TWI420649B - 半導體裝置及控制其操作之方法 - Google Patents
半導體裝置及控制其操作之方法 Download PDFInfo
- Publication number
- TWI420649B TWI420649B TW094146638A TW94146638A TWI420649B TW I420649 B TWI420649 B TW I420649B TW 094146638 A TW094146638 A TW 094146638A TW 94146638 A TW94146638 A TW 94146638A TW I420649 B TWI420649 B TW I420649B
- Authority
- TW
- Taiwan
- Prior art keywords
- reverse gate
- inversion layer
- bit line
- semiconductor substrate
- voltage
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 109
- 238000000034 method Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims description 56
- 239000000872 buffer Substances 0.000 claims description 25
- 230000005641 tunneling Effects 0.000 claims description 14
- 230000000694 effects Effects 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 description 11
- 230000005684 electric field Effects 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000002784 hot electron Substances 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000284 extract Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 210000003423 ankle Anatomy 0.000 description 1
- 239000006285 cell suspension Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0491—Virtual ground arrays
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Dram (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/019645 WO2006070473A1 (ja) | 2004-12-28 | 2004-12-28 | 半導体装置及びその動作制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200636974A TW200636974A (en) | 2006-10-16 |
TWI420649B true TWI420649B (zh) | 2013-12-21 |
Family
ID=36614600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094146638A TWI420649B (zh) | 2004-12-28 | 2005-12-27 | 半導體裝置及控制其操作之方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7321511B2 (ja) |
EP (1) | EP1833091A4 (ja) |
JP (1) | JP5392985B2 (ja) |
CN (1) | CN101091252B (ja) |
TW (1) | TWI420649B (ja) |
WO (1) | WO2006070473A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8448102B2 (en) | 2006-03-09 | 2013-05-21 | Tela Innovations, Inc. | Optimizing layout of irregular structures in regular layout context |
US7763534B2 (en) | 2007-10-26 | 2010-07-27 | Tela Innovations, Inc. | Methods, structures and designs for self-aligning local interconnects used in integrated circuits |
US8658542B2 (en) | 2006-03-09 | 2014-02-25 | Tela Innovations, Inc. | Coarse grid design methods and structures |
US8653857B2 (en) | 2006-03-09 | 2014-02-18 | Tela Innovations, Inc. | Circuitry and layouts for XOR and XNOR logic |
US9563733B2 (en) | 2009-05-06 | 2017-02-07 | Tela Innovations, Inc. | Cell circuit and layout with linear finfet structures |
US9009641B2 (en) | 2006-03-09 | 2015-04-14 | Tela Innovations, Inc. | Circuits with linear finfet structures |
US9230910B2 (en) | 2006-03-09 | 2016-01-05 | Tela Innovations, Inc. | Oversized contacts and vias in layout defined by linearly constrained topology |
US9035359B2 (en) | 2006-03-09 | 2015-05-19 | Tela Innovations, Inc. | Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods |
US8541879B2 (en) | 2007-12-13 | 2013-09-24 | Tela Innovations, Inc. | Super-self-aligned contacts and method for making the same |
US7956421B2 (en) | 2008-03-13 | 2011-06-07 | Tela Innovations, Inc. | Cross-coupled transistor layouts in restricted gate level layout architecture |
US7446352B2 (en) | 2006-03-09 | 2008-11-04 | Tela Innovations, Inc. | Dynamic array architecture |
US8839175B2 (en) | 2006-03-09 | 2014-09-16 | Tela Innovations, Inc. | Scalable meta-data objects |
US7917879B2 (en) | 2007-08-02 | 2011-03-29 | Tela Innovations, Inc. | Semiconductor device with dynamic array section |
JP2007281137A (ja) * | 2006-04-05 | 2007-10-25 | Sharp Corp | 不揮発性半導体記憶装置およびその製造方法、前記不揮発性半導体記憶装置を備えてなる携帯電子機器 |
US7838920B2 (en) * | 2006-12-04 | 2010-11-23 | Micron Technology, Inc. | Trench memory structures and operation |
US8667443B2 (en) | 2007-03-05 | 2014-03-04 | Tela Innovations, Inc. | Integrated circuit cell library for multiple patterning |
US8453094B2 (en) | 2008-01-31 | 2013-05-28 | Tela Innovations, Inc. | Enforcement of semiconductor structure regularity for localized transistors and interconnect |
US7939443B2 (en) | 2008-03-27 | 2011-05-10 | Tela Innovations, Inc. | Methods for multi-wire routing and apparatus implementing same |
SG10201608214SA (en) | 2008-07-16 | 2016-11-29 | Tela Innovations Inc | Methods for cell phasing and placement in dynamic array architecture and implementation of the same |
US9122832B2 (en) | 2008-08-01 | 2015-09-01 | Tela Innovations, Inc. | Methods for controlling microloading variation in semiconductor wafer layout and fabrication |
US8661392B2 (en) | 2009-10-13 | 2014-02-25 | Tela Innovations, Inc. | Methods for cell boundary encroachment and layouts implementing the Same |
