TWI417912B - 捲取式真空成膜裝置 - Google Patents
捲取式真空成膜裝置 Download PDFInfo
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- TWI417912B TWI417912B TW096128806A TW96128806A TWI417912B TW I417912 B TWI417912 B TW I417912B TW 096128806 A TW096128806 A TW 096128806A TW 96128806 A TW96128806 A TW 96128806A TW I417912 B TWI417912 B TW I417912B
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- 238000004804 winding Methods 0.000 title claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 21
- 238000003825 pressing Methods 0.000 claims description 20
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 description 23
- 239000002184 metal Substances 0.000 description 19
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- 239000003990 capacitor Substances 0.000 description 13
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
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- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
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- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000005026 oriented polypropylene Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007774 anilox coating Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
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- 238000009434 installation Methods 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
- B05C1/0821—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line characterised by driving means for rollers or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
- B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
- B05C1/083—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets being passed between the coating roller and one or more backing rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
- B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
- B05C1/0834—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets the coating roller co-operating with other rollers, e.g. dosing, transfer rollers
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physical Vapour Deposition (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
本發明係有關一種適用於例如自身保全功能型薄膜電容器的製造之捲取式真空成膜裝置。
習知技術中,對於薄膜電容器的製造係使用一種一面從拉出輥拉出塑膠薄膜等絕緣性薄膜,並在該絕緣性薄膜的一表面蒸鍍金屬膜後,將該薄膜捲取至捲取輥之形式的捲取式真空蒸鍍裝置。
然而,亦有一種稱為自身保全功能型的薄膜電容器,這種薄膜電容器係將形成於薄膜表面的金屬蒸鍍膜予以個別化成複數個電容器片,並以相同的蒸鍍膜所構成的寬度較窄之連接部將彼此鄰接的電容器片互相連接。這種類型的薄膜電容器係在局部產生絕緣破壞時使上述連接部熔斷(熔絲(fuse)功能),藉此將電容器的絕緣破壞區域以個片單位抑制到最小限度。
在以上述的捲取式真空蒸鍍裝置來製造這種自身保全型的薄膜電容器時,係於拉出輥與蒸發源之間設置遮罩形成手段,以對薄膜的成膜面形成用以劃定金屬膜的蒸鍍區域之遮罩圖案(例如,參照下述專利文獻1)。
作為遮罩形成手段,係一面將薄膜夾置於印刷輥(版胴)與支承輥(backup roller)(壓胴)之間來搬運,一面將從油供給源經由轉印輥而轉印於印刷輥的遮罩圖案之形成用油從印刷輥朝薄膜的成膜面予以連續地轉印形成。藉此,以連續地製造具有任意形狀的電容器片之自身保全功能型的薄膜電容器。
另一方面,在習知的捲取式真空蒸鍍裝置中,印刷輥或轉印輥係設置於固定在真空室的構件。並且,這些輥群係在大氣環境中進行調整後,在真空室內進行排氣。
然而,當真空室的內部成為減壓狀態時,會產生些微的變形。尤其在最近,有真空室大型化而使排氣時的真空室變形量變大的傾向。當要求遮罩形成單元的位置精度為1/100mm以下時,相對地會有真空室的變形產生1mm左右等級的情形。因此,即使在大氣環境中調整過遮罩形成單元的輥群,亦會有受到變形的影響而對圖案形成產生影響的情形。因此,由於必須考慮變形量來調整輥群,或反覆進行大氣環境中的調整與排氣後的確認,故有耗時的情形。
專利文獻1:日本特開平10-81958號公報
在以上述的遮罩形成手段來進行遮罩圖案的形成時,有關印刷輥與支承輥之間的薄膜寬度方向的推壓力平衡甚為重要。當這些輥間的推壓力平衡不佳時,會有薄膜寬度方向在一端側與另一端側的轉印精度不同,而導致圖案中斷等轉印不良的情形。
因此,在上述專利文獻1中,揭示有一種於用以在構成遮罩形成手段的印刷輥及轉印輥分別設置推壓驅動手段,並個別將轉印輥與印刷輥之間、以及印刷輥與支承輥之間的推壓力予以調整之方法。
然而,在個別進行印刷輥及轉印輥的推壓力調整之方法中,有作業複雜化且作業時間變長之問題。此外,又有遮罩形成手段的構成亦複雜化之問題。
本發明乃有鑒於上述問題而研創者,其課題在提供一種能容易且快速地對印刷輥與支承輥之間的推壓力平衡進行調整之捲取式真空成膜裝置。
為了解決上述課題,在本發明的捲取式真空成膜裝置中,用以對薄膜的成膜面形成用以劃定成膜材料的成膜區域之遮罩圖案之遮罩形成手段係具備有:遮罩形成單元,包含有用以形成遮罩圖案之油供給源、用以將該供給源所供給的油保持於外周之第一輥、以及用以將油轉印至薄膜的成膜面以作為遮罩圖案之第二輥;支承輥,在與前述第二輥之間夾著薄膜,並使薄膜壓接至第二輥;以及單元移動機構,使前述遮罩形成單元相對於真空室移動;而前述單元移動機構係使遮罩形成單元相對於支承輥的位置移動,以調整有關於前述第二輥與支承輥之間的薄膜寬度方向的推壓力平衡。
在本發明中,第二輥係對應印刷輥。由於包含有第一輥及第二輥之遮罩形成單元係藉由對於真空室的相對移動來進行有關於第二輥與支承輥之間的薄膜寬度方向的推壓力平衡調整,而廢止第一輥及第二輥的個別調整並實現以單元單位的推壓力平衡調整,從而謀求作業的容易化與作業時間的縮短。
此外,在本發明中,前述遮罩形成單元係具有框架,用以支撐第一輥的軸之兩端與第二輥的軸之兩端,且該框架係以可移動之方式設置於固定設置在真空室的台座;前述單元移動機構係構成為使至少前述框架的一端朝支承輥方向移動。藉此,能將構成簡單化,並將第二輥相對於支承輥的軸平行度作成可調整,而可容易且快速地調整有關於第二輥與支承輥之間的薄膜寬度方向的推壓力平衡。較佳為前述框架係設置成可以台座的一點為中心而可旋轉移動。
並且,將前述單元移動機構構成為可從真空室的外部進行遠距離操作,藉此真空排氣後的遮罩形成單元的調整亦可容易地進行。
依據本發明的捲取式真空成膜裝置,可容易且快速地調整印刷輥與支承輥之間的推壓力平衡。
以下,參照圖式說明本發明的實施形態。在本實施形態中,作為捲取式真空成膜裝置,係以於捲取式真空蒸鍍裝置應用本發明為例來加以說明。
第1圖係本發明的實施形態的捲取式真空蒸鍍裝置10的概略構成圖。本實施形態的捲取式真空蒸鍍裝置10係具備有真空室11、薄膜12的拉出輥13、冷卻用圓筒輥(can roller)14、薄膜12的捲取輥15、以及蒸鍍物質的蒸發源(對應於本發明的「成膜手段」)16。
真空室11係經由配管連接部11a、11c而連接至未圖示的真空泵等之真空排氣系統,且真空室11的內部係經減壓排氣至預定的真空度。真空室11的內部空間係藉由分隔板11b而分隔成供拉出輥13與捲取輥15等配置之室、以及供蒸發源16配置之室。
薄膜12為裁切成預定寬度的長條狀的絕緣性塑膠薄膜,可使用例如OPP(Oriented Polypropylene;延伸聚丙烯)薄膜、PET(polyethylene terephthalate;聚對苯二甲酸乙二酯)薄膜、PPS(polyphenylene sulfide;聚苯硫醚)薄膜等。薄膜12係從拉出輥13予以拉出,經由複數個引導輥及圓筒輥14而由捲取輥予以捲取。此外,於拉出輥13及捲取輥15設置有未圖示的旋轉驅動部。
圓筒輥14係筒狀,且為鐵等金屬所製成,於內部具備有冷卻媒體循環系統等之冷卻機構,或使圓筒輥14旋轉驅動之旋轉驅動機構等。薄膜12以預定的環抱角度捲繞於圓筒輥14的周面。捲繞於圓筒輥14的薄膜12的外側面之成膜面係藉由來自蒸發源16的蒸鍍物質而成膜,同時藉由圓筒輥14而冷卻。
藉由上述的捲取輥13、圓筒輥14、捲取輥15、以及其他的引導輥,而構成本發明中用以使薄膜12在真空室11內行進的「行進手段」。
蒸發源16係用以收容蒸鍍物質,且具備有以電阻加熱、感應加熱、電子束加熱等眾知的手法使蒸鍍物質加熱蒸發之機構。該蒸發源16係配置於圓筒輥14的下方,使蒸鍍物質的蒸氣附著於相對向的圓筒輥14上的薄膜12上而形成皮膜。此外,該蒸發源16係對應本發明中用以將成膜材料成膜於行進中的薄膜12之「成膜手段」。
作為蒸鍍物質,除了Al(鋁)、Co(鈷)、Cu(銅)、Ni(鎳)、Ti(鈦)等之金屬元素單體外,亦適用Al-Zn(鋅)、Cu-Zn、Fe(鐵)-Co等之兩種以上的金屬或多元系合金。蒸發源16不限定於一個,亦可設置複數個。
本實施形態的捲取式真空蒸鍍裝置10復具備有遮罩形成單元20。遮罩形成單元20係設置於蒸發源16的上游側,亦即,拉出輥13與蒸發源16(筒輥14)之間。遮罩形成單元20係與後述的支承輥21一起構成本發明的「遮罩形成手段」。
第2圖係顯示薄膜12的成膜面。遮罩形成單元20係構成為以含跨薄膜12的成膜面之大致整面來塗佈的方式例如第2圖A中以影線(hatching)表示的形狀之遮罩圖案(油圖案)25。由於遮罩圖案25上未成膜有金屬層,故於成膜後,金屬膜26係成膜於遮罩圖案25的開口部25a,該金屬膜26係至經由連接部26a以預定的間距連接覆蓋有蒸鍍物質且大致矩形狀的金屬圖案之形態。此外,金屬膜26的成膜形態並未限定於上述者。
並且,各金屬層26係分別構成電容器片,且連接部26a係構成為於局部產生絕緣破壞時,以所產生的電流之焦耳熱(Joule heat)來進行熔斷,並具有以個片單位將電容器的絕緣破壞區域抑制到最小限度之自身保全功能型薄膜電容器之功能。
第3圖係遮罩形成單元20的概略構成圖。遮罩形成單元20係具備有:油噴射源31A;均塗輥(anilox roller)等油供給輥31;轉印輥(第一輥)32,將該油供給輥31所供給的油保持於外周;以及印刷輥(第二輥)33,從該轉印輥32來轉印油,並將該油轉印至薄膜12的成膜面而作為遮罩圖案25。此外,油噴射源31A及油供給輥31係構成本發明的「油供給源」。亦可僅以油噴射源31A來構成油供給源。
轉印輥32係從油供給輥31供給需要量的油,並將所供給的油轉印至印刷輥33。於印刷輥33的表面形成有對應遮罩圖案25的凸版,而被轉印至該凸版的油係轉印至薄膜12的成膜面而形成遮罩圖案25。印刷輥33係具有比薄膜12的寬度尺吋還大的軸長度。
油噴射源31、油供給輥31A、轉印輥32、以及印刷輥33之各軸的兩端係由共通的框架體34所支撐。於框架體34設置有未圖示之驅動單元,用以旋轉驅動油供給輥31A、轉印輥32、以及印刷輥33。框架體34係構成遮罩形成單元20的底部以及兩側壁部,而框架體34的底部係經由後述的單元移動機構51而設置於安裝在真空室11局部內壁面的台座18上。
另一方面,支承輥21係在與印刷輥33之間夾著薄膜12,使薄膜12壓接至印刷輥33。於支承輥21設置有彈壓機構41,用以將支承輥21朝印刷輥33予以彈壓。彈壓機構41係具備有:彈壓具42,用以支撐支承輥21的軸部兩端;以及驅動馬達43,用以將該彈壓具42朝印刷輥33予以彈壓。此外,支承輥21係經由支撐臂44而以擺動自如的方式安裝於真空室11的局部。
本實施形態的捲取式真空蒸鍍裝置10係具備有單元移動機構51,其係使遮罩形成單元20相對於台座18相對移動,以調整有關於印刷輥33與支承輥21之間的薄膜12的寬度方向的推壓力平衡。
第4圖係顯示單元移動機構51的構成圖,A為概略側面圖,B為平面圖。單元移動機構51係具備有:轉動軸52,設置於台座18與遮罩形成單元20之間;驅動源53,使遮罩形成單元20繞著該轉動軸52旋轉;以及引導部54,引導遮罩形成單元20相對於台座18之移動。如第4圖B所示,轉動軸52係設置於框架體34的一端側(印刷輥33的軸方向一端側),驅動源53係以可將遮罩形成單元20的另一端側朝箭頭S所示的前後方向予以驅動之方式而固定於台座18上。
驅動源53係例如以歩進馬達、滾珠螺桿(ball screw)單元等微傳輸機構所構成,以台座18的一點(轉動軸52)為中心使框架體34旋轉移動於箭頭C所示的方向。此外,轉動軸52的設置部位雖未限定於上述的例子,惟轉動軸52(支點)與驅動源53(作用點)之間的距離越長,越可進行高精度的轉動控制。
接著,針對上述構成的本實施形態的捲取式真空蒸鍍裝置10的動作加以說明。
在已減壓至預定真空度的真空室11的內部中,從拉出輥13連續拉出的薄膜12係經過遮罩形成步驟與蒸鍍步驟後,由捲取輥15連續地捲取。
在遮罩形成步驟中,藉由遮罩形成單元20而於薄膜12的成膜面印刷有第2圖所示形態的遮罩圖案25。形成有遮罩圖案25的薄膜12係由圓筒輥14所捲取。另外,根據需要,亦可對薄膜12照射電子線等電荷粒子線等而施以提高對圓筒輥14密著力之處理。再者,將蒸發源16所蒸發的蒸鍍物質沈積於薄膜12的成膜面,藉此形成第2圖B所示的金屬膜26。蒸鍍有金屬膜26的薄膜12係經由引導輥而由捲取輥15所捲取。
在此,以遮罩形成單元20來進行遮罩圖案25的形成時,用以挾持行進中的薄膜12之印刷輥33與支承輥21之間的有關於薄膜寬度方向的推壓力平衡甚為重要。當該等輥間的推壓力平衡不佳時,在薄膜12寬度方向的一端側與另一端側的油圖案的轉印精度會不同,最壞的情形下還會導致圖案的中斷。這種問題係由於印刷輥33與支承輥21的軸間平行度降低為起因而產生者,故有需要高精度地進行印刷輥33相對於支承輥21之軸位置調整。
因此,於本實施形態中,由於遮罩形成單元20對於構成真空室11局部的台座18呈轉轉自如,故藉由驅動源53的傳輸驅動,能改變印刷輥33相對於支承輥21之軸位置以進行推壓力的調整,並能高精度地調整兩輥21、33的軸間平行度。此外,由於藉由彈壓機構41使支承輥21經常推壓於印刷輥33側,故於印刷輥33的軸位置調整時,薄膜12的挾持力不會變化。
此外,在本實施形態中,係藉由包含有印刷輥33及轉印輥32之遮罩形成單元20整體相對於真空室11之相對移動來進行印刷輥33與支承輥21之間的推壓力調整,故無須個別調整印刷輥33及轉印輥32,能實現以單元單位的推壓力調整,並能謀求構成的簡單化、作業的容易化、以及作業時間的縮短。
此外,亦可構成為從真空室11的外部遠距離操作驅動源53。該情形下,真空排氣後可容易地進行遮罩形成單元20的調整。例如,在排氣後可容易且迅速地立即進行印刷輥33及支承輥21之間的推壓力平衡的再調整,而能謀求生產性的提升。
此外,由於遮罩形成單元20的框架體34係設置成可對台座18移動,或者僅以轉動軸52來固定,故不容易受到真空室11變形的影響。因此,在大氣環境中進行遮罩形成單元20的調整後,即使將真空室11內予以排氣,亦難以產生印刷輥33與支承輥21之間的推壓力平衡的變動。
以上,雖針對本發明的實施形態加以說明,但本發明並未限定於此等實施形態,可依據本發明的技術思想而進行各種的變形。
例如,在上述的實施形態中,雖將單元移動機構51構成為於遮罩形成單元20的一端側設置轉動軸52,且於另一端側連接驅動源53,但亦可取代這種構成,而於遮罩形成單元20的一端側及另一端側之雙方配置驅動源,將此等各驅動源進行驅動控制以進行遮罩形成單元20的位置調整,而謀求支承輥21與印刷輥33之間的推壓力平衡的最佳化。
此外,於薄膜12的引導路徑上追加遮罩圖案25的檢查步驟,並將檢查結果反饋至遮罩形成單元20的單元驅動機構51,以進行印刷輥33的軸位置之最佳化等控制形態亦可採用。
此外,在上述的實施形態中,作為成膜手段,雖以使用有蒸發源16的真空蒸鍍法來將金屬膜予以成膜之例子來說明,但本發明當然未限定於此,亦可適用以濺鍍法或各種CVD(Chemical Vapor Deposition;化學氣相沉積)法等將金屬膜或非金屬膜予以成膜的其他成膜法,並能配合這些成膜法適當地採用濺渡靶等之成膜手段。
10‧‧‧捲取式真空蒸鍍裝置(捲取式真空成膜裝置)
11‧‧‧真空室
11a、11c‧‧‧配管連接部
11b‧‧‧分隔板
12‧‧‧薄膜
13‧‧‧拉出輥
14‧‧‧圓筒輥
15‧‧‧捲取輥
16‧‧‧蒸發源(成膜手段)
18‧‧‧台座
20‧‧‧遮罩形成單元
21‧‧‧支承輥
25‧‧‧遮罩圖案
25a‧‧‧開口部
26‧‧‧金屬膜
26a‧‧‧連接部
31‧‧‧油供給輥
31A‧‧‧油噴射源
32‧‧‧轉印輥
33‧‧‧印刷輥
34‧‧‧框架體
41‧‧‧彈壓機構
42‧‧‧彈壓具
43‧‧‧驅動馬達
44‧‧‧支撐臂
51‧‧‧單元移動機構
52‧‧‧轉動軸
53‧‧‧驅動源
54‧‧‧引導部
第1圖係顯示作為本發明實施形態的捲取式真空成膜裝置的捲取式真空蒸鍍裝置的概略構成圖。
第2圖係顯示以第1圖的捲取式真空蒸鍍裝置的遮罩形成單元所形成的遮罩圖案之例圖,A係顯示金屬膜蒸鍍前,B係顯示金屬膜蒸鍍後。
第3圖係第1圖的捲取式真空蒸鍍裝置的遮罩形成單元的概略側面圖。
第4圖係顯示第3圖的遮罩形成單元的構成圖,A為側面圖,B為平面圖。
10...捲取式真空蒸鍍裝置(捲取式真空成膜裝置)
11...真空室
11a...配管連接部
11b...分隔板
12...薄膜
13...拉出輥
14...圓筒輥
15...捲取輥
16...蒸發源(成膜手段)
20...遮罩形成單元
21...支承輥
Claims (3)
- 一種捲取式真空成膜裝置,係具備有:真空室;行進手段,使薄膜於前述真空室內行進;成膜手段,將成膜材料成膜於行進中的前述薄膜;以及遮罩形成手段,於前述成膜手段的上游形成用以於前述薄膜劃定前述成膜材料的成膜區域之遮罩圖案;前述遮罩形成手段係具備有:台座,固定在前述真空室;遮罩形成單元,包含:設置成以前述台座的一點為中心而可旋轉移動之框架;用以形成前述遮罩圖案之油供給源;兩端支撐於前述框架,用以將前述供給源所供給的油保持於外周之第一輥;以及兩端支撐於前述框架,用以將前述油轉印至前述薄膜的成膜面以作為遮罩圖案之第二輥;支承輥,在與前述第二輥之間夾著前述薄膜,並使前述薄膜壓接至前述第二輥;以及單元移動機構,使前述遮罩形成單元相對於前述真空室移動,而前述單元移動機構係使前述遮罩形成單元相對於前述支承輥的位置而移動,以調整有關於前述第二輥與前述支承輥之間的薄膜寬度方向的壓接力平衡。
- 如申請專利範圍第1項之捲取式真空成膜裝置,其中,前述框架中,於垂直於前述薄膜行進方向之方向的一端設置前述框架的旋轉移動中心,前述單元移動機構係使至少前述框架的另一端朝前述支承輥方向移動。
- 如申請專利範圍第1項之捲取式真空成膜裝置,其中,前述單元移動機構係可從前述真空室的外部進行遠距離操作。
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- 2007-07-26 US US12/374,675 patent/US8333841B2/en active Active
- 2007-07-26 WO PCT/JP2007/064639 patent/WO2008018297A1/ja active Application Filing
- 2007-07-26 JP JP2008528773A patent/JP4958906B2/ja active Active
- 2007-07-26 CN CN200780029292XA patent/CN101501242B/zh active Active
- 2007-07-26 KR KR1020097001147A patent/KR101099597B1/ko active IP Right Grant
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JPH0466155A (ja) * | 1990-07-04 | 1992-03-02 | Sumitomo Metal Ind Ltd | ロールコーティング装置 |
JPH1081958A (ja) * | 1996-09-03 | 1998-03-31 | Toray Ind Inc | 真空蒸着装置 |
CN1619009A (zh) * | 2003-11-20 | 2005-05-25 | 爱发科股份有限公司 | 卷绕式真空蒸镀方法及卷绕式真空蒸镀装置 |
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CN101501242B (zh) | 2011-06-15 |
EP2050838B1 (en) | 2012-11-28 |
KR101099597B1 (ko) | 2011-12-28 |
US20090320747A1 (en) | 2009-12-31 |
EP2050838A1 (en) | 2009-04-22 |
KR20090024798A (ko) | 2009-03-09 |
EP2050838A4 (en) | 2011-11-30 |
JP4958906B2 (ja) | 2012-06-20 |
TW200814107A (en) | 2008-03-16 |
US8333841B2 (en) | 2012-12-18 |
JPWO2008018297A1 (ja) | 2009-12-24 |
WO2008018297A1 (fr) | 2008-02-14 |
CN101501242A (zh) | 2009-08-05 |
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