TWI421143B - The workpiece holder is placed in the fixing table and the workpiece is placed with a fixing glass holder - Google Patents

The workpiece holder is placed in the fixing table and the workpiece is placed with a fixing glass holder Download PDF

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Publication number
TWI421143B
TWI421143B TW100132142A TW100132142A TWI421143B TW I421143 B TWI421143 B TW I421143B TW 100132142 A TW100132142 A TW 100132142A TW 100132142 A TW100132142 A TW 100132142A TW I421143 B TWI421143 B TW I421143B
Authority
TW
Taiwan
Prior art keywords
workpiece
glass
suction groove
suction
groove
Prior art date
Application number
TW100132142A
Other languages
English (en)
Chinese (zh)
Other versions
TW201244865A (en
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201244865A publication Critical patent/TW201244865A/zh
Application granted granted Critical
Publication of TWI421143B publication Critical patent/TWI421143B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW100132142A 2011-01-25 2011-09-06 The workpiece holder is placed in the fixing table and the workpiece is placed with a fixing glass holder TWI421143B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011013022A JP5240301B2 (ja) 2011-01-25 2011-01-25 被加工物載置固定用テーブルおよび被加工物載置固定用ガラスチャック

Publications (2)

Publication Number Publication Date
TW201244865A TW201244865A (en) 2012-11-16
TWI421143B true TWI421143B (zh) 2014-01-01

Family

ID=46519505

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100132142A TWI421143B (zh) 2011-01-25 2011-09-06 The workpiece holder is placed in the fixing table and the workpiece is placed with a fixing glass holder

Country Status (4)

Country Link
JP (1) JP5240301B2 (ko)
KR (1) KR101326398B1 (ko)
CN (1) CN102601530B (ko)
TW (1) TWI421143B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3046370B1 (fr) * 2015-12-31 2018-02-16 Ecole Centrale De Nantes Procede et systeme pour le reglage d'un dispositif de fabrication additive
CN111148596B (zh) 2017-10-04 2022-09-16 极光先进雷射株式会社 激光加工方法以及激光加工系统
CN109434519B (zh) * 2018-12-24 2024-08-02 天津职业技术师范大学 真空永磁板
KR20220132708A (ko) * 2021-03-23 2022-10-04 삼성디스플레이 주식회사 레이저 가공용 워크 테이블
CN114799689B (zh) * 2022-04-29 2023-02-14 中国科学院西安光学精密机械研究所 一种激光加工用微球吸附定位装置及方法
CN115193823B (zh) * 2022-07-20 2024-04-12 武汉来勒光电科技有限公司 一种激光器的耦合封装设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034102U (ko) * 1989-06-02 1991-01-16
JPH06326337A (ja) * 1993-04-16 1994-11-25 Mitsubishi Heavy Ind Ltd レーザ加工装置
TW200618088A (en) * 2004-10-05 2006-06-01 Matsushita Electric Ind Co Ltd Method for dividing semiconductor wafer and manufacturing method for semiconductor devices

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3004102U (ja) * 1994-03-15 1994-11-08 栄治 下永 平板加工用ベッド
JP3908519B2 (ja) * 2001-11-28 2007-04-25 トッパン・フォームズ株式会社 レーザ加工システム
JP4342992B2 (ja) * 2004-03-17 2009-10-14 株式会社ディスコ レーザー加工装置のチャックテーブル
JP2006205187A (ja) * 2005-01-26 2006-08-10 Disco Abrasive Syst Ltd レーザー加工装置
JP2006263795A (ja) * 2005-03-25 2006-10-05 Disco Abrasive Syst Ltd レーザ加工装置
JP2007307597A (ja) * 2006-05-19 2007-11-29 Disco Abrasive Syst Ltd レーザー加工装置
JP5198203B2 (ja) * 2008-09-30 2013-05-15 株式会社ディスコ 加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034102U (ko) * 1989-06-02 1991-01-16
JPH06326337A (ja) * 1993-04-16 1994-11-25 Mitsubishi Heavy Ind Ltd レーザ加工装置
TW200618088A (en) * 2004-10-05 2006-06-01 Matsushita Electric Ind Co Ltd Method for dividing semiconductor wafer and manufacturing method for semiconductor devices

Also Published As

Publication number Publication date
KR101326398B1 (ko) 2013-11-11
KR20120086242A (ko) 2012-08-02
JP5240301B2 (ja) 2013-07-17
TW201244865A (en) 2012-11-16
CN102601530B (zh) 2015-08-19
JP2012152774A (ja) 2012-08-16
CN102601530A (zh) 2012-07-25

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