US9159627B2 (en) | 2010-11-12 | 2015-10-13 | Tela Innovations, Inc. | Methods for linewidth modification and apparatus implementing the same |
US8363491B2 (en) * | 2011-01-28 | 2013-01-29 | Freescale Semiconductor, Inc. | Programming a non-volatile memory |
US11041764B2 (en) * | 2016-02-29 | 2021-06-22 | Washington University | Self-powered sensors for long-term monitoring |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW409250B (en) * | 1997-10-01 | 2000-10-21 | Nippon Electric Co | A semiconductor memory device |
TW411465B (en) * | 1998-05-19 | 2000-11-11 | Oki Micro Design Kk | Semiconductor memory device |
US6531735B1 (en) * | 1999-09-17 | 2003-03-11 | Hitachi, Ltd. | Semiconductor integrated circuit |
TW200400509A (en) * | 2002-05-06 | 2004-01-01 | Symetrix Corp | Ferroelectric memory |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0167874B1 (ko) * | 1993-06-29 | 1999-01-15 | 사토 후미오 | 반도체 기억장치 |
KR20010006135A (ko) * | 1997-04-11 | 2001-01-26 | 프로그래머블 실리콘 솔루션즈 | 전기적 소거가능 비휘발성 메모리 |
US7190023B2 (en) * | 1999-09-17 | 2007-03-13 | Renesas Technology Corp. | Semiconductor integrated circuit having discrete trap type memory cells |
JP2004152977A (ja) * | 2002-10-30 | 2004-05-27 | Renesas Technology Corp | 半導体記憶装置 |
JP2005056889A (ja) * | 2003-08-04 | 2005-03-03 | Renesas Technology Corp | 半導体記憶装置およびその製造方法 |
JP2005191542A (ja) * | 2003-12-01 | 2005-07-14 | Renesas Technology Corp | 半導体記憶装置 |
JP2006060030A (ja) * | 2004-08-20 | 2006-03-02 | Renesas Technology Corp | 半導体記憶装置 |
US7158420B2 (en) * | 2005-04-29 | 2007-01-02 | Macronix International Co., Ltd. | Inversion bit line, charge trapping non-volatile memory and method of operating same |
-
2004
- 2004-12-28 EP EP04808000A patent/EP1833091A4/en not_active Withdrawn
- 2004-12-28 JP JP2006550539A patent/JP5392985B2/ja not_active Expired - Fee Related
- 2004-12-28 CN CN2004800447293A patent/CN101091252B/zh not_active Expired - Fee Related
- 2004-12-28 WO PCT/JP2004/019645 patent/WO2006070473A1/ja active Application Filing
-
2005
- 2005-12-22 US US11/316,800 patent/US7321511B2/en not_active Expired - Fee Related
- 2005-12-27 TW TW094146638A patent/TWI420649B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW409250B (en) * | 1997-10-01 | 2000-10-21 | Nippon Electric Co | A semiconductor memory device |
TW411465B (en) * | 1998-05-19 | 2000-11-11 | Oki Micro Design Kk | Semiconductor memory device |
US6531735B1 (en) * | 1999-09-17 | 2003-03-11 | Hitachi, Ltd. | Semiconductor integrated circuit |
TW200400509A (en) * | 2002-05-06 | 2004-01-01 | Symetrix Corp | Ferroelectric memory |
Also Published As
Publication number | Publication date |
---|---|
CN101091252A (zh) | 2007-12-19 |
EP1833091A1 (en) | 2007-09-12 |
WO2006070473A1 (ja) | 2006-07-06 |
JPWO2006070473A1 (ja) | 2008-06-12 |
US7321511B2 (en) | 2008-01-22 |
CN101091252B (zh) | 2012-09-05 |
JP5392985B2 (ja) | 2014-01-22 |
TW200636974A (en) | 2006-10-16 |
EP1833091A4 (en) | 2008-08-13 |
US20060256617A1 (en) | 2006-11-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI420649B (zh) | 半導體裝置及控制其操作之方法 | |
US6777292B2 (en) | Set of three level concurrent word line bias conditions for a NOR type flash memory array | |
US6646924B1 (en) | Non-volatile memory and operating method thereof | |
US7485530B2 (en) | Method for manufacturing a multiple-gate charge trapping non-volatile memory | |
US20060007741A1 (en) | Charge trapping non-volatile memory with two trapping locations per gate, and method for operating same | |
US20110170357A1 (en) | Nonvolatile memory with a unified cell structure | |
JP3980874B2 (ja) | 半導体記憶装置及びその駆動方法 | |
US20060007732A1 (en) | Charge trapping non-volatile memory and method for operating same | |
KR100960352B1 (ko) | 선 소거 단계를 이용하여 플래시 메모리를 소거하는 방법 | |
TW200306577A (en) | Algorithm dynamic reference programming | |
JPH06275087A (ja) | 不揮発性半導体記憶装置 | |
JPH0685272A (ja) | ソース側注入を使用して書込んだセルを使用する無コンタクト5v高速eprom/フラッシュepromアレイ | |
US5784325A (en) | Semiconductor nonvolatile memory device | |
JPH08279566A (ja) | 並列型不揮発性半導体記憶装置及び同装置の使用方法 | |
US6404681B1 (en) | Method for erasing data from a non-volatile semiconductor memory device | |
JP3410747B2 (ja) | 不揮発性半導体記憶装置 | |
US6822910B2 (en) | Non-volatile memory and operating method thereof | |
US7405972B1 (en) | Non-volatile memory array | |
US7312495B2 (en) | Split gate multi-bit memory cell | |
US6757198B2 (en) | Method for operating a non-volatile memory | |
US6934190B1 (en) | Ramp source hot-hole programming for trap based non-volatile memory devices | |
JP2732070B2 (ja) | 不揮発性半導体記憶装置の書込み方法 | |
US6515912B1 (en) | Semiconductor device | |
JPH06325582A (ja) | 不揮発性記憶装置 | |
US20230386574A1 (en) | Flash memory |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |