JP2008247031A - 高密度プリントヘッドのためのリリースフリー薄膜製造法を用いた高度集積ウェハ結合memsデバイス - Google Patents
高密度プリントヘッドのためのリリースフリー薄膜製造法を用いた高度集積ウェハ結合memsデバイス Download PDFInfo
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- JP2008247031A JP2008247031A JP2008075885A JP2008075885A JP2008247031A JP 2008247031 A JP2008247031 A JP 2008247031A JP 2008075885 A JP2008075885 A JP 2008075885A JP 2008075885 A JP2008075885 A JP 2008075885A JP 2008247031 A JP2008247031 A JP 2008247031A
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- 238000000034 method Methods 0.000 title claims description 31
- 239000012528 membrane Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title description 11
- 239000012530 fluid Substances 0.000 claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 238000004377 microelectronic Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 238000005304 joining Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 24
- 238000007641 inkjet printing Methods 0.000 abstract 3
- 239000010409 thin film Substances 0.000 description 53
- 230000008569 process Effects 0.000 description 19
- 239000000758 substrate Substances 0.000 description 17
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 238000002161 passivation Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000000156 glass melt Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000032368 Device malfunction Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
- B41J2/23—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
- B41J2/235—Print head assemblies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micromachines (AREA)
Abstract
【解決手段】ドライバコンポーネント110と、ドライバコンポーネント110とは別個に製造され、開口のない流体薄膜を含んだMEMSコンポーネント112と、ドライバコンポーネント110およびMEMSコンポーネント112を作動的に接合する結合フィーチャ332と、MEMSコンポーネント112に取り付けられたノズルプレート114を備えるMEMS型インクジェットプリントヘッドである。
【選択図】図1A
Description
Claims (5)
- ドライバコンポーネントと、
該ドライバコンポーネントとは別個に製造され、開口のない流体薄膜を含んだMEMSコンポーネントと、
該ドライバコンポーネントおよび該MEMSコンポーネントを作動的に接合する結合フィーチャと、
該MEMSコンポーネントに取り付けられたノズルプレートを備えることを特徴とするMEMS型インクジェットプリントヘッド。 - 請求項1に記載のデバイスであって、前記MEMSコンポーネントが、犠牲層を除去する酸性エッチングを用いずに形成されることを特徴とするデバイス。
- 請求項1に記載のデバイスであって、前記開口のない流体薄膜がシリコンを含むことを特徴とするデバイス。
- 請求項1に記載のデバイスであって、前記結合フィーチャがガラスを含むことを特徴とするデバイス。
- 請求項1に記載のデバイスであって、前記ドライバコンポーネントがマイクロ電子的方法を用いて製造されることを特徴とするデバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/693,209 US8455271B2 (en) | 2007-03-29 | 2007-03-29 | Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads |
US11/693,209 | 2007-03-29 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008247031A true JP2008247031A (ja) | 2008-10-16 |
JP2008247031A5 JP2008247031A5 (ja) | 2011-05-06 |
JP5356706B2 JP5356706B2 (ja) | 2013-12-04 |
Family
ID=39534843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008075885A Expired - Fee Related JP5356706B2 (ja) | 2007-03-29 | 2008-03-24 | 高密度プリントヘッドのためのリリースフリー薄膜製造法を用いた高度集積ウェハ結合memsデバイス |
Country Status (5)
Country | Link |
---|---|
US (2) | US8455271B2 (ja) |
EP (1) | EP1974922B1 (ja) |
JP (1) | JP5356706B2 (ja) |
KR (1) | KR101497996B1 (ja) |
TW (1) | TWI427002B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8328331B2 (en) * | 2010-03-19 | 2012-12-11 | Xerox Corporation | Ink jet print head plate |
EP2576225B1 (en) * | 2010-05-27 | 2020-01-15 | Hewlett-Packard Development Company, L.P. | Printhead and related methods and systems |
US8567913B2 (en) * | 2010-06-02 | 2013-10-29 | Xerox Corporation | Multiple priming holes for improved freeze/thaw cycling of MEMSjet printing devices |
EP2617076B1 (en) * | 2010-09-15 | 2014-12-10 | Ricoh Company, Limited | Electromechanical transducing device and manufacturing method thereof |
US9096062B2 (en) * | 2011-08-01 | 2015-08-04 | Xerox Corporation | Manufacturing process for an ink jet printhead including a coverlay |
US9421772B2 (en) | 2014-12-05 | 2016-08-23 | Xerox Corporation | Method of manufacturing ink jet printheads including electrostatic actuators |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10157104A (ja) * | 1996-11-28 | 1998-06-16 | Tec Corp | インクジェットプリンタヘッド |
JP2000052544A (ja) * | 1998-08-07 | 2000-02-22 | Ricoh Co Ltd | インクジェットヘッド |
JP2002009358A (ja) * | 2000-06-21 | 2002-01-11 | Canon Inc | 圧電素子構造および液体噴射記録ヘッドとその製造方法 |
