TWI420243B - A photohardenable resin composition, a dry film thereof and a hardened product, and a printed circuit board using the same - Google Patents

A photohardenable resin composition, a dry film thereof and a hardened product, and a printed circuit board using the same Download PDF

Info

Publication number
TWI420243B
TWI420243B TW98137804A TW98137804A TWI420243B TW I420243 B TWI420243 B TW I420243B TW 98137804 A TW98137804 A TW 98137804A TW 98137804 A TW98137804 A TW 98137804A TW I420243 B TWI420243 B TW I420243B
Authority
TW
Taiwan
Prior art keywords
group
compound
resin composition
film
resin
Prior art date
Application number
TW98137804A
Other languages
English (en)
Chinese (zh)
Other versions
TW201032003A (en
Inventor
Manabu Akiyama
Shoji Minegishi
Masao Arima
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201032003A publication Critical patent/TW201032003A/zh
Application granted granted Critical
Publication of TWI420243B publication Critical patent/TWI420243B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
    • C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW98137804A 2008-11-07 2009-11-06 A photohardenable resin composition, a dry film thereof and a hardened product, and a printed circuit board using the same TWI420243B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008287021A JP2010113241A (ja) 2008-11-07 2008-11-07 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Publications (2)

Publication Number Publication Date
TW201032003A TW201032003A (en) 2010-09-01
TWI420243B true TWI420243B (zh) 2013-12-21

Family

ID=42152625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98137804A TWI420243B (zh) 2008-11-07 2009-11-06 A photohardenable resin composition, a dry film thereof and a hardened product, and a printed circuit board using the same

Country Status (5)

Country Link
JP (1) JP2010113241A (ja)
KR (1) KR101693900B1 (ja)
CN (1) CN102272677B (ja)
TW (1) TWI420243B (ja)
WO (1) WO2010052811A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5854600B2 (ja) * 2010-12-28 2016-02-09 太陽インキ製造株式会社 光硬化性樹脂組成物
JP5707154B2 (ja) * 2011-01-31 2015-04-22 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその用途
CN104950574A (zh) * 2014-03-31 2015-09-30 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物及印刷电路板
CN106916262B (zh) * 2015-12-25 2020-03-13 太阳油墨（苏州）有限公司 孔穴填埋用固化性树脂组合物及其固化物、和印刷电路板
CN106916261B (zh) * 2015-12-25 2020-05-19 太阳油墨（苏州）有限公司 孔穴填埋用固化性树脂组合物及其固化物、和印刷电路板
WO2018146821A1 (ja) * 2017-02-07 2018-08-16 株式会社有沢製作所 感光性樹脂組成物、該感光性樹脂組成物を用いたソルダーレジストフィルム、フレキシブルプリント配線板及び画像表示装置
US11609493B2 (en) 2017-02-07 2023-03-21 Arisawa Mfg. Co., Ltd. Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display device
TWI789434B (zh) * 2017-09-26 2023-01-11 日商大阪有機化學工業股份有限公司 光間隔物形成用感光性樹脂組合物、光間隔物之形成方法、附光間隔物之基板、及彩色濾光片
JP7445831B2 (ja) * 2019-03-27 2024-03-08 パナソニックＩｐマネジメント株式会社 繊維シート、並びに、それを用いた積層体、回路基板および電子基板
WO2023085155A1 (ja) * 2021-11-15 2023-05-19 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、硬化物および電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1143524A (ja) * 1997-07-29 1999-02-16 Shinnakamura Kagaku Kogyo Kk カリックスアレーン誘導体及びそれを含有する硬化性樹脂組成物
JP2008233744A (ja) * 2007-03-23 2008-10-02 Taiyo Ink Mfg Ltd 硬化性組成物及びその硬化物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605625B2 (ja) * 1976-12-01 1985-02-13 東洋インキ製造株式会社 硬化性被覆剤
JPS58206618A (ja) * 1982-05-27 1983-12-01 Mitsubishi Petrochem Co Ltd ポリアクリレ−トを製造する方法
JPH01213347A (ja) * 1988-02-19 1989-08-28 Toagosei Chem Ind Co Ltd 硬化性樹脂組成物
JPH03249653A (ja) * 1990-02-27 1991-11-07 Konica Corp 感光性組成物
EP1402321A1 (en) * 2001-07-04 2004-03-31 Showa Denko K.K. Resist curable resin composition and cured article thereof
TW200303895A (en) 2002-03-06 2003-09-16 Hitachi Chemical Co Ltd Photosensitive resin composition
WO2003078494A1 (fr) * 2002-03-15 2003-09-25 Taiyo Ink Manufacturing Co., Ltd. Resines durcissables et compositions de resines durcissables les contenant
JP3953851B2 (ja) 2002-03-22 2007-08-08 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物
JP2004359867A (ja) * 2003-06-05 2004-12-24 Hitachi Chem Co Ltd 絶縁樹脂組成物、これを用いたプリプレグ、樹脂付導体箔、導体張積層板及び多層配線板並びに多層配線板の製造方法
TWI442180B (zh) * 2006-03-24 2014-06-21 Taiyo Holdings Co Ltd An alkali-developable hardening composition and a hardened product thereof
JP2008063452A (ja) * 2006-09-07 2008-03-21 Taiyo Ink Mfg Ltd 硬化性組成物及びその硬化物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1143524A (ja) * 1997-07-29 1999-02-16 Shinnakamura Kagaku Kogyo Kk カリックスアレーン誘導体及びそれを含有する硬化性樹脂組成物
JP2008233744A (ja) * 2007-03-23 2008-10-02 Taiyo Ink Mfg Ltd 硬化性組成物及びその硬化物

Also Published As

Publication number Publication date
TW201032003A (en) 2010-09-01
JP2010113241A (ja) 2010-05-20
WO2010052811A1 (ja) 2010-05-14
KR101693900B1 (ko) 2017-01-06
CN102272677A (zh) 2011-12-07
KR20110086814A (ko) 2011-08-01
CN102272677B (zh) 2013-09-04

Similar Documents

Publication Publication Date Title
TWI476526B (zh) A photohardenable resin composition
TWI391782B (zh) A photohardenable resin composition, a dry film and a cured product thereof, and a printed circuit board using them
TWI420243B (zh) A photohardenable resin composition, a dry film thereof and a hardened product, and a printed circuit board using the same
JP5583941B2 (ja) 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5537864B2 (ja) 光硬化性樹脂組成物
JP5439075B2 (ja) 光硬化性樹脂組成物
JP5559999B2 (ja) 光硬化性樹脂組成物
TWI500640B (zh) Hardened resin composition
JP2011043565A (ja) 光硬化性樹脂組成物
JP5091353B2 (ja) 光硬化性樹脂組成物
TWI507823B (zh) A photochromic resin composition of alkali developability, a dry film and a cured product thereof, and a printed circuit board using them
JP5951820B2 (ja) 光硬化性樹脂組成物
JP5864524B2 (ja) 光硬化性樹脂組成物
JP5520510B2 (ja) 光硬化性樹脂組成物
JP5917602B2 (ja) 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2013047818A (ja) 光硬化性樹脂組成物
JP2011059613A (ja) ソルダーレジスト組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5536167B2 (ja) ソルダーレジスト用光硬化性樹脂組成物
JP2013047816A (ja) プリント配線板用光硬化性樹脂組成物