嘴平板114可如業界已知者所構成,藉以回應驅動器元件110對薄膜元件112的啟動而噴散液滴。特別是,噴嘴平板114可具有複數個孔115,此等孔115形成於其內以自該噴墨列印頭100噴散液體。
現討論自所完成列印頭100內之噴嘴平板114的液體噴散,可自等孔115,將像是墨水(未圖示)的液體此等注入到噴嘴平板114內。當將驅動信號施加於微電機系統(MEMS)薄膜130時,其會朝向薄膜電極122移動,減少墨水腔室內上方處的壓力,並且將墨水拉引至腔室內。當驅動信號關閉或降低時,MEMS薄膜130回返至其原始位置,增加該腔室內上方處的壓力,並經由噴嘴平板114內的孔115注出墨水。
該驅動器元件110如第2A圖至第2E圖例示方式製造。雖已說明一系列製造步驟,然須知可根據製造參數,增入或移除各個步驟。此外,雖特別就有關CMOS裝置驅動器晶圓者說明驅動器元件110,然其並非意圖限制此等示範性實施例。從而,亦可在普通裸光矽或玻璃基板上構成驅動器元件110。
如第2A圖所示,提供矽基板晶圓216作為對於驅動器元件110的起始材料。在第2B圖中,CMOS層218形成於矽基板晶圓216的表面上。如此技藝所周知,CMOS層218之沉積可包含多項掩模及疊層如。在第2C圖中,鈍化介電層220形成於CMOS層218上。一般說來,鈍化層220可由二氧化矽所構成;然而,這可根據製造要件而改變。其他可作為鈍化層220的材料包含氮化矽、具微量氮的二氧化矽以及鉿基高k值介電質。
如第2D圖所示,電極222可形成於鈍化層220上。電極222形成薄膜元件112之電容性薄膜(第1A圖及第1B圖的130)的相對電極,並且可凹入而低於黏合特徵224,此
等特徵224透過此等電極222形成。須須 暸解該詞彙「一」薄膜電極可指一電極圖案。例如,接地電位電極223可透過此等電極222定位,藉以對應或校準薄膜元件112的特徵,如將說明。須知此等電極222可為摻質多晶矽或任何其他導體。例如,此等電極222可為鋁、銅、ITO等等,並且須與基底晶圓處理相容。以前,公認使用這些類型的電極不可能,原因在於實際上所有的反應金屬都會在氫氟酸中溶解。然而,由於此等示範性實施例可免於使用氫氟酸蝕刻處理並可併入所述金屬,因此可預期能夠將金屬電極222直接施用在像是CMOS驅動器陣列之微電子電路的上表面。熟諳本技藝人士須知,適當多層式聚合物及金屬製程可運用於此等示範性實施例。
參照第2E圖,黏合特徵224可形成於鈍化介電的表面上。此等電極222可凹入而低於特徵224,藉以在該驅動器元件110的鈍化介電220與該薄膜元件112之間界界定一間隙高度。
黏合特徵224可為在該電極層222之前或之後所施加的圖案化玻璃特徵。須知,可根據製程限制及裝置設計以改變製程。
驅動器元件110亦可含有經機械拋光的平面氧化物或表面,藉以提供一平坦、均勻的基板表面。該機械拋光可如業界所周知,例如為一化學機械拋光(CMP)。通常,可在當驅動器元件110於其上含有氧化物時形成平面氧化物表面。由於驅動器元件110可由薄膜元件112個別製成,因此可嚴密控制氧化物沉積,並可獲致且維持精確厚度。
現參照第3A圖至第3D圖,其顯示薄膜元件112之示範性製造。第3A圖顯示SOI晶圓,並且其包含有矽基板326、氧化物層328及裝置層330,同時根據業界周知之方式組裝。該裝置層330可為厚約2μm的矽裝置。該匹配氧化物層328可圖案化以形成一用於晶圓的納入氧化物膜332,藉以晶圓黏合於裝置層328之一表面上,該表面面朝驅動器元件110之黏合特徵224。亦可使用此匹配氧化物層以在該薄膜328上形成氧化物凹窩,其可另外不藉由傳統沉積方法形成。作為替代方式,該凹窩可直接地形成於第2D、2E圖中的電極222上。
該裝置層330可例如為SOI晶圓的作用層。雖然厚度對暸解本發明實施例而言並非關鍵,然通常使用厚約2μm的作用層。
須知所述結構並不限於SOI晶圓材料,並且進一步可與多晶矽薄膜技術相容。對於多晶矽薄膜技術來說,使用空白矽晶圓以作為基底。沉積適當的氧化物,然後塗佈2μm(或所欲厚度)的多晶矽。可將圖案化處理及其他沉積作業合用於相關於SOI所述者。
一旦備製裝置層以供黏合,即可視需要進行圖案化,此乃因為其仍維持露出。此為先前無法實現的優點。事實上,藉由個別製造驅動器元件110及薄膜元件112之每一者,並且藉由像是氫氟酸之危險材料來消除蝕刻處理,可將許多製造步驟重新排組,俾適合特定設計或晶圓代工製程。
如於第3C圖中所示,可藉由對該矽處理層326進行後
研磨及/或拋光處理而達所欲厚度以界定薄膜元件112的厚度。可在一或更多的步驟中交替地或循序地進行研磨及/或拋光處理。藉由範例,可將一矽處理層326研磨及/或拋光至一約80μm的厚度。
如第3D圖中所示,可對該矽處理層326及該覆蓋氧化物層328進行一深度蝕刻以供露出該薄膜層330。該深度蝕刻造成可形成液體腔室336,以及環繞此等液體腔室336的液體邊壁338。
對於較深處的液體腔室層,可在晶圓黏合之前先進行研磨、拋光及腔室蝕刻處理。對於極薄的液體腔室層,或是結構會因其大小而變得脆弱的情況,可在研磨、拋光及蝕刻處理之後黏合該驅動器元件110及該薄膜元件112。須知,由於驅動器元件110及薄膜元件112之每一者個別製造,因此製造次序並無決定性,可具有彈性。