JP2002067313A (ja) * | 2000-08-30 | 2002-03-05 | Ricoh Co Ltd | 液滴吐出ヘッド |
JP2002314163A (ja) * | 2001-02-09 | 2002-10-25 | Seiko Epson Corp | 圧電体薄膜素子の製造方法、これを用いたインクジェットヘッド |
JP3479530B2 (ja) * | 2003-05-14 | 2003-12-15 | ブラザー工業株式会社 | インクジェットヘッドの形成方法 |
WO2005037558A2 (en) * | 2003-10-10 | 2005-04-28 | Dimatix, Inc. | Print head with thin membrane |
WO2006047326A1 (en) * | 2004-10-21 | 2006-05-04 | Fujifilm Dimatix, Inc. | Sacrificial substrate for etching |
JP2006175765A (ja) * | 2004-12-24 | 2006-07-06 | Ricoh Printing Systems Ltd | シリコン部材の陽極接合法及びこれを用いたインクジェットヘッド製造方法並びにインクジェットヘッド及びこれを用いたインクジェット記録装置 |
JP2007035801A (ja) * | 2005-07-25 | 2007-02-08 | Fuji Xerox Co Ltd | 圧電素子、液滴吐出ヘッド及び液滴吐出装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US6648453B2 (en) * | 1997-07-15 | 2003-11-18 | Silverbrook Research Pty Ltd | Ink jet printhead chip with predetermined micro-electromechanical systems height |
JP2001072073A (ja) | 1999-08-31 | 2001-03-21 | Yoshino Kogyosho Co Ltd | 計量具 |
JP2002052705A (ja) | 2000-08-04 | 2002-02-19 | Ricoh Co Ltd | インクジェットヘッド、インクジェットヘッドの製造方法および当該ヘッドを用いた画像形成装置 |
JP4070175B2 (ja) | 2000-09-29 | 2008-04-02 | 株式会社リコー | 液滴吐出ヘッド、インクジェット記録装置、画像形成装置、液滴を吐出する装置 |
JP4039799B2 (ja) | 2000-11-06 | 2008-01-30 | 株式会社リコー | 液滴吐出ヘッド、画像形成装置及び液滴を吐出する装置 |
US6568794B2 (en) * | 2000-08-30 | 2003-05-27 | Ricoh Company, Ltd. | Ink-jet head, method of producing the same, and ink-jet printing system including the same |
US6705708B2 (en) * | 2001-02-09 | 2004-03-16 | Seiko Espon Corporation | Piezoelectric thin-film element, ink-jet head using the same, and method for manufacture thereof |
JP3828116B2 (ja) * | 2003-01-31 | 2006-10-04 | キヤノン株式会社 | 圧電体素子 |
JP4259509B2 (ja) * | 2004-12-27 | 2009-04-30 | セイコーエプソン株式会社 | 静電アクチュエータ、液滴吐出ヘッド、液滴吐出装置及び静電デバイス並びにそれらの製造方法 |
JP2006187934A (ja) | 2005-01-06 | 2006-07-20 | Seiko Epson Corp | 静電アクチュエータ及びその製造方法、液滴吐出ヘッド及びその製造方法、液滴吐出装置並びにデバイス |
US7625073B2 (en) | 2005-06-16 | 2009-12-01 | Canon Kabushiki Kaisha | Liquid discharge head and recording device |
US7993969B2 (en) * | 2006-08-10 | 2011-08-09 | Infineon Technologies Ag | Method for producing a module with components stacked one above another |
-
2007
- 2007-03-29 US US11/693,209 patent/US8455271B2/en not_active Expired - Fee Related
-
2008
- 2008-02-27 EP EP08151995.1A patent/EP1974922B1/en not_active Expired - Fee Related
- 2008-03-24 JP JP2008075885A patent/JP5356706B2/ja not_active Expired - Fee Related
- 2008-03-28 TW TW097111259A patent/TWI427002B/zh not_active IP Right Cessation
- 2008-03-28 KR KR1020080028749A patent/KR101497996B1/ko active IP Right Grant
-
2013
- 2013-05-01 US US13/875,262 patent/US8828750B2/en not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10157104A (ja) * | 1996-11-28 | 1998-06-16 | Tec Corp | インクジェットプリンタヘッド |
JP2000052544A (ja) * | 1998-08-07 | 2000-02-22 | Ricoh Co Ltd | インクジェットヘッド |
JP2002009358A (ja) * | 2000-06-21 | 2002-01-11 | Canon Inc | 圧電素子構造および液体噴射記録ヘッドとその製造方法 |
JP2002067313A (ja) * | 2000-08-30 | 2002-03-05 | Ricoh Co Ltd | 液滴吐出ヘッド |
JP2002314163A (ja) * | 2001-02-09 | 2002-10-25 | Seiko Epson Corp | 圧電体薄膜素子の製造方法、これを用いたインクジェットヘッド |
JP3479530B2 (ja) * | 2003-05-14 | 2003-12-15 | ブラザー工業株式会社 | インクジェットヘッドの形成方法 |
WO2005037558A2 (en) * | 2003-10-10 | 2005-04-28 | Dimatix, Inc. | Print head with thin membrane |
WO2006047326A1 (en) * | 2004-10-21 | 2006-05-04 | Fujifilm Dimatix, Inc. | Sacrificial substrate for etching |
JP2006175765A (ja) * | 2004-12-24 | 2006-07-06 | Ricoh Printing Systems Ltd | シリコン部材の陽極接合法及びこれを用いたインクジェットヘッド製造方法並びにインクジェットヘッド及びこれを用いたインクジェット記録装置 |
JP2007035801A (ja) * | 2005-07-25 | 2007-02-08 | Fuji Xerox Co Ltd | 圧電素子、液滴吐出ヘッド及び液滴吐出装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI427002B (zh) | 2014-02-21 |
JP5356706B2 (ja) | 2013-12-04 |
EP1974922B1 (en) | 2013-05-15 |
EP1974922A1 (en) | 2008-10-01 |
US8828750B2 (en) | 2014-09-09 |
TW200906634A (en) | 2009-02-16 |
KR101497996B1 (ko) | 2015-03-03 |
US20080238997A1 (en) | 2008-10-02 |
US8455271B2 (en) | 2013-06-04 |
KR20080088484A (ko) | 2008-10-02 |
US20130241999A1 (en) | 2013-09-19 |
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