TWI420525B - 非揮發性半導體記憶體電路 - Google Patents

非揮發性半導體記憶體電路 Download PDF

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Publication number
TWI420525B
TWI420525B TW098124578A TW98124578A TWI420525B TW I420525 B TWI420525 B TW I420525B TW 098124578 A TW098124578 A TW 098124578A TW 98124578 A TW98124578 A TW 98124578A TW I420525 B TWI420525 B TW I420525B
Authority
TW
Taiwan
Prior art keywords
voltage
data
level
input data
volatile semiconductor
Prior art date
Application number
TW098124578A
Other languages
English (en)
Chinese (zh)
Other versions
TW201037709A (en
Inventor
Yoon-Jae Shin
Dong-Keun Kim
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of TW201037709A publication Critical patent/TW201037709A/zh
Application granted granted Critical
Publication of TWI420525B publication Critical patent/TWI420525B/zh

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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/147Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0064Verifying circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/06Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1006Data managing, e.g. manipulating data before writing or reading out, data bus switches or control circuits therefor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1096Write circuits, e.g. I/O line write drivers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Read Only Memory (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
TW098124578A 2009-04-14 2009-07-21 非揮發性半導體記憶體電路 TWI420525B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090032315A KR101038992B1 (ko) 2009-04-14 2009-04-14 비휘발성 반도체 메모리 회로

Publications (2)

Publication Number Publication Date
TW201037709A TW201037709A (en) 2010-10-16
TWI420525B true TWI420525B (zh) 2013-12-21

Family

ID=42934267

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098124578A TWI420525B (zh) 2009-04-14 2009-07-21 非揮發性半導體記憶體電路

Country Status (4)

Country Link
US (1) US8194473B2 (enExample)
JP (1) JP2010250920A (enExample)
KR (1) KR101038992B1 (enExample)
TW (1) TWI420525B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI702601B (zh) * 2017-06-20 2020-08-21 華邦電子股份有限公司 半導體記憶裝置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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KR101080209B1 (ko) * 2010-09-30 2011-11-07 주식회사 하이닉스반도체 반도체 장치
US8331164B2 (en) * 2010-12-06 2012-12-11 International Business Machines Corporation Compact low-power asynchronous resistor-based memory read operation and circuit
KR101813175B1 (ko) * 2011-02-21 2017-12-29 삼성전자주식회사 논리 회로, 상기 논리 회로를 포함하는 집적 회로 및 상기 집적 회로의 동작 방법
KR20130104287A (ko) * 2012-03-13 2013-09-25 삼성전자주식회사 센싱 검증부를 포함하는 반도체 메모리 장치
KR20140028481A (ko) * 2012-08-29 2014-03-10 에스케이하이닉스 주식회사 쓰기 전류를 측정할 수 있는 반도체 메모리 장치 및 쓰기 전류 측정 방법
KR102024523B1 (ko) 2012-12-26 2019-09-24 삼성전자 주식회사 저항체를 이용한 비휘발성 메모리 장치 및 그 구동 방법
KR102079370B1 (ko) 2013-02-05 2020-02-20 삼성전자주식회사 비휘발성 메모리 장치 및 그것의 쓰기 방법
US10832765B2 (en) * 2018-06-29 2020-11-10 Taiwan Semiconductor Manufacturing Co., Ltd. Variation tolerant read assist circuit for SRAM
KR102651128B1 (ko) 2018-12-11 2024-03-26 삼성전자주식회사 데이터 비교 기록을 수행하는 메모리 장치 및 이를 포함하는 메모리 시스템

Citations (6)

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Publication number Priority date Publication date Assignee Title
US6094374A (en) * 1998-03-25 2000-07-25 Nec Corporation Nonvolatile semiconductor memory device including sense amplifier having verification circuit
US7210012B2 (en) * 2002-09-06 2007-04-24 Samsung Electronics Co., Ltd. Write-protection blocks for non-volatile semiconductor memory device
US20080123389A1 (en) * 2006-11-29 2008-05-29 Samsung Electronics Co., Ltd. Method of driving multi-level variable resistive memory device and multi-level variable resistive memory device
US20080157827A1 (en) * 2006-12-29 2008-07-03 Hynix Semiconductor Inc. Input buffer circuit
US20090016100A1 (en) * 2007-07-12 2009-01-15 Samsung Electronics Co., Ltd. Multi-level phase change memory device and related methods
US20090043973A1 (en) * 2007-08-10 2009-02-12 Hynix Semiconductor Inc. Phase change memory device

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JP2000076874A (ja) * 1998-08-27 2000-03-14 Hitachi Ltd 不揮発性半導体記憶装置
JP3781240B2 (ja) * 1998-09-07 2006-05-31 株式会社ルネサステクノロジ 不揮発性半導体メモリおよびそれを内蔵した半導体集積回路
JP2000268593A (ja) * 1999-03-18 2000-09-29 Matsushita Electric Ind Co Ltd 不揮発性半導体メモリ
JP2004055073A (ja) * 2002-07-23 2004-02-19 Matsushita Electric Ind Co Ltd 不揮発性半導体記憶装置および不揮発性半導体記憶装置の検査方法
JP2004234739A (ja) * 2003-01-29 2004-08-19 Renesas Technology Corp 不揮発性半導体記憶装置
JP4867297B2 (ja) * 2005-11-08 2012-02-01 ソニー株式会社 記憶装置のベリファイ方法
KR100764738B1 (ko) * 2006-04-06 2007-10-09 삼성전자주식회사 향상된 신뢰성을 갖는 상변화 메모리 장치, 그것의 쓰기방법, 그리고 그것을 포함한 시스템
KR100895387B1 (ko) 2007-10-16 2009-04-30 주식회사 하이닉스반도체 상 변화 메모리 장치
KR20090126587A (ko) * 2008-06-04 2009-12-09 삼성전자주식회사 상 변화 메모리 장치 및 그것의 읽기 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6094374A (en) * 1998-03-25 2000-07-25 Nec Corporation Nonvolatile semiconductor memory device including sense amplifier having verification circuit
US7210012B2 (en) * 2002-09-06 2007-04-24 Samsung Electronics Co., Ltd. Write-protection blocks for non-volatile semiconductor memory device
US20080123389A1 (en) * 2006-11-29 2008-05-29 Samsung Electronics Co., Ltd. Method of driving multi-level variable resistive memory device and multi-level variable resistive memory device
US20080157827A1 (en) * 2006-12-29 2008-07-03 Hynix Semiconductor Inc. Input buffer circuit
US20090016100A1 (en) * 2007-07-12 2009-01-15 Samsung Electronics Co., Ltd. Multi-level phase change memory device and related methods
US20090043973A1 (en) * 2007-08-10 2009-02-12 Hynix Semiconductor Inc. Phase change memory device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI702601B (zh) * 2017-06-20 2020-08-21 華邦電子股份有限公司 半導體記憶裝置

Also Published As

Publication number Publication date
US8194473B2 (en) 2012-06-05
KR20100113804A (ko) 2010-10-22
JP2010250920A (ja) 2010-11-04
TW201037709A (en) 2010-10-16
KR101038992B1 (ko) 2011-06-03
US20100259974A1 (en) 2010-10-14

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