可接續其個別製造,藉由周知的晶圓對晶圓黏合技術將驅動器元件110與薄膜元件112黏合。在此等示範性實施例中,驅動器元件110的黏合特徵224熔融黏合於薄膜元件112的黏合特徵332。晶圓對晶圓黏合處理對於將晶圓接合係非常正確的方法。玻璃熔融黏合極為強力、密封且正確。無需增入額外材料,亦無需在黏合區域中進行任何擠壓。此類型的黏合特別地適用於示範性實施例,因為其可使用在晶圓上已發現的材料,並且自然地配合於製程中。另外,目前在半導體業界係由現有的設備供應商支援所使用的製程及材料。
可接受對於玻璃熔融黏合的多項替代方式並予運用於
此等示範性實施例,而這些包含金質熔融黏合、焊燒黏合、黏劑黏合等。
完成的列印頭100含有噴嘴平板114,其放置於薄膜元件112之露出表面上,如第1A圖及第1B圖所示。通常,噴嘴平板114施用於組裝之驅動器基板元件110及液體薄膜元件112,而其等可事先藉由前述玻璃熔融所黏合。作為一選項,可在其中,當將個別晶粒封裝至一列印頭陣列內之處,施用噴嘴平板114。此選項架構性,並且不被本文所述晶圓處理的選擇所限制。
熟於本技藝人士須知可將該侵犯性濕式氫氟酸蝕刻自本文所述之示範性方法中消除,如此可提供若非如此將會無法作出的疊層組合。例如,當運用濕式氫氟酸蝕刻時,氮化物膜會需在氧化物之下受到保護,藉以防止負面移除。在這些類型的薄膜裝置中,可在操作過程中產生高電場。這些氮化物膜可累構電荷而改變電場與所獲力度,因此比不上一理想材料。藉由消除濕式酸性蝕刻,製造商的可獲用選項變得更為多元。僅藉由範例,現可運用熱性氧化物或其他高品質介電物,改善該MEMS類型之噴墨列印頭的效能,而無在製造過程中對元件材料造成損壞的風險。
100‧‧‧MEMS噴墨列印頭
110‧‧‧驅動器元件
112‧‧‧液體薄膜元件
114‧‧‧噴嘴平板
115‧‧‧孔
116‧‧‧晶圓基板
118‧‧‧CMOS層
120‧‧‧鈍化介電
122‧‧‧薄膜電極
123‧‧‧接地電位電極
124‧‧‧黏合特徵
126‧‧‧矽晶圓基板
128‧‧‧氧化物層
130‧‧‧裝置(薄膜)層
132‧‧‧黏合特徵
134‧‧‧黏合特徵
216‧‧‧矽基板晶圓
218‧‧‧CMOS層
220‧‧‧鈍化介電層
222‧‧‧電極
223‧‧‧接地電位電極
224‧‧‧黏合特徵
326‧‧‧矽基板
326‧‧‧矽處理層
328‧‧‧氧化物層
330‧‧‧裝置層
332‧‧‧納入氧化物膜
332‧‧‧黏合特徵
336‧‧‧液體腔室
338‧‧‧液體邊壁
410‧‧‧結構
420‧‧‧鄰近薄膜
430‧‧‧氫氟酸蝕刻劑釋出孔
併入本說明書內,構成其一部分並顯示若干本發明實施例之附圖,連同該說明一起用以解釋本發明原理。
第1A圖顯示根據本教示之實施例的列印頭組裝示範性元件爆出視圖;第1B圖顯示根據本教示之實施例的經組裝列印頭;
第2A圖至第2E圖顯示根據本教示之實施例的驅動器元件組裝製程;第3A圖至第3D圖顯示根據本教示之實施例的液體薄膜元件組裝製程;以及第4A圖係一已知列印頭結構的爆出視圖,並且第4B圖為該結構的組裝視圖。
100‧‧‧MEMS噴墨列印頭
114‧‧‧噴嘴平板
115‧‧‧孔
116‧‧‧晶圓基板
118‧‧‧CMOS層
120‧‧‧鈍化介電
122‧‧‧薄膜電極
123‧‧‧接地電位電極
124‧‧‧黏合特徵
126‧‧‧矽晶圓基板
128‧‧‧氧化物層
130‧‧‧裝置(薄膜)層
132‧‧‧黏合特徵
134‧‧‧黏合特徵
Claims (5)
- 一種MEMS類型之噴墨列印頭,包括:驅動器元件,其包含至少一金屬電極,於其上形成有一鈍化介電層、一由該鈍化介電層所覆蓋的CMOS層、及一薄膜電極,一驅動電路形成在該CMOS層上,該鈍化介電層被設置在該CMOS層與該薄膜電極之間,而在該CMOS層上形成有該驅動電路的;薄膜元件,其係由該驅動器元件個別製成,該薄膜元件包含無釋出孔啟動的流體薄膜;黏合特徵,其將該驅動器元件及該薄膜元件以操作的方式接合;以及噴嘴平板,其附著於該薄膜元件,其中該鈍化介電層覆蓋該CMOS層而該驅動電路即形成在CMOS層上,以致位在該薄膜元件下方的該鈍化介電層,在其一位置處不會暴露其下的CMOS層,及薄膜電極被設置在充分鄰近無釋出孔啟動的流體薄膜,以致回應一驅動信號而提供無釋出孔啟動的流體薄膜的位移。
- 如申請專利範圍第1項之MEMS類型之噴墨列印頭,其中該薄膜元件是在沒有用於移除犧牲層之酸性蝕刻劑的情況下形成。
- 如申請專利範圍第1項之MEMS類型之噴墨列印頭,其中該無釋出孔的流體薄膜包括矽。
- 如申請專利範圍第1項之MEMS類型之噴墨列印頭,其中該等黏合特徵包括玻璃。
- 如申請專利範圍第1項之MEMS類型之噴墨列印頭,其中該驅動器元件係藉由微電子方法製造,該至少一金屬電極包含鋁、銅及銦錫氧化物(ITO)之任一者,且該至少一金屬電極係在沒有酸蝕刻劑的情況下形成。
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8328331B2 (en) * | 2010-03-19 | 2012-12-11 | Xerox Corporation | Ink jet print head plate |
US8789932B2 (en) * | 2010-05-27 | 2014-07-29 | Hewlett-Packard Development Company, L.P. | Printhead and related methods and systems |
US8567913B2 (en) * | 2010-06-02 | 2013-10-29 | Xerox Corporation | Multiple priming holes for improved freeze/thaw cycling of MEMSjet printing devices |
WO2012036103A1 (en) * | 2010-09-15 | 2012-03-22 | Ricoh Company, Ltd. | Electromechanical transducing device and manufacturing method thereof, and liquid droplet discharging head and liquid droplet discharging apparatus |
US9096062B2 (en) * | 2011-08-01 | 2015-08-04 | Xerox Corporation | Manufacturing process for an ink jet printhead including a coverlay |
US9421772B2 (en) | 2014-12-05 | 2016-08-23 | Xerox Corporation | Method of manufacturing ink jet printheads including electrostatic actuators |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6312108B1 (en) * | 1998-08-07 | 2001-11-06 | Ricoh Company, Ltd. | Ink-jet head |
EP1748500A2 (en) * | 2005-07-25 | 2007-01-31 | Fuji Xerox Co., Ltd. | Piezoelectric element, droplet-ejecting head, and droplet-ejecting apparatus |
TW200709946A (en) * | 2005-06-16 | 2007-03-16 | Canon Kk | Liquid discharge head and recording device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10157104A (ja) * | 1996-11-28 | 1998-06-16 | Tec Corp | インクジェットプリンタヘッド |
US6648453B2 (en) * | 1997-07-15 | 2003-11-18 | Silverbrook Research Pty Ltd | Ink jet printhead chip with predetermined micro-electromechanical systems height |
JP2001072073A (ja) | 1999-08-31 | 2001-03-21 | Yoshino Kogyosho Co Ltd | 計量具 |
JP3796394B2 (ja) * | 2000-06-21 | 2006-07-12 | キヤノン株式会社 | 圧電素子の製造方法および液体噴射記録ヘッドの製造方法 |
JP2002052705A (ja) | 2000-08-04 | 2002-02-19 | Ricoh Co Ltd | インクジェットヘッド、インクジェットヘッドの製造方法および当該ヘッドを用いた画像形成装置 |
US6568794B2 (en) * | 2000-08-30 | 2003-05-27 | Ricoh Company, Ltd. | Ink-jet head, method of producing the same, and ink-jet printing system including the same |
JP3963341B2 (ja) | 2000-08-30 | 2007-08-22 | 株式会社リコー | 液滴吐出ヘッド |
JP4039799B2 (ja) | 2000-11-06 | 2008-01-30 | 株式会社リコー | 液滴吐出ヘッド、画像形成装置及び液滴を吐出する装置 |
JP4070175B2 (ja) | 2000-09-29 | 2008-04-02 | 株式会社リコー | 液滴吐出ヘッド、インクジェット記録装置、画像形成装置、液滴を吐出する装置 |
JP4088817B2 (ja) * | 2001-02-09 | 2008-05-21 | セイコーエプソン株式会社 | 圧電体薄膜素子の製造方法、これを用いたインクジェットヘッド |
US6705708B2 (en) * | 2001-02-09 | 2004-03-16 | Seiko Espon Corporation | Piezoelectric thin-film element, ink-jet head using the same, and method for manufacture thereof |
JP3828116B2 (ja) * | 2003-01-31 | 2006-10-04 | キヤノン株式会社 | 圧電体素子 |
JP3479530B2 (ja) * | 2003-05-14 | 2003-12-15 | ブラザー工業株式会社 | インクジェットヘッドの形成方法 |
KR101137643B1 (ko) * | 2003-10-10 | 2012-04-19 | 후지필름 디마틱스, 인크. | 박막을 구비한 프린트 헤드 |
ATE502893T1 (de) * | 2004-10-21 | 2011-04-15 | Fujifilm Dimatix Inc | Ätzverfahren mit verwendung eines opfersubstrats |
JP4654458B2 (ja) * | 2004-12-24 | 2011-03-23 | リコープリンティングシステムズ株式会社 | シリコン部材の陽極接合法及びこれを用いたインクジェットヘッド製造方法並びにインクジェットヘッド及びこれを用いたインクジェット記録装置 |
JP4259509B2 (ja) * | 2004-12-27 | 2009-04-30 | セイコーエプソン株式会社 | 静電アクチュエータ、液滴吐出ヘッド、液滴吐出装置及び静電デバイス並びにそれらの製造方法 |
JP2006187934A (ja) | 2005-01-06 | 2006-07-20 | Seiko Epson Corp | 静電アクチュエータ及びその製造方法、液滴吐出ヘッド及びその製造方法、液滴吐出装置並びにデバイス |
US7993969B2 (en) * | 2006-08-10 | 2011-08-09 | Infineon Technologies Ag | Method for producing a module with components stacked one above another |
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2008
- 2008-02-27 EP EP08151995.1A patent/EP1974922B1/en not_active Ceased
- 2008-03-24 JP JP2008075885A patent/JP5356706B2/ja not_active Expired - Fee Related
- 2008-03-28 KR KR1020080028749A patent/KR101497996B1/ko active IP Right Grant
- 2008-03-28 TW TW097111259A patent/TWI427002B/zh not_active IP Right Cessation
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2013
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6312108B1 (en) * | 1998-08-07 | 2001-11-06 | Ricoh Company, Ltd. | Ink-jet head |
TW200709946A (en) * | 2005-06-16 | 2007-03-16 | Canon Kk | Liquid discharge head and recording device |
EP1748500A2 (en) * | 2005-07-25 | 2007-01-31 | Fuji Xerox Co., Ltd. | Piezoelectric element, droplet-ejecting head, and droplet-ejecting apparatus |
Also Published As
Publication number | Publication date |
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TW200906634A (en) | 2009-02-16 |
EP1974922B1 (en) | 2013-05-15 |
KR20080088484A (ko) | 2008-10-02 |
US20130241999A1 (en) | 2013-09-19 |
JP5356706B2 (ja) | 2013-12-04 |
JP2008247031A (ja) | 2008-10-16 |
US20080238997A1 (en) | 2008-10-02 |
US8455271B2 (en) | 2013-06-04 |
US8828750B2 (en) | 2014-09-09 |
KR101497996B1 (ko) | 2015-03-03 |
EP1974922A1 (en) | 2008-10-01 |
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